CN219458618U - Bus duct with good heat dissipation effect - Google Patents
Bus duct with good heat dissipation effect Download PDFInfo
- Publication number
- CN219458618U CN219458618U CN202320374229.6U CN202320374229U CN219458618U CN 219458618 U CN219458618 U CN 219458618U CN 202320374229 U CN202320374229 U CN 202320374229U CN 219458618 U CN219458618 U CN 219458618U
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- China
- Prior art keywords
- heat dissipation
- bus duct
- fixedly connected
- heat
- plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 51
- 230000000694 effects Effects 0.000 title claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims description 34
- 230000003014 reinforcing effect Effects 0.000 claims description 15
- 239000004519 grease Substances 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- 238000005086 pumping Methods 0.000 abstract description 2
- 238000005057 refrigeration Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a bus duct with good heat dissipation effect, which comprises a bus duct and a heat dissipation mechanism, wherein the heat dissipation mechanism is arranged in the bus duct; the bus duct comprises two oppositely arranged side plates, the inner sides of the two side plates are fixedly connected with a wire box, and a plurality of uniformly distributed conductors are sleeved in the wire box; the heat dissipation mechanism comprises a conductor fixedly connected inside the wire box, and the conductor is sleeved on the surface of the conductor. According to the utility model, the heat energy generated by the conductor can be exchanged into the radiator by arranging the heat dissipation mechanism, and then the heat dissipation fan can be used for rapidly pumping the high temperature in the radiator into the surrounding air, so that the bus duct can be efficiently dissipated, and compared with the existing bus duct which can only dissipate heat and cool through heat exchange with the air, the bus duct has the advantages of efficiently dissipating heat and increasing the heat dissipation efficiency of the bus duct.
Description
Technical Field
The utility model belongs to the technical field of bus ducts, and particularly relates to a bus duct with a good heat dissipation effect.
Background
The bus duct is a closed metal device formed by copper and aluminum bus posts and is used for distributing large power to each element of the dispersion system. Increasingly, wires and cables have been replaced in the field of low-voltage indoor power transmission mains engineering. The bus duct is generally used for transmitting power, so that the bus duct can generate relatively large heat when in work, and the heat is collected to bake the bus duct, so that the safety of the bus duct is affected, the existing bus duct does not have the function of efficient heat dissipation, and only can perform inefficient cooling and heat dissipation through heat exchange with surrounding air, so that the bus duct is inconvenient to use by people, and the practicability is reduced.
Therefore, the bus duct needs to be designed and modified, so that the phenomenon that the existing bus duct does not have a high-efficiency heat dissipation function and can only conduct low-efficiency cooling and heat dissipation through heat exchange with surrounding air is effectively prevented.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model aims to provide a bus duct with good heat dissipation effect, which has the advantage of high-efficiency cooling and heat dissipation, and solves the problems that the existing bus duct does not have the function of high-efficiency heat dissipation and can only conduct low-efficiency cooling and heat dissipation through heat exchange with surrounding air.
The utility model provides the following technical scheme: the bus duct with good heat dissipation effect comprises a bus duct and a heat dissipation mechanism, wherein the heat dissipation mechanism is arranged in the bus duct;
the bus duct comprises two oppositely arranged side plates, the inner sides of the two side plates are fixedly connected with a wire box, and a plurality of uniformly distributed conductors are sleeved in the wire box;
the heat dissipation mechanism comprises a conductor fixedly connected to the inside of the wire box, the conductor is sleeved on the surface of the conductor, two uniformly distributed exchange grooves are formed in the upper side and the lower side of the wire box, a heat conducting plate is fixedly connected to the inside of the exchange grooves and is in contact with the conductor, a semiconductor refrigerating sheet is attached to one side of the heat conducting plate away from the conductor, the cold end of the semiconductor refrigerating sheet is attached to the heat conducting plate, the heat end of the semiconductor refrigerating sheet is away from the heat conducting plate, a radiator is fixedly connected to one side of the semiconductor refrigerating sheet away from the heat conducting plate, a heat dissipation fan is arranged on one side of the radiator away from the semiconductor refrigerating sheet in a spaced mode, and four uniformly distributed supporting legs are fixedly connected to the periphery of the surface of the heat dissipation fan and are fixedly connected with the heat dissipation fan through the supporting legs and the wire box.
The upper side and the lower side of the semiconductor refrigeration piece are fixedly connected with heat-conducting silicone grease layers, the semiconductor refrigeration piece is attached to the heat-conducting plate through the heat-conducting silicone grease layers, and the semiconductor refrigeration piece is fixedly connected with the radiator through the heat-conducting silicone grease layers.
The semiconductor refrigerating piece is characterized in that connecting pieces are fixedly connected to two sides of the semiconductor refrigerating piece, screws are connected to the tops of the connecting pieces in a threaded mode, and the connecting pieces are fixedly connected with the wire box through the screws.
The surface fixedly connected with gusset plate of supporting leg, gusset plate and heat dissipation fan and line box fixed connection.
