WO2009104283A1

WO2009104283A1 - Damping device of electronic device

Info

Publication number: WO2009104283A1
Application number: PCT/JP2008/053662
Authority: WO
Inventors: えり子小林
Original assignee: Kobayashi Eriko
Priority date: 2008-02-20
Filing date: 2008-02-29
Publication date: 2009-08-27
Also published as: JP2009199653A

Abstract

A damping device of an electronic device, which has a simple and compact structure, is superior in lightness, economy, durability and damping performance and can suitably be applied to a thin electronic device storing case, is provided. The damping device of the electronic device is that in the electronic device storing case. It is provided with a pair or two pairs of tie plate-like electronic device support members (31) that are bent so that a horizontal part (31a) extends to a side of outer faces on right and left sides of the electronic device (20), a hollow damper member (32s) and a screw member (33a) which is engaged/inserted into a hollow part of the damper member with space. The damper member inserted into the screw member and is fitted to a lower face of a horizontal part of the electronic device support member through a shock absorbing member washer (35) becomes an abutting support part to a base in the electronic device storing case, and trigger-supports the electronic device in a non-contact state to the electronic device storing case (10c).

Description

Electronic device vibration control device

The present invention relates to a vibration damping device for an electronic device housing case for housing and protecting an electronic device such as a hard disk drive (hereinafter referred to as “HDD”), in particular, impact resistance, low vibration, quietness, The present invention relates to a vibration damping device for an electronic device suitable for use in a thin electronic device housing case that is excellent in airtightness, drip-proof property and heat dissipation.

In recent years, as a representative example of electronic devices, along with miniaturization and high-speed processing of computer systems, HDDs used as external storage devices have been required to have high-speed processing and large capacity along with miniaturization. . As the recording density of HDDs accelerates, the narrowing of tracks (higher track density or higher TPI) of magnetic heads / media is rapidly progressing.

Thus, when the high TPI of the HDD is advanced and the track is densified, the magnetic head may be deviated from the target track even by a slight vibration, and the reliability of the HDD is lowered. In particular, in HDDs equipped with high-density tracks, there is a strong demand for reduction of vibrations and noise associated therewith.

An impact-resistant small and lightweight portable hard disk device has been proposed as an HDD housing case in which a vibration damping device capable of meeting such demands is incorporated (for example, Patent Document 1).

In the portable hard disk device 200 described in Patent Document 1, as shown in FIG. 8, the shock absorbing material 106 installed between the HDD 104 and the case main body 105 that houses the HDD 104 has an outer surface area of 2 to 50 of the HDD 104. It is the structure of the vibration control device that contacts with%.

Also, an HDD housing case has been proposed in which a vibration damping device is incorporated together with measures against heat generation when the HDD motor is driven (for example, Patent Document 2).

As shown in FIGS. 9 and 10, the HDD housing case 11 described in Patent Document 2 includes a case main body 13 and a lid member 14 attached to the periphery of the opening 13 a at the top of the case main body 13. A pair of

fixing pieces

17 and 17 for fixing the HDD 12 in a suspended state are continuously provided on the inner surface of the lid member 14, and the inner surface of the case main body 13 and the inner surface of the lid member 14 are covered with the sound absorbing material 15. Is a configuration of a vibration damping device that is attached via a vibration damping material 16 disposed on the periphery of the opening 13a at the top of the case body 13.

Accordingly, the lid member 14 that fixes the HDD 12 is attached to the case main body 13, and a pair of

fixing pieces

17 and 17 for fixing the HDD 12 are continuously provided on the lid member 14, and the HDD 12 in the case main body 13 is driven. The heat is transferred to the lid member 14 through the

fixing pieces

17 and 17 protruding into the case main body 13 and released to the case main body 13. Further, the sound absorbing material 15 is arranged on the inner surfaces of the case main body 13 and the lid member 14, and the vibration isolation material 16 is arranged on the periphery of the opening 13 a at the top of the case main body 13 to which the lid member 14 is attached. To reduce.

Furthermore, an anti-vibration support device for a hard disk drive unit has been proposed in which the elastic body supporting the HDD is compressed without being twisted by fastening screws and the performance of the elastic body is reduced during long-term use (for example, Patent Document 3).

As shown in FIGS. 11 and 12, the vibration isolating support device described in Patent Document 3 includes a substantially cylindrical elastic body 406 having a through hole at the center and a central portion 406 a constricted, and a through-hole of the elastic body 406. A pipe 405 to be inserted into the hole; a pressing plate 410 that presses the elastic body 406; and a holding plate 408 that fixes the hard disk drive unit 401 and has a mounting hole 408b to the housing 402. 408 is inserted into the mounting hole 408b, the constriction of the central portion 406a of the elastic body 406 is engaged with the holding plate 408, and the elastic body 406 engaged with the holding plate 408 is positioned between the housing 402 and the pressing plate 410 and fastened. The elastic body 406 is compressed with a screw 404 without twisting, and the pressing plate 410 is fastened to the housing 402.
JP 2003-272367 A JP 2004-234777 A JP 2004-197787 A

In the vibration damping device for the HDD housing case 200 of Patent Document 1, the shock absorber 106 is provided between the HDD 104 and the case main body 105 so as to be in contact with 2 to 50% of the outer surface area of the HDD 104. Has impact resistance. However, since the shock absorbing material 106 is provided between the HDD 104 and the case main body 105, it cannot be thick in terms of space and is about 3 mm thin, so that the shock resistance and vibration absorbing performance are not sufficient. There is a point.

