CN101472451A - Electronic device with movable radiating space - Google Patents

Electronic device with movable radiating space Download PDF

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Publication number
CN101472451A
CN101472451A CNA2007103061115A CN200710306111A CN101472451A CN 101472451 A CN101472451 A CN 101472451A CN A2007103061115 A CNA2007103061115 A CN A2007103061115A CN 200710306111 A CN200710306111 A CN 200710306111A CN 101472451 A CN101472451 A CN 101472451A
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CN
China
Prior art keywords
cover plate
heat
anchor point
electronic installation
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007103061115A
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Chinese (zh)
Inventor
王锋谷
黄庭强
王少甫
许圣杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Corp
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Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to CNA2007103061115A priority Critical patent/CN101472451A/en
Publication of CN101472451A publication Critical patent/CN101472451A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an electronic device which is provided with a movable dissipation space, and comprises a body and a cover plate. The body is provided with a heat-conducting plate; heat in the body is dissipated through the heat-conducting plate; the cover plate is connected to the body, and moves to a laminating position and a ventilating position relative to the body; when the cover plate is positioned in the ventilating position, an airflow path passing through the heat-conducting plate is formed between the body and the cover plate; the heat of the heat-conducting plate is dissipated through air flowing through the airflow path; and under the condition that an active radiating structure is not used, the radiating efficiency of the portable electronic device is promoted, and the internal temperature of the portable electronic device is reduced.

