CN206042635U - Heat radiator of chip - Google Patents
Heat radiator of chip Download PDFInfo
- Publication number
- CN206042635U CN206042635U CN201620849647.6U CN201620849647U CN206042635U CN 206042635 U CN206042635 U CN 206042635U CN 201620849647 U CN201620849647 U CN 201620849647U CN 206042635 U CN206042635 U CN 206042635U
- Authority
- CN
- China
- Prior art keywords
- chip
- conductive pad
- groove
- heat conductive
- thermal pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat radiator of chip, the radiator comprises a radiator body, thermal pad and chip, set up a plurality of storage tanks that are used for holding thermal pad on the radiator body, at least one thermal pad is put in order in the storage tank of one of them, and thermal pad hugs closely the chip for the another side absorption of radiator body, it leads to groove I and the logical groove II of heat dissipation to have seted up a set of heat dissipation with thermal pad on the terminal surface that every storage tank is used for laminating, wherein thermal pad's is the rectangle structure roughly, a recess has been seted up at thermal pad's middle part, the middle part of recess is provided with a flange, still evenly be provided with a plurality of heat dissipation notches on the edge of radiator body. It is rational in infrastructure, carry out heat dissipation to the chip through thermal pad, be convenient for assemble the overall arrangement, can reduce traditional utilization heat pipe cooling and lead to overall arrangement randomly arranged's the condition for whole heat dissipation overall arrangement is compact reasonable, has improved space utilization greatly, and heat dispersion is good moreover, and maneuverability is strong.
Description
Technical field
This utility model is related to area of computer aided radiator structure technical field, more particularly to a kind of chip radiator.
Background technology
Chip is the most key part in computer running, but chip can produce in running it is substantial amounts of
Heat, raises can chip temperature, and high temperature is the formidable enemy of integrated circuit, and high temperature can not only cause system operation unstable, using the longevity
Life shortens, it could even be possible to burning some parts when serious, thus normal use of computer can be impacted, therefore
How to carry out effectively radiating to chip becomes current computer production firm more concern.
Current chip radiating is mainly carried out by heat pipe, and one end of heat pipe is connected with radiator, and the other end is contacted with chip,
So as to realize the heat loss through conduction of chip heat.But many electronic products adopt chipset at present, if using traditional utilization
The mode of heat pipe heat radiation, will cause layout confusion to a certain extent without chapter, it is difficult to reach in limited space and more manage
The radiating state thought.
Therefore, it is in order to solve above-mentioned problem, special to provide a kind of new technology.
Utility model content
The purpose of this utility model there is provided a kind of rational in infrastructure, it is easy to assemble the chip of layout and perfect heat-dissipating
Radiator.
The technical scheme adopted by this utility model is：
A kind of chip radiator, including radiator body, heat conductive pad and chip, offers on the radiator body multiple
For accommodating the storage tank of heat conductive pad, at least one heat conductive pad is put in order in storage tank of one of which, and heat conductive pad is relative
It is close to chip in the another side absorption of radiator body, each storage tank is for offering one on the end face fitted with heat conductive pad
Group radiating groove I and radiating groove II, the wherein substantially rectangular in cross section structure of heat conductive pad, offer a groove in the middle part of heat conductive pad,
A flange is provided with the middle part of groove, and the height of the flange protrudes from the edge of heat conductive pad, and the center of flange offers always
The groove of flange upper and lower surface is through at, some radiating notches on the edge of the radiator body, are also evenly arranged with.
Further, the radiating notch radiated on groove I and the corresponding connection radiator body of radiating groove II.
Further, the groove I that radiates is symmetrical arranged with radiating groove II and is distributed in splayed.
Further, the sectional view of radiating groove I and radiating groove II is horn-like.
Further, heat conductive pad is integrated injection mo(u)lding.
The beneficial effects of the utility model are：It is rational in infrastructure, storage tank is opened up on radiator body and accommodates heat conductive pad, lead to
Crossing heat conductive pad carries out heat loss through conduction to chip, is easy to assemble layout, and can reduce tradition causes layout miscellaneous using heat pipe heat radiation
The random situation without chapter so that whole radiating layout compact and reasonable, substantially increases space availability ratio, and the setting of the groove that radiates
There are guide functions to heat, be easy to quick heat radiating, perfect heat-dissipating, low cost.
Description of the drawings
With reference to the accompanying drawings and detailed description this utility model is described in further detail.
Fig. 1 is structural representation of the present utility model.
Fig. 2 accommodates the structural representation of the radiator body of heat conductive pad for this utility model.
Structural representations of the Fig. 3 for this utility model heat conductive pad.
Wherein：1st, radiator body, 2, heat conductive pad, 3, chip, 4, storage tank, 5, radiating groove I, 6, radiating groove II,
7th, groove, 8, flange, 9, groove, 10, radiating notch.
Specific embodiment
In order to deepen to understanding of the present utility model, further is made to this utility model below in conjunction with embodiment and accompanying drawing
Describe in detail, the embodiment is only used for explaining this utility model, does not constitute the restriction to protection domain of the present utility model.
A kind of chip radiator as shown in Figure 1 to Figure 3, including radiator body 1, heat conductive pad 2 and chip 3, radiator
Multiple storage tanks 4 for accommodating heat conductive pad 2 are offered on body 1, and at least one heat conductive pad 2 is put in order appearance of one of which
Put in groove 4, and heat conductive pad 2 relative to radiator body 1 another side absorption be close to chip 3, each storage tank 4 for lead
One group of radiating groove I 5 and radiating groove II 6, the wherein substantially rectangular in cross section knot of heat conductive pad 2 is offered on the end face of the laminating of heat pad 2
Structure, the middle part of heat conductive pad 2 offer a groove 7, and the middle part of groove 7 is provided with a flange 8, and the height of the flange 8 is protruded from leads
The edge of heat pad 2, and the center of flange 8 offer one through 8 upper and lower surface of flange groove 9, the edge of radiator body 1
On be also evenly arranged with it is some radiating notches 10.
