CN210610129U - Heat dissipation sheet and cooking utensil - Google Patents

Abstract

The utility model provides a fin and cooking utensil, this fin includes: the heat dissipation unit comprises a heat absorption surface and a heat conduction surface, the heat absorption surface and the heat conduction surface jointly form the upper surface of the heat dissipation unit, and the heat absorption surface is arranged corresponding to the electronic element; the thickness of the heat dissipation unit where the heat absorbing surface is located is larger than that of the heat dissipation unit where at least part of the heat conducting surface is located. Through the technical scheme provided by the application, the problems of large occupied space and large weight in the prior art can be solved.

Description

Heat dissipation sheet and cooking utensil

Technical Field

The utility model relates to a cooking utensil technical field particularly, relates to a fin and cooking utensil.

Background

At present, in the electric pressure cooker adopting an electromagnetic mode for heating, electronic elements in the electric pressure cooker can generate heat in the working process. In order to cool the electronic component, the electronic component is usually disposed on a heat sink, and the heat sink is used to cool the electronic component.

In the prior art, the upper surface and the lower surface of the heat sink are both flat and parallel to each other, and the electronic component is disposed on the upper surface of the heat sink. However, the above-described structure has a problem that the heat sink occupies a large space and has a large weight.

SUMMERY OF THE UTILITY MODEL

The utility model provides a fin and cooking utensil to solve the big, the big problem of weight of occupation of land space among the prior art.

According to an aspect of the present invention, there is provided a heat sink, the heat sink comprising: the heat dissipation unit comprises a heat absorption surface and a heat conduction surface, the heat absorption surface and the heat conduction surface jointly form the upper surface of the heat dissipation unit, and the heat absorption surface is arranged corresponding to the electronic element; the thickness of the heat dissipation unit where the heat absorbing surface is located is larger than that of the heat dissipation unit where at least part of the heat conducting surface is located. By adopting the structure, the thickness of the heat dissipation unit where the heat absorbing surface is arranged is set to be larger than the thickness of the heat dissipation unit where at least part of the heat conducting surface is arranged, so that the heat dissipation unit where the heat absorbing surface is arranged can be conveniently and fully utilized to conduct heat conduction and cool, and because the heat generated by the heat conducting surface to the electronic element is conducted along with the heat conducting surface, the heat on the heat dissipation sheet can be gradually reduced, so that the thickness and the size of the heat dissipation unit where the heat conducting surface is arranged can be reduced, the occupied space of the heat dissipation sheet can be reduced.

Furthermore, the thickness of the heat dissipation unit where the heat conduction surface far away from the heat absorption surface is located is smaller than that of the heat dissipation unit where the heat conduction surface close to the heat absorption surface is located, so that the weight of the heat dissipation sheet can be reduced while the heat dissipation and cooling effects are ensured.

Furthermore, the thickness of the heat dissipation unit is gradually reduced from the position of the heat absorption surface to the peripheral direction of the heat dissipation unit, so that the weight of the heat dissipation fin can be reduced while the heat dissipation and cooling effects are ensured. Moreover, by adopting the structure, the heat can be conducted on the heat conducting surface more uniformly.

Further, the heat absorbing surface is located in the middle of the upper surface. Through above-mentioned structure for the heat absorption surface is heat conduction face all around equals with the distance of heat absorption surface, and the heat conduction area on the heat conduction face is the same, so can make the heat more even in the conduction on the heat conduction face, avoids local heat to concentrate, can guarantee the effect of heat dissipation cooling.

Furthermore, the number of the heat conduction surfaces is one or more, and under the condition that one heat conduction surface is arranged, the heat conduction surface and the heat absorption surface are not coplanar; in the case of a plurality of heat transfer surfaces, at least one heat transfer surface is not coplanar with the heat absorbing surface. By adopting the structure, the surface area of the surface of the heat dissipation unit formed by the heat absorption surface and the heat conduction surface together can be increased, so that the heat dissipation area of the heat dissipation fin can be increased in a limited space, and the heat dissipation effect of the heat dissipation fin can be improved.

Further, in the case of one heat conduction surface, the heat conduction surface is not parallel to the heat absorption surface; when the heat conduction surface is multiple, at least one heat conduction surface is not parallel to the heat absorption surface, so that the surface area of the heat dissipation unit surface formed by the heat absorption surface and the heat conduction surface together can be increased.