Description

Electronic installation with movable heat-dissipating space
Technical field
The present invention relates to a kind of electronic installation, particularly relate to a kind of electronic installation that forms heat-dissipating space with removable cover.
Background technology
Constantly develop and consider modern's action demand along with science and technology, existing portable electronic equipment, with super brain machine (Ultra Mobile Personal Computer, UMPC) or in the action net arrangement (Mobile Internet Devices, MID) etc. be example, except that towards multitask development and have the powerful processing operational capability, also requirement must possess have compact, characteristic such as be easy to carry about with one.But for satisfying above-mentioned feature, overriding concern be how to solve because function is more and more, when the process chip operational capability is strong more, incident high heat problem.Relatively large in the past electronic installation, with personal computer (PC) or the dynamical mobile computer of tool (NB) etc. is example, large-area fin of making and fan are taken away heat (active heat dissipation design) in electronic installation, but this mode is under the trend of volume-diminished, significant discomfort is used for the small-sized portable electronic equipment of insufficient space, therefore along with the user uses the elongation of portable electronic equipment time, the heat energy that portable electronic equipment produced can build up heat energy because can't effectively discharge, make the portable electronic equipment over-heat inside, the chip that causes portable electronic equipment inside operates undesiredly because of overheated when running, or the housing of portable electronic equipment is out of shape or makes the operator feel problem such as uncomfortable because of housing is too warm because of overheated.Therefore the dealer needs to propose to promote the heat dissipation of portable electronic equipment with the passive heat radiation design, and reduces the temperature in the portable electronic equipment at above-mentioned demands of applications.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of electronic installation with movable heat-dissipating space, is used for promoting the usefulness of heat radiation in the electronic device construction system.
To achieve these goals, the invention provides a kind of electronic installation, it is characterized in that, include:
One body has a heat-conducting plate, and this intrinsic heat looses by this heat-conducting plate and removes; And
One cover plate, be connected in this body, and this body is displaced into an applying position and a vent position relatively, when this cover plate is positioned at this vent position, form an air flow path by this heat-conducting plate between this body and this cover plate, loose except that the heat of this heat-conducting plate by air this air flow path of flowing through.
Described electronic installation, wherein, this cover plate is a heat-conducting, and when this cover plate was positioned at this applying position, this cover plate and this heat-conducting plate were fitted, and removes the heat of this heat-conducting plate to loose.
Described electronic installation, wherein, this cover plate has many water conservancy diversion lines along this air flow path.
Described electronic installation, wherein, this body has at least one slide rail, this slide rail has one first anchor point and one second anchor point, this cover plate has at least one slide block corresponding with this slide rail, this slide block slippage is in this slide rail and optionally be positioned this first anchor point and this second anchor point, make this cover plate optionally displacement in this applying position and this vent position.
Described electronic installation, wherein, this body also comprises an at least one guide rails and an elastic component, this guide rails comprises an applying path and a release way, this guide rails has one first anchor point and one second anchor point, and this cover plate also comprises a draw bar, this guide rails is guided this cover plate and is displaced between this applying position and this vent position, this elastic component normality pushes against this cover plate toward this vent position, when this cover plate is positioned at vent position and this cover plate by towards these body pushing and pressing the time, this draw bar along this applying path movement to this first anchor point, and be positioned at this applying position and by towards the pushing and pressing of this body the time, this draw bar moves to second anchor point along this release way when this cover plate.
Described electronic installation, wherein, this draw bar one end is fixedly set in this cover plate, and the other end moves along this guide rails.
Described electronic installation, wherein, this elastic component is spring or shell fragment.
Useful technique effect of the present invention is, when cover plate is positioned at the applying position, cover plate is after the body pushing and pressing, then form an airspace between cover plate and body, mode by free convection will be exposed at heat on the heat-conducting plate of airspace outward and loose and remove, reach the heat dissipation that the state that does not use active radiator structure promotes portable electronic equipment down, reduce the portable electronic equipment temperature inside.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is according to the schematic perspective view of first embodiment of the invention cover plate when the applying position;
Fig. 2 is according to the schematic perspective view of first embodiment of the invention cover plate when the vent position;
Fig. 3 be according to the first embodiment of the invention cover plate when the applying position, the floor map of inner each module position of body and cover plate;
Fig. 4 be according to the first embodiment of the invention cover plate when the vent position, the floor map of inner each module position of body and cover plate;
Fig. 5 be according to the second embodiment of the invention cover plate when the applying position, the floor map of inner each module position of body and cover plate;
Fig. 6 be according to the second embodiment of the invention cover plate when the vent position, the floor map of inner each module position of body and cover plate;
Fig. 7 be according to the third embodiment of the invention cover plate when the applying position, the floor map of inner each module position of body and cover plate;
Fig. 8 be according to the third embodiment of the invention cover plate when the vent position, the floor map of inner each module position of body and cover plate;
Fig. 9 is according to the schematic perspective view of fourth embodiment of the invention cover plate when the vent position;
Figure 10 is according to the schematic perspective view of fifth embodiment of the invention cover plate when the vent position.
Wherein, Reference numeral:
10 electronic installations
11 bodies
111 heat-conducting plates
112 slide rails
1121,11,311 first anchor points
1122,11,321 second anchor points
113 guide rails
1131 applying paths
1132 release way
114 elastic components
12 cover plates
121 slide blocks
122 draw bars
Embodiment
Below in conjunction with the drawings and specific embodiments technical scheme of the present invention is made further more detailed description.
Consulting Figure 1 and Figure 2, is according in the first embodiment of the invention, and cover plate is respectively at fitting and schematic perspective view during vent position.
Consult Figure 1 and Figure 2, show that the electronic installation 10 with movable radiating space includes body 11 and cover plate 12, wherein body 11 has a heat-conducting plate 111, and the heat in the body 11 looses by heat-conducting plate 111 and removes, in concrete application example of the present invention, above-mentioned electronic installation 10 refers to portable computer (Portable Computer), such as but not limited to net arrangement (Mobile Internet Devices in the action, MID), super brain machine (Ultra Mobile Personal Computer, UMPC) or the like.
Consult Figure 1 and Figure 2, cover plate 12 is connected in body 11 with mobilizable relation, and body 11 is displaced into an applying position (as shown in Figure 1) and a vent position (as shown in Figure 2) relatively.When cover plate 12 is positioned at vent position, form an air flow path by heat-conducting plate 111 between body 11 and the cover plate 12, loose except that the heat of heat-conducting plate 111 by the air air flow path of flowing through.Vent position with heat-dissipating space can form good free convection effect, is used for reducing the heat energy that electronic installation 10 systems are produced effectively, and the usefulness of heat radiation in the elevator system.
Wherein, cover plate 12 can be a heat-conducting with many water conservancy diversion lines, and its heat-conducting is such as but not limited to copper, aluminium, magnesium metal and one of the group of alloy arbitrarily thereof, thus, when cover plate 12 is positioned at vent position, but the air-guiding path makes the thermal convection effect better, and heat dissipation is provided.
In addition, when cover plate 12 returns back to fit-state, cover plate 12 and heat-conducting plate 111 are fitted, and the material of heat-conducting plate 111 can be but be not limited to copper, aluminium, magnesium metal and one of group of alloy arbitrarily, therefore when cover plate 12 returns back to fit-state, can pass through heat exchange pattern, the heat of heat-conducting plate 111 be loose via cover plate 12 remove.
Consulting Fig. 3 to shown in Figure 6, is respectively according to the present invention among first and second embodiment, respectively when cover plate during in applying position and vent position, and the floor map of body and each module position of cover plate inside.
Consult Fig. 3 to shown in Figure 6, has at least one guide rails 113 in the body 11, its guide rails 113 comprises applying path 1131 and release way 1132, have one first anchor point 11311 and second anchor point 11321 in the guide rails 113, also have an elastic component 114 in the body 11, its elastic component 114 can be spring or shell fragment, and cover plate 12 comprises a draw bar 122, wherein draw bar 122 1 ends are fixedly set in cover plate 12, and the other end moves along guide rails 113.Guide rails 113 guiding cover plates 12 are displaced between applying position (as Fig. 3 and shown in Figure 5) and the vent position (as Fig. 4 and shown in Figure 6), its elastic component 114 normalities push against cover plate 12 toward vent position (as Fig. 4 and shown in Figure 6), when cover plate 12 is positioned at vent position (as Fig. 4 and shown in Figure 6) and cover plate 12 by towards body 11 pushing and pressing the time, draw bar 122 moves to first anchor point 11311 (as Fig. 3 and shown in Figure 5) along applying path 1131, and being positioned at applying position (as Fig. 3 and shown in Figure 5) and cover plate 12 by the time when cover plate 12 towards body 11 pushing and pressing, draw bar 122 moves to second anchor point 11321 (as Fig. 4 and shown in Figure 6) along release way 1132.
Consulting Fig. 7 and shown in Figure 8, is according in the third embodiment of the invention, respectively when cover plate during in applying position and vent position, and the floor map of inner each module position of body and cover plate.
Consult Fig. 7 and shown in Figure 8, has at least one slide rail 112 in the body 11, have one first anchor point 1121 and one second anchor point 1122 in the slide rail 112, cover plate 12 then has the corresponding slide block 121 of at least one and slide rail 112, slide block 121 slippages in slide rail 112 and optionally be positioned first anchor point 1121 and second anchor point 1122, make cover plate 12 optionally displacement in applying position (as shown in Figure 7) and vent position (as shown in Figure 8).
Consulting Fig. 9 and shown in Figure 10, is respectively according to the present invention among the 4th and the 5th embodiment, when the schematic perspective view of cover plate during in vent position.
Wherein, show when the cover plate 12 that has a movable relation with body 11 is positioned at vent position, and can form an air flow path by heat-conducting plate 111 between the body 11, loose except that the heat of heat-conducting plate 111 by the air air flow path of flowing through.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.

