WO2021103848A1

WO2021103848A1 - Single-board heat dissipation structure

Info

Publication number: WO2021103848A1
Application number: PCT/CN2020/121798
Authority: WO
Inventors: 邓治高; 刘伟
Original assignee: 华为技术有限公司
Priority date: 2019-11-29
Filing date: 2020-10-19
Publication date: 2021-06-03
Also published as: CN212519534U

Abstract

The present utility model provides a single-board heat dissipation structure, and relates to the technical field of heat dissipation. The single-board heat dissipation structure comprises a printed circuit board, a first heating element provided on the printed circuit board, and a lining board; the printed circuit board comprises a first face and a second face arranged opposite each other, the first heating element is provided between the lining board and the first face of the printed circuit board, the lining board is fixedly connected to the printed circuit board, and the lining board has a heat dissipation structure. By providing a part of the heating element between the lining board and the first face of the printed circuit board, there is more space on the second face of the printed circuit board for arrangement of components such as a memory, a network card, a hard disk, and a lamp, so that the layout of the components provided on the printed circuit board is rational, thereby improving the utilization rate of the space on which the printed circuit board is provided.

Description

Single board heat dissipation structure

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office with an application number of 201922127932.3 and titled "a single-board heat dissipation structure" on November 29, 2019, the entire content of which is incorporated into this application by reference.

Technical field

The utility model relates to the technical field of heat dissipation, in particular to a single board heat dissipation structure.

Background technique

As the scale of chips installed on a single board becomes larger and more powerful, the power consumption of the chip becomes higher and higher, and the power consumption of some single chips has reached several hundred watts. These chips with higher power consumption also produce higher heat. In order not to affect their working performance, these chips need to be dissipated. In addition, when the power consumption of the chip is large, the power supply current required by the chip is large, and the power supply module that provides this current has a high heat output. Therefore, the power supply module also needs to dissipate heat.

At present, when dissipating heat from heating elements such as chips and power supply modules on a single board, a heat sink is usually provided on the corresponding heating element. Affected by the product form, most of the power supply modules and chips with heat sink are arranged on the same side of the printed circuit board (PCB) of the single board, which will result in insufficient use of the space of the PCB.

Utility model content

The technical scheme of the utility model provides a single-board heat dissipation structure, so that the space utilization rate of the single-board is improved.

The technical solution of the utility model provides a single-board heat dissipation structure. The single-board heat dissipation structure mainly includes a printed circuit board, a first heating element arranged on the printed circuit board, and a backing board. One side and the second side; the first heating element is arranged between the lining board and the first surface of the printed circuit board; the lining board is fixedly connected with the printed circuit board, and the lining board has a heat dissipation structure. By adopting the single-board heat dissipation structure of the embodiment of the present utility model, the backing plate plays a role of supporting the printed circuit board to avoid deformation of the printed circuit board during use, thereby improving its structural stability, while also realizing The heat dissipation function of the first heating element. In addition, when the first heating element is dissipated through the liner, the components arranged on the second side of the printed circuit board can be added, so that it can meet more functional requirements.

In a possible embodiment of the present invention, when the heat dissipation structure of the liner is specifically arranged, the heat dissipation structure may be a heat dissipation channel provided on the liner. In order to improve the effectiveness of the lining plate for heat dissipation of the first heating element, the heat dissipation channel can be spread over the entire lining plate. In addition, the heat dissipation channel may be a gas circulation channel or a liquid circulation channel, so that the circulation of gas or liquid in the heat dissipation channel realizes the heat dissipation of the first heating element.

In another possible embodiment of the present invention, the lining plate may also be provided with a containing groove, the containing groove is arranged opposite to the first heating element, and the heat dissipation structure is a heat equalizing plate or Radiator components such as heat pipes. In this way, when the lining board is fixed to the printed circuit board by screws, bolts and other fasteners, the heat sink can be closely attached to the first heating element, so that the heat sink can dissipate heat from the first heating element.

