CN208367615U - A kind of computer heat dissipation equipment - Google Patents
A kind of computer heat dissipation equipment Download PDFInfo
- Publication number
- CN208367615U CN208367615U CN201820905073.9U CN201820905073U CN208367615U CN 208367615 U CN208367615 U CN 208367615U CN 201820905073 U CN201820905073 U CN 201820905073U CN 208367615 U CN208367615 U CN 208367615U
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- heat
- conducting plate
- plate
- fixed
- fixed frame
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of computer heat dissipation equipment, belong to the field of radiating of computer, including heat-conducting plate, the heat-conducting plate is connected with fixed frame, the fixed frame is connected with fixed link, the close contact of the fixed frame and heating element is realized between the fixed frame and the heat-conducting plate by clamping structure, the clamping structure includes fixinig plate and spring, along the fixinig plate for being extended with the plate structure parallel with the heat-conducting plate perpendicular to the direction of the fixed link on any opposite side frame of fixed frame, it is attached between the fixinig plate and the heat-conducting plate by the spring, it forms the spring and squeezes the structure that the heat-conducting plate is in close contact the heat-conducting plate and heating element, the heat-conducting plate is connected with the radiator distributed for heat by thermal conductive wire, for increasing the contact area of heat-conducting plate and CPU, improve computer Radiating efficiency.
Description
Technical field
The utility model relates to the field of radiating of computer, more particularly to a kind of computer heat dissipation equipment.
Background technique
Computer can generate a large amount of heat in use, and wherein the CPU of computer can be generated more at work
Heat, such as not in time to computer carry out radiating treatment will lead to computer the speed of service it is slack-off serious when will lead to calculating
Machine damage of internal device is contacted with CPU by using copper heat-conducting plate, is made when radiating to computer CPU
Heat on CPU is radiated in time by heat-conducting plate, and heat-conducting plate will increase heat dissipation area when coming into full contact with CPU and increase heat dissipation effect
Fruit, but usually there will be gap in the prior art, between heat-conducting plate and CPU and be unable to fully be bonded more, it will lead to heat-conducting plate
Heat transfer efficiency is poor, it is therefore desirable to which a kind of heat dissipation equipment of weight comes into full contact with heat-conducting plate with CPU, by increasing contact surface machine
Realize the raising to radiating efficiency.
Utility model content
For above situation, for the defect for overcoming the prior art, the utility model provides a kind of computer heat dissipation equipment, uses
In the contact area for increasing heat-conducting plate and CPU, the radiating efficiency of computer is improved.
Its technical solution is that a kind of computer heat dissipation equipment, including heat-conducting plate, the heat-conducting plate are connected with fixed frame, institute
It states fixed frame and forms rectangular box-like structure, be equipped with fixed link at the position at four angles of the fixed frame, the fixed frame passes through
The fixed link is fixed on cabinet inside, realizes the fixed frame by clamping structure between the fixed frame and the heat-conducting plate
With the close contact of heating element, the clamping structure includes fixinig plate and spring, any opposite side frame of fixed frame
Upper edge is extended with the fixinig plate of the plate structure parallel with the heat-conducting plate, the fixinig plate perpendicular to the direction of the fixed link
Be attached between the heat-conducting plate by the spring, formed the spring squeeze the heat-conducting plate make the heat-conducting plate with
The structure that heating element is in close contact, the heat-conducting plate are connected with the heat dissipation distributed for heat by thermal conductive wire and fill
It sets.
Further, the radiator includes heat sink, and the heat sink is one on the computer host box
The inside of a side plate, the heat sink is equipped with multiple thermal troughs compatible with the thermal conductive wire, and the outside of the heat sink is equal
It is even to be equipped with several cooling fins.
Further, the thermal conductive wire is the linear structure of cylindrical-shaped structure, and the thermal trough is on the heat sink
Circular through-hole structure is formed, each thermal trough is adjacent on the heat sink to be arranged in parallel, and the heat sink is by with good
The material of good heat dissipation performance is made.
Further, it is equipped with installing frame outside the heat sink, forms one between the installing frame and the heat sink
The installation cavity of a rectangular parallelepiped structure is at least equipped with a radiator fan inside the installation cavity, and the radiator fan is in cabinet
Inside is attached by conducting wire and power supply.
Further, the thermal conductive wire is on the inner wall that the cabinet inside is fixed on the cabinet by wire fixing device,
The wire fixing device includes the fixing buckle of several rectangular box-like structures, form that several are connected inside the fixing buckle with
The compatible cavity of the thermal conductive wire, the both ends of the fixing buckle are extended with the fixing piece of rectangular sheet structure to two sides, institute
Fixing piece is stated equipped with through-hole.
