CN103747608B - A kind of Anti-off movable heat conduction structure - Google Patents
A kind of Anti-off movable heat conduction structure Download PDFInfo
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- CN103747608B CN103747608B CN201310688023.1A CN201310688023A CN103747608B CN 103747608 B CN103747608 B CN 103747608B CN 201310688023 A CN201310688023 A CN 201310688023A CN 103747608 B CN103747608 B CN 103747608B
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- heat
- pcb board
- conducting plate
- silica gel
- conducting
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Abstract
The present invention relates to a kind of Anti-off movable heat conduction structure, including the heat-conducting plate for being resisted against compressible heat-conducting medium on pcb board, heat-conducting plate is provided with the lead column coordinated with the positioning interporal lacuna on pcb board.Lead column includes that the connection end relative with heat-conducting plate, connection end are stretched out and expose to pcb board.Anti-off movable heat conduction structure also includes that locking part, locking part are detachably arranged on connection end, and heat-conducting plate is movably attached on pcb board, and prevents heat-conducting plate from departing from from pcb board.Heat-conducting medium is clamped fixation by heat-conducting plate and pcb board.The invention enables heat-conducting medium is clamped fixation by heat-conducting plate and pcb board, and be flexibly connected with pcb board, when repairing or replacing to pcb board, heat-conducting plate, heat conductive silica gel can be dismounted together with mainboard, ensure that position of the heat-conducting medium on heat-conducting plate does not produce to come off or deviate, it is to avoid cause shift in position and damage the risk for treating radiating element by pressure due to reapposing heat-conducting medium.
Description
Technical field
A kind of the present invention relates to conductive structure, more particularly, it relates to Anti-off movable heat conduction structure.
Background technology
Radiating element such as IC chip treated by the pcb board card of industrial products, be particularly equipped with many high configurations on mainboard, is
Keep such and treat radiating element long-time normal work, need to radiate them.
Heat conductive silica gel is typically pressed on using directly placement aluminium flake and treats to be radiated on radiating element by traditional structural design,
But due to the restriction that hardware design is required, many treats radiating element relatively far apart not in the same area, and height differs.It is into
This and assembling are simple to be considered, typically can treat heat conductive silica gel of the radiating element using same thickness to be close to height in design,
So as to have the heat conductive silica gel of multiple differing heights.
Remove mainboard keeped in repair or Renewal process in, heat conductive silica gel can come off, shift, and ressemble heat conductive silica gel
The substantial amounts of working time can be spent, meanwhile, the risk for misplacing heat conductive silica gel position also occurs when ressembling.
If position misplaces, after assembling, can then cause some to treat that radiating element is pressed too tight and damaged, or some are treated
Radiating element is not completely attached to and cannot be radiated, so as to cause product bug run.
Content of the invention
The technical problem to be solved in the present invention is, there is provided a kind of improved Anti-off movable heat conduction structure.
The technical solution adopted for the present invention to solve the technical problems is：A kind of Anti-off movable heat conduction structure is constructed,
Including the heat-conducting plate for being resisted against compressible heat-conducting medium on pcb board, the heat-conducting plate be provided with the pcb board
The lead column that coordinates of positioning interporal lacuna, the lead column includes that the connection end relative with the heat-conducting plate, the connection end are stretched
Go out and expose to the pcb board；
The Anti-off movable heat conduction structure also includes locking part, and the locking part is detachably arranged at the connection end
On, the heat-conducting plate is movably attached on the pcb board, and prevents the heat-conducting plate from departing from from the pcb board；
The heat-conducting medium is clamped fixation by the heat-conducting plate and the pcb board.
Preferably, the end face of the connection end is provided with screw thread lockhole, and the locking part is spiral shell corresponding with the lockhole
Nail or screw.
Preferably, lead column includes two.
Preferably, the lead column is cylinder.
Preferably, diameter of the diameter of the lead column less than the pilot hole.
Preferably, plate body of the heat-conducting plate for aluminum.
Implement the Anti-off movable heat conduction structure of the present invention, have the advantages that：By in the present invention in heat conduction
The lead column coordinated with the positioning interporal lacuna on pcb board is set on plate, heat-conducting plate and pcb board can be caused to clamp heat-conducting medium solid
Determine and be flexibly connected with pcb board.When repairing or replacing to pcb board, heat-conducting plate, heat conductive silica gel can be torn open together with mainboard
Dress.
Present configuration is simple, and disassembly process can ensure that position of the heat-conducting medium on heat-conducting plate does not produce and come off or partially
From, it is to avoid cause shift in position and damage the risk for treating radiating element by pressure due to reapposing heat-conducting medium.
Description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the installment state side sectional view of Anti-off movable heat conduction structure of the present invention；
Fig. 2 is the schematic perspective view of Fig. 1 installment states；
Fig. 3 is the exploded perspective view of Anti-off movable heat conduction structure of the present invention.
