CN103747608A - Anti-off movable heat conduction structure - Google Patents
Anti-off movable heat conduction structure Download PDFInfo
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- CN103747608A CN103747608A CN201310688023.1A CN201310688023A CN103747608A CN 103747608 A CN103747608 A CN 103747608A CN 201310688023 A CN201310688023 A CN 201310688023A CN 103747608 A CN103747608 A CN 103747608A
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- heat conduction
- heat
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- pcb board
- conducting plate
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Abstract
The invention relates to an anti-off movable heat conduction structure. The structure comprises a heat conduction plate used for abutting a compressible heat conduction medium on a PCB, and the heat conduction plate is provided with guide columns which are in clearance fit with positioning holes on the PCB. Each guide column includes a connection end opposite to the heat conduction plate, and the connection end extends to be exposed out of the PCB. The anti-off movable heat conduction structure further comprises locking pieces which are detachably arranged on the connection ends so as to movably mount the heat conduction plate on the PCB and prevent the heat conduction plate from falling off the PCB. The heat conduction plate and the PCB clamp and fix the heat conduction medium. According to the anti-off movable heat conduction structure, the heat conduction plate and the PCB clamp and fix the heat conduction medium, and the heat conduction plate is movably connected with the PCB. Therefore, the heat conduction plate, heat conduction silica gel and a motherboard can be disassembled and assembled together when the PCB is maintained or replaced, the heat conduction medium is ensured not to fall off or deviate from the heat conduction plate, and the risk that a to-be-cooled device may be crushed due to position change caused by heat conducting medium repositioning is avoided.
Description
Technical field
The present invention relates to conductive structure, more particularly, relate to the movable conductive structure of a kind of slip-off preventing.
Background technology
What on the pcb board card, particularly mainboard of industrial products, be equipped with many high configurations treats that radiating element is as IC chip, for keeping this type of to treat the long-time normal work of radiating element, need to dispel the heat to them.
Traditional structural design is general to be adopted and directly places aluminium flake heat conductive silica gel is pressed on and treats to dispel the heat on radiating element, but the restriction requiring due to hardware designs, manyly treats that radiating element is not relatively far apart at the same area, and highly differs.For cost and assemble simple and easy consideration, generally can adopt the heat conductive silica gel of same thickness to approaching the radiating element for the treatment of of height in design, thereby have the heat conductive silica gel of multiple differing heights.
Take off that mainboard keeps in repair or Renewal process in, heat conductive silica gel can come off, be shifted, and ressembles heat conductive silica gel and can spend a large amount of operating times, meanwhile, also there will be the risk that misplaces heat conductive silica gel position when ressembling.
If position misplaces, after assembling, can cause some to treat that radiating element is pressed too tightly and damages, or some treats that radiating element does not touch completely and cannot dispel the heat, thereby cause product bug to move.
Summary of the invention
The technical problem to be solved in the present invention is, provides a kind of improved slip-off preventing movable conductive structure.
The technical solution adopted for the present invention to solve the technical problems is: construct the movable conductive structure of a kind of slip-off preventing, comprise for compressible heat-conducting medium is resisted against to the heat-conducting plate on pcb board, described heat-conducting plate be provided with described pcb board on the lead of location hole matched in clearance, described lead comprises the link relative with described heat-conducting plate, and described link stretches out and exposes to described pcb board;
The movable conductive structure of described slip-off preventing also comprises locking part, and described locking part is detachably arranged on described link, so that described heat-conducting plate is installed on described pcb board movably, and prevents that described heat-conducting plate from departing from from described pcb board;
Described heat-conducting plate and described pcb board clamp fixing by described heat-conducting medium.
Preferably, the end face of described link is provided with screw thread lockhole, and described locking part is screw or the screw corresponding with described lockhole.
Preferably, lead comprises two.
Preferably, described lead is cylindrical.
Preferably, the diameter of described lead is less than the diameter of described pilot hole.
Preferably, described heat-conducting plate is the plate body of aluminium matter.
Implement the movable conductive structure of slip-off preventing of the present invention, there is following beneficial effect: by the present invention, on heat-conducting plate, arrange with pcb board on the lead of location hole matched in clearance, can make heat-conducting plate and pcb board that heat-conducting medium is clamped fixing and is flexibly connected with pcb board.When pcb board is repaired or replaced, can be by heat-conducting plate, heat conductive silica gel with mainboard together dismounting.
The present invention is simple in structure, and disassembly process can guarantee that the position of heat-conducting medium on heat-conducting plate do not produce and come off or depart from, and has avoided due to the risk that reapposes heat-conducting medium and cause shift in position to damage by pressure to treat radiating element.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the installment state side sectional view of the movable conductive structure of slip-off preventing of the present invention;
Fig. 2 is the schematic perspective view of Fig. 1 installment state;
Fig. 3 is the exploded perspective view of the movable conductive structure of slip-off preventing of the present invention.