Further, in the vibration damping device for the HDD housing case of Patent Document 2, a pair of

fixing pieces

17 and 17 for fixing the HDD 12 are provided continuously to the lid member 14, and vibration of the HDD 12 17 is transmitted to the lid member 14 through 17, and further propagates to the case body 13 through a screw member (not shown) for fixing the lid member 14. In addition, the vibration isolator 16 provided on the periphery of the opening 13a at the top of the case body 13 cannot be thick and is about 3 mm thin, so that the vibration absorption performance is not sufficient, and the shock resistance and low vibration are low. There is room for further improvements in sex.

On the other hand, in the anti-vibration support device of Patent Document 3, the outer diameter surface of the constricted portion of the central portion 406a of the elastic body 406 that is inserted into and engaged with the mounting hole 408b of the holding plate 408 is caught in the inner surface of the mounting hole 308b. Since the hard disk drive unit 401 and the holding plate 408 that supports the hard disk drive unit 401 are displaced in the vertical direction, the housing 402 is held at a predetermined position in the vertical direction. Can not be. Further, the shape of the substantially cylindrical elastic body 406 with the central portion 406a confined is complicated, and a pair of holding bodies (a total of four) elastic bodies 406 are attached to both side surfaces of the hard disk drive unit 401 at one time. 408 and the two pressing plates 410 that press the pair of elastic bodies 306 are both large, and there are problems such as an increase in weight and cost.

The present invention has been made to solve such problems, and has a simple and compact structure, which is excellent in lightness, durability, and vibration control performance, and is airtight, drip-proof, shock resistant, and low vibration. An object of the present invention is to provide an electronic device vibration damping device that can be suitably applied to a case for housing an electronic device such as a thin HDD that ensures high performance, quietness, and heat dissipation.

In order to achieve the above object, a vibration damping device for an electronic device according to a first aspect of the present invention is a vibration damping device in an electronic device housing case for housing an electronic device, and a band plate is provided on the left and right sides of the electronic device. A pair of or two electronic device support members that are bent so that a horizontal portion projects from the outer surface of both side surfaces and supports the electronic device, a hollow cylindrical damper member having an arbitrary cross section, and a hollow portion of the damper member A screw member that is loosely inserted while being held in a non-contact state, and is inserted through the screw member through shock absorbing member washers each including a shock absorbing member on the lower surface of the horizontal portion of the electronic device support member. The damper member attached in this manner becomes a contact support portion to the bottom surface in the electronic device housing case, thereby elastically supporting the electronic device in a non-contact state with respect to the electronic device housing case. As a feature There.

According to a second aspect of the present invention, in the electronic device vibration damping device according to the first aspect, the pair of electronic device support members each have a band plate that leaves the horizontal portion, and the electronic device is disposed in a central portion in the longitudinal direction. It is characterized by having an electronic device support portion bent and formed in a concave shape or a reverse concave shape for fitting and supporting.

A third aspect of the present invention is the electronic device vibration damping device according to the first aspect, wherein each of the two pairs of electronic device support members has a horizontal portion on each of the left and right side surfaces of the electronic device. It is bent into a substantially L shape or a substantially inverted L shape, and is fixed to a pair of side surfaces of the electronic device.

A fourth aspect of the present invention is the electronic device vibration damping device according to any one of the first to third aspects, wherein the damper member includes a spring member, a gel-like shock absorbing member, a vibration damping rubber, and a low vibration member. It is characterized by comprising any one of a thermoplastic elastomer having a hardness cushioning property or a combination thereof.

According to the first aspect of the present invention, the damper member of the vibration control device is disposed on both sides of the electronic device even in a thin electronic device housing case that is constrained in space in the vertical direction. In addition to ensuring a sufficient thickness to exhibit shock and vibration absorption performance, the damper member part serves as a contact support for the bottom surface of the electronic device storage case, and the electronic device is not in contact with the electronic device storage case. In addition, the damper member is loosely inserted into the screw member and attached to the lower surface of the horizontal portion of the electronic device support member via the shock absorbing member washer, and the screw mounting hole in the horizontal portion is the screw member. For example, because it has a sufficiently large hole diameter to maintain a non-contact state, vibrations during operation of the electronic device do not propagate directly to the electronic device housing case via the electronic device support member, Without propagating directly the electronic device to an external shock from the electronic device housing case, the impact resistance damper member protects the quietness and an electronic apparatus to absorb these vibrations and shocks can be sufficiently secured.

