CN206162309U - Solid state disk assembly and heat dissipation device thereof - Google Patents
Solid state disk assembly and heat dissipation device thereof Download PDFInfo
- Publication number
- CN206162309U CN206162309U CN201621070048.0U CN201621070048U CN206162309U CN 206162309 U CN206162309 U CN 206162309U CN 201621070048 U CN201621070048 U CN 201621070048U CN 206162309 U CN206162309 U CN 206162309U
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- CN
- China
- Prior art keywords
- solid state
- hard disc
- state hard
- base plate
- radiating shell
- Prior art date
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- 239000007787 solid Substances 0.000 title claims abstract description 60
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 230000005855 radiation Effects 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000003973 paint Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A solid state disk assembly comprises a solid state disk and a heat dissipation device, wherein the solid state disk comprises a circuit board and a plurality of chips attached to the circuit board, the heat dissipation device comprises a heat dissipation shell arranged outside the solid state disk and a heat conduction sheet clamped between the corresponding chip and the heat dissipation shell, the heat dissipation shell is made of heat dissipation metal sheets, and the heat dissipation shell is provided with a connecting part connected with the solid state disk. The heat generated by the chip of the solid state disk during working is conducted to the heat dissipation shell from the heat conducting fins, so that the heat dissipation area is increased, and the heat dissipation effect of the solid state disk assembly is improved. The utility model discloses still relate to a heat abstractor.
Description
Technical field
The utility model is related to hard disk, the radiating dress of more particularly to a kind of solid state hard disc component and the solid state hard disc component
Put.
Background technology
Solid state hard disc（solid state disk,SSD）With small volume, capacity is big and the advantages of noiselessness, therefore
Jing is widely used in the electronic products such as computer or server.However, as the performance of solid state hard disc is constantly lifted, solid state hard disc
Caloric value be also continuously increased, the existing radiating mode for only relying on fan can not meet radiating requirements.
Utility model content
In view of this, it is necessary to a kind of heat abstractor that can improve radiating effect is provided and consolidating for the heat abstractor is provided with
State Hard disc module.
A kind of heat abstractor, for solid state hard disc radiating, the heat abstractor to include being installed in the solid state hard disc
An outer radiating shell and the conducting strip being located between the solid state hard disc and radiating shell, the radiating shell is by radiating
Sheet metal is made, and the radiating shell is provided with the connecting portion for being connected to the solid state hard disc.
Preferably, the radiating shell includes a base plate of bar shaped and prolongs towards the same side from two relative sides of the base plate
The biside plate stretched, surrounds an accepting groove between side plate described in the base plate and two, the solid state hard disc is contained in the accepting groove,
The conducting strip is located between the inner surface of the base plate and the solid state hard disc.
Preferably, the connecting portion is at least one fixing piece being respectively arranged on side plate described in two, and each fixing piece is fixed
In the corresponding side of the circuit board of the solid state hard disc.
Preferably, each fixing piece is that corresponding side plate is formed to projection in the accepting groove.
Preferably, each fixing piece is just provided with a fixing face to the side of the base plate, and the fixing piece is away from the bottom
The side of plate is provided with the slide guide face of an arc.
Preferably, the radiating shell is made up of aluminum alloy materials.
Preferably, the appearance iso-surface patch of the radiating shell or the various figures of paint or color.
A kind of solid state hard disc component, including a solid state hard disc and a heat abstractor, the solid state hard disc includes a circuit board
And some chips being attached on the circuit board, the heat abstractor includes being installed in a radiation shell outside the solid state hard disc
Body and the conducting strip being located between corresponding chip and radiating shell, the radiating shell is made up of heat dissipation metal plate, institute
State radiating shell and be provided with the connecting portion for being connected to the solid state hard disc.