Having the technical effect that the heat-conducting plate is realized by the fixed frame and coming into full contact with CPU for the utility model, has
Effect increases heat-conducting area, strengthens the heat transfer efficiency of the heat-conducting plate, described in the radiator is realized and is embedded in thermal conductive wire
It in thermal trough, realizes and rapid cooling is carried out by heat sink, the cooling fin can effectively increase radiating efficiency, be dissipated by described
Hot-air fan can further strengthen the radiating efficiency of radiator, and the fixed device can be inside computer cabinet to thermally conductive
Line is arranged and is fixed, and prevents thermal conductive wire from winding with cabinet inside All other routes.
Detailed description of the invention
Fig. 1 is the top view that fixed frame is connect with heat-conducting plate in the utility model.
Fig. 2 is the side view that fixed frame is connect with heat-conducting plate in the utility model.
Fig. 3 is the structural schematic diagram of radiator in the utility model.
Fig. 4 is the structural schematic diagram of fixing buckle in the utility model.
Specific embodiment
Below in conjunction with Figure of description, specific embodiment is described in further details.
Heat-conducting plate 1: the heat-conducting plate 1 is rectangular plate-like structure compatible with CPU shape, the material of the heat-conducting plate 1
It is the preferable material of heating conduction, the material of the heat-conducting plate 1 includes but is not limited to metallic copper, and the two side ends of the heat-conducting plate are prolonged
Stretching has thermal conductive wire 8, the preferable material of the equally applicable thermal diffusivity of material of the thermal conductive wire 8, the material of the thermal conductive wire 8 include but
It is not limited to metallic copper, the connection type between the thermal conductive wire 8 and the heat-conducting plate 1 can be integral structure, each described to lead
Hot line 8 is uniformly distributed on the heat-conducting plate 1 and is extended up in the thermal trough 6 in the heat sink outward.
Fixed frame 2: the fixed frame 2 forms the frame like structure of rectangle, the position at four angles of lower end edge of the fixed frame 2
Place is extended with fixed link 13 perpendicular to the fixed frame 2, and the fixed link 13 is used to the fixed frame 2 being fixed on computer machine
Inside case, the fixed link 13 can be the plate structure of rectangle, and the bottom end of the fixed link 13 is along perpendicular to the fixed link
13 direction is extended with the fixed feet of rectangular sheet structure outward, and the fixed feet is equipped with screw hole, to the fixed frame
When being fixed, the fixed feet is fixed on computer cabinet inside using screw, the fixed frame 2 with it is described thermally conductive
It is attached between plate 1 by spring 4, the connection type between the spring 4 and the fixed frame 2 and the heat-conducting plate 1
It may be a fixed connection, the spring 4 can be the spring of common column structure, and the fixed frame is fixed on the outer of CPU
Side, the heat-conducting plate 1 are contacted with CPU, and when the heat-conducting plate 1 and CPU are contacted, the spring 4 occurs elastic deformation and simultaneously generates
Certain elastic acting force, the heat-conducting plate 1 is pressed on the CPU by realization connects the heat-conducting plate 1 and CPU sufficiently
Touching, and then increase contact area, that is, heat-conducting area between heat-conducting plate 1 and CPU, increase the heat dissipation effect to CPU.
Radiator: the radiator includes heat sink 5, and the heat sink 5 is one on the computer host box
A side plate, the inside of the heat sink 5 are equipped with multiple thermal troughs 6 compatible with the thermal conductive wire 8, the heat sink 5 outside
Side is uniformly provided with several cooling fins 7, and the thermal trough 6 forms circular through-hole structure on the heat sink 5, each described to lead
Heat channel 6 is adjacent on the heat sink 5 to be arranged in parallel, and the heat sink 5 is made of the material with excellent heat dispersion performance, described
The material of heat sink 5 includes but is not limited to metallic copper, and each thermal conductive wire 8 is placed in 6 inside of thermal trough and is dissipated by described
Cooling fin 7 on hot plate 5 and heat sink is quickly dissipated to the outside of computer cabinet, realizes the rapid cooling to computer cabinet
Processing increases radiating efficiency.
It is equipped with installing frame 9 outside the heat sink 5, forms a cuboid between the installing frame 9 and the heat sink 5
The installation cavity of structure, is at least equipped with a radiator fan 10 inside the installation cavity, and the radiator fan 10 is in cabinet inside
It is attached by conducting wire and power supply, be can be further improved at the heat dissipation to computer cabinet by the radiator fan 10
Reason.
Wire fixing device: the thermal conductive wire 8 is on the inner wall that the cabinet inside is fixed on the cabinet by wire fixing device, institute
The fixing buckle 11 that wire fixing device includes several rectangular box-like structures is stated, forms what several were connected inside the fixing buckle 11
The both ends of cavity compatible with the thermal conductive wire 8, the fixing buckle 11 are extended with the fixation of rectangular sheet structure to two sides
Part 12, the fixing piece 12 are equipped with through-hole, in use, the fixing buckle 11 is fixed on computer by the fixing piece 12
On cabinet, and each thermal conductive wire 8 is passed through by the cavity inside the fixing buckle 11, is realized to 8 position of thermal conductive wire
It is fixed.
