CN112987880A

CN112987880A - Heat sink device

Info

Publication number: CN112987880A
Application number: CN201911211467.XA
Authority: CN
Inventors: 张洪梅
Original assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2019-12-02
Filing date: 2019-12-02
Publication date: 2021-06-18
Anticipated expiration: 2039-12-02
Also published as: CN112987880B

Abstract

A heat dissipation device comprises a heat dissipation sheet, a shell and an elastic piece, wherein the heat dissipation sheet is used for dissipating heat of a heating body, the shell is used for accommodating the heating body and the heat dissipation sheet, the shell comprises a cover plate, the sheet end of the heat dissipation sheet is placed towards the cover plate, one surface, facing the inside of the shell, of the cover plate is elastically connected with the heat dissipation sheet through the elastic piece, and the cover plate abuts against and pushes the plane end of the heat dissipation sheet to be in contact with.

Description

Heat sink device

Technical Field

The present invention relates to a heat dissipating device.

Background

At present, a computer motherboard uses a high-energy solid state disk to develop a trend, but the high-energy solid state disk has a higher calorific value, which means that more heat dissipation fins are needed to dissipate heat of the solid state disk. The traditional radiating fin fixing mode is that holes are formed in a main board, and two ends of the radiating fin are fixed to the main board through screws, but for a small case, the main board does not have enough space for providing holes for fixing the radiating fin, so that the radiating fin cannot be fixed to the main board.

Disclosure of Invention

In view of the above, it is desirable to provide a heat dissipation device that dissipates heat from the heat sink away from the motherboard and also dissipates heat from the heating element of the solid state disk.

In an embodiment of the present invention, the heat dissipation device includes a heat dissipation fin, the heat dissipation fin is configured to dissipate heat from a heating element, the heat dissipation device further includes a housing and an elastic member, the housing is configured to accommodate the heating element and the heat dissipation fin, the housing includes a cover plate, a sheet-shaped end of the heat dissipation fin is disposed toward the cover plate, one surface of the cover plate facing the inside of the housing is elastically connected to the heat dissipation fin through the elastic member, and the cover plate pushes a planar end of the heat dissipation fin through the elastic member to contact the heating element to dissipate heat.

In an embodiment of the present invention, a guide pillar is disposed on a surface of the cover plate facing the inside of the housing, the elastic member is disposed on the guide pillar in a penetrating manner, the heat sink is disposed with a through hole, the heat sink is slidably disposed on the guide pillar through the through hole, the elastic member is located between the cover plate and the heat sink, and the guide pillar is used for guiding the heat sink.

In an embodiment of the present invention, the cover plate is provided with a baffle plate around each of the guide pillars, the length of the baffle plate is smaller than that of the guide pillars, and a distal end of the baffle plate is used for limiting movement of the heat sink toward the cover plate.

In an embodiment of the present invention, a stop block is disposed at a terminal of the guide post, and the stop block is used for limiting movement of the heat sink away from the cover plate.

In an embodiment of the present invention, a heat conducting gasket is attached to a planar end of the heat sink, and the heat conducting gasket is used for filling an air gap on the surface of the heating element.

In an embodiment of the present invention, the casing is a housing of a chassis, and the cover plate is an upper cover of the housing.

In an embodiment of the invention, the stop block is a flat head screw, and the area of the screw head is larger than that of the guide pillar.

In an embodiment of the present invention, the elastic member is a spring.

The radiating device achieves the purpose of radiating the solid state disk of the heating body while separating the radiating fins from the mainboard through the cover plate and the elastic piece.

Drawings

Fig. 1 is a perspective view of a heat dissipation device according to an embodiment of the invention.

Fig. 2 is a schematic perspective view of an internal structure of a heat dissipation device according to an embodiment of the invention.

Fig. 3 is an exploded view of a heat dissipation device according to an embodiment of the invention.

Fig. 4 is an enlarged view of IV in one embodiment of the present invention.

Description of the main elements

Heat sink 100

Heating element 200

Heat sink 10

Flap end 11

Planar end 12

Through hole 13

Housing 20

Cover plate 21

Guide post 211

Stop block 2111

Baffle 212

Elastic member 30

Heat-conducting gasket 300

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. In the following embodiments, features of the embodiments may be combined with each other without conflict.

Referring to fig. 1 and 2, in an embodiment of the invention, a heat dissipation device 100 includes a heat sink 10, a housing 20, and an elastic member 30. The heat sink 10 includes a blade end 11 and a planar end 12. The flat end 12 is for contacting the heating body 200 and absorbing heat of the heating body 200 while transferring the heat to the sheet end 11, and the sheet end 11 is for radiating the heat. The case 20 accommodates the heat generating element 200 and the heat sink 10. The housing 20 includes a cover plate 21. The fin end 11 of the heat sink 10 is placed toward the cover plate 20. The surface (inner surface) of the cover plate 21 facing the inside of the case 10 is elastically connected to the heat sink 10 by an elastic member 30. The cover plate 20 pushes the flat end 12 of the heat sink 10 against the heating body 200 by the elastic member 30 to dissipate heat.

Referring to fig. 3 and 4, a guide post 211 is disposed on a surface (inner surface) of the cover plate 21 facing the inside of the housing 10. The elastic element 30 is inserted into the guide post 211. The heat sink 10 has through holes 13 at both ends. The heat sink 10 is slidably disposed on the guide posts 211 through the through holes 13, and the elastic member 30 is located between the cover plate 21 and the heat sink 10. The guide posts 211 serve to guide the heat sink 10.