Preferably, the radiating shell includes a base plate of bar shaped and prolongs towards the same side from two relative sides of the base plate
The biside plate stretched, surrounds an accepting groove between side plate described in the base plate and two, the solid state hard disc is contained in the accepting groove,
The conducting strip is located between the inner surface of the base plate and the solid state hard disc.
Preferably, the connecting portion is at least one fixing piece being respectively arranged on side plate described in two, and each fixing piece is fixed
In the corresponding side of the circuit board of the solid state hard disc.
Prior art is compared, the radiating shell of the utility model solid state hard disc component is installed in outside the solid state hard disc and leads
Backing is located between chip and radiating shell, and the heat produced during chip operation is conducted to the radiation shell from the conducting strip
On body, so as to increasing heat radiation area, the radiating effect of the solid state hard disc component is improved, drop bottom chip temperature in working order
Degree, makes the work of the solid state hard disc component more stable.
Description of the drawings
Fig. 1 is the schematic perspective view of the utility model solid state hard disc component.
Fig. 2 is the exploded view of Fig. 1.
Fig. 3 is the opposite direction stereogram of Fig. 2.
Fig. 4 is along the sectional view of IV-IV lines in Fig. 1.
Fig. 5 is the enlarged drawing of V parts in Fig. 4.
Specific embodiment
Face is carried out with reference to the accompanying drawing in the utility model embodiment clearly to the technical scheme in the utility model embodiment
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the utility model, rather than the reality of whole
Apply example.In the case where not conflicting, the feature in following embodiment and embodiment can be mutually combined.Based on the utility model
In embodiment, the every other enforcement that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of the utility model protection.
It should be noted that in the utility model, when a component is considered as with another component " being connected ", it
Can be joined directly together with another component, or be indirectly connected to another component by component placed in the middle.
Unless otherwise defined, all of technology used herein and scientific terminology are led with technology of the present utility model is belonged to
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, rather than be intended to limit the utility model.
Fig. 1 to Fig. 3 is referred to, the utility model solid state hard disc component 100 includes a solid state hard disc 20 and a heat abstractor
30。
The solid state hard disc 20 includes a circuit board 22 of bar shaped and is attached at the relative two sides of the circuit board 22
Chip 25.The one end of the circuit board 22 is provided with metal finger 221, and a breach is opened up in the middle part of the other end of the circuit board 22
223。
The heat abstractor 30 includes a radiating shell 32 and the conducting strip 35 in bar shaped.The radiating shell 32 is by dissipating
Thermometal piece is made, and in present embodiment, the radiating shell 32 is made up of aluminum alloy materials.
The radiating shell 32 includes a base plate 321 of bar shaped and from two relative sides of the base plate 321 towards the same side
The biside plate 323 of extension.An accepting groove 325 is surrounded described in the base plate 321 and two between side plate 323.The one of the base plate 321
An opening 3251 is opened up in the middle part of end.The radiating shell 32 is provided with the connecting portion for fixing the solid state hard disc 20.This
In embodiment, the connecting portion is to be respectively arranged at least one fixing piece 326 on the upside of the middle part of side plate 323 described in two, each card
Gu piece 326 is formed to projection in the accepting groove 325 from corresponding side plate 323.In present embodiment, each fixing piece 326
It is made of by Sheet Metal Forming Technology.
Fig. 2 and Fig. 5 is referred to, each fixing piece 326 is just provided with a fixing face 327 to the side of the base plate 321, described
Fix the slide guide face 328 that piece 326 is provided with an arc away from the side of the base plate 321.
Fig. 1 to Fig. 4 is seen also, during assembling, the conducting strip 35 accepting groove of the radiating shell 32 is positioned over into
In 325；Again the circuit board 22 of the solid state hard disc 20 is positioned over into the upside of the accepting groove 325, and makes the circuit board 22
Breach 223 just to the opening 3251 of the base plate 321.The pressing circuit board 22, makes the electricity towards in the accepting groove 325
What two relative sides of road plate 22 were slided respectively supports the slide guide face 328 of corresponding fixing piece 326, and the radiating shell 32 is elastic
Deformation, until the circuit board 22 crosses slide guide face 328, the elastic reset of the radiating shell 32 and make the fixing of fixing piece 326
Face 327 is fastened in the surface of the circuit board 22.Now, the conducting strip 35 be located in the inner surface of the base plate 321 with it is right
Between the chip 25 answered.