In addition, the size of the projection area of the liner on the printed circuit board can also be adjusted to enable the liner to support the printed circuit board, thereby avoiding the printed circuit board from being deformed during use, and improving its Structural stability. Moreover, when the area of the lining board is larger, the area of the heat dissipation structure provided on the lining board can also be larger. In this way, for the first heating element with a larger amount of heat, the heat dissipation requirements can be met, so as to realize the Effective heat dissipation of a heating element.

In a possible embodiment of the present invention, a thermal interface material can also be arranged between the first heating element and the lining plate to improve the heat conduction efficiency between the heating element and the heat dissipation structure of the lining plate, thereby enhancing the heat transfer to the first heating element. The heat dissipation effect of the component.

In a possible embodiment of the present invention, the single-board heat dissipation structure may further include a second heating element, the second heating element is a power supply module, and the power supply module is arranged on the second side of the printed circuit board; the first heating element is a standby The power supply device is electrically connected to the power supply module. When power is supplied to the device to be powered through the power supply module, the current provided by the power supply module can enter the device to be powered after passing through the printed circuit board.

In a possible implementation of the present invention, when the device to be powered is arranged on the printed circuit board, the device to be powered has a first pin, the first side of the printed circuit board has a first pad, and the device to be powered can pass through The first pin and the first pad are welded and fixed on the first surface of the printed circuit board.

In a possible implementation of the present invention, when the power supply module is specifically set, the power supply module has a second pin, the second side of the printed circuit board has a second pad, and the power supply module can communicate with the first pin through the second pin. The welding of the two pads is fixed on the second surface of the printed circuit board.

When connecting the device to be powered with the power supply module, it is possible but not limited to provide a current flow channel on the printed circuit board, and the second pin of the power supply module and the first pin of the device to be powered can be connected to each other through the current flow channel connection. Wherein, the current flow channel may be, but is not limited to, a copper pillar, a via hole or a metal trace that penetrates the printed circuit board.

In addition, by adopting the technical solution of the embodiment of the present utility model, the current flow channel can also be arranged perpendicular to the printed circuit board, and in addition, the power supply module can be arranged opposite to the device to be powered. By arranging the power supply module and the device to be powered oppositely and electrically connecting the two through a current flow channel perpendicular to the printed circuit board, the power supply module can achieve vertical power supply to the device to be powered, thereby effectively shortening the power supply path and reducing voltage loss. In addition, by adopting the technical solution, the increase in the number of layers of the printed circuit board can be effectively avoided, so that the cost of the printed circuit board can be effectively controlled.

In a possible embodiment of the present invention, when the power supply module is specifically set, the power supply module may also be provided with a first connector, and the power supply device further includes a second connector provided on the printed circuit board, the first connector It is electrically connected with the second connector through a cable. The second connector can be connected to the first pin of the device to be powered through a current flow channel penetrating the printed circuit board. When the current flow channel is perpendicular to the printed circuit board, the power supply module and the second connector can be arranged opposite to the device to be powered, so as to realize the vertical power supply of the device to be powered. Therefore, the power supply path is effectively shortened, which can simplify the design cost of the power supply path, and can also reduce the current loss in the process of powering the device to be powered by the power supply module. In addition, by adopting the technical solution, the increase in the number of layers of the printed circuit board can be effectively avoided, so that the cost of the printed circuit board can be effectively controlled.

In a possible implementation of the present invention, the power supply module has multiple power supply units, the device to be powered has multiple power supply units, and the power supply units are electrically connected to the power supply units in a one-to-one correspondence. Therefore, the power supply unit of the power supply module provides currents of corresponding voltages for the power supply units of the power supply devices to meet the requirements of the power supply devices for different power supply currents.

Description of the drawings

FIG. 1 is a schematic structural diagram of a single-board heat dissipation structure provided by an embodiment of the prior art;

2 is a schematic structural diagram of a single-board heat dissipation structure provided by an embodiment of the present invention;

3 is a schematic structural diagram of a single-board heat dissipation structure provided by another embodiment of the present invention;

Figure 4 is a top view of the liner provided in Figure 3;

5 is a schematic structural diagram of a single-board heat dissipation structure provided by another embodiment of the present invention;

Fig. 6 is a schematic structural diagram of a single-board heat dissipation structure provided by another embodiment of the present invention.

