CN210247364U - Heat conduction module and heat dissipation system - Google Patents

Abstract

The utility model discloses a heat conduction module and cooling system belongs to power amplifier technical field. Wherein, the space power synthesizer; the space power combiner penetrates through the first through hole in the heat conduction block, and two ends of the space power combiner extend out; the space power combiner comprises a first heat conduction layer, wherein a coaxial waveguide is arranged at one end of the space power combiner, and the first heat conduction layer is arranged between the coaxial waveguide and a heat conduction block. The utility model discloses a heat conduction piece and first heat-conducting layer carry out all-round heat conduction to the space power synthesizer, are favorable to improving heat conduction efficiency.

Description

Heat conduction module and heat dissipation system

Technical Field

The utility model belongs to the technical field of power amplifier, specifically speaking relates to a heat conduction module and cooling system.

Background

A power amplifier is an amplifier that can generate maximum power output to drive a load under a given distortion rate. The power amplifier mainly comprises a power combiner and a radiator, wherein the power combiner is divided into a plane power combiner and a space power combiner, and heat dissipation is carried out through a forced air cooling technology to realize stable output. At present, most of power combiners are planar power combiners, which are relatively simple in heat dissipation, that is, the planar power combiners are in contact with a planar direct-contact surface of a heat sink to dissipate heat.

Compared with a plane power combiner, the space power combiner is in a cylinder structure and has the characteristics of small size, high output power, multiple combining modules and concentrated heat consumption. At present, the technical scheme related to the heat dissipation of the space power combiner is less, and the heat dissipation problem of the space power combiner needs to be solved urgently. Patent publication No.: CN107222175A, published: in 2017, 9 and 29 months, the invention and creation name is: a novel interpenetration type broadband solid-state power amplifier is provided. Wherein, this novel interlude formula design's broadband solid state power amplifier discloses following technical scheme: in order to realize the compact design of the whole machine, the shape of the space power combiner is designed to be cylindrical, a cylindrical through hole is reserved in the radiator, and the space power combiner is arranged in the radiator to penetrate through the radiator. In the technical scheme, the heat conduction efficiency of the radiator is low, and the heat generated by the space power synthesizer is not easy to be led out in time.

Disclosure of Invention

1. Problems to be solved

The problem of the heat that produces to space power synthesizer among the prior art derives inefficiency, the utility model provides a heat conduction module, this scheme carry out all-round heat conduction to space power synthesizer, improve heat conduction efficiency.

The utility model also provides a cooling system. This scheme is passed through radiator and fan and is effectively dispelled the heat to heat conduction module. 2. Technical scheme

In order to solve the above problems, the utility model adopts the following technical proposal.

A thermally conductive module, comprising:

a spatial power combiner;

the space power combiner penetrates through the first through hole in the heat conduction block, and two ends of the space power combiner extend out;

the space power combiner comprises a first heat conduction layer, wherein a coaxial waveguide is arranged at one end of the space power combiner, and the first heat conduction layer is arranged between the coaxial waveguide and a heat conduction block.

Preferably, the first heat conduction layer is a flexible heat conduction pad.

Preferably, the first heat conduction layer is attached to and covers an end face of the heat conduction block close to one end of the coaxial waveguide.

More preferably, the thickness of the first heat conducting layer is not more than 0.3 mm.

Preferably, the heat conducting block comprises two heat conducting substrates which are in the same shape and are connected, the side surfaces of the two heat conducting substrates which are connected are respectively provided with an arc-shaped groove, and the two arc-shaped grooves jointly enclose the first through hole.

The utility model provides a heat dissipation system, including radiator, fan and foretell heat conduction module, the radiator is connected in the heat conduction piece lateral surface, and the radiator contacts with the heat conduction piece and conducts heat, and the ventilation passageway of radiator is just to the wind gap of fan.

Preferably, a second heat conduction layer is arranged between the radiator and the heat conduction block.