The number of the reinforcing plates is a plurality of the reinforcing plates and the reinforcing plates are uniformly distributed on the surfaces of the two ends of the supporting legs, and the concrete shape of each reinforcing plate is triangular.
The inner side of the side plate is fixedly connected with a dustproof net, and the dustproof net is positioned on one side of the radiating fan away from the radiating fan.
The beneficial effects of the utility model are as follows:
1. according to the utility model, the heat energy generated by the conductor can be exchanged into the radiator by arranging the heat dissipation mechanism, and then the heat dissipation fan can be used for rapidly pumping the high temperature in the radiator into the surrounding air, so that the bus duct can be efficiently dissipated, and compared with the existing bus duct which can only dissipate heat and cool through heat exchange with the air, the bus duct has the advantages of efficiently dissipating heat and increasing the heat dissipation efficiency of the bus duct.
2. The heat conduction silicone grease layer is arranged, so that the heat conduction device has the advantage of increasing the heat conduction efficiency, and the heat conduction silicone grease layer can be used for filling gaps between the semiconductor refrigerating sheet and the heat conduction plate as well as between the semiconductor refrigerating sheet and the heat radiator, so that air in the gaps is avoided, and the heat conduction efficiency of the heat radiation mechanism is prevented from being influenced by the air.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model.
Fig. 2 is a schematic discharge diagram of fig. 1 a according to the present utility model.
Fig. 3 is a schematic discharge diagram of the present utility model B in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
As shown in fig. 1 to 3, the heat dissipation mechanism 2 of the present embodiment is provided inside the bus duct 1;
the bus duct 1 comprises two oppositely arranged side plates 101, the inner sides of the two side plates 101 are fixedly connected with a wire box 102, and a plurality of uniformly distributed conductors 103 are sleeved in the wire box 102;
the heat dissipation mechanism 2 comprises a conductor 21 fixedly connected inside a wire box 102, the conductor 21 is made of an insulating heat-conducting material, the conductor 21 is sleeved on the surface of a conductor 103, two uniformly distributed exchange grooves 22 are formed in the upper side and the lower side of the wire box 102, a heat conducting plate 23 is fixedly connected to the inside of the exchange grooves 22, the heat conducting plate 23 is in contact with the conductor 21, a semiconductor refrigerating sheet 24 is attached to one side, far away from the conductor 21, of the heat conducting plate 23, the cold end of the semiconductor refrigerating sheet 24 is attached to the heat conducting plate 23, the hot end of the semiconductor refrigerating sheet 24 is arranged far away from the heat conducting plate 23, a radiator 25 is fixedly connected to one side, far away from the semiconductor refrigerating sheet 24, of the radiator 25, a heat dissipation fan 26 is arranged at intervals, four uniformly distributed supporting legs 27 are fixedly connected to the periphery of the surface of the heat dissipation fan 26, and the heat dissipation fan 26 is fixedly connected with the wire box 102 through the supporting legs 27.
Referring to fig. 1, 2 and 3, the upper and lower sides of the semiconductor refrigeration sheet 24 are fixedly connected with the heat conduction silicone grease layer 3, the semiconductor refrigeration sheet 24 is attached to the heat conduction plate 23 through the heat conduction silicone grease layer 3, and the semiconductor refrigeration sheet 24 is fixedly connected with the radiator 25 through the heat conduction silicone grease layer 3.
By arranging the heat-conducting silicone grease layer 3, the heat-conducting silicone grease layer 3 can be used for filling gaps between the semiconductor refrigerating sheet 24 and the heat-conducting plate 23 and the radiator 25, so that air is prevented from being present in the gaps, and the heat-conducting efficiency of the heat-radiating mechanism 2 is prevented from being influenced by the air.
Referring to fig. 3, the semiconductor refrigerating sheet 24 is fixedly connected with a connecting piece 4 at both sides, a screw 5 is screwed at the top of the connecting piece 4, and the connecting piece 4 is fixedly connected with the wire box 102 through the screw 5.
The connecting piece 4 and the screw 5 are arranged, so that the device has the advantage of reinforcing connection, the connection strength between the semiconductor refrigerating piece 24 and the wire box 102 can be reinforced, and the phenomenon that the semiconductor refrigerating piece 24 is easy to loosen or shift is avoided.
Referring to fig. 3, the surface of the support leg 27 is fixedly connected with a reinforcing plate 6, and the reinforcing plate 6 is fixedly connected with the heat radiation fan 26 and the wire box 102.
The reinforcing plate 6 is arranged in the embodiment, so that the device has the advantage of stable connection, the reinforcing plate 6 can be utilized to ensure the stable connection between the supporting leg 27 and the radiating fan 26 as well as between the supporting leg 27 and the wire box 102, and the phenomenon that the supporting leg 27 is easy to loose and fall off is avoided.
Referring to fig. 3, the number of the reinforcing plates 6 is several and uniformly distributed on the surfaces of both ends of the supporting leg 27, and the specific shape of the reinforcing plates 6 is a triangle.