Detailed ways

In order to facilitate the understanding of the single-board heat dissipation structure provided by the embodiments of the present invention, the following first explains the application scenarios of the single-board heat dissipation structure provided by the embodiments of the present invention. The single-board heat dissipation structure can be installed in mobile phones, tablet computers, and handheld computers ( personal digital assistant, PDA) and other electronic devices. In order to realize the heat dissipation of the central processing unit (CPU), artificial intelligence (AI) processor, system on chip (SoC) or power management unit installed on the board. At the same time, the rationality of the layout of the components arranged on the single board is improved.

First, referring to Fig. 1, in an existing technical solution, when a single-board heat dissipation structure is specifically set, the single-board heat dissipation structure mainly includes a printed circuit board (PCB 01), and the components 02 arranged on the PCB 01, And the liner 03 used to support the PCB 01. Wherein, PCB 01 includes a first surface 011 and a second surface 012 that are arranged oppositely.

Due to some large-scale and powerful components 02, such as chips waiting for power supply, their required power consumption is relatively high, and some can even reach more than 300 watts. These components to be powered with higher power consumption also produce higher heat. In order not to affect their working performance, these components need to be dissipated. A common method is to provide a heat sink 04 on the device to be powered. In addition, when the power consumption of the device to be powered is large, the required power supply current is large, and the heat generation of the power supply module that provides this current is also high. Therefore, the power supply module also needs to be dissipated.

In order to achieve effective heat dissipation of components 02 such as power supply devices and power supply modules with higher heat generation, the heat sink 04 used is also larger in size and occupies more space. Due to the limitation of the installation space of the single-board heat dissipation structure in the electronic equipment, the components to be powered with the heat sink 04 and the power supply module 02 are all installed on the first side 011 of the PCB 01, and the lining board takes up a small space 03 is fixed on the second side 012 of PCB 01. In summary, it can be seen that the use of this technical solution will limit the number of components 02 that can be set on the first side 011 of the PCB 01, and the space on the second side 012 of the PCB 01 will not be fully utilized. . In order to solve the above-mentioned problems, the embodiment of the present invention provides a single-board heat dissipation structure. The specific arrangement of the single-board heat dissipation structure will be described in detail below with reference to the accompanying drawings, so as to facilitate the understanding of the single-board heat dissipation structure.

2, an embodiment of the present invention provides a single-board heat dissipation structure. The single-board heat dissipation structure mainly includes a PCB 1, a heating element 2 provided on the PCB 1, and a backing board 3. Among them, the heating element 2 can be arranged between the lining board 3 and the PCB 1. When the liner 3 is specifically arranged, a heat dissipation channel (not shown in the figure) is provided in the liner 3. The heat dissipation channel can be a liquid circulation channel or a gas circulation channel to pass liquid (for example, water) or gas (for example, air). The circulation in the heat dissipation channel realizes the heat dissipation of the heating element.

In addition, referring to FIG. 2, in the embodiment of the present invention, the projection area of the backing board 3 on the PCB 1 can be adjusted so that the backing board 3 can support the PCB 1, thereby preventing the PCB 1 from being used. Deformation occurs during the process, improving its structural stability. Moreover, when the area of the lining plate 3 is larger, the area of the heat dissipation channel provided on the lining plate 3 can also be larger. In this way, for the heating element 2 with a larger amount of heat, the heat dissipation requirements can be met to achieve the Effective heat dissipation of the heating element 2.

When connecting the lining board 3 with the PCB 1, the lining board 3 can be locked to the PCB 1 with fasteners 4 such as screws and bolts. The number of fasteners 4 can be determined according to the size of the lining board 3. For example, There are one, two or more, as long as the liner board 3 and the PCB 1 can be reliably connected. In this way, while fixing the lining board 3, the heating element 2 can also be squeezed onto the PCB 1 to realize the fixing of the heating element 2.