Having the technical effect that the heat-conducting plate is realized by the fixed frame and coming into full contact with CPU for the utility model, has
Effect increases heat-conducting area, strengthens the heat transfer efficiency of the heat-conducting plate, described in the radiator is realized and is embedded in thermal conductive wire
It in thermal trough, realizes and rapid cooling is carried out by heat sink, the cooling fin can effectively increase radiating efficiency, be dissipated by described
Hot-air fan can further strengthen the radiating efficiency of radiator, and the fixed device can be inside computer cabinet to thermally conductive
Line is arranged and is fixed, and prevents thermal conductive wire from winding with cabinet inside All other routes.
Above by specific embodiment and embodiment, invention is explained in detail, but these are not composition pair
Limitation of the invention.Without departing from the principles of the present invention, those skilled in the art can also make many deformations and change
Into these also should be regarded as protection scope of the present invention.
Claims (5)
1. a kind of computer heat dissipation equipment, including heat-conducting plate (1), the heat-conducting plate (1) is connected with fixed frame (2), the fixation
Frame (2) forms rectangular box-like structure, is equipped with fixed link (13) at the position at four angles of the fixed frame (2), the fixed frame
(2) cabinet inside is fixed on by the fixed link (13), which is characterized in that the fixed frame (2) and the heat-conducting plate (1) it
Between the close contacts of the fixed frame (2) and heating element is realized by clamping structure, the clamping structure includes fixinig plate
(3) and spring (4) it, is extended on any opposite side frame of fixed frame (2) along the direction perpendicular to the fixed link (13)
The fixinig plate (3) of the plate structure parallel with the heat-conducting plate (1), passes through between the fixinig plate (3) and the heat-conducting plate (1)
The spring (4) is attached, and forming the spring (4) extruding heat-conducting plate (1) makes the heat-conducting plate (1) and first device that generates heat
The structure that part is in close contact, the heat-conducting plate (1) are connected with the radiator distributed for heat by thermal conductive wire (8).
2. a kind of computer heat dissipation equipment according to claim 1, which is characterized in that the radiator includes heat sink
(5), the heat sink (5) is a side plate on the computer host box, the inside of the heat sink (5) be equipped with it is multiple with
The thermal conductive wire (8) compatible thermal trough (6) is uniformly provided with several cooling fins (7) on the outside of the heat sink (5).
3. a kind of computer heat dissipation equipment according to claim 2, which is characterized in that the thermal conductive wire (8) is cylindric
The linear structure of structure, the thermal trough (6) form circular through-hole structure, each thermal trough on the heat sink (5)
(6) adjacent on the heat sink (5) to be arranged in parallel.
4. a kind of computer heat dissipation equipment according to claim 3, which is characterized in that be equipped with outside the heat sink (5)
Installing frame (9) forms the installation cavity of a rectangular parallelepiped structure, the installation between the installing frame (9) and the heat sink (5)
Intracavitary portion is at least equipped with a radiator fan (10), and the radiator fan (10) is carried out in cabinet inside by conducting wire and power supply
Connection.
5. a kind of computer heat dissipation equipment according to claim 1, which is characterized in that the thermal conductive wire (8) is in the machine
It is fixed on the inner wall of the cabinet inside case by wire fixing device, the wire fixing device includes consolidating for several rectangular box-like structures
It is fixed to detain (11), several compatible cavitys with the thermal conductive wire (8) being connected are formed inside the fixing buckle (11), it is described
The both ends of fixing buckle (11) are extended with the fixing piece (12) of rectangular sheet structure to two sides, and the fixing piece (12) is equipped with logical
Hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820905073.9U CN208367615U (en) | 2018-06-12 | 2018-06-12 | A kind of computer heat dissipation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820905073.9U CN208367615U (en) | 2018-06-12 | 2018-06-12 | A kind of computer heat dissipation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208367615U true CN208367615U (en) | 2019-01-11 |
Family
ID=64928560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820905073.9U Expired - Fee Related CN208367615U (en) | 2018-06-12 | 2018-06-12 | A kind of computer heat dissipation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208367615U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110160015A (en) * | 2019-06-25 | 2019-08-23 | 林韵烨 | A kind of LED light maintained easily |
| CN112987880A (en) * | 2019-12-02 | 2021-06-18 | 鸿富锦精密工业(武汉)有限公司 | Heat sink device |
-
2018
- 2018-06-12 CN CN201820905073.9U patent/CN208367615U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110160015A (en) * | 2019-06-25 | 2019-08-23 | 林韵烨 | A kind of LED light maintained easily |
| CN112987880A (en) * | 2019-12-02 | 2021-06-18 | 鸿富锦精密工业(武汉)有限公司 | Heat sink device |
| CN112987880B (en) * | 2019-12-02 | 2023-11-03 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190111 Termination date: 20190612 |