CN208314700U - Fan-free embedded computer - Google Patents

Fan-free embedded computer Download PDF

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Publication number
CN208314700U
CN208314700U CN201820682605.7U CN201820682605U CN208314700U CN 208314700 U CN208314700 U CN 208314700U CN 201820682605 U CN201820682605 U CN 201820682605U CN 208314700 U CN208314700 U CN 208314700U
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CN
China
Prior art keywords
shell
fan
heater element
heat
embedded computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820682605.7U
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Chinese (zh)
Inventor
黄文涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Global Wei Technology Co Ltd
Original Assignee
Shenzhen Global Wei Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Global Wei Technology Co Ltd filed Critical Shenzhen Global Wei Technology Co Ltd
Priority to CN201820682605.7U priority Critical patent/CN208314700U/en
Application granted granted Critical
Publication of CN208314700U publication Critical patent/CN208314700U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of fan-free embedded computer, it includes shell, mainboard, heater element, elastomer and heat-conducting piece, wherein, the outside of shell is provided with heat sink and reinforces radiating part, mainboard is fixed in shell, heater element is electrically connected at the top of mainboard, the position of heater element is corresponding with the position of radiating part is reinforced, elastomer is located between the bottom of mainboard and the intracorporal bottom surface of shell, and heat-conducting piece contacts respectively with heater element and shell conducting the heat of heater element to shell.The fan-free embedded computer of the utility model is by being arranged reinforcement radiating part corresponding with heater element position, the heat of heater element to obtain conduction faster to distribute, the setting of elastomer simultaneously can guarantee that the heater element on mainboard is close to the stability of inner walls face, so that the heat of heater element, which can stablize conduction, carries out distributing for heat to shell.

