CN102548365A - Mobile terminal with high heat radiation performance - Google Patents

Mobile terminal with high heat radiation performance Download PDF

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Publication number
CN102548365A
CN102548365A CN2012100156398A CN201210015639A CN102548365A CN 102548365 A CN102548365 A CN 102548365A CN 2012100156398 A CN2012100156398 A CN 2012100156398A CN 201210015639 A CN201210015639 A CN 201210015639A CN 102548365 A CN102548365 A CN 102548365A
Authority
CN
China
Prior art keywords
chip
heat
portable terminal
screening cover
shielding cover
Prior art date
Application number
CN2012100156398A
Other languages
Chinese (zh)
Inventor
张帆
Original Assignee
惠州Tcl移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州Tcl移动通信有限公司 filed Critical 惠州Tcl移动通信有限公司
Priority to CN2012100156398A priority Critical patent/CN102548365A/en
Publication of CN102548365A publication Critical patent/CN102548365A/en

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Abstract

The invention discloses a mobile terminal with a high heat radiation performance. The mobile terminal comprises a PCB (Printed Circuit Board), a chip, a shielding cover and a heat conducting gad, wherein the chip and the shielding cover are arranged on the PCB; the shielding cover is covered above the chip; the chip comprises a heat chip; the heat conducting pad is arranged between the heating chip and the shielding cover; and the heat conducting pad is attached to the upper surface of the heating chip and is supported against the shielding cover in a connection manner. According to the mobile terminal with the high heat radiation performance, disclosed by the invention, because the heat conducting pad is additionally arranged between the heating chip and the shielding cover, the heat generated by the heat chip can be transferred onto the shielding cover. A copper foil capable of increasing heat radiating area and heat radiating efficiency is additionally arranged above the shielding cover, so that the heat is radiated out through the copper foil. According to the invention, through simple structural improvement, the heat radiating performance of the chip can be increased greatly without redesign of a circuit and layout alternation of various functional elements, and a very strong practicability is achieved.