Furthermore, the heat dissipation unit comprises a plurality of heat conduction surfaces, the plurality of heat conduction surfaces are arranged along the periphery of the heat absorption surface, and two adjacent heat conduction surfaces are connected with each other, so that the heat absorption surface and the plurality of heat conduction surfaces jointly form one surface of the heat dissipation unit.

Furthermore, the plurality of heat conduction surfaces are not coplanar with each other or are not parallel with each other, so as to further improve the heat dissipation effect of the heat dissipation plate.

Further, the radiating unit comprises a lower surface opposite to the upper surface, the radiating fin further comprises at least one radiating tooth, and the radiating tooth is arranged on the lower surface of the radiating unit, so that the heat conducting surface can transfer heat in the radiating unit to the radiating tooth, the radiating tooth is utilized to assist in radiating, and the radiating effect is further improved. Wherein, the fin still includes the installation piece, and the installation piece sets up the both sides at the fin, so is convenient for assemble the fin.

Furthermore, the radiating fin comprises at least one radiating unit, and under the condition that the number of the radiating units is multiple, the radiating units are sequentially connected, so that the radiating effect of the radiating fin is further improved.

According to another aspect of the present invention, there is provided a cooking appliance comprising the above-mentioned heat sink.

Use the technical scheme of the utility model, this fin includes the radiating element, and the radiating element includes heat-absorbing surface and heat-conducting surface. The heat absorbing surface and the heat conducting surface jointly form the upper surface of the heat dissipation unit, and the heat absorbing surface is arranged corresponding to the electronic element. The thickness of the heat dissipation unit where the heat absorbing surface is located is set to be larger than the thickness of the heat dissipation unit where at least part of the heat conducting surface is located, the heat dissipation unit where the heat absorbing surface is located is conveniently and fully utilized for conducting heat and cooling, and the heat on the heat dissipation fin can be gradually reduced due to the fact that the heat conducting surface conducts heat to the heat generated by the electronic component, so that the thickness of the heat dissipation unit where the heat conducting surface is located can be reduced, the occupied space of the heat dissipation fin can be reduced, and the weight of the heat dissipation fin is reduced.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 shows a schematic structural diagram of a heat sink provided by the present invention;

fig. 2 shows a cross-sectional view of a heat sink provided by the present invention;

FIG. 3 shows a top view of FIG. 1;

fig. 4 shows a front view of fig. 1.

Wherein the figures include the following reference numerals:

10. a heat dissipation unit; 11. a heat absorbing surface; 12. a heat conducting surface;

20. a heat dissipating tooth;

30. and (7) mounting the sheet.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 to 4, a heat sink according to an embodiment of the present invention includes a heat dissipation unit 10, the heat dissipation unit 10 includes a heat absorption surface 11 and a heat conduction surface 12, the heat absorption surface 11 and the heat conduction surface 12 together form an upper surface of the heat dissipation unit 10, and an electronic component is disposed on the heat absorption surface 11. Specifically, the thickness of the heat dissipation unit 10 where the heat absorption surface 11 is located is greater than the thickness of the heat dissipation unit 10 where at least part of the heat conduction surface 12 is located. Because the electronic element is arranged on the heat absorbing surface 11, the electronic element can generate a large amount of heat in the working process, and the heat conduction efficiency of the solid heat dissipation unit 10 is superior to that of air, so that the thickness and the size of the heat dissipation unit 10 where the heat absorbing surface 11 is located are designed to be thicker, and the heat dissipation unit 10 where the heat absorbing surface 11 is located can be conveniently and fully utilized to conduct heat and cool. Furthermore, as the heat-conducting surface 12 conducts heat generated by the electronic component, the heat will gradually decrease, so that the thickness of the heat-dissipating unit 10 where the heat-conducting surface 12 is located can be reduced. The heat absorbing surface 11 may be a plane or a curved surface, and the heat conducting surface 12 may be a plane or a curved surface. In the present embodiment, the heat absorbing surface 11 and the heat conducting surface 12 are both planar, and an included angle is formed between the heat absorbing surface 11 and the heat conducting surface 12. By arranging the heat absorbing surface 11 as a plane, mounting of the electronic component is facilitated.

