CN113096696A - External memory for computer - Google Patents
External memory for computer Download PDFInfo
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- CN113096696A CN113096696A CN202110229515.9A CN202110229515A CN113096696A CN 113096696 A CN113096696 A CN 113096696A CN 202110229515 A CN202110229515 A CN 202110229515A CN 113096696 A CN113096696 A CN 113096696A
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- 238000003825 pressing Methods 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 238000005057 refrigeration Methods 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 239000000956 alloy Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/04—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers
- G11B33/0405—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers for storing discs
- G11B33/0411—Single disc boxes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1426—Reducing the influence of the temperature by cooling plates, e.g. fins
Abstract
An external memory for a computer comprises a shell, a microprocessor, a placing plate and a pressing plate; the placing plate is connected with the inner wall of the shell through an elastic supporting component; the placing plate is provided with a second socket part for connecting the data transmission with the memory body; the second socket part is connected with the data interface through a data line; a group of side end faces of the shell are provided with first socket parts; the first socket part is provided with a power socket and a data interface; the upper end face of the shell is provided with an end cover, and two groups of outer end faces, which are far away from each other, of the shell are provided with a plurality of groups of mounting grooves; the shell is internally provided with an adjusting component, a temperature detection unit and a microprocessor which are used for pressing the pressure plate on the memory body; the bottom surface of each group of mounting grooves is provided with a first through hole, and a heat dissipation plate is arranged in each group of mounting grooves; the semiconductor refrigerating sheet is arranged in the first through hole. The memory provided by the invention has good heat dissipation performance, and can be effectively prevented from being broken after falling.
Description
Technical Field
The invention relates to the technical field of computers, in particular to an external memory for a computer.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has the function of storage and memory. The intelligent electronic device is a modern intelligent electronic device which can operate according to a program and automatically process mass data at a high speed; along with the development of science and technology, the application of computers is more and more popular, and the use of computers is more and more unavailable in daily life and office needs; when a computer is used, massive data needs to be stored, an external memory is often used to improve the capacity of storing application data of the computer, the heat energy generated inside the memory when the memory runs for a long time can affect the use performance of the memory if the heat energy cannot be timely dissipated, and in addition, after the memory accidentally falls, the memory is impacted, so that the electronic components inside the memory can be damaged, and the memory cannot be normally used.
Disclosure of Invention
Objects of the invention
The invention provides an external memory for a computer, which has good heat dissipation performance and can effectively prevent the memory from being broken after falling.
(II) technical scheme
The invention provides an external memory for a computer, which comprises a shell, a first socket part, a microprocessor, a placing plate, a temperature detection unit, a pressing plate and a plurality of groups of semiconductor refrigerating sheets, wherein the shell is provided with a first socket part;
a group of side end faces of the shell are provided with first openings, the upper end face of the shell is provided with second openings, the shell is provided with an end cover used for sealing the second openings, and two groups of outer end faces, far away from each other, of the shell are provided with a plurality of groups of mounting grooves; the bottom surface of each group of mounting grooves is provided with a first through hole, and a heat dissipation plate is arranged in each group of mounting grooves;
the hot ends of the semiconductor refrigeration pieces are respectively connected with the end faces of the heat dissipation plates in the shell; the first socket part is arranged in the first opening, and a power socket and a data interface are arranged on the first socket part;
the lower end face of the placing plate is provided with an elastic supporting component; the elastic supporting component is connected with the inner wall of the shell; the placing plate is provided with a second socket part for connecting the data transmission with the memory body; the second socket part is connected with the data interface through a data line;
the pressing plate is positioned right above the placing plate, a placing space for clamping and placing the memory body is formed between the pressing plate and the placing plate, and an adjusting assembly for tightly pressing the pressing plate on the memory body is arranged in the shell;
the microprocessor is connected with the inner wall of the shell; the microprocessor, the temperature detection unit, the plurality of groups of semiconductor refrigeration pieces and the power socket are electrically connected; the temperature detection unit is connected with the pressing plate.
