CN104159391A - Heat dissipation device for terminal, and terminal - Google Patents
Heat dissipation device for terminal, and terminal Download PDFInfo
- Publication number
- CN104159391A CN104159391A CN201310180342.1A CN201310180342A CN104159391A CN 104159391 A CN104159391 A CN 104159391A CN 201310180342 A CN201310180342 A CN 201310180342A CN 104159391 A CN104159391 A CN 104159391A
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- Prior art keywords
- terminal
- components
- parts
- heat
- heat dissipating
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cookers (AREA)
- Central Heating Systems (AREA)
Abstract
The embodiments of the present invention provide a heat dissipation device for a terminal, and a terminal. In one embodiment, the terminal comprises a printed circuit board and an element disposed on the printed circuit board. The heat dissipation device is a heat dissipation cover, and the heat dissipation cover is directly arranged above the element for leading out heat generated by the element during working. According to the invention, the heat dissipation cover is disposed in the terminal and is directly located on the printed circuit board in the terminal, heat generated by the element is conducted evenly by use of the heat conduction property of the heat dissipation cover, and therefore, the problem of local overheating that occurs when the terminal runs is resolved, and the user experience is improved.
Description
Technical field
The present invention relates to terminal applies field, particularly relate to a kind of heat abstractor for terminal and terminal.
Background technology
Along with the development of the communication technology, terminal, the particularly intelligent terminal based on 3G (Third Generation) Moblie technology and long evolving system, the dominant frequency of its internal main chip is more and more higher, memory access rate is more and more faster, radio-frequency (RF) power amplification and power management power consumption are also corresponding more and more higher, therefore, the radiating treatment of terminal are just seemed and are even more important.
Fig. 1 is the structural representation of the pcb board of terminal in prior art, and Fig. 2 is the structural representation of the radome of terminal in prior art; Known with reference to Fig. 1, these high power devices of terminal inner, as devices such as core cpu, power management power consumptions, caloric value increasing, and the heat that other components and parts whens work distributes is less than the caloric value of these high power devices conventionally, this can cause the problem of terminal local overheating; And, in the prior art, for fear of the phase mutual interference of signal between each components and parts, often need to shielding construction be set respectively for each high power device, the shielding cavity that in radome as shown in Figure 2 and Fig. 1, the shielded rack shown in dotted portion forms, this will further aggravate the local overheating of terminal.
Therefore, providing a kind of technology that can solve terminal local problems of excessive heat in the time of work, is those skilled in the art's technical problems urgently to be resolved hurrily.
Summary of the invention
The invention provides a kind of heat abstractor and terminal that is applied to terminal, solved the problem of terminal local overheating in current techniques.
The invention provides a kind of heat abstractor that is applied to terminal, in one embodiment, terminal comprises printing board PCB, is arranged at the components and parts on printed circuit board (PCB); Heat abstractor is a heat dissipating housing, and heat dissipating housing is directly arranged at components and parts tops, and the heat producing when components and parts are worked is derived.
Preferably, the heat dissipating housing shown in above-described embodiment comprises cover body and heat dissipating layer, and heat dissipating layer is between components and parts and cover body, and the heat producing when components and parts are worked exports to cover body.
Preferably, the cover body shown in above-described embodiment is formed in one.
Preferably, the material of the cover body shown in above-described embodiment is highly heat-conductive material.
Preferably, the set-up mode of the heat dissipating layer shown in above-described embodiment comprises: the space between printed circuit board (PCB) and cover body is filled with heat dissipating layer completely; Or one end of heat dissipating layer is connected with the heating face of at least one components and parts, the other end is connected with cover body.
Preferably, the heat dissipating layer shown in above-described embodiment is thermal grease layer or omnidirectional's conducting foam layer.
Preferably, other components and parts work of the signal interfered with terminal that heat dissipating housing shown in above-described embodiment produces while also work for the components and parts on shielded printed circuit board, and/or the signal that other components and parts of shield terminal produce while work disturbs the components and parts work on printed circuit board (PCB).
In order to address the above problem, the present invention also provides a kind of terminal, in one embodiment, this terminal comprises: printed circuit board (PCB), be arranged at components and parts and heat abstractor provided by the invention on printed circuit board (PCB), heat abstractor is a heat dissipating housing, heat dissipating housing is directly arranged at components and parts tops, and the heat producing when components and parts are worked is derived.