The thickness of the heat dissipation unit 10 with the heat absorbing surface 11 is greater than the thickness of the heat dissipation unit 10 with at least part of the heat conducting surface 12. First, the heat transfer surface 12 and the heat absorbing surface 11 are uniformly thick at a position closer to the heat transfer surface 12 than the heat absorbing surface 11, and the heat transfer surface 12 starts to become thin after the heat transfer surface 12 is relatively distant from the heat absorbing surface 11 by a certain distance. Secondly, the thickness of the heat-conducting surface 12 becomes thinner from the connection with the heat-absorbing surface 11. In the present embodiment, the second case is adopted, so that the weight of the heat sink can be reduced while the heat conduction and temperature reduction effects of the heat dissipation unit 10 where the heat absorption surface 11 is located are ensured.

By applying the heat sink provided by this embodiment, the thickness of the heat dissipation unit 10 where the heat absorbing surface 11 is located is greater than the thickness of the heat dissipation unit 10 where the heat conducting surface 12 is located, so as to ensure that the heat dissipation unit 10 where the heat absorbing surface 11 is located conducts heat and cools down, and along with the gradual reduction of heat, by reducing the thickness of the heat dissipation unit 10 where the heat conducting surface 12 is located, the occupied space of the heat sink can be reduced, and the weight of the heat sink is reduced.

The thickness of the heat conducting surface 12 far away from the heat absorbing surface 11 is smaller than that of the heat conducting surface 12 near the heat absorbing surface 11, so that the weight of the heat radiating fin can be reduced while the heat radiating and cooling effects are ensured.

In this embodiment, the heat absorbing surface 11 is located at the middle of the upper surface, so the thickness of the central portion of the heat dissipating unit 10 is the largest, and the heat sink has enough volume to conduct heat. Specifically, the heat absorbing surface 11 is arranged in the middle of the upper surface, and the distances between the heat conducting surfaces 12 on the periphery of the heat absorbing surface 11 and the heat absorbing surface 11 are equal, so that heat is conducted more uniformly on the heat absorbing surface 11 and the heat conducting surfaces 12, and the heat dissipation and cooling effects can be further ensured. In other embodiments, the heat absorbing surface 11 may be disposed at or near the side portion of the heat dissipating unit 10 according to the position of the electronic component.

Specifically, the thickness of the heat dissipating unit 10 gradually decreases from the position of the heat absorbing surface 11 to the peripheral direction of the heat dissipating unit 10, so that the weight of the heat dissipating fin can be reduced while the heat dissipating and cooling effects are ensured.

In the present embodiment, the thickness of the heat dissipation unit 10 where the heat absorption surface 11 is located is 5mm, so that the heat absorption surface 11 directly contacting with the electronic component can sufficiently absorb and conduct the heat of the electronic component. The thickness of the heat dissipating unit 10 having the heat conductive surface 12 is gradually reduced from a position close to the heat absorbing surface 11 to a position away from the heat absorbing surface 11. Specifically, at the edge of the heat dissipating unit 10, the thickness of the heat dissipating unit 10 where the heat conductive surface 12 is located is 1 mm.

One or more heat conduction surfaces 12 are provided, and in the case of one heat conduction surface 12, the heat conduction surface 12 is not coplanar with the heat absorption surface 11; in the case of a plurality of heat transfer surfaces 12, at least one heat transfer surface 12 is not coplanar with the heat absorbing surface 11. Specifically, the heat conduction surface 12 and the heat absorption surface 11 are not coplanar, which includes the following two cases. The first case is: the heat conducting surface 12 is directly connected with the heat absorbing surface 11, and the heat conducting surface 12 is not parallel to the heat absorbing surface 11. The second case is: at least one heat conduction surface 12 and the heat absorption surface 11 form a ladder structure, specifically, the heat conduction surface 12 and the heat absorption surface 11 can be connected through one or more connection surfaces, so that the heat conduction surface 12, the connection surfaces and the heat absorption surface 11 together form one or more ladder surfaces, at this time, the heat conduction surface 12 and the heat absorption surface 11 can be kept parallel, and the heat conduction surface 12 and the heat absorption surface 11 can also be not parallel. In the present embodiment, the plurality is at least two.