Preferably, the radiator comprises a plurality of radiating fins, heat pipes and a heat conducting base plate, the radiating fins are arranged in parallel in sequence, the heat pipes comprise a first pipe section, a second pipe section and a third pipe section which are communicated in sequence, the first pipe section and the third pipe section respectively penetrate through the radiating fins in sequence, the heat pipes are multiple, the third pipe sections of all the heat pipes are close to the heat conducting block, and the first pipe sections of all the heat pipes are uniformly distributed on the outer edges of the radiating fins.

Preferably, the radiating fins are provided with second through holes which are matched with the shapes of the heat pipes and used for the heat pipes to penetrate through, and the second through holes are provided with punching flanges which are in contact with the surfaces of the heat pipes for heat transfer.

Preferably, the two radiators are symmetrically distributed on two sides of the heat conducting block, the heat conducting block comprises two butted heat conducting base bodies, two opposite side faces of the two heat conducting base bodies are respectively provided with a groove, and the two grooves jointly enclose the first through hole.

3. Advantageous effects

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the heat conduction module of the utility model conducts heat to the space power synthesizer in all directions through the heat conduction block and the first heat conduction layer, thereby improving the heat conduction efficiency; on one hand, the first through hole is matched with the space power combiner in shape, so that the space power combiner is in surface contact with the heat conducting block, and heat around the space power combiner can be transferred to the heat conducting block; on the other hand, the heat of the coaxial waveguide at the end of the spatial power combiner is rapidly transferred to the heat conducting block along the first heat conducting layer. In the prior art, the overall size of the space power combiner is smaller, and the operable space around the end part of the space power combiner is very small, so that the heat generated by the space power combiner cannot be effectively led out.

(2) The utility model discloses a heat conduction module covers first heat-conducting layer at the terminal surface that the heat conduction piece is close to coaxial waveguide one end, and at this moment, the lateral surface of heat conduction piece can be transmitted fast to the heat of coaxial waveguide department, further improves the heat conduction effect.

(3) The utility model discloses a heat conduction module, the thickness of first heat-conducting layer is no longer than 0.3mm, can make the fine attached terminal surface that is close to coaxial waveguide one end at the heat conduction piece of flexible heat conduction pad, reduces thermal contact resistance.

(4) The utility model discloses a cooling system effectively dispels the heat to heat conduction module through radiator and fan.

(5) The utility model discloses a cooling system sets up the second heat-conducting layer between radiator and heat conduction piece, is favorable to reducing thermal contact resistance, reduces the distribution gradient of temperature field.

(6) The utility model discloses a heat dissipation system adopts a plurality of heat pipes, and a plurality of heat pipes use the space power synthesizer to be radial distribution as the center, can be favorable to improving the radiating efficiency with each department of the quick transmission of heat on the heat conduction piece to the radiator.

(7) The utility model discloses a cooling system punches a hole turn-ups and heat pipe face contact, has increased heat pipe and radiating fin's area of contact, is favorable to further improving the radiating efficiency.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipation system;

FIG. 2 is a top view of a heat sink;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;

fig. 4 is a perspective view of the heat dissipating fin.

In the figure: 1. a spatial power combiner; 2. a heat conducting block; 3. a first thermally conductive layer; 4. a heat sink; 5. a fan; 6. a housing; 41. a heat dissipating fin; 42. a heat pipe; 43. a heat conductive substrate; 411. punching and flanging; 412. a second through hole; 421. a first tube section; 422. a second tube section; 423. a third tube section.

Detailed Description

The present invention will be further described with reference to the following specific embodiments.