Identifier declaration in figure: pcb board 10, location hole 11, treat radiating element 12, heat-conducting medium 20, heat conductive silica gel 21, heat-conducting plate 30, lead 31, link 32, lockhole 33, locking part 40, housing 50.
Embodiment
For technical characterictic of the present invention, object and effect being had more clearly, understand, now contrast accompanying drawing and describe the specific embodiment of the present invention in detail.
The movable conductive structure of slip-off preventing in a preferred embodiment of the invention shown in Fig. 1 and Fig. 2 comprises the heat-conducting plate 30 for clamping with 10 pairs of compressible heat-conducting mediums 20 of pcb board and the locking part 40 removably connecting with heat-conducting plate 30, so that heat-conducting plate 30 is detachably arranged on pcb board 10.
In certain embodiments, heat-conducting plate 30 is the plate body of aluminium matter, and understandably, in other embodiments, heat-conducting plate 30 also can be the copper plate body with better thermal conduction characteristic.Heat-conducting medium 20 is heat conductive silica gel 21, so that in use heat-conducting plate 30 and pcb board 10 can compress it.
As shown in Figure 3, preferably, pcb board 10 is provided with two circular location holes 11, and heat-conducting plate 30 is provided with respectively two columniform leads 31 with two location hole 11 matched in clearance.Lead 31 comprises the link 32 relative with heat-conducting plate 30, and link 32 stretches out and exposes to pcb board 10.The diameter of lead 31 is less than the diameter of location hole 11, and to guarantee that heat-conducting plate 30 is installed to after pcb board 10, heat-conducting plate 30 can move around along location hole 11.
Again as shown in Figure 1, further, on the end face of link 32, be provided with screw thread lockhole 33, locking part 40 is the screw corresponding with lockhole 33 or screw etc., by coordinating of locking part 40 and lockhole 33, realize removably connecting of heat-conducting plate 30 and pcb board 10, and the heat-conducting mediums 20 such as heat conductive silica gel 21 are installed between the two.In other embodiments, on link 32, also external screw thread can be set, locking part 40 can be nut.Meanwhile, can be when regulating the latched position of locking part 40 on link 32 to clamp different application environment the heat conductive silica gel 21 of different-thickness.
Two leads 31 can guarantee that the position between heat-conducting plate 30 and pcb board 10 does not produce lateral position skew.In other embodiments, location hole 11 on pcb board 10 also can be a polygonal hole or other irregularly-shaped holes, lead 31 also can be a polygon mating with the profile of location hole 11 or Special-Shaped Column body structure, to guarantee that the relative pcb board 10 of heat-conducting plate 30 does not rotate.
Below in conjunction with accompanying drawing, application of the present invention is described further.
By pcb board 10 horizontal positioned, make to treat the placement that faces up of radiating element 12 places.Again the heat conductive silica gel of some differing heights 21 is placed into IC chip corresponding on pcb board 10 and waits on radiating element 12, and guarantee that the apparent height of each heat conductive silica gel 21 after placement is identical or close.
Heat-conducting plate 30 is pressed together on heat conductive silica gel 21, lead 31 is inserted in location hole 11, in the middle of now heat-conducting plate 30 and pcb board 10 are installed in heat conductive silica gel 21.Locking part 40 is locked on link 32, can realizes heat conductive silica gel 21 is clamped fixing.Meanwhile, heat-conducting plate 30, heat conductive silica gel 21, pcb board 10 threes form one, can directly pcb board 10 be installed on corresponding product.
When pcb board 10 is installed, when heat-conducting plate 30 is subject to housing 50 extruding of product, heat conductive silica gel 21 compressions, make heat-conducting plate 30 integral body move close to pcb board 10.If the locus of interiors of products is less, when the compression that heat conductive silica gel 21 is subject to is too large, the heat conductive silica gel 21 of replaceable proper height, avoids stressed too large, causes the damage for the treatment of radiating element 12.
When dismounting pcb board 10, pcb board 10 and heat-conducting plate 30, heat conductive silica gel 21 integral demountings can be got off, then locking part 40 is dismantled, can separately pcb board 10 be taken out and be repaired or replaced.In whole process, the position between heat conductive silica gel 21 and heat-conducting plate 30 can not produce displacement yet, and heat conductive silica gel 21 can not come off from heat-conducting plate 30 yet.
Understandably, above-mentioned each technical characterictic can combination in any be used and unrestricted.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (6)
1. the movable conductive structure of slip-off preventing, comprise for compressible heat-conducting medium (20) being resisted against to the heat-conducting plate (30) on pcb board (10), it is characterized in that, described heat-conducting plate (30) be provided with described pcb board (10) on the lead (31) of location hole (11) matched in clearance, described lead (31) comprises the link (32) relative with described heat-conducting plate (30), and described link (32) stretches out and exposes to described pcb board (10);
The movable conductive structure of described slip-off preventing also comprises locking part (40), described locking part (40) is detachably arranged on described link (32), upper described heat-conducting plate (30) is installed to movably to described pcb board (10), and prevent that described heat-conducting plate (30) from departing from from described pcb board (10);
Described heat-conducting plate (30) and described pcb board (10) clamp fixing by described heat-conducting medium (20).