When the solid state hard disc component 100 works, the metal finger 221 of the circuit board 22 is plugged in into an electronic installation
On connector, conducting strip 35 described in the heat Jing that the chip 25 of the solid state hard disc 20 is produced when working is conducted to the radiation shell
On body 32, so as to increase area of dissipation, radiating efficiency is improve.The radiating shell 32 is wrapped in the four of the circuit board 22
In week, can prevent chip 25 from damaging during using the solid state hard disc component 100, so as to effectively protect chip 25.
Separately, in the appearance iso-surface patch or the various figures of paint or color of the radiating shell 32, the solid state hard disc group is made
Part 100 is more attractive in appearance.
Embodiment of above is only unrestricted to illustrate the technical solution of the utility model, although with reference to above embodiment party
Formula has been described in detail to the utility model, it will be understood by those within the art that, can be to of the present utility model
Technical scheme is modified or equivalent should not all depart from the spirit and scope of technical solutions of the utility model.
Claims (10)
1. a kind of heat abstractor, for giving solid state hard disc radiating, it is characterised in that：The heat abstractor is described including being installed in
A radiating shell outside solid state hard disc and the conducting strip being located between the solid state hard disc and radiating shell, the radiation shell
Body is made up of heat dissipation metal plate, and the radiating shell is provided with the connecting portion for being connected to the solid state hard disc.
2. heat abstractor as claimed in claim 1, it is characterised in that：The radiating shell includes a base plate of bar shaped and from institute
The biside plate that two relative sides of base plate extend towards the same side is stated, an accepting groove is surrounded described in the base plate and two between side plate,
The solid state hard disc is contained in the accepting groove, and the conducting strip is located in the inner surface and the solid state hard disc of the base plate
Between.
3. heat abstractor as claimed in claim 2, it is characterised in that：The connecting portion is respectively arranged on side plate described in two
At least one fixes piece, the corresponding side of circuit board that each fixing piece is fastened in the solid state hard disc.
4. heat abstractor as claimed in claim 3, it is characterised in that：Each fixing piece is corresponding side plate to the accepting groove
Interior projection is formed.
5. heat abstractor as claimed in claim 3, it is characterised in that：Each fixing piece is just provided with one to the side of the base plate
Fixing face, the fixing piece is provided with the slide guide face of an arc away from the side of the base plate.
6. heat abstractor as claimed in claim 1, it is characterised in that：The radiating shell is made up of aluminum alloy materials.
7. heat abstractor as claimed in claim 1, it is characterised in that：The appearance iso-surface patch of the radiating shell is painted various
Figure or color.
8. a kind of solid state hard disc component, an including solid state hard disc and a heat abstractor, it is characterised in that：The solid state hard disc includes
One circuit board and some chips being attached on the circuit board, the heat abstractor includes being installed in outside the solid state hard disc
One radiating shell and the conducting strip being located between corresponding chip and radiating shell, the radiating shell is by heat dissipation metal plate
Make, the radiating shell is provided with the connecting portion for being connected to the solid state hard disc.
9. solid state hard disc component as claimed in claim 8, it is characterised in that：One base plate of the radiating shell including bar shaped and
From the biside plate that two relative sides of the base plate extend towards the same side, a collecting is surrounded described in the base plate and two between side plate
Groove, the solid state hard disc is contained in the accepting groove, and the inner surface that the conducting strip is located in the base plate is hard with the solid-state
Between disk.