Further, according to the present invention, the outer diameter surface of the constricted portion of the central portion 406a of the elastic body 406 inserted into the mounting hole 408b of the holding plate 408 in the vibration isolating support device of Patent Document 3 bites into the inner surface of the mounting hole 408b. Unlike the structure that contacts intensively, the damper member part is in contact with the horizontal part of the electronic device support member over the entire upper end surface, so there is no deterioration in wear even during long-term use. Predetermined position holding of the electronic device and the electronic device support member with respect to the vertical direction of the device housing case is permanently enabled. In addition, the elastic body 406 in the vibration isolating support device of Patent Document 3 is different from that of a substantially cylindrical shape, and according to the present invention, the damper member can be made into a hollow cylindrical shape having an arbitrary cross section. There is a degree.

Furthermore, the pair of electronic device support members is composed of a lightweight and compact strip that is bent so as to have horizontal portions on the outer surfaces of the left and right side surfaces of the electronic device. The two pressing plates 410 and the like are unnecessary, and there are excellent effects such that the size and weight can be significantly reduced as compared with one large holding plate 408 to which a total of four elastic bodies 406 are attached. According to the present invention having such a configuration, it is possible to reduce the cost because it is simple and lightweight with a compact structure, and is excellent in durability and vibration suppression performance, airtightness, drip-proof property, impact resistance, low vibration property, It is possible to provide an electronic device damping device that can be suitably applied to a thin electronic device housing case that ensures quietness and heat dissipation.

According to the invention of claim 2, in addition to having the same effect as that of the invention of claim 1, the electronic device is fitted into the concave or reverse concave electronic device support part at the center of each of the pair of electronic device support members. Since it is worn and supported, there is an effect that the electronic device can be assembled stably and easily.

According to the invention of claim 3, in addition to having the same effect as that of the invention of claim 1, two pairs of substantially L-shaped or substantially inverted L-shaped electronic device support members are provided on both side surfaces of the electronic device. Since each pair is fixed to each other, the simplest structure is obtained. Therefore, the electronic device housing case can be made thin, and the weight and cost can be reduced by omitting the electronic device supporting portion at the center of the electronic device supporting member in claim 2. There is an effect.

According to the invention of claim 4, in addition to having the same effect as the invention of any one of claims 1 to 3, the damper member absorbs, for example, micro vibrations and shocks in a wide frequency range. Gel-like shock absorbing members such as alpha gel (αGEL: trade name of Geltec), which is a very excellent vibration and shock absorbing material, and spring members, vibration damping rubber, and low hardness cushioning properties Any one or combination of thermoplastic elastomers having the above can be adopted as appropriate, so that the degree of freedom in designing the vibration damping device is increased, and the leakage of vibration when the electronic device is activated to the outside of the electronic device housing case It is possible to further improve the low vibration and quietness due to the prevention, as well as the impact resistance that protects the electronic equipment by absorbing external impact.

It is a front longitudinal cross-sectional view of the electronic device storage case 10 to which the vibration damping device of Example 1 by one Embodiment of this invention is applied. It is a side longitudinal cross-sectional view of the electronic device storage case of FIG. It is a front longitudinal cross-sectional view of the electronic device storage case to which the damping device of Example 2 by other embodiment of this invention is applied. It is a front longitudinal cross-sectional view of the electronic device storage case to which the vibration damping device of Example 3 by further another embodiment of this invention is applied. It is a front longitudinal cross-sectional view of the electronic device accommodation case to which the damping device of Example 4 by further another embodiment of this invention is applied. It is a front longitudinal cross-sectional view of the electronic device accommodation case to which the damping device of Example 5 by further another embodiment of this invention is applied. It is a front longitudinal cross-sectional view of the electronic device storage case to which the vibration damping device of Example 6 by further another embodiment of this invention is applied. It is a disassembled perspective view of the HDD accommodation case to which the conventional vibration damping device is applied. It is a disassembled perspective view of the HDD accommodation case to which the conventional vibration control device (Patent Document 2) is applied. FIG. 10 is a front view (longitudinal sectional view) of the HDD housing case of FIG. 9. It is a disassembled perspective view of the conventional vibration isolating support apparatus (patent document 3). It is a side surface longitudinal cross-sectional view of the vibration isolating support apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Case main body 1a Bottom surface 1b, 1c Side surface 1d Flange part 2

Lid

2a, 31c, 32a, 310c, 320c, 330c Screw mounting hole 3

Sound insulation material

4, 4a Thermal conductivity improvement adhesive

synthetic resin mat

5, 50 Heat sink 6 Damping Material 7 Sound absorbing material 8 Sound insulating material 9 Adhesive synthetic resin sheet with improved

thermal conductivity

10, 10a, 10b, 10c, 10d, 10e, 10f Electronic device housing case 20

Electronic device

21, 33,

33a Screw member

22, 35 Shock absorbing

member Washer

30, 30a, 30b, 30c, 30d,

30e Damping device

31, 310, 320, 330 Electronic

device support member

31a, 311, 321, 331

Horizontal portion

31b, 333 Electronic

device support portion

32, 32s Damper member 34 Nut 36 Shock absorbing member sheet 51, 60f, 61f Heat fins 60 Case substrate 61f1,

61f2 Finribu

312 and 322 upstanding portion 313 the electronic device mounting portion

Hereinafter, a vibration damping device for an electronic apparatus according to the present invention will be described with reference to the drawings of six embodiments.