Description

Fan-free embedded computer
Technical field
The utility model relates to computer field, in particular to the fan-free embedded computer of a kind of high efficiency and heat radiation.
Background technique
Currently, computer is at work, internal heating element work will generate heat, and especially operand is big and the duration When longer fever it is especially serious, in the prior art, many computer-internals require setting fan come to computer-internal into Row blowing heat dissipation, and is arranged fan more occupied space, is unfavorable for computer to miniaturization, while fan work also can be into The energy consumption of one step simultaneously can generate thermal energy.
Therefore need to provide a kind of fan-free embedded computer to solve above-mentioned technical problem.
Utility model content
The utility model provides a kind of fan-free embedded computer, corresponding with heater element position by being arranged Reinforce radiating part, enables the heat of heater element to obtain conduction faster and distribute, to solve in computer in the prior art Portion requires setting fan heat dissipation is blowed to computer-internal, and fan more occupied space is arranged, and is unfavorable for calculating Machine is to miniaturization, while fan work also can further consume energy and can lead to the problem of thermal energy.
In order to solve the above technical problems, the technical solution of the utility model are as follows: a kind of fan-free embedded computer, packet It includes:
Shell is provided with heat sink in the outside of the shell and reinforces radiating part;
Mainboard;It is fixed in the shell;
Heater element is electrically connected at the top of the mainboard, the position of the heater element and the reinforcement radiating part Position it is corresponding;
Elastomer, between the bottom and the intracorporal bottom surface of the shell of the mainboard, when the mainboard is fixed at When in the shell, the elastomer is in compressive state;And
Heat-conducting piece, the heat-conducting piece contact respectively with the heater element and the shell with by the heat of the heater element In amount conduction to the shell.
In the present invention, the reinforcement radiating part includes at least two pieces of connecting plates disposed in parallel, the connecting plate Plate face be parallel to the housing outer surface, muti-piece supporting plate is provided between two pieces of adjacent connecting plates, described in muti-piece Spacing between supporting plate is equal.
Further, supporting plate described in muti-piece is arranged along the extending direction of the connecting plate, and the head and the tail of supporting plate described in muti-piece connect It connects.
In the present invention, the shell, the heat sink and the reinforcement heat sink are an integral molding structure, institute Stating shell, the heat sink and the reinforcement heat sink is copper material.
In the present invention, thermal grease layer is provided between the heater element and the heat-conducting piece.
In the present invention, the shell includes cap and bottom case, and the cap includes top plate and is connected to described First side plate at top plate both ends, the bottom case include bottom plate and the second side plate for being connected to the bottom plate both ends, the heat dissipation Plate is evenly distributed in the outer surface of the top plate and first side plate.
Further, the height of first side plate and second side plate is equal, and the length of second side plate is equal to The distance between two blocks of described first side plates, are provided with Connection protrusion on the inner wall of the cap, in the Connection protrusion It is provided with threaded hole, through-hole corresponding with the threaded hole is provided on second side plate, screw passes through the through-hole It is fixedly connected with the threaded hole, multiple electrical ports is provided on second side plate.
In addition, the both ends of the bottom plate include extension, it is provided on the extension for making the bottom plate and outer Set the connecting hole that basic fixation member is fixedly connected.
In the present invention, the heat-conducting piece and the shell are an integral molding structure, the heat-conducting piece and the hair Thermal element is at face contact.
In the present invention, the elastomer is rubber material.
The utility model compared to the prior art, it has the advantage that: the fan-free embedded computer of the utility model By the way that reinforcement radiating part corresponding with heater element position is arranged, enables the heat of heater element to obtain conduction faster and dissipate Hair, while the setting of elastomer can guarantee that the heater element on mainboard is close to the stability of inner walls face, so that fever The heat of element can stablize conduction and carry out distributing for heat to shell, and radiating efficiency is high, without embedded setting fan to inside It radiates.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below in embodiment Required attached drawing is briefly described, and the accompanying drawings in the following description is only that the section Example of the utility model is corresponding Attached drawing.
Fig. 1 is the structural schematic diagram of the preferred embodiment of the fan-free embedded computer of the utility model.
Fig. 2 is the schematic cross-sectional view of the fan-free embedded computer of the utility model.
Fig. 3 is the structural schematic diagram of the reinforcement radiating part of the fan-free embedded computer of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those skilled in the art are obtained without making creative work The every other embodiment obtained, fall within the protection scope of the utility model.
In the prior art, many computer-internals require that fan is arranged heat dissipation is blowed to computer-internal, And fan more occupied space is set, it is unfavorable for computer to miniaturization, while fan work also can further consume energy And thermal energy can be generated.
It the following is a kind of the excellent of fan-free embedded computer that can solve the above technical problem provided by the utility model Select embodiment.
Referring to Fig.1 and 2, wherein Fig. 1 is the preferred embodiment of the fan-free embedded computer of the utility model Structural schematic diagram, Fig. 2 are the schematic cross-sectional view of the fan-free embedded computer of the utility model.
The similar unit of structure is to be given the same reference numerals in the figure.
A kind of preferred embodiment of fan-free embedded computer provided by the utility model are as follows: fan-free embedding assembly Machine comprising shell 11, mainboard 15, heater element 16, elastomer 17 and heat-conducting piece 117;
The outside of shell 11 is provided with heat sink 13 and reinforces radiating part 12;
Mainboard 15 is fixed in shell 11;
Heater element 16 is electrically connected at the top of mainboard 15, the position of heater element 16 and the position for reinforcing radiating part 12 It is corresponding;
Elastomer 17 is located between the bottom surface in the bottom and shell 11 of mainboard 15, when mainboard 15 is fixed at shell 11 When interior, elastomer 17 is in compressive state, and the setting of elastomer 17 can guarantee that the heater element 16 on mainboard 15 is close to shell 11 The stability of inner wall dissipates so that the heat of heater element 16, which can stablize conduction, carries out distributing for heat to shell 11 The thermal efficiency is high, wherein the elastomer 17 in this preferred embodiment is rubber material;
Heat-conducting piece 117 contacts respectively with heater element 16 and shell 11 conducting the heat of heater element 16 to shell 11 On.
Referring to figure 3., wherein Fig. 3 shows for the structure of the reinforcement radiating part of the fan-free embedded computer of the utility model It is intended to.
Specifically, reinforcing radiating part 12 includes at least two pieces of connecting plates 121 disposed in parallel, the plate face of connecting plate 121 is flat Row is provided with muti-piece supporting plate 122 in 11 outer surface of shell between two pieces of adjacent connecting plates 121, between muti-piece supporting plate 122 Spacing is equal.
Wherein, muti-piece supporting plate 122 is arranged along the extending direction of connecting plate 121, the head and the tail connection of muti-piece supporting plate 121, structure Compact and rapid heat dissipation.
Shell 11, heat sink 13 and reinforcement heat sink 13 are an integral molding structure, shell 11, heat sink 13 and reinforcement Heat sink 13 is copper material, copper material rapid heat dissipation.
In the preferred embodiment, thermal grease layer 18 is provided between heater element 16 and heat-conducting piece 117.
In the preferred embodiment, shell 11 includes cap 112 and bottom case 111, and cap 112 includes top plate and is connected to First side plate at top plate both ends, bottom case 111 include bottom plate 116 and the second side plate for being connected to 116 both ends of bottom plate, heat sink 13 It is evenly distributed in the outer surface of top plate and the first side plate.
Wherein, the height of the first side plate and the second side plate is equal, and the length of the second side plate is equal between two piece of first side plate Distance, Connection protrusion 118 is provided on the inner wall of cap 112, threaded hole is provided in Connection protrusion 118, second Through-hole 115 corresponding with threaded hole is provided on side plate, screw passes through through-hole 115 and is fixedly connected with threaded hole, so that Cap 112 and the fixed snapping of bottom case 111.
Be provided with multiple electrical ports 14 on the second side plate, the electrical port in this preferred embodiment include USB interface, Power interface, network interface, audio interface and video interface etc..
In addition, the both ends of bottom plate 116 include extension 113, it is provided on extension 113 for making bottom plate 116 and outer Set the connecting hole 114 that basic fixation member is fixedly connected.
In the present invention, heat-conducting piece 117 and shell 11 are an integral molding structure, heat-conducting piece 117 and heater element 16 At face contact.
The fan-free embedded computer of this preferred embodiment is dissipated by the way that reinforcement corresponding with heater element position is arranged Hot portion enables the heat of heater element to obtain conduction faster and distributes, reinforces radiating part and connected by connecting plate and setting Supporting plate composition between plate, simple and compact for structure and rapid heat dissipation;
The setting of elastomer simultaneously can guarantee that the heater element on mainboard is close to the stability of inner walls face, so that The heat of heater element can stablize conduction and carry out distributing for heat to shell, and radiating efficiency is high, without embedded setting fan pair It radiates inside.
Although above preferred embodiment is not used in conclusion the utility model is disclosed above with preferred embodiment To limit the utility model, those skilled in the art can make without departing from the spirit and scope of the utility model It is various to change and retouch, therefore the protection scope of the utility model subjects to the scope of the claims.