Identifier declaration in figure：Pcb board 10, location hole 11, treat radiating element 12, heat-conducting medium 20, heat conductive silica gel 21,
Heat-conducting plate 30, lead column 31, connection end 32, lockhole 33, locking part 40, housing 50.
Specific embodiment
In order to be more clearly understood to the technical characteristic of the present invention, purpose and effect, now control accompanying drawing is described in detail
The specific embodiment of the present invention.
Anti-off movable heat conduction structure in a preferred embodiment of the invention illustrated in Fig. 1 and Fig. 2 includes using
The lock being detachably connected in the heat-conducting plate 30 compressible heat-conducting medium 20 clamped with pcb board 10 and with heat-conducting plate 30
Firmware 40, heat-conducting plate 30 is removably mounted on pcb board 10.
In certain embodiments, plate body of the heat-conducting plate 30 for aluminum, it is possible to understand that ground, in other embodiments, heat conduction
Plate 30 is alternatively the copper plate body with preferable thermal conduction characteristic.Heat-conducting medium 20 is heat conductive silica gel 21, with use
Heat-conducting plate 30 and pcb board 10 can be compressed to which.
As shown in Figure 3, it is preferable that pcb board 10 is provided with two circular location holes 11, heat-conducting plate 30 be provided with respectively with
Two cylindrical lead columns 31 that two 11 gaps of location hole coordinate.Lead column 31 includes the connection end relative with heat-conducting plate 30
32, connection end 32 is stretched out and exposes to pcb board 10.Diameter of the diameter of lead column 31 less than location hole 11, to ensure heat-conducting plate 30
After being installed to pcb board 10, heat-conducting plate 30 can move back and forth along location hole 11.
Again as shown in figure 1, further, screw thread lockhole 33 is provided with the end face of connection end 32, and locking part 40 is and lock
33 corresponding screw of hole or screw etc., by locking part 40 and the cooperation of lockhole 33, realize that heat-conducting plate 30 is removable with pcb board 10
Connection is unloaded, and the heat-conducting mediums such as heat conductive silica gel 21 20 are clamped therebetween.In other embodiments, on connection end 32
External screw thread can be set, and locking part 40 can be nut.Meanwhile, can by adjust latched position of the locking part 40 on connection end 32 come
The heat conductive silica gel 21 of different-thickness when clamping different application environment.
Two lead columns 31 can ensure that the position between heat-conducting plate 30 and pcb board 10 does not produce lateral position skew.At which
In his embodiment, the location hole 11 on pcb board 10 is alternatively a polygonal hole or other irregularly-shaped holes, and lead column 31 is alternatively one
The polygon of the individual form fit with location hole 11 or special-shaped column structure, to ensure that 30 relative pcb board 10 of heat-conducting plate is not produced
Rotate.
Below in conjunction with the accompanying drawings the application of the present invention is described further.
By 10 horizontal positioned of pcb board, make to treat the placement that faces up that radiating element 12 is located.Again by the heat conduction of some differing heights
Silica gel 21 is placed into corresponding IC chip on pcb board 10 and waits on radiating element 12, and ensures each heat conductive silica gel 21 after placing
Apparent height same or like.
Heat-conducting plate 30 is pressed together on heat conductive silica gel 21, lead column 31 is inserted in location hole 11, now heat-conducting plate 30
Heat conductive silica gel 21 is installed in centre with pcb board 10.Locking part 40 is locked on connection end 32, you can realize heat conductive silica gel 21
Clamp fixation.Meanwhile, heat-conducting plate 30, heat conductive silica gel 21,10 three of pcb board group are integral, and it is right directly can be installed to pcb board 10
On the product that answers.
When pcb board 10 is installed, when heat-conducting plate 30 is subject to the housing 50 of product to extrude, 21 compression of heat conductive silica gel,
30 entirety of heat-conducting plate is made to move close to pcb board 10.If the locus of interiors of products is less, what heat conductive silica gel 21 was subject to compresses
When too big, the heat conductive silica gel 21 of replaceable proper height, it is to avoid stress is too big causes the damage for treating radiating element 12.
When pcb board 10 is dismantled, pcb board 10 and heat-conducting plate 30,21 integral demounting of heat conductive silica gel can be got off, then to locking
Part 40 is dismantled, you can is individually taken out pcb board 10 and is repaired or replaced.In whole process, heat conductive silica gel 21 and heat conduction
Position between plate 30 will not also produce displacement, and heat conductive silica gel 21 also will not come off from heat-conducting plate 30.
It is to be appreciated that above-mentioned each technical characteristic can be used in any combination and unrestricted.
Presently preferred embodiments of the present invention is the foregoing is only, not in order to limit the present invention, all in essence of the invention
Any modification, equivalent and improvement that is made within god and principle etc., should be included within the scope of the present invention.