Claims (7)

1, a kind of electronic installation is characterized in that, includes:
One body has a heat-conducting plate, and this intrinsic heat looses by this heat-conducting plate and removes; And
One cover plate, be connected in this body, and this body is displaced into an applying position and a vent position relatively, when this cover plate is positioned at this vent position, form an air flow path by this heat-conducting plate between this body and this cover plate, loose except that the heat of this heat-conducting plate by air this air flow path of flowing through.
2, electronic installation according to claim 1 is characterized in that, this cover plate is a heat-conducting, and when this cover plate was positioned at this applying position, this cover plate and this heat-conducting plate were fitted, and removes the heat of this heat-conducting plate to loose.
3, electronic installation according to claim 1 is characterized in that, this cover plate has many water conservancy diversion lines along this air flow path.
4, electronic installation according to claim 1, it is characterized in that, this body has at least one slide rail, this slide rail has one first anchor point and one second anchor point, this cover plate has at least one slide block corresponding with this slide rail, this slide block slippage is in this slide rail and optionally be positioned this first anchor point and this second anchor point, make this cover plate optionally displacement in this applying position and this vent position.
5, electronic installation according to claim 1, it is characterized in that, this body also comprises an at least one guide rails and an elastic component, this guide rails comprises an applying path and a release way, this guide rails has one first anchor point and one second anchor point, and this cover plate also comprises a draw bar, this guide rails is guided this cover plate and is displaced between this applying position and this vent position, this elastic component normality pushes against this cover plate toward this vent position, when this cover plate is positioned at vent position and this cover plate by towards these body pushing and pressing the time, this draw bar along this applying path movement to this first anchor point, and be positioned at this applying position and by towards the pushing and pressing of this body the time, this draw bar moves to second anchor point along this release way when this cover plate.
6, electronic installation according to claim 5 is characterized in that, this draw bar one end is fixedly set in this cover plate, and the other end moves along this guide rails.
7, electronic installation according to claim 5 is characterized in that, this elastic component is spring or shell fragment.
CNA2007103061115A 2007-12-28 2007-12-28 Electronic device with movable radiating space Pending CN101472451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2007103061115A CN101472451A (en) 2007-12-28 2007-12-28 Electronic device with movable radiating space

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007103061115A CN101472451A (en) 2007-12-28 2007-12-28 Electronic device with movable radiating space

Publications (1)

Publication Number Publication Date
CN101472451A true CN101472451A (en) 2009-07-01

Family

ID=40829450

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007103061115A Pending CN101472451A (en) 2007-12-28 2007-12-28 Electronic device with movable radiating space

Country Status (1)

Country Link
CN (1) CN101472451A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105611008A (en) * 2016-02-24 2016-05-25 努比亚技术有限公司 Mobile terminal
CN112987880A (en) * 2019-12-02 2021-06-18 鸿富锦精密工业(武汉)有限公司 Heat sink device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105611008A (en) * 2016-02-24 2016-05-25 努比亚技术有限公司 Mobile terminal
CN105611008B (en) * 2016-02-24 2020-01-14 深圳市中新力电子科技有限公司 Mobile terminal
CN112987880A (en) * 2019-12-02 2021-06-18 鸿富锦精密工业(武汉)有限公司 Heat sink device
CN112987880B (en) * 2019-12-02 2023-11-03 鸿富锦精密工业(武汉)有限公司 Heat dissipation device

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Open date: 20090701