In the first case, since the heat-conducting surface 12 is not parallel to the heat-absorbing surface 11, the surface area of the surface of the heat-dissipating unit 10 formed by the heat-absorbing surface 11 and the heat-conducting surface 12 can be increased, and the floor space and the weight of the heat sink can be reduced. In the second case, since one or more connecting surfaces are provided between the heat conducting surface 12 and the heat absorbing surface 11, it is also possible to increase the surface area of the surface of the heat dissipating unit 10 formed by the heat absorbing surface 11 and the heat conducting surface 12 together, and to reduce the floor space and weight of the heat sink. The heat-conducting surface 12 may be an inclined surface or a curved surface. In the present embodiment, the plurality of heat conducting surfaces 12 are all inclined surfaces, the heat conducting surface 12 is directly connected to the heat absorbing surface 11, and the heat conducting surface 12 is not parallel to the heat absorbing surface 11. The heat-conducting surface 12 may be inclined downwards towards the heat-absorbing surface 11, or inclined downwards away from the heat-absorbing surface 11, so that the heat-conducting surface 12 is not parallel to the heat-absorbing surface 11. In this embodiment, the heat conducting surface 12 is inclined downward in a direction away from the heat absorbing surface 11.

Wherein, in case of one heat-conducting surface 12, the heat-conducting surface 12 is not parallel to the heat-absorbing surface 11; in the case where the heat-conductive surface 12 is plural, at least one heat-conductive surface 12 is not parallel to the heat-absorbing surface 11. In the present embodiment, the number of the heat conducting surfaces 12 is multiple, and the plurality of heat conducting surfaces 12 are not parallel to the heat absorbing surface 11. In other embodiments, in the case that the heat-conducting surface 12 is plural, one heat-conducting surface 12 may be disposed not parallel to the heat-absorbing surface 11, and the other heat-conducting surfaces 12 may be disposed parallel to the heat-absorbing surface 11.

In the present embodiment, the heat dissipating unit 10 includes a plurality of heat conducting surfaces 12, the plurality of heat conducting surfaces 12 are disposed along the periphery of the heat absorbing surface 11, and two adjacent heat conducting surfaces 12 are connected to each other, so that the heat absorbing surface 11 and the plurality of heat conducting surfaces 12 together form one surface of the heat dissipating unit 10.

Wherein the plurality of heat-conducting surfaces 12 are not coplanar with each other, or the plurality of heat-conducting surfaces 12 are not parallel with each other. When two adjacent heat conduction surfaces 12 of the plurality of heat conduction surfaces 12 are directly connected, the two adjacent heat conduction surfaces 12 are not parallel to each other; when two adjacent heat conduction surfaces 12 of the plurality of heat conduction surfaces 12 are connected by one or more connection surfaces, the two adjacent heat conduction surfaces 12 may be parallel or non-parallel.

In this embodiment, the heat dissipating unit 10 includes a lower surface opposite to the upper surface, the upper surface of the heat dissipating unit 10 is provided with a heat absorbing surface 11 and a heat conducting surface 12, and the whole lower surface of the heat dissipating unit 10 is the heat conducting surface 12, so that the heat dissipating area of the heat dissipating unit 10 can be increased. The heat conducting surface 12 of the lower surface of the heat dissipating unit 10 may be an inclined plane or a curved surface. The heat-conducting surface 12 of the lower surface is radially distributed on the lower surface with the center of the heat-dissipating unit 10.

The heat sink further includes heat dissipation teeth 20, and the heat dissipation teeth 20 are disposed on the lower surface of the heat dissipation unit 10, so that the heat conduction surface 12 can transfer heat in the heat dissipation unit 10 to the heat dissipation teeth 20, and the heat dissipation teeth 20 are utilized to perform auxiliary heat dissipation, thereby further improving the heat dissipation effect.

Specifically, the heat sink includes at least one heat dissipation tooth 20, and the at least one heat dissipation tooth 20 is disposed on the lower surface of the heat dissipation unit 10 to further improve the heat dissipation effect of the heat sink. When the heat sink includes a plurality of heat dissipation teeth 20, the plurality of heat dissipation teeth 20 may be alternately disposed on the lower surface of the heat dissipation unit 10, or may be disposed in parallel on the lower surface of the heat dissipation unit 10. Also, the plurality of heat dissipation teeth 20 may be arranged at intervals along the length direction of the heat dissipation unit 10, or may be arranged at intervals along the width direction of the heat dissipation unit 10. In the present embodiment, the plurality of heat dissipation teeth 20 are disposed in parallel on the lower surface of the heat dissipation unit 10, and the plurality of heat dissipation teeth 20 are arranged at equal intervals along the length direction of the heat dissipation unit 10.

The heat sink includes at least one heat dissipating unit 10, and when there are a plurality of heat dissipating units 10, the plurality of heat dissipating units 10 are connected in sequence. Specifically, the plurality of heat dissipation units 10 are connected end to end along the length direction of the heat dissipation units 10, so as to further improve the heat dissipation capability of the heat dissipation fins. In other embodiments, a plurality of heat dissipating units 10 may be connected end to end along the width direction of the heat dissipating units 10.