Description

A kind of portable terminal of high heat dispersion
Technical field
The present invention relates to the mobile terminal device field, relate in particular to a kind of portable terminal of high heat dispersion.
Background technology
Existing portable terminal is as shown in Figure 1, is provided with pcb board 100 in the portable terminal 150, and this pcb board 100 is provided with plurality of chips 130, and chip 130 peripheries are provided with screening cover 120, also has the circuit element 140 with chip 130 couplings in the screening cover 120.Said chip 130 certainly leads to heat in the course of the work, and distributing of its heat mainly is to rely on heat loss through radiation, and the heat transference efficiency of radiation is lower, so this heat can cause chip 130 temperature to rise.And the work of each chip all has certain temperature range requirement, when temperature exceeds its operating temperature range, and anomaly such as can cause chip efficient to reduce, power output is forbidden, burnt.
To this problem, at present traditional solution is: 1, design circuit again; 2, layout printed circuit board (PCB) again changes the layout of each function element; 3, the material that improves printed circuit board (PCB) is to strengthen the chip cooling performance.
Though the tradition solution can solve heating problem to a certain extent, but these solutions need change pcb board, issue Gerber again.If in the later stage of a development project, just find heating problem, above method all is unpractical, can cause project process to postpone significantly because change PCB.And after the typing of project Electronic Design; When project is carried out processor speed-raising or other compatible fully chips of base pin selection when substituting former design chips; Also possibly cause heating property to exceed the chip specification requirement; Traditional like this solution is owing to need correcting (promptly change PCB comprise change circuit design), thereby increased the research and development expense and prolonged the construction cycle.
Therefore, prior art awaits to improve and development.
Summary of the invention
In view of the deficiency of above-mentioned prior art, the object of the present invention is to provide a kind of portable terminal of high heat dispersion, be intended to solve the problem of existing mobile terminal chip weak heat-dissipating.
Technical scheme of the present invention is following:
A kind of portable terminal of high heat dispersion comprises pcb board and is arranged on chip and the screening cover on the said pcb board that said screening cover is located at the top of said chip, and wherein, the portable terminal of said high heat dispersion also comprises heat conductive pad; Said chip comprises euthermic chip, and said heat conductive pad is arranged between euthermic chip and the screening cover, and said heat conductive pad sticks to the upper surface of euthermic chip and connects with screening cover.
Described portable terminal, wherein, said heat conductive pad is one to be rich in the cushion of metal ingredient.
Described portable terminal, wherein, the size of said heat conductive pad is identical with the upper surface of said euthermic chip with shape.
Described portable terminal, wherein, the portable terminal of said high heat dispersion also comprises Copper Foil, said Copper Foil is fixed on the said screening cover through conducting resinl.
Described portable terminal, wherein, said conducting resinl is rich in metal ingredient.
Described portable terminal, wherein, said euthermic chip is a WWAN power amplifier chip.
Described portable terminal, wherein, said portable terminal is a mobile phone.
Beneficial effect: the portable terminal of high heat dispersion of the present invention, owing between chip and screening cover, set up heat conductive pad, thereby the heat transferred that can chip be produced is to screening cover; And above screening cover, set up and can improve the Copper Foil of area of dissipation and radiating efficiency, thereby heat is radiate through Copper Foil, thus; The heat that chip produces is able to distribute fast, and its temperature also can significantly reduce, and the present invention is through simple architecture advances; Need not design again circuit; Need not to change the layout of each function element, can significantly improve the chip cooling performance, have very strong practicality.
Description of drawings
Fig. 1 is the generalized section of the heat dispersion structure of portable terminal in the prior art.
Fig. 2 is the generalized section of the heat dispersion structure of the portable terminal of high heat dispersion of the present invention.
Embodiment
The present invention provides a kind of portable terminal of high heat dispersion, and is clearer, clear and definite for making the object of the invention, technical scheme and effect, below to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Portable terminal of the present invention can be a mobile phone, also can be other hand-held mobile terminals.In the prior art, because chip is a radiation mode to the thermaltransmission mode between its screening cover, efficient is very low, and its heat nearly all accumulates in around the chip, and temperature rise is bigger, weak heat-dissipating.Mode through heat conduction among the present invention has promptly increased heat conductive pad around euthermic chip or Copper Foil carries out heat conduction, has improved heat transference efficiency greatly, has increased area of dissipation, and the heat dispersion of portable terminal of the present invention is improved greatly.
In the present invention, said heat conductive pad mainly is to stick on the euthermic chip.Because when cell-phone heating generally is some chip operation; The heat that the chip internal circuit produces; Can't in time shed causes temperature higher, and corresponding matched circuit (resistance, electric capacity, inductance, magnetic bead, crystal oscillator etc.) can not be the principal element of heating than big electric current.Therefore, what be primarily aimed in the design in the present invention is euthermic chip, like WWAN power amplifier chip.
See also Fig. 2, Fig. 2 is the structural representation of the portable terminal of high heat dispersion of the present invention, and as shown in Figure 2, the portable terminal 280 of high heat dispersion of the present invention comprises pcb board 200, chip, screening cover 210 and match circuit 270; Said chip, screening cover 210, heat conductive pad 240 and match circuit 270 are arranged on the pcb board 200; Said screening cover 210 is located at the top of chip.Comprise euthermic chip 260 in the said chip, improvement of the present invention is, on said euthermic chip 260, sets up a heat conductive pad 240, and said heat conductive pad 240 sticks on the euthermic chip 260 and with screening cover 210 and connects.The present invention is not changing on the Electronic Design basis of mobile phone printed circuit board (PCB); Increase heat conductive pad 240 between the euthermic chip 260 of need protections and screening cover 210; The heating of euthermic chip 260 is transmitted on the screening cover 210; Change original heat loss through radiation mode the radiating mode of heat conduction into, increased heat transference efficiency, the heat dispersion of portable terminal is improved greatly.