Preferably, the mobile terminal shown in above-described embodiment also comprises shielded rack, and shielded rack is arranged on printed circuit board (PCB), by the components and parts subregion isolation on printed circuit board (PCB).
Preferably, the shielded rack shown in above-described embodiment is one-body molded.
Beneficial effect of the present invention:
Heat abstractor provided by the invention and terminal, by a heat dissipating housing is set in terminal, this heat dissipating housing is located immediately in terminal on printed circuit board (PCB), the heat that the components and parts that are arranged on this printed circuit board (PCB) are produced all gathers, utilize the thermal conduction characteristic of this heat dissipating housing, the heat that all components and parts are produced evenly conducts and is disseminated in air, has solved existing terminal in the time of operation, the local overheating problem occurring, has strengthened user's experience.
Brief description of the drawings
Fig. 1 is the structural representation of the pcb board of terminal in prior art;
Fig. 2 is the structural representation of the radome of terminal in prior art;
The structural representation of the heat abstractor that Fig. 3 provides for one embodiment of the invention;
The structural representation of the heat abstractor that Fig. 4 provides for another embodiment of the present invention;
The structural representation of pcb board in the terminal that Fig. 5 provides for one embodiment of the invention.
Embodiment
Heat abstractor provided by the invention can be widely used in various terminals, to solve its heat production/inhomogeneous too high problem of terminal equipment local temperature being caused of dispelling the heat, as mobile phone, panel computer, notebook computer etc., below taking terminal as mobile phone and by specific embodiment mode by reference to the accompanying drawings, the present invention is made to further annotation explanation.
The structural representation of the heat abstractor that Fig. 3 provides for one embodiment of the invention, known with reference to Fig. 3, in the present embodiment, the heat abstractor 3 that is applied to terminal provided by the invention is a heat dissipating housing, now, and in conjunction with Fig. 1, known, terminal comprises printed circuit board (PCB), is arranged at the multiple components and parts on printed circuit board (PCB), and its distributed areas are as shown in the components and parts district in Fig. 1 and Fig. 5; Heat dissipating housing is directly arranged at components and parts tops, and the heat producing when components and parts are worked is derived.
In other embodiments, the heat dissipating housing shown in Fig. 3 should be greater than the setting area that components and parts are set on PCB; Preferably, the shape of this heat dissipating housing is mated with the setting area that components and parts are set on PCB, and be slightly larger than this setting area, the effect arranging like this has: guarantee can solve the PCB inhomogeneous problem of dispelling the heat, and can not affect the layout of other components and parts of terminal, the making material that can save again heat dissipating housing, has reduced production cost.
The structural representation of the heat abstractor that Fig. 4 provides for another embodiment of the present invention, as shown in Figure 4, in the present embodiment, heat abstractor 3 provided by the invention is a heat dissipating housing, and, this heat dissipating housing comprises cover body 31 and heat dissipating layer 32, and heat dissipating layer is between components and parts and cover body, and the heat producing when components and parts are worked exports to cover body;
In the embodiment shown in fig. 4, heat dissipating layer 32 does not cover cover body 31 completely, but only with pcb board on high power device corresponding position be provided with heat dissipating layer 32, to accelerate heat that these high power devices are produced other position transmission rates to terminal equipment, strengthen heat conduction speed, also needn't increase too large cost, simultaneously, can also store to a certain extent some heats, slow down the temperature increase rate of terminal equipment; In other embodiments, heat dissipating layer 32 can cover cover body 31 completely, although can increase like this production cost, can increase also heat accumulation effect and heat-conducting effect, can also avoid terminal equipment privately to be opened by non-maintenance personal, to cause guarantee disagreement.
Preferably, in other embodiments, the structure that the cover body 31 shown in Fig. 4 is formed in one; By one-body molded cover body 31 material variety that not only reduces heat dissipating housing, integral type UNICOM region is larger, more attractive in appearance, is conducive to heat conduction and is distributed to whole terminal equipment, has solved the too high problem of the existing terminal equipment local temperature of prior art.
Preferably, in other embodiments, the material of the cover body 31 shown in Fig. 4 is highly heat-conductive material, as copper etc., adopts highly heat-conductive material to manufacture the cover body 31 of heat dissipating housing, can be from the problem of further solution terminal local overheating.
Preferably, in other embodiments, the heat dissipating layer 32 shown in Fig. 4 is thermal grease layer or omnidirectional's conducting foam layer, certainly, can also be the heat dissipating layer that other the Heat Conduction Material that possesses better thermal conduction effect forms; The present embodiment heat dissipating layer is set to thermal grease layer and/or omnidirectional's conducting foam layer is because this bi-material possesses good heat-conducting effect, and cheap, is beneficial to the manufacturing cost of control terminal.
