CN111667853A

CN111667853A - Shockproof heat dissipation structure and storage device thereof

Info

Publication number: CN111667853A
Application number: CN201910174295.7A
Authority: CN
Inventors: 郑宏展
Original assignee: Mitac Computer Kunshan Co Ltd; Getac Technology Corp
Current assignee: Mitac Computer Kunshan Co Ltd; Getac Technology Corp
Priority date: 2019-03-08
Filing date: 2019-03-08
Publication date: 2020-09-15
Also published as: CN113409833A

Abstract

The invention discloses a shockproof heat dissipation structure and a storage device thereof, which comprises a heat conduction shell, a heat source, a shock absorption component and a heat transfer piece, wherein the heat conduction shell is provided with a heat conduction hole; the heat source and the shock absorbing member are arranged in the heat conduction shell, the shock absorbing member is arranged in the heat conduction shell so as to form an interval space between the heat source and the heat conduction shell, and the heat transfer element can be deformed by gravity and is arranged in the interval space in a twisting manner so as to allow heat conduction between the heat source and the heat conduction shell. The invention provides a shockproof heat dissipation structure and a storage device thereof, which mainly enable heat generated by a hard disk or a heat source to be conducted and released to a heat conduction shell so as to help the hard disk or the heat source to dissipate heat or reduce the operating temperature of the hard disk or the heat source.

Description

Shockproof heat dissipation structure and storage device thereof

[ technical field ] A method for producing a semiconductor device

The present invention relates to a heat dissipation structure, and more particularly to a shockproof heat dissipation structure and a storage device thereof.

[ background of the invention ]

At present, in the conventional structure such as a removable hard disk or a structure for loading a storage device, in order to provide shock absorption effects such as shock absorption or shock absorption, a shock absorption element made of a material such as rubber is disposed between the hard disk and the case so that the hard disk does not directly contact the case, and thus when the case is vibrated by an external force, the vibration energy is not directly transmitted to the hard disk through the case to cause the hard disk to be vibrated, and the vibration energy is absorbed by the shock absorption element only, thereby having the similar effects and effects of shock absorption, shock absorption or shock absorption.

However, because there is no heat transmission structure between the hard disk or the storage device and the box body under the technical limitation of shock resistance, and if the box body is a closed structure, the heat generated by the hard disk is not easy to dissipate or cool when the hard disk is operated in the box body, the problem of heat dissipation is more and more difficult to overcome.

In view of the above, the present invention provides a method for improving and solving the above-mentioned deficiencies, and aims to provide a method for improving and solving the above-mentioned deficiencies.

[ summary of the invention ]

The main objective of the present invention is to provide a shockproof heat dissipation structure and a storage device thereof, which is connected to a hard disk and a housing thereof through a heat conduction member capable of deforming under gravity, so as to facilitate heat dissipation of the hard disk through the heat conduction member.

In order to achieve the above object, the present invention provides a heat dissipation structure with shock resistance, which comprises a heat conductive housing, a heat source, a shock absorbing member, and a heat transfer member; the heat source and the shock absorbing member are arranged in the heat conduction shell, the shock absorbing member is arranged in the heat conduction shell so as to form an interval space between the heat source and the heat conduction shell, and the heat transfer element can be deformed by gravity and is arranged in the interval space in a twisting manner so as to allow heat conduction between the heat source and the heat conduction shell.

In order to achieve the above object, the present invention provides a storage device having the above-mentioned shockproof heat dissipation structure, wherein the heat source is generated by a hard disk.

[ description of the drawings ]

Fig. 1 is a perspective exploded view of the exterior of the heat dissipation structure combined with shock resistance according to the present invention.

Fig. 2 is a schematic perspective exploded view of the interior of the heat dissipation structure combined with shock resistance according to the present invention.

Fig. 3 is a perspective assembly view of the interior of the shockproof heat dissipation structure of the present invention.

Fig. 4 is a perspective assembly view of the heat dissipation structure combined with shock resistance according to the present invention.

FIG. 5 is a schematic cross-sectional view of the shockproof heat dissipation structure according to the present invention.

FIG. 6 is a schematic sectional view of another perspective of the heat dissipation structure with shock absorption according to the present invention.

FIG. 7 is a schematic sectional view of another embodiment of the heat dissipation structure with shock absorption according to the present invention.

[ detailed description ] embodiments

For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and are not intended to be limiting.

Please refer to fig. 1, fig. 2 and fig. 3, which are a schematic exterior exploded view, a schematic interior exploded view and a schematic interior assembled view, respectively. The invention provides a heat dissipation structure combined with shock resistance and a storage device thereof, wherein the storage device comprises a heat conduction shell 1, a hard disk 2, a shock absorption component 3 and a heat transfer piece 4; wherein:

the heat-conducting casing 1 is mainly used for carrying and assembling the above components to provide protection, and can be made of materials with better heat-conducting number, such as aluminum. In the embodiment of the present invention, the heat conductive housing 1 may include a base 10 and an upper cover 11, and the base 10 and the upper cover 11 are combined into the heat conductive housing 1 in an up-and-down covering manner, so that the above components can be disposed in the heat conductive housing 1.