FIG. 1 is a front longitudinal sectional view of an electronic device housing case 10 to which a vibration damping device 30 of Example 1 according to an embodiment of the present invention is applied. FIG. 2 is a side longitudinal sectional view of the electronic device housing case 10 of FIG. FIG.

The electronic device housing case 10 is a bottom metal with an open top made of a thin metal plate such as an Al alloy system that is lightweight and has high thermal conductivity, or a copper alloy system or an iron alloy system that has better thermal conductivity and sound insulation. The case main body 1 and a lid 2 attached to the upper periphery of the case main body 1 have a flat box shape, and the electronic device 20 is placed and accommodated in the center of the case main body 1. It has become.

The outer surfaces of the case body 1 and the lid 2 are formed with uneven dimples on the entire surface, and the thickness of both the plates including the dimples is about 2 mm, for example. Since the outer surface area of the electronic device housing case 10 is increased by the dimples, the heat dissipation effect is improved.

For example, the case body 1 is formed in a box shape by cutting and raising four

side surfaces

1b, 1b, 1c, and 1c on the left and right sides with respect to the bottom surface 1a, and further, an upper portion of these

side surfaces

1b, 1b, 1c, and 1c. The flange portion 1d serving as a mounting surface to which the lid 2 is screwed is bent inwardly with an appropriate width, and the upper surface of the flange portion 1d is formed to be a flush lid mounting surface. Yes. That is, the opening periphery of the upper part of the case body 1 is a flange portion 1d.

The lid 2 absorbs shock in a state where an adhesive synthetic resin sheet 9 having improved thermal conductivity is interposed between the upper surface of the flange portion 1d which is a lid mounting surface at the opening peripheral edge of the upper portion of the case body 1 and endlessly disposed around the entire circumference. A plurality of screw members 21 are detachably screwed to the

flange portions

1d and 1d through a shock absorbing member washer 22 made of a member. The screw mounting hole 2a of the lid 2 has a sufficiently large hole diameter, for example, 4 mm so as to maintain a non-contact state with respect to the screw member 21 having a diameter of 3 mm, for example.

The shock absorbing member washer 22 is, for example, “alpha gel” (αGEL: a product of Geltech Co., Ltd.) mainly made of silicon which is a very excellent vibration and shock absorbing material that absorbs fine vibrations and shocks in a wide frequency range. Name) or the like can be used.

Since the lid 2 is attached in a non-contact state to the opening peripheral edge of the upper portion of the case body 1 through the heat conductive improvement adhesive synthetic resin sheet 9 and the shock absorbing member washer 22, the electronic apparatus The airtightness and drip-proof property of the housing case 10 are ensured, and vibration and noise during operation of the electronic device are prevented from leaking out of the electronic device housing case 10 through the lid 2, and quietness is ensured. The impact resistance which protects the electronic device 20 by absorbing the impact from the outside via 2 can also be secured.

The central portion of the inner surface of the lid 2 excluding the lid mounting surface on the upper peripheral edge of the opening of the case body 1 is made of a material having high thermal conductivity and shock absorption or cushioning, for example, a rectangle such as the above-mentioned trade name “Denka heat dissipation sheet” It is covered with a plate-like thermal conductivity improving adhesive synthetic resin mat 4. Further, a rectangular plate-shaped heat sink 5 corresponding to the size of the electronic device 20 is adhesively held on the lower surface of the adhesive synthetic resin mat 4. That is, the heat sink 5 is sandwiched between the heat conductive improvement adhesive synthetic resin mat 4 and the upper surface of the electronic device 20.

The heat conductive improvement adhesive synthetic resin mat 4 can improve the contact heat transfer efficiency by being in close contact with the upper surface of the electronic device 20 in which dimples are generally formed. As a result, heat from the electronic device 20 to the lid 2 and the heat-conductivity improving adhesive synthetic resin sheet 9 through the heat sink 5 and the heat-conductivity improving adhesive synthetic resin mat 4 in contact with the electronic device 20 and further to the case body 1 is obtained. Since the transmission path is formed, the heat generated from the electronic device 20 can be dissipated from all the surfaces of the electronic device housing case 10, and a sufficient heat dissipation effect can be ensured. In addition, the adhesive synthetic resin mat 4 and the heat sink 5 that improve the thermal conductivity of the inner surface of the lid 2 also have an effect of preventing leakage of noise due to vibration during operation of the electronic device 20 to the outside of the electronic device housing case 10 as a sound insulating material. is there.

The side surfaces 1b, 1b, 1c, and 1c inside the case main body 1 surround the electronic device 20 with a vibration damping material 6, a sound absorbing material 7, and a sound insulating material 8 in order, as shown in FIGS. It is coated in multiple layers.

The central portion of the bottom surface 1a in the case body 1 that surrounds the periphery of the electronic device 20 and reaches the vibration damping material 6, the sound absorbing material 7, and the sound insulating material 8 that are coated in a multilayered manner on the side surfaces 1b, 1b, 1c, and 1c, It is covered with a rectangular plate-shaped sound insulating material 3.