According to the embodiment, the number and the shape of the reinforcing plates 6 are set, so that the device has the advantage of increasing stability, the stability of the supporting legs 27 can be increased by utilizing the characteristic that the triangle has stronger stability, and the supporting legs 27 are prevented from easily shaking.
Referring to fig. 1, a dust screen 7 is fixedly connected to the inner side of the side plate 101, and the dust screen 7 is located at a side of the heat dissipation fan 26 away from the heat dissipation fan 26.
The dustproof net 7 is arranged, so that the device has the dustproof advantage, dust can be prevented from adhering to the surface of the heat dissipation mechanism 2 assembly, the cleanliness of the surface of the heat dissipation mechanism 2 assembly is guaranteed, and the heat dissipation and cooling efficiency of the heat dissipation mechanism 2 assembly is prevented from being influenced by the dust.
The utility model absorbs the heat of the conductor 103 through the conductor 21, then the conductor 21 transmits the heat to the heat-conducting plate 23, at the moment, the semiconductor refrigerating sheet 24 is started, so that the semiconductor refrigerating sheet 24 performs heat exchange on the surface of the heat-conducting plate 23, thereby exchanging the high temperature inside the heat-conducting plate 23 into the radiator 25, and the heat-radiating fan 26 is utilized to rapidly pump the high temperature inside the radiator 25 into the surrounding air, thereby completing the efficient heat radiation of the bus duct 1.
Claims (6)
1. The utility model provides a bus duct that radiating effect is good, includes bus duct (1) and heat dissipation mechanism (2), its characterized in that: the heat dissipation mechanism (2) is arranged in the bus duct (1);
the bus duct (1) comprises two oppositely arranged side plates (101), wherein a wire box (102) is fixedly connected to the inner sides of the two side plates (101), and a plurality of uniformly distributed conductors (103) are sleeved in the wire box (102);
the heat dissipation mechanism (2) comprises a conductor (21) fixedly connected inside a wire box (102), the conductor (21) is sleeved on the surface of the conductor (103), two uniformly distributed exchange grooves (22) are formed in the upper side and the lower side of the wire box (102), a heat conduction plate (23) is fixedly connected to the inner side of the exchange grooves (22), the heat conduction plate (23) is in contact with the conductor (21), a semiconductor refrigerating sheet (24) is attached to one side of the heat conduction plate (23) away from the conductor (21), the cold end of the semiconductor refrigerating sheet (24) is attached to the heat conduction plate (23), the hot end of the semiconductor refrigerating sheet (24) is away from the heat conduction plate (23), a radiator (25) is fixedly connected to one side of the semiconductor refrigerating sheet (24) away from the heat conduction plate (23), four supporting legs (27) are fixedly connected to the periphery of the surface of the heat dissipation plate (26), and the supporting legs (26) are fixedly connected with the heat dissipation plate (102) through the heat dissipation plate (27).
2. The bus duct with good heat dissipation effect as set forth in claim 1, wherein: the semiconductor refrigerating sheet (24) is fixedly connected with the heat-conducting silicone grease layers (3) on the upper side and the lower side, the semiconductor refrigerating sheet (24) is attached to the heat-conducting plate (23) through the heat-conducting silicone grease layers (3), and the semiconductor refrigerating sheet (24) is fixedly connected with the radiator (25) through the heat-conducting silicone grease layers (3).
3. The bus duct with good heat dissipation effect as set forth in claim 2, wherein: the semiconductor refrigerating piece is characterized in that connecting pieces (4) are fixedly connected to two sides of the semiconductor refrigerating piece (24), screws (5) are connected to the tops of the connecting pieces (4) in a threaded mode, and the connecting pieces (4) are fixedly connected with the wire box (102) through the screws (5).
4. A bus duct with good heat dissipation effect according to claim 3, characterized in that: the surface of supporting leg (27) is fixedly connected with gusset plate (6), gusset plate (6) and radiator fan (26) and box (102) fixed connection.
5. The bus duct with good heat dissipation effect according to claim 4, wherein: the number of the reinforcing plates (6) is a plurality, the reinforcing plates are uniformly distributed on the surfaces of the two ends of the supporting legs (27), and the specific shape of each reinforcing plate (6) is triangular.
6. The bus duct with good heat dissipation effect according to claim 5, wherein: the inner side of the side plate (101) is fixedly connected with a dustproof net (7), and the dustproof net (7) is positioned on one side, far away from the radiating fan (26), of the radiating fan (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320374229.6U CN219458618U (en) | 2023-03-03 | 2023-03-03 | Bus duct with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320374229.6U CN219458618U (en) | 2023-03-03 | 2023-03-03 | Bus duct with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219458618U true CN219458618U (en) | 2023-08-01 |
Family
ID=87380992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320374229.6U Active CN219458618U (en) | 2023-03-03 | 2023-03-03 | Bus duct with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219458618U (en) |
-
2023
- 2023-03-03 CN CN202320374229.6U patent/CN219458618U/en active Active
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