Claims (10)

1. a kind of fan-free embedded computer characterized by comprising
Shell is provided with heat sink in the outside of the shell and reinforces radiating part;
Mainboard;It is fixed in the shell;
Heater element is electrically connected at the top of the mainboard, the position of the heater element and the position for reinforcing radiating part It sets corresponding;
Elastomer, between the bottom and the intracorporal bottom surface of the shell of the mainboard, when the mainboard be fixed at it is described When in shell, the elastomer is in compressive state;And
Heat-conducting piece, the heat-conducting piece contact respectively with the heater element and the shell to pass the heat of the heater element It is directed on the shell.
2. fan-free embedded computer according to claim 1, which is characterized in that the reinforcement radiating part includes parallel At least two pieces of connecting plates, the plate face of the connecting plate being arranged are parallel to the housing outer surface, in two pieces of adjacent companies Muti-piece supporting plate is provided between fishplate bar, the spacing between supporting plate described in muti-piece is equal.
3. fan-free embedded computer according to claim 2, which is characterized in that supporting plate described in muti-piece is along the connection The extending direction of plate arranges, the head and the tail connection of supporting plate described in muti-piece.
4. fan-free embedded computer according to claim 1, which is characterized in that the shell, the heat sink with And the reinforcement heat sink is an integral molding structure, the shell, the heat sink and the reinforcement heat sink are copper Material.
5. fan-free embedded computer according to claim 1, which is characterized in that the heater element and described thermally conductive Thermal grease layer is provided between part.
6. fan-free embedded computer according to claim 1, which is characterized in that the shell includes shell lid and bottom Shell, the cap include top plate and the first side plate for being connected to the top plate both ends, and the bottom case includes bottom plate and connection The second side plate at the bottom plate both ends, the heat sink are evenly distributed in the appearance of the top plate and first side plate Face.
7. fan-free embedded computer according to claim 6, which is characterized in that first side plate and described second The height of side plate is equal, and the length of second side plate is equal to the distance between two blocks of described first side plates, in the cap It is provided with Connection protrusion on inner wall, is provided with threaded hole in the Connection protrusion, is provided on second side plate and institute The corresponding through-hole of threaded hole is stated, screw passes through the through-hole and is fixedly connected with the threaded hole, sets on second side plate It is equipped with multiple electrical ports.
8. fan-free embedded computer according to claim 6, which is characterized in that the both ends of the bottom plate include extending Portion is provided with the connecting hole for being fixedly connected with the bottom plate with external basic fixation member on the extension.
9. fan-free embedded computer according to claim 1, which is characterized in that the heat-conducting piece and the shell are Integrated formed structure, the heat-conducting piece and the heater element are at face contact.
10. fan-free embedded computer according to claim 1, which is characterized in that the elastomer is rubber material.
CN201820682605.7U 2018-05-03 2018-05-03 Fan-free embedded computer Expired - Fee Related CN208314700U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820682605.7U CN208314700U (en) 2018-05-03 2018-05-03 Fan-free embedded computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820682605.7U CN208314700U (en) 2018-05-03 2018-05-03 Fan-free embedded computer

Publications (1)

Publication Number Publication Date
CN208314700U true CN208314700U (en) 2019-01-01

Family

ID=64711988

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820682605.7U Expired - Fee Related CN208314700U (en) 2018-05-03 2018-05-03 Fan-free embedded computer

Country Status (1)

Country Link
CN (1) CN208314700U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110568914A (en) * 2019-09-16 2019-12-13 深圳市巨烽显示科技有限公司 mute type all-in-one machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110568914A (en) * 2019-09-16 2019-12-13 深圳市巨烽显示科技有限公司 mute type all-in-one machine

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190101

Termination date: 20210503

CF01 Termination of patent right due to non-payment of annual fee