Preferably, the elastic support assembly comprises a plurality of groups of first springs, a plurality of groups of sliding blocks and a plurality of groups of support rods;
the plurality of groups of sliding blocks are respectively connected with the bottom surface of the shell in a sliding manner, and are symmetrically distributed by taking the central axis of the placing plate as a center; two ends of the plurality of groups of first springs are respectively connected with the plurality of groups of sliding blocks and the inner wall of the shell;
the multiunit bracing piece is central symmetry distribution with the axis of placing the board, and the multiunit bracing piece all inclines to set up, and the one end of multiunit bracing piece is rotated and is connected the multiunit slider, and the other end of multiunit bracing piece all rotates to connect and places the board.
Preferably, heat insulation glue is filled between the inner wall of each group of first through holes and the hot end of each group of semiconductor refrigerating pieces.
Preferably, the adjusting assembly comprises a plurality of groups of guide rods, a plurality of groups of heat conducting fins, a plurality of groups of sliding plates, a plurality of groups of second springs and a plurality of groups of fastening pieces;
a plurality of groups of guide rods are uniformly distributed on two sides of the placing plate side by side;
one end of each group of heat conducting fins is connected with the placing plate, and the other end of each group of heat conducting fins is provided with a second through hole for the guide rod to pass through;
the sliding plates correspond to the guide rods one by one, and each sliding plate is provided with a third through hole for the guide rod to pass through; when the memory body is in an installation state, the elastic supporting component is in a compression state; the guide rods sequentially penetrate through the first through holes and the second through holes; the plurality of groups of second springs are sleeved on the outer sides of the plurality of groups of guide rods; the plurality of groups of fasteners are respectively in threaded fit connection with the plurality of groups of guide rods and respectively compress the plurality of groups of second springs; the multiple groups of second springs are all in a compressed state; the multiple groups of heat conducting fins are all in a bending state, and the multiple groups of heat conducting fins respectively compress the cold ends of the multiple groups of semiconductor refrigeration fins.
Preferably, each group of heat conducting fins is made of aluminum alloy materials.
Preferably, the placing plate is connected with a plurality of groups of guide rods in a sliding mode.
Preferably, the end surface of the placing plate facing to the memory body is provided with a placing groove for sliding fit with the memory body; the end face of the pressing plate is provided with a limiting groove for the memory body to extend into in a matched mode.
Preferably, a plurality of groups of fastening pieces are further included; the cross section of the end cover is L-shaped, a sliding plate is arranged on the side end face of one group of horizontal end faces of the end cover, a plurality of groups of insertion blocks are arranged on the end face, far away from the vertical end face, of one group of horizontal end faces of the end cover, and a plurality of groups of fourth through holes are arranged on one group of vertical end faces of the end cover; a third opening is arranged on the side end face of the shell; the third opening is communicated with the second opening; the inner wall of the second opening is provided with a sliding chute and a plurality of groups of socket blind holes; a countersunk groove is formed in the side end face of the shell along the peripheral direction of the third opening; a plurality of groups of threaded blind holes are arranged in the countersunk groove;
the sliding plate is connected with the sliding chute in a sliding way; the group of vertical end faces of the end cover tightly press the bottom face of the countersunk groove, and the outer end face of the end cover is flush with the outer end face of the shell; the multiple groups of insertion blocks are inserted into the multiple groups of insertion hole blind holes in a matched manner; and the plurality of groups of fastening pieces respectively penetrate through the plurality of groups of fourth through holes and are respectively screwed into the plurality of groups of threaded blind holes.
Preferably, the device also comprises a plurality of groups of fixed blocks; a set of side end face of shell is all connected to multiunit fixed block, all is equipped with the mounting hole on every group fixed block.
Preferably, four groups of edges and corners of the shell are provided with elastic wrap angles.
