CN101221588B - 一种pcb设计中的散热设计方法 - Google Patents
一种pcb设计中的散热设计方法 Download PDFInfo
- Publication number
- CN101221588B CN101221588B CN2007100362799A CN200710036279A CN101221588B CN 101221588 B CN101221588 B CN 101221588B CN 2007100362799 A CN2007100362799 A CN 2007100362799A CN 200710036279 A CN200710036279 A CN 200710036279A CN 101221588 B CN101221588 B CN 101221588B
- Authority
- CN
- China
- Prior art keywords
- pcb
- chip
- design
- heat dissipation
- thermal resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100362799A CN101221588B (zh) | 2007-01-09 | 2007-01-09 | 一种pcb设计中的散热设计方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100362799A CN101221588B (zh) | 2007-01-09 | 2007-01-09 | 一种pcb设计中的散热设计方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101221588A CN101221588A (zh) | 2008-07-16 |
CN101221588B true CN101221588B (zh) | 2011-01-26 |
Family
ID=39631427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100362799A Expired - Fee Related CN101221588B (zh) | 2007-01-09 | 2007-01-09 | 一种pcb设计中的散热设计方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101221588B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102333414B (zh) * | 2011-09-02 | 2014-03-12 | 深圳创动科技有限公司 | 一种散热结构及其制作方法、具有散热结构的电子设备 |
CN103512013A (zh) * | 2012-06-18 | 2014-01-15 | 金健 | 一种led灯发光ic片散热方法 |
CN104424374B (zh) * | 2013-09-05 | 2018-12-11 | 北京宝沃汽车有限公司 | 电路板的热仿真模型的标定方法及系统 |
JP6345930B2 (ja) * | 2013-12-26 | 2018-06-20 | ローム株式会社 | 半導体装置およびその設計方法 |
TWI560565B (en) * | 2015-11-30 | 2016-12-01 | Ind Tech Res Inst | Thermal simulation device and method |
CN108882280B (zh) * | 2017-05-15 | 2020-12-04 | 大唐移动通信设备有限公司 | 一种基站的热设计评估方法和装置 |
CN109089374A (zh) * | 2018-09-10 | 2018-12-25 | 北京四方继保自动化股份有限公司 | 一种pcb电路板局部散热方法 |
CN109614648A (zh) * | 2018-11-09 | 2019-04-12 | 中国航空无线电电子研究所 | 一种pcb板上发热器件布局方法 |
CN111725163A (zh) * | 2020-06-23 | 2020-09-29 | 扬州通信设备有限公司 | 一种降低热阻抗的电子开关安装方法 |
CN113075979B (zh) * | 2021-03-26 | 2022-12-23 | 山东英信计算机技术有限公司 | 一种使用pcb散热的传导结构及实现方法 |
CN114527847A (zh) * | 2022-02-11 | 2022-05-24 | 北京微焓科技有限公司 | 散热装置的设计方法、散热装置及散热装置的制造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1167934A (zh) * | 1996-01-30 | 1997-12-17 | 三星电子株式会社 | 表面补充散热装置 |
US6238086B1 (en) * | 1998-02-02 | 2001-05-29 | Nec Corporation | Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins |
CN1470866A (zh) * | 2002-07-23 | 2004-01-28 | 华为技术有限公司 | 一种热测试装置及其测试方法 |
CN2724361Y (zh) * | 2004-09-01 | 2005-09-07 | 系通电讯设备(上海)有限公司 | 印刷电路板 |
CN1728377A (zh) * | 2005-07-01 | 2006-02-01 | 威盛电子股份有限公司 | 具有改善散热结构的封装基板及电子装置 |
-
2007
- 2007-01-09 CN CN2007100362799A patent/CN101221588B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1167934A (zh) * | 1996-01-30 | 1997-12-17 | 三星电子株式会社 | 表面补充散热装置 |
US6238086B1 (en) * | 1998-02-02 | 2001-05-29 | Nec Corporation | Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins |
CN1470866A (zh) * | 2002-07-23 | 2004-01-28 | 华为技术有限公司 | 一种热测试装置及其测试方法 |
CN2724361Y (zh) * | 2004-09-01 | 2005-09-07 | 系通电讯设备(上海)有限公司 | 印刷电路板 |
CN1728377A (zh) * | 2005-07-01 | 2006-02-01 | 威盛电子股份有限公司 | 具有改善散热结构的封装基板及电子装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101221588A (zh) | 2008-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101221588B (zh) | 一种pcb设计中的散热设计方法 | |
CN105188260B (zh) | 印制电路板内嵌流道液冷换热装置 | |
CN103021877B (zh) | 一种采用双路径传热的高密度芯片散热方法 | |
CN203748105U (zh) | 一种双面线路板 | |
CN103687450A (zh) | 用于机载航空产品的线路板热传导优化设计结构 | |
CN107871723A (zh) | 一种预埋热管的散热板及其应用于电子设备的方法 | |
CN201733513U (zh) | 一种印制板散热装置 | |
CN111370378B (zh) | 一种芯片散热器 | |
US20100020505A1 (en) | Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution | |
CN203605189U (zh) | 一种适用于led灯具和背光模块的一体化散热结构 | |
CN207491300U (zh) | 一种环氧丙烯酸树脂混合线路板 | |
CN108112165B (zh) | 一种电源过孔结构及电源过孔摆放设计方法 | |
CN109152310A (zh) | 一种多圆弧微通道散热装置 | |
CN201064074Y (zh) | 一种热管散热器 | |
CN2629393Y (zh) | 一种模块电源 | |
CN209497788U (zh) | 一种多圆弧微通道散热装置 | |
CN201298958Y (zh) | 一种带散热过孔的mosfet焊盘设计的电路板 | |
CN110062555A (zh) | 散热模块及光模块 | |
CN210381441U (zh) | 一种耐高温电路板 | |
CN208538821U (zh) | 一种小型化封装散热装置 | |
CN209151416U (zh) | 带散热片的铝基板和数据处理设备 | |
Zhu et al. | Thermal Analysis and Design of GaN Device of Energy Storage Converter Based on Icepak | |
CN203131523U (zh) | 一种带有导热柱的led光源模组 | |
CN205789941U (zh) | 一种集成散热器的功率模块 | |
CN202697133U (zh) | 一种元器件散热结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: KUNSHAN JADE TECHNOLOGIES CO., LTD. Free format text: FORMER OWNER: SHANGHAI JADE TECHNOLOGIES CO., LTD. Effective date: 20100719 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 BUILDING 16, NO.115, LANE 572, BIBO ROAD, PUDONG NEW AREA, SHANGHAI CITY TO: 215311 TOWER ABCD, 12/F, SOUTH BUILDING, KUNSHANPUDONG SOFTWARE PARK, BACHENG TOWN, KUNSHAN CITY |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20100719 Address after: A ABCD 12 layer 215311 town Kunshan city Kunshan Pudong Software Park South Applicant after: Shanghai Jade Technologies Co., Ltd. Address before: 201203 Building No. 115, No. 572, Lane 16, blue wave road, Shanghai, Pudong New Area Applicant before: Shanghai Jiede Microelectronic Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110126 Termination date: 20130109 |
|
CF01 | Termination of patent right due to non-payment of annual fee |