Example 1

As shown in fig. 1, a heat conduction module includes a spatial power combiner 1, a heat conduction block 2, and a first heat conduction layer 3. The heat conducting block 2 is provided with a first through hole for the spatial power combiner 1 to pass through, and the end of the spatial power combiner 1 needs to extend out of the first through hole because the end of the spatial power combiner 1 needs to input or output signals. In this embodiment, the first through hole is matched with the shape of the spatial power combiner 1, so that the spatial power combiner 1 is in surface contact with the heat conducting block 2, and heat around the spatial power combiner 1 can be transferred to the heat conducting block 2, where the heat conducting block 2 may be copper, or may be aluminum or another material with good heat conductivity and light weight. One end of the spatial power combiner 1 is provided with a coaxial waveguide and generates heat, here, a first heat conduction layer 3 is arranged between the coaxial waveguide and the heat conduction block 2, and the heat is rapidly transferred to the heat conduction block 2 along the first heat conduction layer 3. In addition, reference may be made to the structure of the spatial power combiner 1: research on key technologies of microwave solid-state broadband power synthesis [ D ]. yang et, university of electronic technology 2018: 37-60. the details are not repeated here.

In the embodiment, the heat conduction block 2 and the first heat conduction layer 3 are used for realizing the all-dimensional heat conduction of the space power combiner 1, and the heat conduction efficiency is improved. It should be noted that, in the field of electronic countermeasure, the power amplifier needs to meet the requirements of ultra wide band, high power and miniaturization, so the overall size of the spatial power combiner 1 is relatively small, and the operable space around the end of the spatial power combiner 1 is very small, and in the prior art, the heat generated by the spatial power combiner 1 cannot be effectively conducted out.

In the present embodiment, the first heat conduction layer 3 preferably employs a flexible heat conduction pad, such as a graphene heat conduction sheet manufactured by Dongguan company of heat pipe technology, model HW-GH50, with a thermal conductivity as high as 50W/m.K, and a thickness of 0.2 mm. Besides, the first heat conduction layer 3 can also adopt heat conduction silicone grease or other heat conduction materials.

In order to improve the heat conduction efficiency, in the present embodiment, the first heat conduction layer 3 covers the end surface of the heat conduction block 2 near one end of the coaxial waveguide, and at this time, the heat at the coaxial waveguide can be quickly transferred to the outer side surface of the heat conduction block 2; here, the outer side surface of the heat conduction block 2 refers to a side surface away from the first through hole and the spatial power combiner 1.

In order to make the flexible heat conduction pad can be fine attached to the end face of the heat conduction block 2 close to one end of the coaxial waveguide, the heat conduction effect is ensured, and in the embodiment, the thickness of the first heat conduction layer 3 is not more than 0.3 mm.

In the embodiment, the heat conducting block 2 comprises two connected heat conducting substrates with the same shape, and the two heat conducting substrates can be detachably connected through bolts; the side surfaces of the two heat conduction substrates which are connected are respectively provided with an arc-shaped groove, and the two arc-shaped grooves jointly enclose the first through hole. In addition, the heat conducting block 2 can also be integrally formed, and at the moment, the surface of the first through hole can be coated with heat conducting silicone grease; and then the spatial power combiner 1 is inserted into the first through hole.

Example 2

As shown in fig. 1, a heat dissipation system includes a heat sink 4, a fan 5 and the heat conduction module described in embodiment 1, where the heat sink 4 is connected to an outer side surface of a heat conduction block 2, and the outer side surface of the heat conduction block 2 is a side surface far away from a first through hole and a spatial power combiner 1; the radiator 4 is in contact with the heat conducting block 2 for heat transfer, and a ventilation channel of the radiator 4 corresponds to an air port of the fan 5. As can be seen from the description of embodiment 1, the heat generated by the spatial power combiner 1 can be quickly transferred to the peripheral side of the heat-conducting block 2, the heat of the heat-conducting block 2 is transferred to the heat sink 4, and the fan 5 is started to perform forced convection heat dissipation.

In order to fully understand the present embodiment, here, the structure of the heat sink 4 is explained: the heat sink 4 generally includes a heat conducting substrate 43 and heat dissipating fins 41, and specifically, the heat conducting substrate 43 has a first side surface and a second side surface opposite to the first side surface, and the first side surface is connected to the heat conducting block 2 by screws; one end of each radiating fin 41 is connected with the second side face, and the plurality of radiating fins 41 are arranged in parallel; any two adjacent heat dissipation fins 41 have a gap therebetween and form a ventilation channel.