Compared with the prior art, the technical scheme of the invention has the following beneficial technical effects:
according to the invention, the end face of the memory body, which is attached to the placing plate, is matched with the socket inserted into the second socket part to carry out data transmission, the pressing plate is pressed tightly against the memory body through the adjusting assembly to press the memory body tightly against the placing plate, at the moment, the elastic supporting assembly is in a compressed state, and the end cover is matched with the shell; after the shell falls accidentally, the impact on the shell is buffered by the elastic supporting component, so that the damage to the memory body is avoided; the temperature detection unit arranged in the shell is used for detecting the temperature in the sealed shell when the memory body runs, and when the temperature in the shell rises, the plurality of groups of semiconductor refrigerating sheets run to cool the interior of the shell, so that the problem that the service performance of the memory body is influenced because high temperature generated when the memory body runs cannot be dissipated in the shell is avoided, and the service life of the memory body is further prolonged;
according to the invention, the memory body is pressed on the placing plate by the pressing plate through the adjusting assembly, and heat energy generated when the memory body operates is conducted to the placing plate and the pressing plate and is gradually conducted to the plurality of groups of heat conducting sheets; the storage device comprises a plurality of groups of semiconductor refrigerating sheets, a plurality of storage plates and a plurality of storage units, wherein the plurality of groups of semiconductor refrigerating sheets run, cold ends of the plurality of groups of semiconductor refrigerating sheets compress the plurality of groups of heat conducting sheets to refrigerate the plurality of groups of heat conducting sheets, and further the storage body and a second socket part between the storage plate and the placing plate are cooled, so that the service life of the storage body is prolonged;
the end cover and the shell are detachably connected, so that the appearance is good.
Drawings
Fig. 1 is a schematic perspective view of an external memory for a computer according to the present invention.
Fig. 2 is a schematic perspective view of a housing of an external memory for a computer according to the present invention.
Fig. 3 is a schematic diagram of a partially enlarged structure at a position a in an external memory for a computer according to the present invention.
Fig. 4 is a schematic perspective view of an end cap of an external memory for a computer according to the present invention.
Fig. 5 is a schematic structural diagram of an external memory for a computer according to the present invention.
Fig. 6 is a schematic diagram of a partially enlarged structure at B in an external memory for a computer according to the present invention.
Fig. 7 is a schematic structural diagram of a placement board and an upper pressure board in an external memory for a computer according to the present invention.
Fig. 8 is a schematic diagram of a partially enlarged structure at C in an external memory for a computer according to the present invention.
Reference numerals: 1. a housing; 2. an end cap; 3. a fixed block; 4. mounting holes; 5. a first socket portion; 6. a first opening; 7. a second opening; 8. a socket blind hole; 9. a heat dissipation plate; 10. a third opening; 11. a countersunk groove; 12. a chute; 13. a threaded blind hole; 14. a fourth via hole; 15. a slide plate; 16. an insertion block; 17. a microprocessor; 18. a second socket portion; 19. placing the plate; 191. a placement groove; 20. a memory body; 21. a temperature detection unit; 22. a guide bar; 23. a first spring; 24. a slider; 25. a support bar; 26. a heat conductive sheet; 27. pressing a plate; 28. a sliding plate; 29. a second spring; 30. a fastener; 31. a semiconductor refrigeration sheet; 32. a first through hole; 33. and (4) heat insulation glue.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-8, the external memory for a computer provided by the present invention comprises a housing 1, a first socket 5, a microprocessor 17, a placing plate 19, a temperature detecting unit 21, a pressing plate 27 and a plurality of groups of semiconductor cooling plates 31;
a group of side end faces of the shell 1 are provided with first openings 6, the upper end face of the shell 1 is provided with second openings 7, the shell 1 is provided with end covers 2 used for sealing the second openings 7, and two groups of outer end faces, far away from each other, of the shell 1 are provided with a plurality of groups of mounting grooves; the bottom surface of each group of mounting grooves is provided with a first through hole 32, and a heat dissipation plate 9 is arranged in each group of mounting grooves; the heat dissipation plate 9 is made of copper alloy materials without limitation;