In addition, a thermal interface material (not shown in the figure) can also be arranged between the heating element 2 and the liner 3 to improve the efficiency of heat conduction between the heating element 2 and the heat dissipation channel of the liner 3, thereby improving the resistance to the heating element 2 The heat dissipation effect.

Continuing to refer to Figure 2, using this technical solution, a part of the heating element 2 is arranged between the backing board 3 and the PCB 1, so that the other side of the PCB 1 opposite to the backing board 3 can have more space for the memory 5. Components such as network cards, hard disks, and lights, so that the number of components that can be installed on the PCB 1 is larger, and the layout is more reasonable, so that the utilization of the space used to install the heat dissipation structure of the single board is improved. In addition, by adding components provided on the single-board heat dissipation structure, the single board including the single-board heat dissipation structure can achieve more functions.

3, in some embodiments of the present invention, a single-board heat dissipation structure is also provided. The single-board heat dissipation structure mainly includes a PCB 1, a heating element 2 disposed on the PCB 1, and a backing board 3. Among them, the heating element 2 can be arranged between the lining board 3 and the PCB 1.

When the liner 3 is specifically set, referring to FIG. 3, a receiving groove 31 is provided on the liner 3, and the receiving groove 31 is arranged opposite to the heating element 2, and the radiator element 6 is accommodated in the receiving groove 31. The radiator element 6 can be, but is not limited to, a vapor chamber (VC) or a heat pipe.

Continuing to refer to Fig. 3, it is also possible to adjust the projection area of the backing board 3 on the PCB 1, so that the backing board 3 can support the PCB 1, thereby avoiding the PCB 1 from being deformed during use, and improving its Structural stability. In addition, referring to Fig. 4, Fig. 4 is a top view of the liner 3 in Fig. 3, and the radiator element 6 provided on the liner 3 can also be extended to the boundary of the liner 3. In this way, when the area of the liner 3 is large , The heat dissipation area of the heat sink element 6 can be set to be larger, so that the heat dissipation requirements of the heat generating element 2 with a larger amount of heat can be met, so as to realize the effective heat dissipation of the heat generating element 2.

When fixing the lining board 3 to the PCB 1, refer to Fig. 3. The lining board 3 can be fixed to the PCB 1 with screws, bolts and other fasteners 4, but the number of fasteners 4 can be based on the size of the lining board 3. It is determined, for example, there can be one, two or more, as long as the backing board 3 and the PCB 1 can be reliably connected. In this way, while the lining board 3 is fixed, the heat sink element 6 can be attached to the heating element 2 to realize effective heat dissipation of the heating element 2. In order to improve the heat conduction efficiency between the heating element 2 and the heat dissipation channel of the lining plate 3, thereby enhancing the heat dissipation effect of the heating element 2, a thermal interface material can also be arranged between the heating element 2 and the heat sink 6.

Continuing to refer to FIG. 3, using the technical solution of the embodiment of the present utility model, a part of the heating element 2 is arranged between the backing board 3 and the PCB 1, so that the other side of the PCB 1 opposite to the backing board 3 can have more The space is used to set up components such as memory 5, network cards, hard disks, and lights, so that the number of components set on the PCB 1 is larger and the layout is more reasonable, so that the utilization of the space used for setting the PCB 1 is improved. In addition, by adding components provided on the single-board heat dissipation structure, the single board including the single-board heat dissipation structure can achieve more functions.

Since there may be multiple heating elements provided on the PCB 1, taking the chip as an example, the power supply module provided on the PCB 1 also needs to supply power for the chip during the working process. At present, when power is supplied to the chip through the power supply module, after the current comes out of the power supply module, it passes through the current routing in the PCB 1 and then enters the corresponding chip. For chips with higher power consumption, the required power supply current is larger. In this way, when supplying power to the chip through the power supply module, in order to meet the current flow requirements, it is necessary to arrange a wider trace in the PCB 1. Generally, the area of the single-layer structure of the PCB 1 is limited, which requires Set up a multilayer structure in the PCB 1 for wiring. As the number of layers of PCB 1 increases, its cost will rise sharply. Considering that the thickness of the traces set on each layer of PCB 1 is small, the traces between each layer need to pass through the layer structure. Punching holes for connection will lead to a large loss of voltage through the PCB 1.

In order to solve the above problem, referring to FIG. 5, in the single-board heat dissipation structure provided by the embodiment of the present invention, the device to be powered 21 and the power supply module 22 are separately arranged on the first surface 11 and the second surface 12 of the PCB 1. Taking the device 21 to be powered on the first side 11 and the power supply module 22 on the second side 12 as an example, when the device 21 to be powered is specifically installed, the device 21 to be powered is provided on the first side of the backing board 3 and the PCB 1 Between 11. The device 21 to be powered has a first pin 211, the first side 11 of the PCB 1 has a first pad (not shown in the figure), and the device 21 to be powered can pass through the first pin 211 and the first pad. The welding is fixed on the first side 11 of the PCB 1. In addition, the lining board 3 may be provided with a heat dissipation channel, or an accommodating groove may be arranged at the position of the lining board 3 corresponding to the device 21 to be powered, and the heat sink is accommodated in the accommodating groove, so as to realize the device to be powered. 21's heat dissipation.

5, when the power supply module 22 is specifically set, the power supply module 22 has a second pin 221, the second side 12 of the PCB 1 has a second pad (not shown in the figure), and the power supply module 22 can pass through the second pin 221. The two pins 221 and the second pad are welded and fixed on the second surface 12 of the PCB 1.

In addition, referring to FIG. 5, a current flow channel 13 may also be provided on the PCB 1, and the second pin 221 of the power supply module 22 and the first pin 211 of the device to be powered 21 can be electrically connected through the current flow channel 13. Wherein, the current flow channel 13 can be, but is not limited to, a copper pillar, a via hole or a metal trace penetrating through the PCB 1. In this way, when power is supplied to the device 21 to be powered through the power supply module 22, the current provided by the power supply module 22 can enter the current flow channel 13 through the second pin 221, and enter the first pin 211 through the current flow channel 13 to enter the power supply.装置21。 Device 21.

It is understandable that the power supply module 22 can also be arranged between the backing board 3 and the PCB 1, and the device to be powered 21 is arranged on the other side of the PCB 1. It is similar to the arrangement in which the device 21 to be powered is arranged on the first surface 11 and the power supply module 22 is arranged on the second surface 12, and will not be repeated here.

In some embodiments, the same device 21 to be powered may have multiple units to be powered with different current requirements. In this way, the power supply module 22 can have multiple power supply units so that the power supply units are electrically connected to the corresponding units to be powered. Thus, the power supply module 22 provides currents of different voltages for the device 21 to be powered.

Continuing to refer to FIG. 5, the current flow channel 13 can also be arranged perpendicular to the PCB 1, and in addition, the power supply module 22 can also be arranged opposite to the device 21 to be powered. By adopting the technical solution of the embodiment of the present utility model, by arranging the power supply module 22 and the device 21 to be powered oppositely, and electrically connecting the two through the current flow channel 13 perpendicular to the PCB 1, the power supply module 22 can realize the device 21 to be powered. The vertical power supply can effectively shorten the power supply path, which can simplify the design cost of the power supply path, and can also reduce the current loss in the process of powering the device 21 to be powered by the power supply module 22. In addition, the adoption of this technical solution can also effectively avoid the increase in the number of layers of the PCB 1, so that the cost of the PCB 1 can be effectively controlled.

In addition, referring to FIG. 6, the power supply module 22 may also be provided with a first connector 222, and the power supply device further includes a second connector 7 provided on the PCB 1, and the first connector 222 is connected to the second connector 7 through the cable 8. Electric connection. The second connector 7 is electrically connected to the current flow channel 13. In this way, the current output from the power supply module 22 can enter the second connector 7 through the first connector 222 and the cable 8; then, after reaching the first pin 211 through the current flow channel 13, enters the device to be powered 21, and enters The device 21 to be powered is completed to supply power to the device 21 to be powered. In the embodiment shown in FIG. 6, both the second connector 7 and the power supply module 22 can be arranged opposite to the device 21 to be powered. In this way, when the current flow channel 13 and the PCB 1 are arranged perpendicularly, the power supply module 22 can be realized. And the second connector 7 provides vertical power supply to the device 21 to be powered, thereby effectively shortening the power supply path, which can simplify the design cost of the power supply path, and can also reduce the current loss in the process of powering the device 21 to be powered by the power supply module 22. In addition, the adoption of this technical solution can also effectively avoid the increase in the number of layers of the PCB 1, so that the cost of the PCB 1 can be effectively controlled.

In some embodiments of the present application, the power supply module 22 has multiple power supply units, and the device to be powered 21 has multiple power supply units. At this time, the power supply units and the power supply units can be electrically connected in a one-to-one correspondence. In this way, the power supply unit of the power supply module 22 provides a current of a corresponding voltage for the power supply unit of the power supply device 21 to meet the requirements of the power supply device 21 for different power supply currents. It can be understood that some power supply units may be connected to the first connector 222 and the second connector 7 can be used to supply power to the corresponding unit to be powered.

The above are only specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present utility model. All should be covered within the scope of protection of this utility model. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

A single-board heat dissipation structure, which is characterized by comprising a printed circuit board, a first heating element and a backing board arranged on the printed circuit board, wherein:

The printed circuit board includes a first surface and a second surface that are opposed to each other;

The first heating element is arranged between the liner and the first surface of the printed circuit board;

The backing board is fixedly connected to the printed circuit board, the backing board has a heat dissipation structure, and the first heating element is in contact with the heat dissipation structure.
The single-board heat dissipation structure according to claim 1, wherein the heat dissipation structure is a heat dissipation channel provided on the liner.
The single-board heat dissipation structure according to claim 2, wherein the heat dissipation channel is a liquid circulation channel or a gas circulation channel.
The single-board heat dissipation structure according to claim 1, wherein the liner has a containing groove, and the containing groove is disposed opposite to the heating element; the heat dissipation structure is a heat sink, and the heat sink Is accommodated in the accommodating groove.
The single-board heat dissipation structure according to any one of claims 1 to 4, wherein the first heating element and the heat dissipation structure are in contact with each other through a thermal interface material.
The single-board heat dissipation structure according to any one of claims 1 to 5, wherein the single-board heat dissipation structure further comprises a second heating element, the second heating element is a power supply module, and the power supply module is disposed at The second side;

The first heating element is a device to be powered, and the device to be powered is electrically connected to the power supply module.
7. The single-board heat dissipation structure according to claim 6, wherein the printed circuit board further has a current flow channel, and the power supply module and the device to be powered are electrically connected through the current flow channel.
8. The single-board heat dissipation structure according to claim 7, wherein the current flow channel is a copper pillar, a via hole or a metal trace that penetrates the printed circuit board.
8. The single-board heat dissipation structure according to claim 7 or 8, wherein the current flow channel is arranged perpendicular to the printed circuit board.
The single-board heat dissipation structure according to any one of claims 6 to 9, wherein the device to be powered has a first pin, the first surface has a first pad, and the device to be powered passes through the The first pin and the first pad are welded and fixed on the first surface.
The single-board heat dissipation structure according to any one of claims 6 to 10, wherein the power supply module has a second pin, the first surface has a second pad, and the power supply module passes through the first The two pins and the second pad are welded and fixed on the first surface.
The single-board heat dissipation structure according to any one of claims 7-9, wherein the power supply module includes a first connector, a second connector is provided on the printed circuit board, and the first connector The second connector is electrically connected to the second connector through a cable; the second connector is electrically connected to the device to be powered through the current flow channel.