In order to reduce the contact thermal resistance and the distribution gradient of the temperature field, in the present embodiment, a second heat conduction layer is disposed between the heat sink 4 and the heat conduction block 2. The second heat conduction layer is preferably made of heat conduction silicone grease. In addition, flexible thermal pads or thermally conductive silicone or other thermally conductive materials may also be used.

In consideration of the overall size and weight requirements of the heat dissipation system, in the embodiment, two heat sinks 4 are symmetrically distributed on two sides of the heat conduction block 2; as shown in fig. 1, two heat sinks 4 are symmetrically distributed on the left and right sides of the heat conducting block 2. On this basis, in order to make the overall structure of the present embodiment compact, the fan 5 is disposed on the short side of the heat sink 4, as shown in fig. 1, the fan 5 is disposed on the front side of the heat sink 4, and the air inlet of the fan 5 faces the ventilation channel of the heat sink 4.

Besides, the heat sink 4, the fan 5 and the heat conducting module are generally installed inside the hollow housing 6, specifically, the heat conducting substrate 43 may be connected to the housing 6 by screws, and the fan 5 may be connected to the housing 6 by screws; an opening is formed in one side of the shell 6, so that the radiator 4, the fan 5 and the heat conducting module can be conveniently placed in the opening; the side wall of the shell 6 is provided with a ventilation opening which is opposite to the fan 5 and the ventilation channel.

Example 3

As shown in fig. 1, a heat dissipation system has a structure substantially similar to that of embodiment 2, and further, the heat sink 4 further includes a heat pipe 42. As shown in fig. 3, the heat pipe 42 includes a first pipe section 421, a second pipe section 422, and a third pipe section 423 that are sequentially communicated, and the first pipe section 421 and the third pipe section 423 respectively sequentially penetrate through the heat dissipation fins 41; as shown in fig. 2, the number of the heat pipes 42 is multiple, the third pipe segments 423 of all the heat pipes 42 are close to the heat conduction block 2, the first pipe segments 421 of all the heat pipes 42 are uniformly distributed on the outer edge of the heat dissipation fin 41, and the outer edge of the heat dissipation fin 41 refers to a side of the heat dissipation fin 41 away from the heat conduction block 2. At this time, the plurality of heat pipes 42 are radially distributed around the heat conductive block 2. Heat pipe 42 is typically comprised of a tube shell, wick and end caps, the wick being a porous material, e.g., a wool wick; pumping the pipe shell into negative pressure, filling a proper amount of working liquid, filling the liquid absorption core tightly attached to the inner wall of the pipe shell with the working liquid, and sealing. In the present embodiment, the working process of the heat pipe 42 is as follows: when the third pipe section is heated, the working liquid in the liquid absorption core is evaporated and vaporized to form steam, the steam flows to the first pipe section and is condensed into the working liquid and releases heat, and the working liquid flows back to the third pipe section under the action of capillary force of the porous material. The heat pipes 42 quickly transfer the heat from the heat conduction block 2 to various parts of the heat sink 4, which is beneficial to improving the heat dissipation efficiency.

In this embodiment, the first tube segment 421 vertically passes through the heat dissipating fins 41, and the third tube segment 423 vertically passes through the heat dissipating fins 41. In addition, the first tube segment 421 can also pass through the heat dissipation fins 41 in an inclined manner, which is beneficial to increasing the heat conduction length of the first tube segment 421 and improving the heat conduction effect of the heat pipe 42.

Because the arrangement mode of the heat pipes 42 is optimized in the embodiment, the heat transfer efficiency of the heat pipes 42 is higher; on the basis, in consideration of the weight requirement of the entire heat dissipation system, in the present embodiment, each heat sink 4 corresponds to 4 heat pipes 42.

For a more compact overall structure, in the present embodiment, as shown in fig. 3, the second tube segments 422 are embedded in a matrix formed by a plurality of heat dissipation fins 41 arranged in parallel.