the multiple groups of semiconductor refrigeration pieces 31 correspond to the multiple groups of first through holes 32 one by one, and the hot ends of the multiple groups of semiconductor refrigeration pieces 31 are respectively connected with the end faces of the multiple groups of heat dissipation plates 9 in the shell 1; the first socket part 5 is arranged in the first opening 6, and a power socket and a data interface are arranged on the first socket part 5;
the lower end surface of the placing plate 19 is provided with an elastic supporting component; the elastic supporting component is connected with the inner wall of the shell; in the working state, the elastic supporting components are all in a compressed state; the placing plate 19 is provided with a second socket part 18 for connecting a memory body 20 for data transmission; the second socket part 18 is connected with the data interface through a data line; the second socket 18 is provided with a socket for inserting the pins of the memory body 20 correspondingly, and the memory body 20 is fitted to the end surface of the placing plate 19 and inserted into the second socket 18;
the pressing plate 27 is positioned right above the placing plate 19, a placing space for clamping and placing the memory body 20 is formed between the pressing plate 27 and the placing plate 19, and an adjusting component for pressing the pressing plate 27 on the memory body 20 is arranged in the shell 1;
the microprocessor 17 is connected with the inner wall of the shell 1; the microprocessor 17, the temperature detection unit 21, the plurality of groups of semiconductor refrigeration pieces 31 and the power socket are electrically connected; the temperature detection unit 21 is connected to the platen 27.
In an embodiment of the invention, the end face of the memory body 20 attached to the placing plate 19 is inserted into the socket on the second socket 18 in a matching manner to perform data transmission, and then the pressing plate 27 is pressed against the memory body 20 through the adjusting component arranged to press the memory body 20 against the placing plate 19, at this time, the elastic supporting component is in a compressed state, and the end cover 2 is matched with the shell 1; after the shell 1 falls accidentally, the impact on the shell is buffered by the elastic supporting component, so that the memory body 20 is prevented from being damaged; the temperature detecting unit 21 of installation in the shell 1 is used for detecting when memory body 20 moves, and the temperature in the sealed shell 1 rises the back when the temperature in the shell 1, and the operation of multiunit semiconductor refrigeration piece 31 is cooled down to shell 1 is inside, and the high temperature that produces when avoiding memory body 20 to move can't give off the performance that influences memory body 20 in shell 1, and then improves its life.
In an alternative embodiment, the elastic support assembly comprises a plurality of sets of first springs 23, a plurality of sets of sliders 24, and a plurality of sets of support rods 25;
a plurality of groups of sliding blocks 24 are respectively connected with the bottom surface of the shell 1 in a sliding way, and the plurality of groups of sliding blocks 24 are symmetrically distributed by taking the central axis of the placing plate 19 as the center; two ends of the plurality of groups of first springs 23 are respectively connected with the plurality of groups of sliding blocks 24 and the inner wall of the shell 1;
the plurality of groups of supporting rods 25 are symmetrically distributed by taking the central axis of the placing plate 19 as a center, the plurality of groups of supporting rods 25 are all obliquely arranged, one end of each group of supporting rods 25 is rotatably connected with the plurality of groups of sliding blocks 24, and the other end of each group of supporting rods 25 is rotatably connected with the placing plate 19;
when the storage device is used, when the pressing plate 27 extrudes the storage device body 20, the plurality of groups of supporting rods 25 gradually incline to push the plurality of groups of sliding blocks 24 to move, so that the lengths of the plurality of groups of first springs 23 are changed, the plurality of groups of first springs 23 have elastic force, and the impact force applied when the storage device falls is buffered by the elastic force of the plurality of groups of first springs 23.
In an optional embodiment, a heat insulation glue 33 is filled between the inner wall of each group of the first through holes 32 and the hot end of each group of the semiconductor chilling plates 31, so as to separate the hot end and the cold end of the semiconductor chilling plates 31, thereby improving the effect of the multiple groups of the semiconductor chilling plates 31 on the refrigeration of the inside of the housing 1.