10. solid state hard disc component as claimed in claim 9, it is characterised in that：The connecting portion is to be respectively arranged on side described in two
At least one fixing piece on plate, the corresponding side of circuit board that each fixing piece is fastened in the solid state hard disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621070048.0U CN206162309U (en) | 2016-09-22 | 2016-09-22 | Solid state disk assembly and heat dissipation device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621070048.0U CN206162309U (en) | 2016-09-22 | 2016-09-22 | Solid state disk assembly and heat dissipation device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206162309U true CN206162309U (en) | 2017-05-10 |
Family
ID=58651260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621070048.0U Active CN206162309U (en) | 2016-09-22 | 2016-09-22 | Solid state disk assembly and heat dissipation device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206162309U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108346438A (en) * | 2018-05-15 | 2018-07-31 | 深圳市超频三科技股份有限公司 | A kind of radiator and a kind of solid state disk |
| CN109491470A (en) * | 2018-12-24 | 2019-03-19 | 南方电网科学研究院有限责任公司 | Computer storage device |
| CN109697994A (en) * | 2017-10-20 | 2019-04-30 | 神讯电脑(昆山)有限公司 | Heat-dissipating casing and plug-in type electronic device with this heat-dissipating casing |
| CN111179978A (en) * | 2018-11-09 | 2020-05-19 | 广达电脑股份有限公司 | Adapter bracket and carrier device |
| CN112631385A (en) * | 2020-12-18 | 2021-04-09 | 深圳忆数存储技术有限公司 | Computer storage hard disk with good heat dissipation effect and use method thereof |
| CN112987880A (en) * | 2019-12-02 | 2021-06-18 | 鸿富锦精密工业(武汉)有限公司 | Heat sink device |
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
| CN114863957A (en) * | 2021-02-03 | 2022-08-05 | 宇瞻科技股份有限公司 | Cooling module and storage device |
| WO2025102298A1 (en) * | 2023-11-16 | 2025-05-22 | 威刚科技股份有限公司 | Solid state disk device and electronic device |
-
2016
- 2016-09-22 CN CN201621070048.0U patent/CN206162309U/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109697994A (en) * | 2017-10-20 | 2019-04-30 | 神讯电脑(昆山)有限公司 | Heat-dissipating casing and plug-in type electronic device with this heat-dissipating casing |
| CN108346438B (en) * | 2018-05-15 | 2024-08-02 | 深圳市超频三科技股份有限公司 | Radiator and solid state disk |
| CN108346438A (en) * | 2018-05-15 | 2018-07-31 | 深圳市超频三科技股份有限公司 | A kind of radiator and a kind of solid state disk |
| CN111179978A (en) * | 2018-11-09 | 2020-05-19 | 广达电脑股份有限公司 | Adapter bracket and carrier device |
| CN109491470A (en) * | 2018-12-24 | 2019-03-19 | 南方电网科学研究院有限责任公司 | Computer storage device |
| CN112987880B (en) * | 2019-12-02 | 2023-11-03 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation device |
| CN112987880A (en) * | 2019-12-02 | 2021-06-18 | 鸿富锦精密工业(武汉)有限公司 | Heat sink device |
| CN112631385B (en) * | 2020-12-18 | 2021-07-06 | 深圳忆数存储技术有限公司 | Computer storage hard disk with good heat dissipation effect and use method thereof |
| CN112631385A (en) * | 2020-12-18 | 2021-04-09 | 深圳忆数存储技术有限公司 | Computer storage hard disk with good heat dissipation effect and use method thereof |
| CN114863957A (en) * | 2021-02-03 | 2022-08-05 | 宇瞻科技股份有限公司 | Cooling module and storage device |
| CN114863957B (en) * | 2021-02-03 | 2023-07-25 | 宇瞻科技股份有限公司 | Heat radiation module and storage device |
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
| WO2025102298A1 (en) * | 2023-11-16 | 2025-05-22 | 威刚科技股份有限公司 | Solid state disk device and electronic device |
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| GR01 | Patent grant |