The vibration damping material 6, the sound absorbing material 7, and the sound

insulating materials

3 and 8 that are applied to the electronic device housing case 10 that houses the electronic device 20 are inaccurate members that scatter dust and fine fibers, and various synthetic resins. It is desirable to use soft type non-woven fabric members such as rubber or rubber. For example, the damping material 6 is various “vibration absorbing pads” or “Denka heat dissipation sheets”, the sound absorbing material 7 is various “sound absorbing foam” such as urethane foam, or “RuBA” (Toray Commercially available products such as various “sound insulation sheets” such as “sound insulation sheet J” (product name of Nittobo) can be applied to the

sound insulation materials

3 and 8 such as DuPont product name. As described above, the “denka heat dissipation sheet” of the adhesive synthetic resin mat 4 is mainly used as a heat conductive member, but can also be used as an impact absorbing material, a vibration damping material, or a sound insulating material.

As shown in FIGS. 1 and 2, the electronic device 20 is made of a band plate and is bent into a concave shape in which the central portion in the longitudinal direction is slightly wider than the width of the electronic device 20, leaving the

horizontal portions

31 a and 31 a at both ends. A pair of electronic device support members 31 on which electronic device support portions 31b for mounting and mounting the electronic device 20 are formed, and attached to the lower surfaces of the

horizontal portions

31a and 31a at both ends of the electronic device support member 31, respectively. It is elastically supported by

vibration control devices

30 and 30 comprising a damper member 32 having a hollow arbitrary cross-sectional shape such as a cylinder.

At this time, the damper member 32 is disposed so that the bottom surface of the damper member 32 protrudes slightly lower than the lower surface of the electronic device support portion 31b of the electronic device support member 31 by, for example, about 2 mm. As a result, a slight gap S is secured between the sound insulating material 3 of, for example, less than about 2 mm on the bottom surface 1a and the lower surface of the electronic device support portion 31b. That is, the electronic device 20 is elastically supported by the vibration damping device 30 in a non-contact state with respect to the case body 1.

Screw mounting holes 31c are formed in the

horizontal portions

31a and 31a at both ends of the electronic device support member 31, respectively. On the other hand, the damper member 32 is formed in a cylindrical bush shape having a thickness of about 6 mm, for example, and has a stepped screw mounting hole 32a that can be embedded so that the head of the screw member 33 does not protrude from the bottom surface of the damper member 32. It is drilled in the center. The damper member 32 is an impact absorbing member formed of an impact absorbing member in a screw member 33 loosely inserted into the

screw mounting holes

32a and 31c on the lower surfaces of the

horizontal portions

31a and 31a at both ends of the electronic device supporting member 31, respectively. The nut 34 is fastened and attached via a washer 35. Each of the screw attachment holes 31c and 32a has a sufficiently large hole diameter, for example, 4 mm so as to maintain a non-contact state with respect to the screw member 33 having a diameter of 3 mm, for example.

By mounting the electronic device 20 on the upper surface of the electronic device support 31b at the center of the vibration damping device 30 assembled in this way, the electronic device 20 is moved upward by the elastic force of the damper member 32 of the vibration damping device 30. The electronic device 20 is elastically supported in the case body 1 with the upper surface of the electronic device 20 in contact with the heat sink 5. Therefore, the electronic device support member 31 and the electronic device 20 do not have to be fixed by fixing means such as a screw member.

The damper member 32 or the shock absorbing

member washers

22 and 35 are not particularly limited as long as they are known, for example, an elastomer material that absorbs and attenuates shock and vibration, has low hardness and cushioning properties. That is, the material of the shock absorbing member is a gel-like resin, rubber-like resin, foamed resin, and is thermoplastic such as silicon, polystyrene, polyester, polyurethane, polyamide, fluororesin, polyolefin, etc. A gel-like impact absorbing member such as an elastomer, for example, “alpha gel” (αGEL: a trade name of Geltech Co., Ltd.) using silicon as a main raw material can be used.

With such a configuration of the vibration damping device 30, the damper member 32 is attached to the side of the electronic device 20 even in the thin electronic device housing case 10 that is restricted in space in the vertical direction, so that the electronic device is supported. The damper member 32 provided on the lower surfaces of the

horizontal portions

31a and 31a at both ends of the member 31 can secure a thickness that can sufficiently exhibit shock and vibration absorption performance, for example, about 6 mm, and the damper member 32 can be applied to the case body 1. Since the electronic device 20 and the electronic device support member 31 are elastically supported in a non-contact state with respect to the case body 1 as a contact support portion, vibration during the operation of the electronic device 20 is caused through the electronic device support member 31. In this way, the vibrations and shocks are absorbed without directly propagating to the case body 1, and further, external shocks are not directly propagated from the case body 1 to the electronic device 20. Impact resistance to protect the quietness and electronic equipment 20 Te can be sufficiently secured.

Further, the electronic device 20 can be stably and easily assembled by being fitted to the upper surface of the concave or reverse concave electronic device support portion 31b at the center of each of the pair of electronic device support members 31.