The cover plate 21 is provided with a baffle 212 at both sides of each guide post 211. The length of the baffle 212 is less than the length of the guide post 211. The ends of the baffles 212 serve to limit the movement of the heat sink 10 toward the cover plate 10. The distance between the end of the baffle 212 and the end of the guide post 211 is the movable range of the heat sink 10.

The end of the guide post 211 is provided with a stop 2111. The stop 2111 is used to limit the movement of the heat sink 10 away from the cover plate 21, and prevent the heat sink 10 from falling off the guide post 211.

The distance between the heat radiation surface of the heat generating element 200 and the cover plate 21 is smaller than or equal to the distance between the stopper 2111 and the cover plate 21. If the distance between the heat radiating surface of the heat generating element 200 and the cover 21 is too large, the heat radiating fins 10 cannot come into contact with the heat generating element 200. When the distance between the heating element 200 and the cover plate 21 is smaller than the distance between the stopper 2111 and the cover plate 21, the heating element 200 supports the heat sink 10, the heat sink 10 slides on the guide post 211 toward the cover plate 21, so that the elastic element 30 is compressed, and the elastic element 30 pushes the heat sink 10 to contact the heating element 200 to dissipate heat.

A thermal pad 300 is attached to the planar end 12 of the heat sink 10. The heat conductive pad 300 is used to fill the air gap on the surface of the heating element 200, so that the heat conduction is more sufficient.

In one embodiment of the present invention, the housing 20 is an outer shell of a chassis. The cover plate 21 is an upper cover of the housing. The heat generator 200 is a solid state disk. The stop block 2111 is a flat head screw, and the area of the screw head is larger than the sectional area of the guide post 211. The elastic member 30 is a spring.

It should be noted that when the position of the heating element 200 is interfered with the axial direction of the guide post 211, the height of the heating element 200 is less than or equal to the height of the stop block 2111, otherwise the stop block 2111 contacts the heating element 200, and the cover plate 21 cannot cover the case 20. When the height of the heating element 200 is lower than the height of the stop block 2111, the flat end 12 cannot naturally contact the heating element 200, so at this time, the height of the heat conducting gasket 300 is greater than or equal to the distance between the stop block 2111 and the heating element 200, and is smaller than the distance between the end of the baffle 212 and the end of the guide post 211 plus the distance between the stop block 2111 and the heating element 200, so that the distance that the heat sink 10 can move on the guide post 211 can be fully utilized, and at the same time, the cover plate 21 can cover the housing 20. When the position where the heat generating body 200 is placed does not interfere with the axial direction of the guide post 211, the height of the heat generating body 200 may be within the movable range of the heat radiating fin 10.

It is understood that in other embodiments, the number of the heat sink 10, the guide pillar 211, the elastic member 30, the stopper 2111 and the baffle 212 may be increased or decreased; the heat dissipating device 100 may have a plurality of heat generating elements 200; the heat generating body 200 may be other components than the solid state disk.

The heat sink 100 achieves the purpose of releasing heat from the heat generating element 200 while separating the heat sink 10 from the main board by the cover plate 21 and the elastic member 30.

Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention. Those skilled in the art can also make other changes and the like in the design of the present invention within the spirit of the present invention as long as they do not depart from the technical effects of the present invention. Such variations are intended to be included within the scope of the invention as claimed.

Claims

1. The utility model provides a heat abstractor, includes the fin, the fin is used for dispelling the heat to the heat-generating body, its characterized in that: the heat radiating device further comprises a shell and an elastic piece, the shell is used for containing the heating body and the radiating fins, the shell comprises a cover plate, the sheet-shaped ends of the radiating fins face the cover plate, one surface, facing the inside of the shell, of the cover plate is elastically connected with the radiating fins through the elastic piece, and the cover plate abuts against and pushes the plane ends of the radiating fins to contact with the heating body through the elastic piece.

2. The heat dissipating device of claim 1, wherein: the radiating fin is characterized in that a guide pillar is arranged on one surface, facing the inside of the shell, of the cover plate, the elastic piece penetrates through the guide pillar, a through hole is formed in the radiating fin, the radiating fin penetrates through the guide pillar in a sliding mode through the through hole, and the elastic piece is located between the cover plate and the radiating fin.

3. The heat dissipating device of claim 2, wherein: the cover plate is provided with a baffle plate around each guide pillar, the length of the baffle plate is smaller than that of the guide pillar, and the tail end of the baffle plate is used for limiting the movement of the cooling fin towards the cover plate.

4. The heat dissipating device of claim 3, wherein: the tail end of the guide post is provided with a stop block, and the stop block is used for limiting the movement of the radiating fin far away from the cover plate.

5. The heat dissipating device of claim 4, wherein: and the plane end of the radiating fin is attached with a heat conducting gasket, and the heat conducting gasket is used for filling an air gap on the surface of the heating body.

6. The heat dissipating device of claim 1, wherein: the shell is a shell of a case, and the cover plate is an upper cover of the shell.

7. The heat dissipating device of claim 4, wherein: the stop block is a flat head screw, and the area of the screw head is larger than that of the guide pillar.

8. The heat dissipating device of claim 1, wherein: the elastic piece is a spring.