In an alternative embodiment, the adjustment assembly includes a plurality of sets of guide rods 22, a plurality of sets of heat-conducting fins 26, a plurality of sets of sliding plates 28, a plurality of sets of second springs 29, and a plurality of sets of fasteners 30;
a plurality of groups of guide rods 22 are arranged side by side and evenly distributed on two sides of the placing plate 19;
one end of each of the plurality of groups of heat-conducting fins 26 is connected with the placing plate 19, and the other end of each group of heat-conducting fins 26 is provided with a second through hole for the guide rod 22 to pass through;
the plurality of groups of sliding plates 28 correspond to the plurality of groups of guide rods 22 one by one, and each group of sliding plates 28 is provided with a third through hole for the guide rods 22 to pass through; in the mounted state of the memory body 20, the elastic support component is in a compressed state; the multiple groups of guide rods 22 sequentially penetrate through the multiple groups of first through holes 32 and the multiple groups of second through holes; the plurality of groups of second springs 29 are sleeved on the outer sides of the plurality of groups of guide rods 22; the plurality of groups of fasteners 30 are respectively in threaded fit connection with the plurality of groups of guide rods 22, and the plurality of groups of fasteners 30 respectively press the plurality of groups of second springs 29; the sets of second springs 29 are all in a compressed state; the multiple groups of heat conducting fins 26 are all in a bent state, and the multiple groups of heat conducting fins 26 respectively press the cold ends of the multiple groups of semiconductor refrigeration fins 31;
in use, the heat generated during the operation of the memory body 20 is conducted to the placing plate 19 and the pressing plate 27 and gradually conducted to the plurality of groups of heat-conducting fins 26; the operation of multiunit semiconductor refrigeration piece 31, multiunit semiconductor refrigeration piece 31's cold junction compresses tightly multiunit conducting strip 26 in order to refrigerate multiunit conducting strip 26, and then dispel the heat to placing board 19, clamp plate 27 and placing memory body 20 and second socket portion 18 between the board 19.
In an alternative embodiment, each set of heat-conducting fins 26 is made of an aluminum alloy; the heat conducting fin 26 made of an aluminum alloy material has good heat conducting and cold conducting properties.
In an alternative embodiment, the placement plate 19 is slidably connected to a plurality of sets of guide rods 22 to improve the stability of the placement plate 19.
In an alternative embodiment, the end surface of the placing plate 19 facing thereto is provided with a placing groove 191 for sliding fitting the memory body 20; the end face of the pressing plate 27 is provided with a limiting groove for the memory body 20 to extend into in a matching manner, so that the memory body 20 can be stably placed between the placing plate 19 and the pressing plate 27.
In an optional embodiment, a plurality of sets of fasteners are also included; the cross section of the end cover 2 is L-shaped, a sliding plate 15 is arranged on the side end face of one group of horizontal end faces of the end cover 2, a plurality of groups of insertion blocks 16 are arranged on the end faces, far away from the vertical end face, of one group of horizontal end faces of the end cover 2, and a plurality of groups of fourth through holes 14 are arranged on one group of vertical end faces of the end cover 2; a third opening 10 is arranged on the side end surface of the shell 1; the third opening 10 communicates with the second opening 7; the inner wall of the second opening 7 is provided with a sliding chute 12 and a plurality of groups of socket blind holes 8; a countersunk groove 11 is formed in the side end face of the housing 1 along the peripheral direction of the third opening 10; a plurality of groups of threaded blind holes 13 are arranged in the countersunk head groove 11;
the sliding plate 15 is connected with the sliding chute 12 in a sliding way; a group of vertical end faces of the end cover 2 tightly press the bottom face of the countersunk groove 11, and the outer end face of the end cover 2 is flush with the outer end face of the shell 1, so that the attractiveness of the memory is improved; the multiple groups of inserting blocks 16 are inserted into the multiple groups of inserting hole blind holes 8 in a matching manner; and multiple groups of fastening pieces respectively penetrate through multiple groups of fourth through holes 14 and are respectively screwed into multiple groups of threaded blind holes 13, so that the end cover 2 and the shell 1 are fixed, and the end cover 2 is conveniently disassembled and assembled.