FIG. 3 is a front longitudinal sectional view of an electronic device housing case 10a to which the vibration damping device 30a of Example 2 according to another embodiment of the present invention is applied.

The damping device 30a of the second embodiment includes a damper member 32s made of a spring member instead of the damper member 32 made of the gel-like shock absorbing member of the damping device 30 of the first embodiment shown in FIGS. The configuration is exactly the same as in the first embodiment except for the differences. Therefore, here, the same reference numerals are given to the same constituent members as those in the first embodiment even if the shapes are partially different.

In this embodiment, as shown in FIG. 3, a compression coil spring as a damper member 32 s is inserted into the lower surfaces of the

horizontal portions

31 a and 31 a at both ends of the electronic device support member 31 and the screw attachment holes 31 c. Between the head 33 a and the nut 34 through the shock absorbing member washer 35.

Therefore, in this embodiment, the bottom surface of the head 33a of the screw member 33 to which the compression coil spring of the damper member 32s is attached is projected slightly downward, for example, about 2 mm from the lower surface of the electronic device support portion 31b of the electronic device support member 31. Is disposed on the bottom surface 1a of the case main body 1 so that a slight gap S is formed between the sound insulating material 3 of, for example, less than 2 mm on the bottom surface 1a and the lower surface of the electronic device support portion 31b. It is to be secured. That is, the electronic device 20 is elastically supported in a non-contact state with respect to the case body 1 by the vibration damping device 30a.

The screw mounting hole 31c has a sufficiently large hole diameter, for example, 4 mm so as to keep a non-contact state with respect to the screw member 33 having a diameter of 3 mm, for example. Also, the compression coil spring of the damper member 32 s naturally has a sufficiently large inner diameter that keeps the screw member 33 in a non-contact state.

By mounting the electronic device 20 on the upper surface of the electronic device support 31b at the center of the vibration damping device 30a assembled in this way, the electronic device 20 has a compression coil spring of the damper member 32s of the vibration damping device 30a. It is appropriately pressed in the direction of the upper lid 2 by elastic force, and is elastically supported in the case main body 1 with the upper surface of the electronic device 20 in contact with the heat sink 5. Therefore, the electronic device support member 31 and the electronic device 20 do not have to be fixed by fixing means such as a screw member.

With such a configuration of the vibration damping device 30a, the damper member 32s is attached to the side of the electronic device 20 even in a thin electronic device housing case 10a that is restricted in space in the vertical direction. The damper members 32s provided on the lower surfaces of the

horizontal portions

31a and 31a at both ends of the 31 can secure a thickness that can sufficiently exhibit shock and vibration absorbing performance, that is, a spring length, and can be secured via the damper member 32s and the shock absorbing member washer 35a. The electronic device 20 and the electronic device support member 31 are elastically supported in a non-contact state with respect to the case main body 1 because the head 33a of the screw member 33 serves as a contact support portion into the case main body 1. 20 The vibration at the time of operation does not propagate directly to the case body 1 through the electronic device support member 31, and the impact from the outside is not lost. Without propagating directly to the electronic device 20 from the main body 1, the impact resistance to protect the quietness and the electronic device 20 to absorb these vibrations and shock can be sufficiently secured.

FIG. 4 is a front longitudinal sectional view of an electronic device housing case 10c to which the vibration damping device 30b of Example 3 according to still another embodiment of the present invention is applied.

The electronic device housing case 10c of the third embodiment is such that the heat sink 5 in the electronic device housing case 10a of the second embodiment shown in FIG. 3 is removed, and the lid 2 or the case main body 1 is formed of a heat conductive vibration damping plate. The difference between the attachment of the screw member 33a through which the damper member 32s made of a compression coil spring is inserted into the vibration damping device 30a in the second embodiment is between the bottom surface of the electronic device 20 and the top surface of the electronic device support portion 31b. Except for the point that an impact absorbing member sheet 36 made of an impact absorbing member similar to the impact absorbing

member washers

22 and 35 is interposed, the rest of the configuration is exactly the same as in the second embodiment. Therefore, here, in order to simplify the explanation and make it easy to understand, the same components as in the second embodiment, the case main body 1 and the lid 2 are given the same reference numerals as in the second embodiment even though the shapes are partially different. .

In this embodiment, as shown in FIG. 4, a material having high thermal conductivity and shock absorption or cushioning properties such as a trade name “Denka Heat Dissipating Sheet” is formed between the inner surface of the lid 2 and the upper surface of the electronic device 20. A plurality of adhesive synthetic resin mats 4a having improved thermal conductivity such as a quadrangular or circular plate shape are interposed.

As a result, a heat transfer path from the electronic device 20 to the lid 2 and the thermal conductivity-enhancing adhesive synthetic resin sheet 9 through the thermal conductivity-improving adhesive synthetic resin mat 4a in contact with the electronic device 20 and further to the case body 1 is provided. Since it is formed, the heat generated from the electronic device 20 can be dissipated from all surfaces of the electronic device housing case 10c, and a sufficient heat dissipation effect can be secured. Further, the adhesive synthetic resin mat 4a with improved thermal conductivity on the inner surface of the lid 2 has an effect of preventing leakage of vibrations when the electronic device 20 is operated to the outside of the electronic device housing case 10c.