Claims (2)
1. a kind of Anti-off movable heat conduction structure, including for being resisted against pcb board (10) by compressible heat-conducting medium (20)
On heat-conducting plate (30), it is characterised in that pcb board (10) are provided with two circular location holes (11), heat-conducting plate (30)
The two cylindrical lead columns (31) for coordinating respectively are provided with two location hole (11) gaps, and lead column (31) includes and leads
The relative connection end (32) of hot plate (30), connection end (32) are stretched out and expose to pcb board (10), and the diameter of lead column (31) is less than fixed
The diameter of position hole (11), to ensure that heat-conducting plate (30) is installed to after pcb board (10), lead column (31) can be along location hole (11) back and forth
Mobile；The end face of connection end (32) is provided with screw thread lockhole (33), and locking part (40) is detachably arranged at the connection end
(32) the screw thread lockhole (33) on, and heat-conducting medium (20) is installed between pcb board (10) and heat-conducting plate (30), by heat-conducting plate
(30) it is pressed together on heat conductive silica gel (21), lead column (31) is inserted in location hole (11), now heat-conducting plate (30) and pcb board
(10) heat conductive silica gel (21) is installed in centre；Pcb board (10) is installed, when heat-conducting plate (30) is subject to the housing (50) of product to extrude
When, heat conductive silica gel (21) compression makes heat-conducting plate (30) integrally move close to pcb board (10)；In dismounting pcb board (10)
When, pcb board (10) and heat-conducting plate (30), heat conductive silica gel (21) integral demounting can be got off, then locking part (40) is dismantled,
In whole process, the position between heat conductive silica gel (21) and heat-conducting plate (30) will not produce displacement, and heat conductive silica gel (21) also will not
Come off from heat-conducting plate (30).
2. Anti-off movable heat conduction structure according to claim 1, it is characterised in that described heat-conducting plate (30) are aluminum
Plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310688023.1A CN103747608B (en) | 2013-12-13 | 2013-12-13 | A kind of Anti-off movable heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310688023.1A CN103747608B (en) | 2013-12-13 | 2013-12-13 | A kind of Anti-off movable heat conduction structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103747608A CN103747608A (en) | 2014-04-23 |
| CN103747608B true CN103747608B (en) | 2017-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310688023.1A Active CN103747608B (en) | 2013-12-13 | 2013-12-13 | A kind of Anti-off movable heat conduction structure |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255313B (en) * | 2016-08-30 | 2018-10-02 | 无锡市同步电子制造有限公司 | A kind of preparation of circuit board heat dissipation cold plate and adhering method |
| CN110888506B (en) * | 2019-11-29 | 2021-06-25 | 深圳市核芯智联科技开发有限公司 | Multimedia dual-core industrial control mainboard |
| CN116136618A (en) * | 2021-11-16 | 2023-05-19 | 中兴智能科技南京有限公司 | Optical module heat abstractor and communication equipment |
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| CN101466233A (en) * | 2007-12-21 | 2009-06-24 | 富准精密工业(深圳)有限公司 | Radiator and fixed device for hot pipe |
| CN202018554U (en) * | 2011-04-08 | 2011-10-26 | 杭州亿视电子系统工程有限公司 | Internal heat dissipating structure of high-definition web camera |
| CN102280417A (en) * | 2010-06-08 | 2011-12-14 | 上海景文材料科技发展有限公司 | Heat radiation device for circuit board |
| CN102686086A (en) * | 2012-05-17 | 2012-09-19 | 华为技术有限公司 | Radiating device and electronic component provided with same |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
| CN203722910U (en) * | 2013-12-13 | 2014-07-16 | 深圳市同为数码科技股份有限公司 | Fall-proof movable heat conduction structure |
-
2013
- 2013-12-13 CN CN201310688023.1A patent/CN103747608B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101466233A (en) * | 2007-12-21 | 2009-06-24 | 富准精密工业(深圳)有限公司 | Radiator and fixed device for hot pipe |
| CN102280417A (en) * | 2010-06-08 | 2011-12-14 | 上海景文材料科技发展有限公司 | Heat radiation device for circuit board |
| CN202018554U (en) * | 2011-04-08 | 2011-10-26 | 杭州亿视电子系统工程有限公司 | Internal heat dissipating structure of high-definition web camera |
| CN102686086A (en) * | 2012-05-17 | 2012-09-19 | 华为技术有限公司 | Radiating device and electronic component provided with same |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
| CN203722910U (en) * | 2013-12-13 | 2014-07-16 | 深圳市同为数码科技股份有限公司 | Fall-proof movable heat conduction structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103747608A (en) | 2014-04-23 |
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Effective date of registration: 20221206 Address after: No. 2 Xingke East Road, Dongjiang Hi tech Industrial Park, Zhongkai Hi tech Zone, Huizhou City, Guangdong Province 516000 Patentee after: Huizhou Tongwei Digital Technology Co.,Ltd. Address before: 518000 Room E, North 6th Floor, CEC Lighting R&D Center, South District, High tech Industrial Park, Nanshan District, Shenzhen, Guangdong Patentee before: TVT DIGITAL TECHNOLOGY Co.,Ltd. |