In an optional embodiment, the device further comprises a plurality of groups of fixed blocks 3; a plurality of groups of fixed blocks 3 are connected with a group of side end faces of the shell 1, and each group of fixed blocks 3 is provided with a mounting hole 4;
when the shell 1 is used, when the shell 1 needs to be installed in a computer case in a matched mode for storing computer data, the shell 1 is fixedly installed in the computer case through the bolt matched installation hole 4; the fixed block 3 is connected with the side end face of the shell 1, so that a gap is reserved between the outer end face of the shell 1 and the inner wall of the computer case, and the heat dissipation plate 9 can perform the heat dissipation function on the hot ends of the plurality of groups of semiconductor refrigeration pieces 31.
In an alternative embodiment, the four groups of corners of the shell 1 are provided with elastic wrap angles; be equipped with the elasticity cornerite in the edges and corners department of shell 1 and can protect when shell 1 drops, further avoid equipment to drop back memory body 20 and damage.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (10)
1. An external memory for a computer is characterized by comprising a shell (1), a first socket part (5), a microprocessor (17), a placing plate (19), a temperature detection unit (21), a pressing plate (27) and a plurality of groups of semiconductor refrigerating sheets (31);
a group of side end faces of the shell (1) are provided with first openings (6), the upper end face of the shell (1) is provided with second openings (7), the shell (1) is provided with an end cover (2) used for sealing the second openings (7), and two groups of outer end faces, which are far away from each other, of the shell (1) are provided with a plurality of groups of mounting grooves; the bottom surface of each group of mounting grooves is provided with a first through hole (32), and a heat dissipation plate (9) is arranged in each group of mounting grooves;
the multiple groups of semiconductor refrigeration pieces (31) correspond to the multiple groups of first through holes (32) one by one, and the hot ends of the multiple groups of semiconductor refrigeration pieces (31) are respectively connected with the end faces of the multiple groups of heat dissipation plates (9) positioned in the shell (1); the first socket part (5) is arranged in the first opening (6), and a power socket and a data interface are arranged on the first socket part (5);
the lower end surface of the placing plate (19) is provided with an elastic supporting component; the elastic supporting component is connected with the inner wall of the shell; the placing plate (19) is provided with a second socket part (18) for connecting the memory body (20) for data transmission; the second socket part (18) is connected with the data interface through a data line;
the pressing plate (27) is positioned right above the placing plate (19), a placing space for clamping and placing the memory body (20) is formed between the pressing plate (27) and the placing plate (19), and an adjusting assembly for pressing the pressing plate (27) on the memory body (20) is arranged in the shell (1);
the microprocessor (17) is connected with the inner wall of the shell (1); the microprocessor (17), the temperature detection unit (21), the plurality of groups of semiconductor refrigeration pieces (31) and the power socket are electrically connected; the temperature detection unit (21) is connected with the pressure plate (27).
2. An external memory for computer according to claim 1, wherein the elastic support member comprises a plurality of sets of first springs (23), a plurality of sets of sliders (24), and a plurality of sets of support rods (25);
the multiple groups of sliding blocks (24) are respectively connected with the bottom surface of the shell (1) in a sliding manner, and the multiple groups of sliding blocks (24) are symmetrically distributed by taking the central axis of the placing plate (19) as the center; two ends of the plurality of groups of first springs (23) are respectively connected with the plurality of groups of sliding blocks (24) and the inner wall of the shell (1);
multiunit bracing piece (25) use the axis of placing board (19) as central symmetry and distribute, multiunit bracing piece (25) all slope setting, and multiunit slider (24) are connected in the rotation of the one end of multiunit bracing piece (25), and the other end of multiunit bracing piece (25) all rotates to connect places board (19).
3. An external memory for computer according to claim 1, wherein a heat insulating glue (33) is filled between the inner wall of each group of first through holes (32) and the hot end of each group of semiconductor chilling plates (31).