Further, in this embodiment, although not shown, the lid 2 or the case body 1 is a metal plate with good thermal conductivity, an elastic film with improved thermal conductivity that has excellent shock absorption or cushioning properties and improved thermal conductivity, It is comprised from the heat conductive damping plate laminated | stacked in order of the metal plate.

The thermal conductivity-improving elastic film is made of, for example, a polymer resin film such as an acrylic resin mixed with a high thermal conductivity filler such as metal or carbon, and has a thermal conductivity of 1 KW / (m · K) or more. desirable.

In such an embodiment, in addition to the vibration damping performance of the vibration damping device 30b similar to that of the second embodiment, a heat conductive vibration damping plate laminated with a thermal conductivity improving elastic film interposed between metal plates is covered with the lid 2. And by applying to the case body 1, quietness by preventing leakage of vibration and noise during operation of the electronic device 20 to the outside of the electronic device housing case 10 c and shock resistance that protects the HDD by absorbing external shocks. In addition to the further improvement, even if the heat sink is omitted as in this example, the heat dissipation from the entire electronic device housing case 10b can be effectively ensured.

FIG. 5 is a front longitudinal sectional view of an electronic device housing case 10d to which the vibration damping device 30c of Example 4 according to still another embodiment of the present invention is applied.

In the electronic device housing case 10d of the fourth embodiment, the vibration damping device 30c is divided into the left and right side surfaces of the electronic device 20 with respect to the electronic device housing case 10c of the third embodiment shown in FIG. The configuration is exactly the same as that of the third embodiment except that a total of four (two) are attached and the heat sink 50 is provided on the upper surface of the electronic device 20. Therefore, here, in order to simplify the explanation and make it easy to understand, the same constituent members as those of the third embodiment including the case main body 1 are denoted by the same reference numerals as those of the third embodiment even if the shapes are partially different.

In this embodiment, as shown in FIG. 5, the electronic device support member 310 of the vibration damping device 30c is divided into the left and right electronic device support portions 31b at the center of the electronic device support member 31 in the first to third embodiments. It has a deformed structure. In other words, the electronic device support member 310 is made of a band plate, and stands upright along the left and right side surfaces of the electronic device 20 and on the lower portion of the upright portion 312 so as to project laterally on the outer surface of the left and right side surfaces of the electronic device 20. A horizontal portion 311 bent in an L shape at a right angle and an inverted L shape bent along the upper surface of the electronic device 20 at a right angle above the upright portion 312 and screwed to the upper surface of the electronic device 20 by a screw member (not shown). The electronic device mounting portion 313 is formed.

Also in this embodiment, similarly to the third embodiment, the screw members 33a are respectively connected to the screw mounting holes 310c of the horizontal portion 311 of the electronic device support member 310 through the shock absorbing member washer 35 from above, and the compression coil springs of the damper member 32s. Both of them are loosely inserted, and a thin tip portion 33 b formed in a stepped shape is screwed to the bottom surface 1 a of the case body 1. Both the screw mounting hole 310c and the compression coil spring of the damper member 32s have a sufficiently large hole diameter so as to maintain a non-contact state with respect to the screw member 33a.

According to such a configuration of the split-type support member 310, there is annoyance of screwing the electronic device mounting portion 313 onto the upper surface of the electronic device 20, but for example, the central portion of the electronic device support member 31 in the second embodiment or the like. There is an advantage that the electronic device housing case 10d can be made thinner and lighter by omitting the electronic device support portion 31b.

As shown in FIG. 5, the heat sink 50 placed on the upper surface of the electronic device 20 has, for example, groove-shaped heat radiation fins 51 formed on the upper surface, and the upper surface of the heat radiation fin 51 is an adhesive for improving the thermal conductivity of the inner surface of the lid 2. The synthetic resin mat 4 is arranged in a non-contact state with an appropriate gap S1 with respect to the lower surface of the synthetic resin mat 4.

According to the configuration of this embodiment, the radiant heat from the radiating fins 51 of the heat sink 50 that is in contact with the electronic device 20 is conducted to the lid 2 and the case body 1 via the heat-conductivity improving adhesive synthetic resin mat 4. Since the heat transfer path is formed, the heat generated from the electronic device 20 can ensure the heat radiation effect from all surfaces of the electronic device housing case 10d. In addition, since the electronic device 20 (both of the heat sink 50) is in a non-contact state with the case body 1 and the lid 2, the vibration propagation of the electronic device 20 is blocked with respect to the case body 1 and the lid 2. There is also an effect of further improving the quietness by preventing leakage of vibration and noise during operation of the device 20 to the outside of the electronic device housing case 10d, and impact resistance that protects the electronic device 20 by blocking the propagation of impact from the outside.

FIG. 6 is a front longitudinal sectional view of an electronic device housing case 10e to which the vibration damping device 30d of Example 5 according to still another embodiment of the present invention is applied.