As shown in fig. 4, in order to further improve the heat conduction efficiency of the heat pipe 42, in the present embodiment, the heat dissipation fin 41 is provided with a second through hole 412, which is matched with the shape of the heat pipe 42 and is used for the heat pipe 42 to pass through, a punching flange 411 is provided at the second through hole 412, and the punching flange 411 is in surface contact with the heat pipe 42 for heat transfer; the contact area of the heat pipe 42 and the radiating fin 41 is increased by the punched burring 411. The second through hole 412 is processed on the heat dissipation fin 41 by punching, and the punched flange 411 can be formed in the punching process. In addition, the outer circle surface of the third pipe section can be embedded on the second side surface, so that the contact area between the heat pipe 42 and the heat-conducting substrate 43 is increased, and the heat-conducting efficiency of the heat pipe 42 is further improved.

The position of each spare part is arranged through this embodiment, when guaranteeing overall structure compactness, has realized the holistic effective heat dissipation of cooling system.

The present invention and its embodiments have been described above schematically, and the description is not limited thereto, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching of the present invention, without departing from the inventive spirit of the present invention, the person skilled in the art should also design the similar structural modes and embodiments without creativity to the technical solution, and all shall fall within the protection scope of the present invention.

Claims (10)

1. A heat conducting module, comprising:

a spatial power combiner (1);

the space power combiner (1) penetrates through a first through hole in the heat conducting block (2), and two ends of the space power combiner extend out;

the space power combiner comprises a first heat conduction layer (3), wherein a coaxial waveguide is arranged at one end of the space power combiner (1), and the first heat conduction layer (3) is arranged between the coaxial waveguide and a heat conduction block (2).

2. The heat conducting module of claim 1, wherein: the first heat conduction layer (3) is a flexible heat conduction pad.

3. The heat conducting module of claim 2, wherein: the first heat conduction layer (3) is attached to and covers the end face of one end, close to the coaxial waveguide, of the heat conduction block (2).

4. The heat conducting module of claim 3, wherein: the thickness of the first heat conduction layer (3) is not more than 0.3 mm.

5. The heat conducting module of claim 1, wherein: the heat conducting block (2) comprises two heat conducting substrates which are the same in shape and are connected, the side surfaces of the two heat conducting substrates which are connected are respectively provided with an arc-shaped groove, and the two arc-shaped grooves jointly enclose the first through hole.

6. A heat dissipation system is characterized by comprising a radiator (4), a fan (5) and the heat conduction module as claimed in any one of claims 1 to 5, wherein the radiator (4) is connected to the outer side face of the heat conduction block (2), the radiator (4) is in contact with the heat conduction block (2) for heat conduction, and a ventilation channel of the radiator (4) is over against an air port of the fan (5).

7. The heat dissipation system according to claim 6, wherein a second heat conducting layer is arranged between the heat sink (4) and the heat conducting block (2).

8. The heat dissipation system according to claim 6, wherein the heat sink (4) includes a plurality of heat dissipation fins (41), heat pipes (42) and a heat conduction substrate (43), the heat dissipation fins (41) are arranged in parallel in sequence, the heat pipes (42) include a first pipe section (421), a second pipe section (422) and a third pipe section (423) which are sequentially communicated, the first pipe section (421) and the third pipe section (423) sequentially penetrate through the heat dissipation fins (41), the heat pipes (42) are multiple, the third pipe sections (423) of all the heat pipes are close to the heat conduction block (2), and the first pipe sections (421) of all the heat pipes are uniformly distributed on the outer edges of the heat dissipation fins (41).

9. The heat dissipating system of claim 8, wherein: and the radiating fin (41) is provided with a second through hole (412) which is matched with the shape of the heat pipe (42) and used for the heat pipe (42) to pass through, a punching flanging (411) is arranged at the second through hole (412), and the punching flanging (411) is in surface contact with the heat pipe (42) for heat transfer.

10. The heat dissipating system of claim 6, wherein: the two radiators (4) are symmetrically distributed on two sides of the heat conducting block (2).

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