The hard disk 2 is located in the heat-conducting housing 1 and can be regarded as a heat source 20 because it generates heat during operation. The present invention also provides a heat source that can conduct and release the heat generated by the hard disk 2 or the heat source 20 to the heat-conducting housing 1, so as to help the hard disk 2 or the heat source 20 dissipate heat or reduce the operating temperature thereof.

The shock-absorbing member 3 can be made of rubber, etc. and is disposed in the heat-conducting housing 1, so that a space 100 is formed between the hard disk 2 or the heat source 20 and the heat-conducting housing 1, thereby absorbing the shock energy to be transmitted to the hard disk 2 or the heat source 20 through the shock-absorbing member 3 when the heat-conducting housing 1 is shocked, and further having shock-absorbing effect and efficacy. In the embodiment of the present invention, the shock-absorbing member 3 is extended along one side of the hard disk 2, and a concave groove 30 for tightly placing one side of the hard disk 2 is formed on one side of the shock-absorbing member 3, and a plurality of protruding point-like abutting portions 31 are formed on the other sides of the shock-absorbing member 3, so as to reduce the contact area with the heat-conducting housing 1, thereby improving the shock-absorbing effect.

The heat transfer member 4 is made of a material deformable by gravity, such as a metal foil, which may be an aluminum foil or a copper foil. In the embodiment of the present invention, the heat transfer element 4 may also be a double-layer structure, and one layer is formed by the metal foil, which may be an aluminum foil or a copper foil; the other layer is mylar. The material has a soft texture, so that the transmission of vibration energy can be reduced or avoided, and meanwhile, the heat transfer effect can be properly provided by the heat transfer characteristic. In addition, the thickness d of the heat transfer element can be between 0.025 and 0.1 mm.

Further, as shown in fig. 4, 5 and 6, the heat transfer element 4 is disposed in the space 100 in a twisted manner, and may include a flexible section 40 and two fixed sections 41, and the flexible section 40 is integrally connected between the two fixed sections 41; in this embodiment, the flexible section 40 is attached to the inner wall of the heat conductive housing 1, and the two fixing sections 41 are adhered to the hard disk 2 or the heat source 20. Thus, the heat transfer member 4 can conduct heat between the hard disk 2 and the heat conductive housing 10 (or between the heat source 20 and the heat conductive housing 10), so as to transfer the heat of the hard disk 2 or the heat source 20 to the heat conductive housing 10 for the purpose of dissipating heat and cooling the hard disk 2 or the heat source 20.

Therefore, the heat dissipation structure combined with shock resistance and the storage device thereof can be obtained through the structural composition.

Furthermore, as shown in fig. 7, fig. 7 is a schematic combined cross-sectional view of another embodiment of the present invention. Wherein, the flexible section 40 of the heat transfer element 4 can also be attached to the hard disk 2 or the heat source 20, and the two fixing sections 41 are adhered to the inner wall of the heat conductive housing 1. This configuration can still be changed to the case that the heat transfer member 4 is twisted and disposed in the space 100 to allow heat conduction between the hard disk 2 or the heat source 20 and the heat conductive housing 1.

However, the above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all changes in the equivalent techniques and means used in the specification and drawings of the present invention are also included in the scope of the present invention, and it is obvious that the present invention is also encompassed by the present invention.

Claims

1. A heat dissipation structure that combines to resist shock, its characterized in that includes:

a heat conductive housing;

a heat source located in the heat-conducting shell;

a shock absorbing member disposed in the heat conductive housing to form a space between the heat source and the heat conductive housing; and

at least one heat transfer element capable of deforming by gravity is twisted and arranged in the space to allow heat conduction between the heat source and the heat conduction shell.

2. The structure of claim 1, wherein the thickness of the heat transfer member is between 0.025 mm and 0.1 mm.

3. The structure for dissipating heat in combination with vibration damping as claimed in claim 1, wherein the heat transfer member is a metal foil.

4. The structure of claim 1, wherein the heat transfer member has a double-layered structure, and one of the layers is an aluminum foil or a copper foil.

5. The structure of claim 4, wherein the other layer of the heat transfer member is Mylar.

6. The structure of claim 1, wherein the heat transfer element comprises a flexible section and two fixed sections, and the flexible section is integrally connected between the two fixed sections.

7. The structure of claim 6, wherein the two fixing sections are adhered to the heat source.

8. The structure of claim 7, wherein the two fixing sections are adhered to the inner wall of the heat-conducting casing.

9. The structure of claim 6, wherein the flexible portion abuts against the inner wall of the heat-conducting housing.

10. The structure of claim 9, wherein the flexure portion abuts against the heat source.

11. A storage device having the shockproof heat dissipating structure as claimed in claim 1, wherein the heat source is generated by a hard disk.