In the electronic device housing case 10e according to the fifth embodiment, the electronic device support member 320 of the vibration damping device 30d is screwed onto the upper surface of the electronic device 20 of the electronic device support member 310 according to the fourth embodiment shown in FIG. The rest of the configuration is exactly the same as that of the fourth embodiment, except that the portion 313 is a modified structure that is omitted. Therefore, here, in order to simplify the explanation and make it easy to understand, the same components as those in the fourth embodiment are denoted by the same reference numerals as those in the fourth embodiment even if the shapes are partially different.

As shown in FIG. 6, the electronic device support member 320 according to this embodiment is formed of a strip plate, and has an upright portion 322 that stands upright along the left and right side surfaces of the electronic device 20, and laterally on the outer surfaces of the left and right side surfaces of the electronic device 20. A horizontal portion 321 bent in an L shape at right angles to the lower portion of the upright portion 322 so as to overhang, and the upright portion 322 is screwed to the left and right side surfaces of the electronic device 20 by screw members (not shown). The screw mounting hole 320c of the horizontal portion 321 has the same configuration as the

screw mounting holes

31c and 310c of the first to fourth embodiments.

Other configurations of the electronic device housing case 10e are the same as those in the fourth embodiment. Therefore, in the fifth embodiment, in addition to having the same excellent advantages as those of the fourth embodiment, there is an advantage that the weight can be further reduced and the cost can be further reduced because the electronic device mounting portion 313 in the fourth embodiment is omitted.

FIG. 7 is a front longitudinal sectional view of an electronic device housing case 10f to which the vibration damping device 30e of Example 6 according to still another embodiment of the present invention is applied.

In the electronic device housing case 10f of the sixth embodiment, the electronic device support member 330 of the vibration damping device 30e includes a pair of opposed electronic device support members 310 on both the left and right sides of the electronic device 20 in the fourth embodiment shown in FIG. , 310 has the same configuration as that of the fourth embodiment except that the electronic

device mounting portions

313 and 313 of 310 are integrally deformed. Therefore, here, in order to simplify the explanation and make it easy to understand, the same components as those in the fourth embodiment are denoted by the same reference numerals as those in the fourth embodiment even if the shapes are partially different.

As shown in FIG. 7, the electronic device support member 330 of this embodiment is made of a band plate, and has a reverse concave shape in which the central portion in the longitudinal direction is slightly wider than the width dimension of the electronic device 20 except for the

horizontal portions

331 and 331 at both ends. An electronic device support portion 333 is formed to fit the electronic device 20 on the lower surface bent and to be screwed and supported by a screw member (not shown). The screw mounting hole 330c of the horizontal portion 331 has the same configuration as the

screw mounting holes

31c, 310c and 320c of the first to fifth embodiments.

Other configurations of the electronic device housing case 10f are the same as those in the fourth embodiment.

In the sixth embodiment having such a configuration, the electronic device 20 is fitted into the lower surface of the concave or reverse concave electronic device support portion 333 at the center of each of the pair of electronic device support members 330 and is assembled stably and easily. Can be attached.

Note that the spring constant of the damper member of the vibration damping device is 11.242 N / mm (1.146 kgf / mm) in the case of a compression coil spring, for example, but can be selected as appropriate. Further, a damper member such as a compression coil spring is attached in a state where a preload is applied so as to appropriately press the electronic device in the direction of the upper lid at the time of initial attachment. It is set as appropriate according to the specifications and characteristics of the housing case.

The present invention can provide a vibration damping device for an electronic device that can be suitably applied to a thin electronic device housing case that ensures airtightness, drip-proofing, impact resistance, low vibration, quietness, and heat dissipation. The present invention can also be suitably applied to storage cases such as personal computers, disk array devices, and various optical devices having drive units and / or electronic devices.

Claims

A vibration damping device in an electronic device housing case for housing an electronic device,
A pair of electronic device support members that are bent so that a horizontal portion projects laterally from the outer surface of the left and right side surfaces of the electronic device, and support the electronic device;
A hollow cylindrical damper member of arbitrary cross-section;
A screw member that is loosely inserted and held in a non-contact state in the hollow portion of the damper member,
The damper member inserted through the screw member and attached to the lower surface of the horizontal portion of the electronic device supporting member via an impact absorbing member washer made of an impact absorbing member is applied to the bottom surface in the electronic device housing case. A vibration damping device for an electronic device, wherein the electronic device is elastically supported in a non-contact state with respect to the electronic device housing case by being a contact support portion.
Each of the pair of electronic device support members has an electronic device support portion that is bent and formed in a concave shape or a reverse concave shape so that the band plate fits and supports the electronic device in the longitudinal central portion while leaving the horizontal portion. The electronic device vibration damping device according to claim 1.
The two pairs of electronic device support members are characterized in that each band plate is bent into a substantially L shape or a substantially inverted L shape having the horizontal portion, and a pair of the electronic device support members are fixed to the side surfaces of the electronic device. The electronic device vibration control device according to claim 1.
2. The damper member according to claim 1, wherein the damper member is made of any one of a spring member, a gel-like impact absorbing member, a vibration damping rubber, and a thermoplastic elastomer having a low hardness cushioning property or a combination thereof. 4. The electronic device vibration damping device according to any one of items 3 to 3.