Preferably, in other embodiments, heat dissipating layer 32 set-up modes shown in Fig. 4 are: the space between printed circuit board (PCB) and cover body 31 is filled with heat dissipating layer 32 completely; Or one end of heat dissipating layer 32 is connected with the heating face of at least one components and parts, the other end is connected with cover body 31; Concrete is:
While selecting components and parts, generally select according to the electric quantity consumption of each components and parts and/or heat production speed, the preferential large and/or high components and parts of heat production speed of electric quantity consumption of selecting, because these type of components and parts are in the time of work, can produce fast a large amount of heats, if conducted not in time, just the phenomenon of this type of components and parts region excess Temperature will be caused; After selecting components and parts, the space at this components and parts place can be filled to heat dissipating layer 32 completely, the size of institute's packing space can be determined according to actual needs, can also not select components and parts, directly the space between pcb board and cover body 32 is all filled, to reach best hot laser propagation effect, but exist cost slightly to increase; Accordingly, also can only will between the heating face of these components and parts and cover body 31, fill heat dissipating layer 32, although its radiating effect is slightly worse than the former, production cost can reduce accordingly.
In terminal, each components and parts, in the time of normal work, can produce a large amount of signals, between these signals, may interfere with each other, and in the prior art, independent shield member need to be set and carry out signal shielding; In the present invention, heat abstractor provided by the invention, also be that integrated heat dissipating housing also has signal shielding effect, other components and parts work of the signal interfered with terminal producing while work for the components and parts on shielded printed circuit board, and/or the signal that other components and parts of shield terminal produce while work disturbs the components and parts work on printed circuit board (PCB).
The structural representation of pcb board in the terminal that Fig. 5 provides for one embodiment of the invention, as shown in Figure 5, in the present embodiment, terminal provided by the invention comprises: printed circuit board (PCB), be arranged at components and parts and heat abstractor provided by the invention 3 on printed circuit board (PCB), heat abstractor 3 is a heat dissipating housing, heat dissipating housing is directly arranged at components and parts tops, and the heat producing when components and parts are worked is derived.
Preferably, known with reference to Fig. 5, in other embodiments, on printed circuit board (PCB), be also provided with the shielded rack as shown in Fig. 5 dotted line, shielded rack is by the components and parts subregion isolation on printed circuit board (PCB), for avoiding the phase mutual interference of signal between components and parts; Preferably, can only carry out subregion isolation processing for high power device, ensure on the basis of isolation effect, can also production control cost.
Preferably, known with reference to Fig. 5, in other embodiments, the shielded rack in above-described embodiment is one-body molded; Adopt integrated shielded rack compared with the separate type shielded rack shown in Fig. 1, not only save material, control production cost, there is better shield effectiveness compared with existing separate type shielded rack, and, also can strengthen to a certain extent heat conducting efficiency, contribute to alleviate the phenomenon of the local excess Temperature of terminal.
In summary, by enforcement of the present invention, at least there is following beneficial effect:
First: by a heat dissipating housing is set in terminal, this heat dissipating housing is located immediately in terminal on printed circuit board (PCB), the heat that the components and parts that are arranged on this printed circuit board (PCB) are produced all gathers, utilize the thermal conduction characteristic of this heat dissipating housing, the heat that all components and parts are produced evenly conducts, this heat dissipating housing can conduct heat to rapidly overall printing circuit board pcb board, and be unlikely to PCB local overheating, solve existing terminal in the time of operation, the local overheating problem occurring, has strengthened user's experience;
Secondly, heat dissipating layer is set in heat dissipating housing, can increases radiating effect, and can store a part of heat, further strengthened heat transfer effect;
Again, this heat dissipating housing also possesses signal shielding effect, shield member need to be set separately on PCB, except reducing production costs, terminal inner radiating component and shield member are also simplified, by both unifications, reduce the complexity of terminal equipment member, make the further thinning of terminal become possibility;
Finally, existing separate type shielded rack is made of one, has not only increased signal shielding effect, also increased to a certain extent heat-conducting effect, further alleviate the phenomenon of the local excess Temperature of terminal in prior art.
Below be only the specific embodiment of the present invention; not the present invention is done to any pro forma restriction; any simple modification, equivalent variations or modification that every foundation technical spirit of the present invention is done above execution mode, all still belong to the protection range of technical solution of the present invention.