Wherein, said screening cover 210 is crown caps that different function units designs for fear of mutual radiated interference in the portable terminal.Said pcb board 200, screening cover, match circuit, chip etc. all are fixed on the pcb board 200 through the paster mode, form printed circuit board (PCB).Said match circuit 270 is arranged on the relevant matches circuit corresponding elements in the corresponding screening cover of euthermic chip 260 210.
Said heat conductive pad 240 is one to be rich in the cushion of metal ingredient, simultaneously is coated with one deck adhesive-layer at that joins with euthermic chip 260, is used for the fixing of heat conductive pad 240 and euthermic chip 260.The area shape size of the size of said heat conductive pad 240 and the upper surface of euthermic chip 260 is consistent, highly equal the height in gap between euthermic chip 260 and the screening cover 210.In the portable terminal paster, heat conductive pad 240 covers on the euthermic chip 260, avoids heat conductive pad 240 to contact with match circuit 270, prevents 270 short circuits of match circuit.Because the shell of euthermic chip 260 is silicon materials, so though heat conductive pad 240 is conductors, also can not cause short circuit.
The portable terminal 280 of said high heat dispersion can also comprise a Copper Foil 250 and conducting resinl 220, and said Copper Foil 250 is fixed on the said screening cover 210 through conducting resinl 220.Said conducting resinl 220 is used for Copper Foil 250 is connected with screening cover 210 fixing.In addition, this conducting resinl 220 is rich in metal ingredient, can heat be delivered on the Copper Foil 250 by screening cover 210, makes and transmits heat between the two more fully.
But said Copper Foil 250 monolithics cover respectively on each screening cover 210.Be more preferably, said Copper Foil 250 is for being wholely set, and promptly a slice Copper Foil 250 covers on the screening cover 210 as much as possible.Do not have screening cover and higher relatively element area can hollow out processing for some; Copper Foil 250 is covered on the screening cover of all chips as far as possible; Thereby further improve area of dissipation, heat is distributed through Copper Foil 250, significantly reduce euthermic chip 260 temperature.The heat that so is transmitted to screening cover 210 is transmitted on the Copper Foil 250 through conducting resinl 220 again, because the area of Copper Foil 250 is very big, promptly swept area is very big, thus accelerated heat radiation, thus reduced the temperature of euthermic chip 260.
The heat transferred that the mode of the present invention through heat conduction produced euthermic chip 260 is to Copper Foil 250; Dispel the heat through Copper Foil 250; And the area of dissipation of Copper Foil 250 is far longer than the area of dissipation of euthermic chip 260, so that the heat dispersion of portable terminal of the present invention 280 improves greatly, and the present invention has also kept the mode that other chips dispel the heat through radiation; Promptly on the lower chip of other heatings, do not increase heat conductive pad, guaranteed that further other chips are unaffected.
Specifically; On the pcb board 200 of the present invention a plurality of chips can be set, for example receiver chip, WIFI power amplifier chip, WWAN power amplifier chip, GPS chip, baseband chip, Bluetooth chip, power management chip, internal memory and audio-frequency power amplifier chip etc.Wherein, WWAN power amplifier chip can be GSM power amplifier chip or 3G power amplifier chip.Temperature is too high during said WWAN power amplifier chip operation, and other chip temperatures are normal, and said WWAN power amplifier chip is euthermic chip, need carry out the chip of heat radiation protection.In the prior art, because WWAN power amplifier chip is a radiation mode to the thermaltransmission mode between its screening cover, efficient is very low, thereby heat almost accumulates in around the WWAN power amplifier chip, and temperature rise is bigger.And in the present invention, be between euthermic chip 260 and screening cover 210, to increase by a heat conductive pad 240.Promptly between WWAN power amplifier chip and screening cover 210, heat conductive pad 240 is set.This heat conductive pad 240 is preferably suitable with the size shape of WWAN power amplifier chip; Be the upper surface that heat conductive pad 240 can cover WWAN power amplifier chip fully, so that heat conductive pad 240 can be transferred to screening cover 210 as much as possible with the heat that WWAN power amplifier chip is produced.In addition, heat conductive pad 240 is in contact with one another with match circuit 270 in the time of when attaching heat conductive pad 240, also will avoiding at paster, prevents that the situation of match circuit 270 short circuits from taking place.These heat conductive pad 240 upper ends contact with screening cover 210, and promptly the height of heat conductive pad 240 need just in time equal the distance between WWAN power amplifier chip upper end and screening cover 210 upper walls, and so, this heat conductive pad 240 can be with heat delivered to screening cover 210 tops.
Said screening cover 210 upper ends also are provided with Copper Foil 250, and this Copper Foil 250 covers on the screening cover 210, and this Copper Foil 250 can increase area of dissipation, further improves radiating rate and efficient.
When generally being some chip operation because of the portable terminal heating; The heat that the chip internal circuit produces can't in time distribute and cause its temperature higher; And corresponding matched circuit (for example resistance, electric capacity, inductance, magnetic bead, crystal oscillator etc.) can not produce big electric current, is not the principal element of heating, so match circuit is not the emphasis that the present invention carries out heat radiation protection; But in some special circuits, also can be chosen in match circuit top and heat conductive pad is set carries out heat conduction and handle.
The portable terminal of high heat dispersion of the present invention; Owing between euthermic chip and screening cover, set up heat conductive pad; Thereby the heat transferred that can euthermic chip be produced is to screening cover; And above screening cover, set up and to have improved the Copper Foil of area of dissipation and radiating efficiency, thereby heat is radiate through Copper Foil.Thus, the heat that euthermic chip produces is able to distribute fast, and its temperature also can significantly reduce.The present invention need not design circuit through simple architecture advances again, need not to change the layout of each function element, can significantly improve the euthermic chip heat dispersion, has very strong practicality.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, concerning those of ordinary skills, can improve or conversion that all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.