4. An external storage device for computer according to claim 1, wherein the adjustment assembly comprises a plurality of sets of guide rods (22), a plurality of sets of heat-conducting fins (26), a plurality of sets of sliding plates (28), a plurality of sets of second springs (29), and a plurality of sets of fasteners (30);
a plurality of groups of guide rods (22) are evenly distributed on two sides of the placing plate (19) side by side;
one end of each group of heat-conducting fins (26) is connected with the placing plate (19), and the other end of each group of heat-conducting fins (26) is provided with a second through hole for the guide rod (22) to pass through;
the multiple groups of sliding plates (28) correspond to the multiple groups of guide rods (22) one by one, and each group of sliding plates (28) is provided with a third through hole for the guide rods (22) to pass through; when the memory body (20) is in an installation state, the elastic supporting component is in a compression state; the multiple groups of guide rods (22) sequentially penetrate through the multiple groups of first through holes (32) and the multiple groups of second through holes; the plurality of groups of second springs (29) are sleeved on the outer sides of the plurality of groups of guide rods (22); the multiple groups of fastening pieces (30) are respectively connected with the multiple groups of guide rods (22) in a threaded fit manner, and the multiple groups of fastening pieces (30) respectively press the multiple groups of second springs (29); the multiple groups of second springs (29) are all in a compressed state; the multiple groups of heat conducting fins (26) are all in a bent state, and the multiple groups of heat conducting fins (26) respectively press the cold ends of the multiple groups of semiconductor refrigerating fins (31).
5. An external memory according to claim 4, wherein each set of heat-conducting fins (26) is made of aluminum alloy.
6. An external storage unit for computer according to claim 4, wherein the placement plate (19) is slidably connected to the plurality of guide rods (22).
7. An external memory for computer according to claim 1, wherein the end surface of the placing plate (19) facing thereto is provided with a placing groove (191) for slidably fitting the memory body (20); the end face of the pressing plate (27) is provided with a limiting groove for the memory body (20) to extend into in a matching way.
8. An external memory for computer according to claim 1, further comprising a plurality of sets of fasteners; the cross section of the end cover (2) is L-shaped, a sliding plate (15) is arranged on the side end face of one group of horizontal end faces of the end cover (2), a plurality of groups of insertion blocks (16) are arranged on the end face, far away from the vertical end face, of one group of horizontal end faces of the end cover (2), and a plurality of groups of fourth through holes (14) are arranged on one group of vertical end faces of the end cover (2); a third opening (10) is arranged on the side end surface of the shell (1); the third opening (10) is communicated with the second opening (7); the inner wall of the second opening (7) is provided with a sliding chute (12) and a plurality of groups of socket blind holes (8); a countersunk groove (11) is formed in the side end face of the shell (1) along the peripheral direction of the third opening (10); a plurality of groups of threaded blind holes (13) are arranged in the countersunk head groove (11);
the sliding plate (15) is connected with the sliding chute (12) in a sliding way; a group of vertical end faces of the end cover (2) tightly press the bottom face of the countersunk groove (11), and the outer end face of the end cover (2) is flush with the outer end face of the shell (1); the multiple groups of inserting blocks (16) are inserted into the multiple groups of inserting hole blind holes (8) in a matching way; the plurality of groups of fastening pieces respectively penetrate through the plurality of groups of fourth through holes (14) and are respectively screwed into the plurality of groups of threaded blind holes (13).
9. An external memory for computer according to claim 1, further comprising a plurality of fixed blocks (3); a plurality of groups of fixing blocks (3) are connected with a group of side end faces of the shell (1), and each group of fixing blocks (3) is provided with a mounting hole (4).
10. An external memory for computer according to claim 1, wherein the four corners of the housing (1) are provided with elastic wrap angles.
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Denomination of invention: An External Memory for Computers Effective date of registration: 20231212 Granted publication date: 20221129 Pledgee: Zhongguancun Technology Leasing Co.,Ltd. Pledgor: Beijing Aoxing Technology Co.,Ltd. Registration number: Y2023980071213 |
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