In order to facilitate the assembly of the heat sink, the heat sink further includes mounting pieces 30, and the mounting pieces 30 are disposed at both sides of the heat sink. When the heat sink is constituted by one heat radiating unit 10, the mounting pieces 30 are provided on both sides of the heat radiating unit 10; when the heat sink is constituted by a plurality of heat radiating units 10, the mounting pieces 30 are provided at the end of the heat radiating unit 10 at the head end of the heat sink and at the end of the heat radiating unit 10 at the tail end of the heat sink.

In order to further increase the heat dissipation area of the heat sink, a heat conduction groove may be formed on the heat conduction surface 12. Wherein, the heat conduction grooves can be arranged in a staggered way or in parallel.

The embodiment of the utility model provides a cooking utensil, cooking utensil includes the above-mentioned fin that provides. Wherein, the cooking utensil comprises an electric pressure cooker and an electric cooker.

With the device provided in this embodiment, the thickness of the heat dissipation unit 10 where the heat absorbing surface 11 is located is greater than the thickness of the heat dissipation unit 10 where at least part of the heat conducting surface 12 is located, which not only can improve the heat dissipation effect of the heat dissipation unit 10 in conducting heat and reducing temperature, but also can reduce the floor area of the heat dissipation fins and reduce the weight of the heat dissipation fins.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (11)

1. A heat sink, characterized in that the heat sink comprises:

the heat dissipation unit (10) comprises a heat absorption surface (11) and a heat conduction surface (12), the heat absorption surface (11) and the heat conduction surface (12) jointly form the upper surface of the heat dissipation unit (10), and the heat absorption surface (11) is arranged corresponding to the electronic component;

the thickness of the heat dissipation unit (10) where the heat absorption surface (11) is located is larger than the thickness of the heat dissipation unit (10) where at least part of the heat conduction surface (12) is located.

2. A heat sink according to claim 1, wherein the thickness of the heat dissipating unit (10) at which the heat conducting surface (12) remote from the heat absorbing surface (11) is located is smaller than the thickness of the heat dissipating unit (10) at which the heat conducting surface (12) close to the heat absorbing surface (11) is located.

3. A heat sink according to claim 1, wherein the thickness of the heat dissipating unit (10) decreases from the location of the heat absorbing surface (11) towards the circumferential direction of the heat dissipating unit (10).

4. A heat sink according to claim 1, wherein the heat absorbing surface (11) is located in the middle of the upper surface.

5. A heat sink according to claim 1, wherein the heat conducting surfaces (12) are one or more, in case of one heat conducting surface (12), the heat conducting surface (12) is not coplanar with the heat absorbing surface (11); in the case of a plurality of heat-conducting surfaces (12), at least one heat-conducting surface (12) is not coplanar with the heat-absorbing surface (11).

6. A heat sink according to claim 5, wherein in case of one heat conducting surface (12), the heat conducting surface (12) is not parallel to the heat absorbing surface (11); in the case where the heat-conducting surface (12) is plural, at least one of the heat-conducting surfaces (12) is not parallel to the heat-absorbing surface (11).

7. The heat sink according to claim 5 or 6, wherein the heat dissipating unit (10) comprises a plurality of the heat conducting surfaces (12), a plurality of the heat conducting surfaces (12) are arranged along the periphery of the heat absorbing surface (11), and two adjacent heat conducting surfaces (12) are connected to each other.

8. A heat sink according to claim 5, wherein a plurality of said heat conducting surfaces (12) are not coplanar with each other, or a plurality of said heat conducting surfaces (12) are not parallel with each other.

9. A heat sink according to claim 1, wherein the heat dissipating unit (10) comprises a lower surface disposed opposite to the upper surface, the heat sink further comprising at least one heat dissipating tooth (20), the heat dissipating tooth (20) being disposed on the lower surface of the heat dissipating unit (10), the heat sink further comprising mounting tabs (30), the mounting tabs (30) being disposed on both sides of the heat sink.

10. A heat sink according to claim 1, wherein the heat sink comprises at least one of the heat dissipating units (10), and in the case where the heat dissipating unit (10) is plural, the plural heat dissipating units (10) are connected in series.

11. A cooking appliance, characterized in that it comprises a heat sink according to any one of claims 1 to 10.

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