Claims (7)

1. the portable terminal of a high heat dispersion comprises pcb board and is arranged on chip and the screening cover on the said pcb board, and said screening cover is located at the top of said chip, it is characterized in that, the portable terminal of said high heat dispersion also comprises heat conductive pad; Said chip comprises euthermic chip, and said heat conductive pad is arranged between euthermic chip and the screening cover, and said heat conductive pad sticks to the upper surface of euthermic chip and connects with screening cover.
2. portable terminal according to claim 1 is characterized in that, said heat conductive pad is one to be rich in the cushion of metal ingredient.
3. portable terminal according to claim 1 is characterized in that, the size of said heat conductive pad is identical with the upper surface of said euthermic chip with shape.
4. portable terminal according to claim 1 is characterized in that the portable terminal of said high heat dispersion also comprises Copper Foil, and said Copper Foil is fixed on the said screening cover through conducting resinl.
5. portable terminal according to claim 4 is characterized in that said conducting resinl is rich in metal ingredient.
6. portable terminal according to claim 1 is characterized in that, said euthermic chip is a WWAN power amplifier chip.
7. portable terminal according to claim 1 is characterized in that, said portable terminal is a mobile phone.
CN2012100156398A 2012-01-18 2012-01-18 Mobile terminal with high heat radiation performance CN102548365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012100156398A CN102548365A (en) 2012-01-18 2012-01-18 Mobile terminal with high heat radiation performance

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Application Number Priority Date Filing Date Title
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103037040A (en) * 2012-09-28 2013-04-10 共青城赛龙通信技术有限责任公司 Mobile phone centralized type heat dissipation mechanism
WO2013189463A2 (en) * 2013-05-15 2013-12-27 中兴通讯股份有限公司 Heat dispersion device and terminal
CN104602366A (en) * 2013-10-30 2015-05-06 太阳诱电株式会社 Communication module
CN105828571A (en) * 2015-10-21 2016-08-03 维沃移动通信有限公司 Shielding and heat-dissipation structure of electronic device chip and electronic device
CN106209122A (en) * 2016-07-18 2016-12-07 孙海华 The radio frequency integrated structure of transmitter
CN107454737A (en) * 2017-09-06 2017-12-08 广东欧珀移动通信有限公司 A kind of electronic equipment and its circuit board assemblies
CN110167316A (en) * 2018-02-12 2019-08-23 三星电机株式会社 The mounting structure of communication module and the communication module
CN110325012A (en) * 2018-03-28 2019-10-11 努比亚技术有限公司 Mobile terminal and its radiating subassembly
CN111148403A (en) * 2015-06-04 2020-05-12 华为技术有限公司 Mobile terminal and heat dissipation shielding structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090091888A1 (en) * 2007-10-09 2009-04-09 Chao-Chun Lin Emi shielding and heat dissipating structure
CN201278544Y (en) * 2008-09-12 2009-07-22 中兴通讯股份有限公司 Wireless communication terminal module
CN201584403U (en) * 2009-12-29 2010-09-15 华为技术有限公司 Chip cooling device and chip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090091888A1 (en) * 2007-10-09 2009-04-09 Chao-Chun Lin Emi shielding and heat dissipating structure
CN201278544Y (en) * 2008-09-12 2009-07-22 中兴通讯股份有限公司 Wireless communication terminal module
CN201584403U (en) * 2009-12-29 2010-09-15 华为技术有限公司 Chip cooling device and chip

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103037040A (en) * 2012-09-28 2013-04-10 共青城赛龙通信技术有限责任公司 Mobile phone centralized type heat dissipation mechanism
WO2013189463A2 (en) * 2013-05-15 2013-12-27 中兴通讯股份有限公司 Heat dispersion device and terminal
WO2013189463A3 (en) * 2013-05-15 2014-04-17 中兴通讯股份有限公司 Heat dispersion device and terminal
CN104159391A (en) * 2013-05-15 2014-11-19 中兴通讯股份有限公司 Heat dissipation device for terminal, and terminal
CN104602366A (en) * 2013-10-30 2015-05-06 太阳诱电株式会社 Communication module
CN111148403A (en) * 2015-06-04 2020-05-12 华为技术有限公司 Mobile terminal and heat dissipation shielding structure
CN105828571A (en) * 2015-10-21 2016-08-03 维沃移动通信有限公司 Shielding and heat-dissipation structure of electronic device chip and electronic device
CN106209122A (en) * 2016-07-18 2016-12-07 孙海华 The radio frequency integrated structure of transmitter
CN107454737A (en) * 2017-09-06 2017-12-08 广东欧珀移动通信有限公司 A kind of electronic equipment and its circuit board assemblies
CN110167316A (en) * 2018-02-12 2019-08-23 三星电机株式会社 The mounting structure of communication module and the communication module
CN110167316B (en) * 2018-02-12 2020-09-18 三星电机株式会社 Communication module and mounting structure of the same
US10999957B2 (en) 2018-02-12 2021-05-04 Samsung Electro-Mechanics Co., Ltd. Communication module and mounting structure thereof
CN110325012A (en) * 2018-03-28 2019-10-11 努比亚技术有限公司 Mobile terminal and its radiating subassembly

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Application publication date: 20120704

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