Claims (10)
1. for a heat abstractor for terminal, described terminal comprises printed circuit board (PCB), is arranged at the components and parts on described printed circuit board (PCB); It is characterized in that, described heat abstractor is a heat dissipating housing, and described heat dissipating housing is directly arranged at described components and parts top, and the heat producing when by described components and parts work is derived.
2. the heat abstractor for terminal as claimed in claim 1, it is characterized in that, described heat dissipating housing comprises cover body and heat dissipating layer, and described heat dissipating layer is between described components and parts and described cover body, and the heat producing when by the work of described components and parts exports to described cover body.
3. the heat abstractor for terminal as claimed in claim 2, is characterized in that, described cover body is one-body molded.
4. the heat abstractor for terminal as claimed in claim 2, is characterized in that, the material of described cover body is highly heat-conductive material.
5. the heat abstractor for terminal as claimed in claim 2, is characterized in that, the set-up mode of described heat dissipating layer comprises: the space between described printed circuit board (PCB) and described cover body is filled with described heat dissipating layer completely; Or one end of described heat dissipating layer is connected with the heating face of at least one components and parts, the other end is connected with described cover body.
6. the heat abstractor for terminal as claimed in claim 2, is characterized in that, described heat dissipating layer is thermal grease layer or omnidirectional's conducting foam layer.
7. the heat abstractor for terminal as described in claim 1 to 6 any one, it is characterized in that, the signal that described heat dissipating housing also produces when shielding the work of components and parts on described printed circuit board (PCB) disturbs other components and parts work of described terminal, and/or the signal producing while shielding other components and parts work of described terminal disturbs the components and parts work on described printed circuit board (PCB).
8. a terminal, it is characterized in that, comprise: printed circuit board (PCB), be arranged at the components and parts on described printed circuit board (PCB) and the heat abstractor as described in claim 1 to 7 any one, described heat abstractor is a heat dissipating housing, described heat dissipating housing is directly arranged at described components and parts top, and the heat producing when by described components and parts work is derived.
9. terminal as claimed in claim 8, is characterized in that, described mobile terminal also comprises shielded rack, and described shielded rack is arranged on described printed circuit board (PCB), by the components and parts subregion isolation on described printed circuit board (PCB).
10. terminal as claimed in claim 9, is characterized in that, described shielded rack is one-body molded.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180342.1A CN104159391A (en) | 2013-05-15 | 2013-05-15 | Heat dissipation device for terminal, and terminal |
| PCT/CN2013/082873 WO2013189463A2 (en) | 2013-05-15 | 2013-09-03 | Heat dispersion device and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180342.1A CN104159391A (en) | 2013-05-15 | 2013-05-15 | Heat dissipation device for terminal, and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104159391A true CN104159391A (en) | 2014-11-19 |
Family
ID=49769600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310180342.1A Pending CN104159391A (en) | 2013-05-15 | 2013-05-15 | Heat dissipation device for terminal, and terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104159391A (en) |
| WO (1) | WO2013189463A2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323996A (en) * | 2015-12-09 | 2016-02-10 | 江苏天安智联科技股份有限公司 | Car-mounted enclosure with heat radiation function |
| CN105611716A (en) * | 2016-01-21 | 2016-05-25 | 广东欧珀移动通信有限公司 | Mainboard cooling structure of mobile terminal and mobile terminal |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4811165A (en) * | 1987-12-07 | 1989-03-07 | Motorola, Inc. | Assembly for circuit modules |
| JPH043498A (en) * | 1990-04-20 | 1992-01-08 | Oki Electric Ind Co Ltd | Direct mounting power amplifier |