In the present embodiment, the radiating notch radiated on groove I 5 and the corresponding connection radiator body 1 of radiating groove II 6
10, by radiating, groove I 5, II 6 guides heat to radiating notch 10, is easy to quick heat radiating.
In the present embodiment, the groove I 5 that radiates is symmetrical arranged with radiating groove II 6 and is distributed in splayed so that radiating is logical
The thermal-arrest mouth of groove I 5, II 6 is concentrated and thermovent dispersion, is realized centralized collection heat, is distributed the process of heat, is conducive to heat
Distribute.
In the present embodiment, the sectional view of radiating groove I 5 and radiating groove II 6 is horn-like so that radiating groove
I 5, II 6 are presented structure narrow between the alleviating distention in middle-JIAO of two, are easy to the collection of heat to neutralize and distribute.
In the present embodiment, heat conductive pad 2 is integrated injection mo(u)lding, it is easy to process and assemble, low cost.
The beneficial effects of the utility model are：It is rational in infrastructure, heat loss through conduction is carried out to chip by heat conductive pad, is easy to assembling
Layout, can reduce tradition causes the rambling situation of layout using heat pipe heat radiation so that the compact conjunction of whole radiating layout
Reason, substantially increases space availability ratio, and perfect heat-dissipating, workable.
The above, is only preferred embodiment of the present utility model, is not to make any other to this utility model
The restriction of form, and any modification for being made according to technical spirit of the present utility model or equivalent variations, still fall within this practicality new
Type scope required for protection.
Claims (5)
1. a kind of chip radiator, including radiator body, heat conductive pad and chip, it is characterised in that：On the radiator body
Multiple storage tanks for accommodating heat conductive pad are offered, at least one heat conductive pad is put in order in storage tank of one of which, and
Heat conductive pad is close to chip relative to the another side absorption of radiator body, and each storage tank is for the end face fitted with heat conductive pad
On offer one group of radiating groove I and radiating groove II, the wherein substantially rectangular in cross section structure of heat conductive pad is opened up in the middle part of heat conductive pad
There is a groove, in the middle part of groove, be provided with a flange, the height of the flange protrudes from the edge of heat conductive pad, and the center of flange is opened
Be provided with one through flange upper and lower surface groove, be also evenly arranged with some radiating grooves on the edge of the radiator body
Mouthful.
2. a kind of chip radiator according to claim 1, it is characterised in that：Radiating groove I and radiating groove II are right
The radiating notch on radiator body should be connected.
3. a kind of chip radiator according to claim 1, it is characterised in that：Radiating groove I and radiating groove II are symmetrical
Arrange and be distributed in splayed.
4. a kind of chip radiator according to claim 1, it is characterised in that：Radiating groove I is cut with radiating groove II
Face figure is horn-like.
5. a kind of chip radiator according to claim 1, it is characterised in that：Heat conductive pad is integrated injection mo(u)lding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620849647.6U CN206042635U (en) | 2016-08-08 | 2016-08-08 | Heat radiator of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620849647.6U CN206042635U (en) | 2016-08-08 | 2016-08-08 | Heat radiator of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206042635U true CN206042635U (en) | 2017-03-22 |
Family
ID=58308236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620849647.6U Active CN206042635U (en) | 2016-08-08 | 2016-08-08 | Heat radiator of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206042635U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752395A (en) * | 2020-12-16 | 2021-05-04 | 深圳市诚之益电路有限公司 | Heat radiation structure and smart machine of circuit board |
| WO2021103848A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Single-board heat dissipation structure |
-
2016
- 2016-08-08 CN CN201620849647.6U patent/CN206042635U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021103848A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Single-board heat dissipation structure |
| CN112752395A (en) * | 2020-12-16 | 2021-05-04 | 深圳市诚之益电路有限公司 | Heat radiation structure and smart machine of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206251564U (en) | Heat abstractor, heat dissipation for circuit board system and electronic equipment | |
| CN206042635U (en) | Heat radiator of chip | |
| CN204244630U (en) | Pluggable electronic module heat-transfer device | |
| CN206452607U (en) | A kind of PCB printed circuit boards with heat sinking function | |
| CN204014377U (en) | Multilayered thermally-conductive formula switch | |
| CN210298288U (en) | Industrial control host | |
| CN212163149U (en) | Diversion heat dissipation complex structure | |
| CN210042368U (en) | High heat conduction circuit board | |
| CN209561374U (en) | A kind of electronic equipment | |
| CN206640865U (en) | Heat radiation type PCB heat board | |
| CN201115203Y (en) | Improved circuit component structure | |
| CN203672382U (en) | Vehicle-mounted multimedia navigation device | |
| CN104159391A (en) | Heat dissipation device for terminal, and terminal | |
| CN208314700U (en) | Fan-free embedded computer | |
| CN206806850U (en) | High current cabinet integrated contact box | |
| CN206196240U (en) | Heat radiation structure assembly of mobile terminal and mobile terminal | |
| CN204966192U (en) | Resistor | |
| CN203597571U (en) | Desk capable of dissipating heat | |
| CN217694149U (en) | Heat radiator | |
| CN209787307U (en) | Video converter that radiating effect is good | |
| CN210956652U (en) | Power transistor with good heat dissipation performance | |
| CN204425783U (en) | The pcb board of automobile instrument power circuit | |
| CN207165653U (en) | A kind of battery modules with radiating structure | |
| CN204046923U (en) | Heat radiation pcb board | |
| CN209344551U (en) | A kind of comprehensive distribution cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |