WO2021103848A1 - Structure de dissipation de chaleur à une seule carte - Google Patents

Structure de dissipation de chaleur à une seule carte Download PDF

Info

Publication number
WO2021103848A1
WO2021103848A1 PCT/CN2020/121798 CN2020121798W WO2021103848A1 WO 2021103848 A1 WO2021103848 A1 WO 2021103848A1 CN 2020121798 W CN2020121798 W CN 2020121798W WO 2021103848 A1 WO2021103848 A1 WO 2021103848A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
board
dissipation structure
power supply
printed circuit
Prior art date
Application number
PCT/CN2020/121798
Other languages
English (en)
Chinese (zh)
Inventor
邓治高
刘伟
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021103848A1 publication Critical patent/WO2021103848A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the utility model relates to the technical field of heat dissipation, in particular to a single board heat dissipation structure.
  • the power consumption of the chip becomes higher and higher, and the power consumption of some single chips has reached several hundred watts. These chips with higher power consumption also produce higher heat. In order not to affect their working performance, these chips need to be dissipated. In addition, when the power consumption of the chip is large, the power supply current required by the chip is large, and the power supply module that provides this current has a high heat output. Therefore, the power supply module also needs to dissipate heat.
  • a heat sink is usually provided on the corresponding heating element.
  • most of the power supply modules and chips with heat sink are arranged on the same side of the printed circuit board (PCB) of the single board, which will result in insufficient use of the space of the PCB.
  • the technical scheme of the utility model provides a single-board heat dissipation structure, so that the space utilization rate of the single-board is improved.
  • the technical solution of the utility model provides a single-board heat dissipation structure.
  • the single-board heat dissipation structure mainly includes a printed circuit board, a first heating element arranged on the printed circuit board, and a backing board. One side and the second side; the first heating element is arranged between the lining board and the first surface of the printed circuit board; the lining board is fixedly connected with the printed circuit board, and the lining board has a heat dissipation structure.
  • the backing plate plays a role of supporting the printed circuit board to avoid deformation of the printed circuit board during use, thereby improving its structural stability, while also realizing The heat dissipation function of the first heating element.
  • the components arranged on the second side of the printed circuit board can be added, so that it can meet more functional requirements.
  • the heat dissipation structure of the liner when the heat dissipation structure of the liner is specifically arranged, the heat dissipation structure may be a heat dissipation channel provided on the liner. In order to improve the effectiveness of the lining plate for heat dissipation of the first heating element, the heat dissipation channel can be spread over the entire lining plate.
  • the heat dissipation channel may be a gas circulation channel or a liquid circulation channel, so that the circulation of gas or liquid in the heat dissipation channel realizes the heat dissipation of the first heating element.
  • the lining plate may also be provided with a containing groove, the containing groove is arranged opposite to the first heating element, and the heat dissipation structure is a heat equalizing plate or Radiator components such as heat pipes.
  • the heat sink can be closely attached to the first heating element, so that the heat sink can dissipate heat from the first heating element.
  • the size of the projection area of the liner on the printed circuit board can also be adjusted to enable the liner to support the printed circuit board, thereby avoiding the printed circuit board from being deformed during use, and improving its Structural stability.
  • the area of the lining board is larger, the area of the heat dissipation structure provided on the lining board can also be larger. In this way, for the first heating element with a larger amount of heat, the heat dissipation requirements can be met, so as to realize the Effective heat dissipation of a heating element.
  • a thermal interface material can also be arranged between the first heating element and the lining plate to improve the heat conduction efficiency between the heating element and the heat dissipation structure of the lining plate, thereby enhancing the heat transfer to the first heating element.
  • the heat dissipation effect of the component can also be arranged between the first heating element and the lining plate to improve the heat conduction efficiency between the heating element and the heat dissipation structure of the lining plate, thereby enhancing the heat transfer to the first heating element.
  • the single-board heat dissipation structure may further include a second heating element, the second heating element is a power supply module, and the power supply module is arranged on the second side of the printed circuit board; the first heating element is a standby
  • the power supply device is electrically connected to the power supply module. When power is supplied to the device to be powered through the power supply module, the current provided by the power supply module can enter the device to be powered after passing through the printed circuit board.
  • the device to be powered when the device to be powered is arranged on the printed circuit board, the device to be powered has a first pin, the first side of the printed circuit board has a first pad, and the device to be powered can pass through The first pin and the first pad are welded and fixed on the first surface of the printed circuit board.
  • the power supply module when the power supply module is specifically set, the power supply module has a second pin, the second side of the printed circuit board has a second pad, and the power supply module can communicate with the first pin through the second pin.
  • the welding of the two pads is fixed on the second surface of the printed circuit board.
  • the current flow channel may be, but is not limited to, a copper pillar, a via hole or a metal trace that penetrates the printed circuit board.
  • the current flow channel can also be arranged perpendicular to the printed circuit board, and in addition, the power supply module can be arranged opposite to the device to be powered.
  • the power supply module can achieve vertical power supply to the device to be powered, thereby effectively shortening the power supply path and reducing voltage loss.
  • the increase in the number of layers of the printed circuit board can be effectively avoided, so that the cost of the printed circuit board can be effectively controlled.
  • the power supply module when the power supply module is specifically set, the power supply module may also be provided with a first connector, and the power supply device further includes a second connector provided on the printed circuit board, the first connector It is electrically connected with the second connector through a cable.
  • the second connector can be connected to the first pin of the device to be powered through a current flow channel penetrating the printed circuit board.
  • the power supply module and the second connector can be arranged opposite to the device to be powered, so as to realize the vertical power supply of the device to be powered.
  • the power supply path is effectively shortened, which can simplify the design cost of the power supply path, and can also reduce the current loss in the process of powering the device to be powered by the power supply module.
  • the increase in the number of layers of the printed circuit board can be effectively avoided, so that the cost of the printed circuit board can be effectively controlled.
  • the power supply module has multiple power supply units
  • the device to be powered has multiple power supply units
  • the power supply units are electrically connected to the power supply units in a one-to-one correspondence. Therefore, the power supply unit of the power supply module provides currents of corresponding voltages for the power supply units of the power supply devices to meet the requirements of the power supply devices for different power supply currents.
  • FIG. 1 is a schematic structural diagram of a single-board heat dissipation structure provided by an embodiment of the prior art
  • FIG. 2 is a schematic structural diagram of a single-board heat dissipation structure provided by an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a single-board heat dissipation structure provided by another embodiment of the present invention.
  • Figure 4 is a top view of the liner provided in Figure 3;
  • FIG. 5 is a schematic structural diagram of a single-board heat dissipation structure provided by another embodiment of the present invention.
  • Fig. 6 is a schematic structural diagram of a single-board heat dissipation structure provided by another embodiment of the present invention.
  • the single-board heat dissipation structure can be installed in mobile phones, tablet computers, and handheld computers ( personal digital assistant, PDA) and other electronic devices.
  • PDA personal digital assistant
  • the single-board heat dissipation structure can be installed in mobile phones, tablet computers, and handheld computers ( personal digital assistant, PDA) and other electronic devices.
  • PDA personal digital assistant
  • AI artificial intelligence
  • SoC system on chip
  • power management unit installed on the board.
  • the rationality of the layout of the components arranged on the single board is improved.
  • the single-board heat dissipation structure mainly includes a printed circuit board (PCB 01), and the components 02 arranged on the PCB 01, And the liner 03 used to support the PCB 01.
  • PCB 01 includes a first surface 011 and a second surface 012 that are arranged oppositely.
  • the heat sink 04 used is also larger in size and occupies more space. Due to the limitation of the installation space of the single-board heat dissipation structure in the electronic equipment, the components to be powered with the heat sink 04 and the power supply module 02 are all installed on the first side 011 of the PCB 01, and the lining board takes up a small space 03 is fixed on the second side 012 of PCB 01. In summary, it can be seen that the use of this technical solution will limit the number of components 02 that can be set on the first side 011 of the PCB 01, and the space on the second side 012 of the PCB 01 will not be fully utilized. .
  • the embodiment of the present invention provides a single-board heat dissipation structure.
  • the specific arrangement of the single-board heat dissipation structure will be described in detail below with reference to the accompanying drawings, so as to facilitate the understanding of the single-board heat dissipation structure.
  • an embodiment of the present invention provides a single-board heat dissipation structure.
  • the single-board heat dissipation structure mainly includes a PCB 1, a heating element 2 provided on the PCB 1, and a backing board 3. Among them, the heating element 2 can be arranged between the lining board 3 and the PCB 1.
  • a heat dissipation channel (not shown in the figure) is provided in the liner 3.
  • the heat dissipation channel can be a liquid circulation channel or a gas circulation channel to pass liquid (for example, water) or gas (for example, air). The circulation in the heat dissipation channel realizes the heat dissipation of the heating element.
  • the projection area of the backing board 3 on the PCB 1 can be adjusted so that the backing board 3 can support the PCB 1, thereby preventing the PCB 1 from being used. Deformation occurs during the process, improving its structural stability.
  • the area of the lining plate 3 is larger, the area of the heat dissipation channel provided on the lining plate 3 can also be larger. In this way, for the heating element 2 with a larger amount of heat, the heat dissipation requirements can be met to achieve the Effective heat dissipation of the heating element 2.
  • the lining board 3 When connecting the lining board 3 with the PCB 1, the lining board 3 can be locked to the PCB 1 with fasteners 4 such as screws and bolts.
  • the number of fasteners 4 can be determined according to the size of the lining board 3. For example, There are one, two or more, as long as the liner board 3 and the PCB 1 can be reliably connected. In this way, while fixing the lining board 3, the heating element 2 can also be squeezed onto the PCB 1 to realize the fixing of the heating element 2.
  • a thermal interface material (not shown in the figure) can also be arranged between the heating element 2 and the liner 3 to improve the efficiency of heat conduction between the heating element 2 and the heat dissipation channel of the liner 3, thereby improving the resistance to the heating element 2 The heat dissipation effect.
  • a part of the heating element 2 is arranged between the backing board 3 and the PCB 1, so that the other side of the PCB 1 opposite to the backing board 3 can have more space for the memory 5.
  • Components such as network cards, hard disks, and lights, so that the number of components that can be installed on the PCB 1 is larger, and the layout is more reasonable, so that the utilization of the space used to install the heat dissipation structure of the single board is improved.
  • the single board including the single-board heat dissipation structure can achieve more functions.
  • a single-board heat dissipation structure mainly includes a PCB 1, a heating element 2 disposed on the PCB 1, and a backing board 3. Among them, the heating element 2 can be arranged between the lining board 3 and the PCB 1.
  • a receiving groove 31 is provided on the liner 3, and the receiving groove 31 is arranged opposite to the heating element 2, and the radiator element 6 is accommodated in the receiving groove 31.
  • the radiator element 6 can be, but is not limited to, a vapor chamber (VC) or a heat pipe.
  • Fig. 4 is a top view of the liner 3 in Fig. 3, and the radiator element 6 provided on the liner 3 can also be extended to the boundary of the liner 3.
  • the heat dissipation area of the heat sink element 6 can be set to be larger, so that the heat dissipation requirements of the heat generating element 2 with a larger amount of heat can be met, so as to realize the effective heat dissipation of the heat generating element 2.
  • the lining board 3 can be fixed to the PCB 1 with screws, bolts and other fasteners 4, but the number of fasteners 4 can be based on the size of the lining board 3. It is determined, for example, there can be one, two or more, as long as the backing board 3 and the PCB 1 can be reliably connected. In this way, while the lining board 3 is fixed, the heat sink element 6 can be attached to the heating element 2 to realize effective heat dissipation of the heating element 2.
  • a thermal interface material can also be arranged between the heating element 2 and the heat sink 6.
  • a part of the heating element 2 is arranged between the backing board 3 and the PCB 1, so that the other side of the PCB 1 opposite to the backing board 3 can have more
  • the space is used to set up components such as memory 5, network cards, hard disks, and lights, so that the number of components set on the PCB 1 is larger and the layout is more reasonable, so that the utilization of the space used for setting the PCB 1 is improved.
  • the single board including the single-board heat dissipation structure can achieve more functions.
  • the power supply module provided on the PCB 1 also needs to supply power for the chip during the working process.
  • the power supply module when power is supplied to the chip through the power supply module, after the current comes out of the power supply module, it passes through the current routing in the PCB 1 and then enters the corresponding chip.
  • the required power supply current is larger.
  • the area of the single-layer structure of the PCB 1 is limited, which requires Set up a multilayer structure in the PCB 1 for wiring.
  • the device to be powered 21 and the power supply module 22 are separately arranged on the first surface 11 and the second surface 12 of the PCB 1.
  • the device 21 to be powered is provided on the first side of the backing board 3 and the PCB 1 Between 11.
  • the device 21 to be powered has a first pin 211, the first side 11 of the PCB 1 has a first pad (not shown in the figure), and the device 21 to be powered can pass through the first pin 211 and the first pad.
  • the lining board 3 may be provided with a heat dissipation channel, or an accommodating groove may be arranged at the position of the lining board 3 corresponding to the device 21 to be powered, and the heat sink is accommodated in the accommodating groove, so as to realize the device to be powered. 21's heat dissipation.
  • the power supply module 22 when the power supply module 22 is specifically set, the power supply module 22 has a second pin 221, the second side 12 of the PCB 1 has a second pad (not shown in the figure), and the power supply module 22 can pass through the second pin 221.
  • the two pins 221 and the second pad are welded and fixed on the second surface 12 of the PCB 1.
  • a current flow channel 13 may also be provided on the PCB 1, and the second pin 221 of the power supply module 22 and the first pin 211 of the device to be powered 21 can be electrically connected through the current flow channel 13.
  • the current flow channel 13 can be, but is not limited to, a copper pillar, a via hole or a metal trace penetrating through the PCB 1.
  • the power supply module 22 can also be arranged between the backing board 3 and the PCB 1, and the device to be powered 21 is arranged on the other side of the PCB 1. It is similar to the arrangement in which the device 21 to be powered is arranged on the first surface 11 and the power supply module 22 is arranged on the second surface 12, and will not be repeated here.
  • the same device 21 to be powered may have multiple units to be powered with different current requirements.
  • the power supply module 22 can have multiple power supply units so that the power supply units are electrically connected to the corresponding units to be powered.
  • the power supply module 22 provides currents of different voltages for the device 21 to be powered.
  • the current flow channel 13 can also be arranged perpendicular to the PCB 1, and in addition, the power supply module 22 can also be arranged opposite to the device 21 to be powered.
  • the power supply module 22 can realize the device 21 to be powered.
  • the vertical power supply can effectively shorten the power supply path, which can simplify the design cost of the power supply path, and can also reduce the current loss in the process of powering the device 21 to be powered by the power supply module 22.
  • the adoption of this technical solution can also effectively avoid the increase in the number of layers of the PCB 1, so that the cost of the PCB 1 can be effectively controlled.
  • the power supply module 22 may also be provided with a first connector 222, and the power supply device further includes a second connector 7 provided on the PCB 1, and the first connector 222 is connected to the second connector 7 through the cable 8. Electric connection.
  • the second connector 7 is electrically connected to the current flow channel 13. In this way, the current output from the power supply module 22 can enter the second connector 7 through the first connector 222 and the cable 8; then, after reaching the first pin 211 through the current flow channel 13, enters the device to be powered 21, and enters The device 21 to be powered is completed to supply power to the device 21 to be powered.
  • both the second connector 7 and the power supply module 22 can be arranged opposite to the device 21 to be powered.
  • the power supply module 22 can be realized.
  • the second connector 7 provides vertical power supply to the device 21 to be powered, thereby effectively shortening the power supply path, which can simplify the design cost of the power supply path, and can also reduce the current loss in the process of powering the device 21 to be powered by the power supply module 22.
  • the adoption of this technical solution can also effectively avoid the increase in the number of layers of the PCB 1, so that the cost of the PCB 1 can be effectively controlled.
  • the power supply module 22 has multiple power supply units, and the device to be powered 21 has multiple power supply units. At this time, the power supply units and the power supply units can be electrically connected in a one-to-one correspondence. In this way, the power supply unit of the power supply module 22 provides a current of a corresponding voltage for the power supply unit of the power supply device 21 to meet the requirements of the power supply device 21 for different power supply currents. It can be understood that some power supply units may be connected to the first connector 222 and the second connector 7 can be used to supply power to the corresponding unit to be powered.

Abstract

La présente invention concerne un modèle d'utilité comprenant une structure de dissipation de chaleur à une seule carte et concerne le domaine technique de la dissipation de la chaleur. La structure de dissipation de chaleur à une seule carte comprend une carte de circuit imprimé, un premier élément chauffant disposé sur la carte de circuit imprimé et une plaque de revêtement. La carte de circuit imprimé comprend une première face et une seconde face disposées à l'opposé l'une de l'autre ; le premier élément chauffant est disposé entre la plaque de revêtement et la première face de la carte de circuit imprimé ; la plaque de revêtement est reliée de manière fixe à la carte de circuit imprimé et la plaque de revêtement a une structure de dissipation de chaleur. En fournissant une partie de l'élément chauffant entre la plaque de revêtement et la première face de la carte de circuit imprimé, il y a plus d'espace sur la seconde face de la carte de circuit imprimé pour l'agencement de composants tels qu'une mémoire, une carte réseau, un disque dur, et une lampe, de telle sorte que la disposition des composants disposés sur la carte de circuit imprimé est rationnelle, ce qui permet d'améliorer le taux d'utilisation de l'espace sur lequel la carte de circuit imprimé est fournie.
PCT/CN2020/121798 2019-11-29 2020-10-19 Structure de dissipation de chaleur à une seule carte WO2021103848A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201922127932.3 2019-11-29
CN201922127932.3U CN212519534U (zh) 2019-11-29 2019-11-29 一种单板散热结构

Publications (1)

Publication Number Publication Date
WO2021103848A1 true WO2021103848A1 (fr) 2021-06-03

Family

ID=74385680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/121798 WO2021103848A1 (fr) 2019-11-29 2020-10-19 Structure de dissipation de chaleur à une seule carte

Country Status (2)

Country Link
CN (1) CN212519534U (fr)
WO (1) WO2021103848A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5379187A (en) * 1993-03-25 1995-01-03 Vlsi Technology, Inc. Design for encapsulation of thermally enhanced integrated circuits
US6414847B1 (en) * 2001-04-09 2002-07-02 Agilent Technologies, Inc. Integral dielectric heatspreader
CN201213344Y (zh) * 2008-06-12 2009-03-25 中兴通讯股份有限公司 子印制线路板散热器的固定装置
CN206042635U (zh) * 2016-08-08 2017-03-22 昆山莹帆精密五金有限公司 一种芯片散热器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5379187A (en) * 1993-03-25 1995-01-03 Vlsi Technology, Inc. Design for encapsulation of thermally enhanced integrated circuits
US6414847B1 (en) * 2001-04-09 2002-07-02 Agilent Technologies, Inc. Integral dielectric heatspreader
CN201213344Y (zh) * 2008-06-12 2009-03-25 中兴通讯股份有限公司 子印制线路板散热器的固定装置
CN206042635U (zh) * 2016-08-08 2017-03-22 昆山莹帆精密五金有限公司 一种芯片散热器

Also Published As

Publication number Publication date
CN212519534U (zh) 2021-02-09

Similar Documents

Publication Publication Date Title
JP4598614B2 (ja) ソケット及び電子機器
US20050083660A1 (en) Power supply without cooling fan
JPH04330745A (ja) 可撓性相互接続モジュール
CN101221588B (zh) 一种pcb设计中的散热设计方法
TW201701115A (zh) 用於晶片供電的組裝結構、電子設備
US20050207115A1 (en) Heat dissipating arrangement
JP2015500569A (ja) 集積回路（ｉｃ）チップのための放熱構造の設計
CN111065199A (zh) 一种供电装置及单板
TW200428924A (en) Functional module having built-in heat dissipation fins
CN112954949A (zh) 网络设备电源及用于网络设备电源的散热系统
US20100020505A1 (en) Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution
WO2021103848A1 (fr) Structure de dissipation de chaleur à une seule carte
TWI522032B (zh) 散熱模組
CN209402925U (zh) 一种pcb板的双面散热装置
CN201733513U (zh) 一种印制板散热装置
JP2016071269A (ja) 電子機器、及びシステム
TW201944880A (zh) 電子設備的主機板散熱系統
US20170147044A1 (en) Mezzanine filler module apparatuses and methods for computing devices
CN215526589U (zh) 一种无风扇工控机的加速散热结构
CN220456400U (zh) 一种运算装置和散热装置
CN108135075A (zh) 一种高导热印制电路板
CN217563836U (zh) 单面镀金pcb线路板
CN109152195A (zh) 一种自具散热功能的车载多媒体电子系统
CN216146509U (zh) 一种便于通风散热的pcb线路板
TWM243001U (en) Heat dissipation

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20894082

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20894082

Country of ref document: EP

Kind code of ref document: A1