| JPH0567893A (en) * | 1991-09-10 | 1993-03-19 | Mitsubishi Electric Corp | Local shielding method for circuit board |
| US5369552A (en) * | 1992-07-14 | 1994-11-29 | Ncr Corporation | Multi-chip module with multiple compartments |
| US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
| US20050111194A1 (en) * | 2003-11-21 | 2005-05-26 | Lg Electronics Inc. | Heat radiating system and method for a mobile communication terminal |
| CN1784136A (en) * | 2004-12-01 | 2006-06-07 | 展讯通信（上海）有限公司 | Radiator for mobile communication device |
| KR20080082744A (en) * | 2007-03-09 | 2008-09-12 | 삼성전자주식회사 | Heat radiating apparatus for device |
| JP2008270537A (en) * | 2007-04-20 | 2008-11-06 | Yokogawa Electric Corp | Heat dissipation arrangement of electronic part |
| CN101415316A (en) * | 2008-08-21 | 2009-04-22 | 深圳华为通信技术有限公司 | Electronic device and manufacturing method thereof |
| CN101413651A (en) * | 2007-10-19 | 2009-04-22 | 浩然科技股份有限公司 | Sealed type power supply apparatus modularization apparatus |
| CN201263290Y (en) * | 2008-10-06 | 2009-06-24 | 深圳华为通信技术有限公司 | Electromagnetic shielding device and shielding module with radiating function |
| CN101690442A (en) * | 2007-07-09 | 2010-03-31 | 大自达系统电子株式会社 | High frequency module having shielding and heat dissipating characteristics and method for manufacturing the same |
| CN202026562U (en) * | 2011-03-11 | 2011-11-02 | 深圳瑞谷电子有限公司 | Shielding hood with radiation function |
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN202310446U (en) * | 2011-11-11 | 2012-07-04 | 上海广电影视制作有限公司 | Circuit board with radiator |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
| CN102802379A (en) * | 2011-06-29 | 2012-11-28 | 深圳光启高等理工研究院 | Radiation component and electronic equipment |
-
2013
- 2013-05-15 CN CN201310180342.1A patent/CN104159391A/en active Pending
- 2013-09-03 WO PCT/CN2013/082873 patent/WO2013189463A2/en active Application Filing
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4811165A (en) * | 1987-12-07 | 1989-03-07 | Motorola, Inc. | Assembly for circuit modules |
| JPH043498A (en) * | 1990-04-20 | 1992-01-08 | Oki Electric Ind Co Ltd | Direct mounting power amplifier |
| JPH0567893A (en) * | 1991-09-10 | 1993-03-19 | Mitsubishi Electric Corp | Local shielding method for circuit board |
| US5369552A (en) * | 1992-07-14 | 1994-11-29 | Ncr Corporation | Multi-chip module with multiple compartments |
| US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
| US20050111194A1 (en) * | 2003-11-21 | 2005-05-26 | Lg Electronics Inc. | Heat radiating system and method for a mobile communication terminal |
| CN1784136A (en) * | 2004-12-01 | 2006-06-07 | 展讯通信（上海）有限公司 | Radiator for mobile communication device |
| KR20080082744A (en) * | 2007-03-09 | 2008-09-12 | 삼성전자주식회사 | Heat radiating apparatus for device |
| JP2008270537A (en) * | 2007-04-20 | 2008-11-06 | Yokogawa Electric Corp | Heat dissipation arrangement of electronic part |
| CN101690442A (en) * | 2007-07-09 | 2010-03-31 | 大自达系统电子株式会社 | High frequency module having shielding and heat dissipating characteristics and method for manufacturing the same |
| CN101413651A (en) * | 2007-10-19 | 2009-04-22 | 浩然科技股份有限公司 | Sealed type power supply apparatus modularization apparatus |
| CN101415316A (en) * | 2008-08-21 | 2009-04-22 | 深圳华为通信技术有限公司 | Electronic device and manufacturing method thereof |
| CN201263290Y (en) * | 2008-10-06 | 2009-06-24 | 深圳华为通信技术有限公司 | Electromagnetic shielding device and shielding module with radiating function |
| CN202026562U (en) * | 2011-03-11 | 2011-11-02 | 深圳瑞谷电子有限公司 | Shielding hood with radiation function |
| CN102802379A (en) * | 2011-06-29 | 2012-11-28 | 深圳光启高等理工研究院 | Radiation component and electronic equipment |
| CN202310446U (en) * | 2011-11-11 | 2012-07-04 | 上海广电影视制作有限公司 | Circuit board with radiator |
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN102711416A (en) * | 2012-05-24 | 2012-10-03 | 中兴通讯股份有限公司 | Heat dissipation processing device and mobile terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323996A (en) * | 2015-12-09 | 2016-02-10 | 江苏天安智联科技股份有限公司 | Car-mounted enclosure with heat radiation function |
| CN105611716A (en) * | 2016-01-21 | 2016-05-25 | 广东欧珀移动通信有限公司 | Mainboard cooling structure of mobile terminal and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013189463A3 (en) | 2014-04-17 |
| WO2013189463A2 (en) | 2013-12-27 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141119 |
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| RJ01 | Rejection of invention patent application after publication |