2. the movable conductive structure of slip-off preventing according to claim 1, is characterized in that, the end face of described link (32) is provided with screw thread lockhole (33), and described locking part (40) is screw or the screw corresponding with described lockhole (33).
3. the movable conductive structure of slip-off preventing according to claim 1 and 2, is characterized in that, lead (31) comprises two.
4. the movable conductive structure of slip-off preventing according to claim 3, is characterized in that, described lead (31) is cylindrical.
5. the movable conductive structure of slip-off preventing according to claim 4, is characterized in that, the diameter of described lead (31) is less than the diameter of described pilot hole.
6. the movable conductive structure of slip-off preventing according to claim 1, is characterized in that, described heat-conducting plate (30) is the plate body of aluminium matter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310688023.1A CN103747608B (en) | 2013-12-13 | 2013-12-13 | A kind of Anti-off movable heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310688023.1A CN103747608B (en) | 2013-12-13 | 2013-12-13 | A kind of Anti-off movable heat conduction structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103747608A true CN103747608A (en) | 2014-04-23 |
| CN103747608B CN103747608B (en) | 2017-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310688023.1A Active CN103747608B (en) | 2013-12-13 | 2013-12-13 | A kind of Anti-off movable heat conduction structure |
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| Country | Link |
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| CN (1) | CN103747608B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN110888506B (en) * | 2019-11-29 | 2021-06-25 | 深圳市核芯智联科技开发有限公司 | Multimedia dual-core industrial control mainboard |
| WO2023087587A1 (en) * | 2021-11-16 | 2023-05-25 | 中兴通讯股份有限公司 | Optional module heat dissipation apparatus and communication device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101466233A (en) * | 2007-12-21 | 2009-06-24 | 富准精密工业(深圳)有限公司 | Radiator and fixed device for hot pipe |
| CN202018554U (en) * | 2011-04-08 | 2011-10-26 | 杭州亿视电子系统工程有限公司 | Internal heat dissipating structure of high-definition web camera |
| CN102280417A (en) * | 2010-06-08 | 2011-12-14 | 上海景文材料科技发展有限公司 | Heat radiation device for circuit board |
| CN102686086A (en) * | 2012-05-17 | 2012-09-19 | 华为技术有限公司 | Radiating device and electronic component provided with same |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
| CN203722910U (en) * | 2013-12-13 | 2014-07-16 | 深圳市同为数码科技股份有限公司 | Fall-proof movable heat conduction structure |
-
2013
- 2013-12-13 CN CN201310688023.1A patent/CN103747608B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101466233A (en) * | 2007-12-21 | 2009-06-24 | 富准精密工业(深圳)有限公司 | Radiator and fixed device for hot pipe |
| CN102280417A (en) * | 2010-06-08 | 2011-12-14 | 上海景文材料科技发展有限公司 | Heat radiation device for circuit board |
| CN202018554U (en) * | 2011-04-08 | 2011-10-26 | 杭州亿视电子系统工程有限公司 | Internal heat dissipating structure of high-definition web camera |
| CN102686086A (en) * | 2012-05-17 | 2012-09-19 | 华为技术有限公司 | Radiating device and electronic component provided with same |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
| CN203722910U (en) * | 2013-12-13 | 2014-07-16 | 深圳市同为数码科技股份有限公司 | Fall-proof movable heat conduction structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN106255313B (en) * | 2016-08-30 | 2018-10-02 | 无锡市同步电子制造有限公司 | A kind of preparation of circuit board heat dissipation cold plate and adhering method |
| CN110888506B (en) * | 2019-11-29 | 2021-06-25 | 深圳市核芯智联科技开发有限公司 | Multimedia dual-core industrial control mainboard |
| WO2023087587A1 (en) * | 2021-11-16 | 2023-05-25 | 中兴通讯股份有限公司 | Optional module heat dissipation apparatus and communication device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103747608B (en) | 2017-03-15 |
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Effective date of registration: 20221206 Address after: No. 2 Xingke East Road, Dongjiang Hi tech Industrial Park, Zhongkai Hi tech Zone, Huizhou City, Guangdong Province 516000 Patentee after: Huizhou Tongwei Digital Technology Co.,Ltd. Address before: 518000 Room E, North 6th Floor, CEC Lighting R&D Center, South District, High tech Industrial Park, Nanshan District, Shenzhen, Guangdong Patentee before: TVT DIGITAL TECHNOLOGY Co.,Ltd. |