M243001 五、創作說明 【新型所 本創 尤其是電 先前技 電腦 元器件温 中央處 裝置以確 目前 聲片和風 理器上。 熱效果。 [新型内 本創 熱部件的 (1) 屬之技 作涉及 腦的元 術】 内部的 度升高 理器工 保元器 所使用 扇作為 散熱片 容】 作的目的是提供一種利用熱管、 散熱裝置，為中央處理器提供了 術領域】 一種散熱裝 器件的散熱 電子元器件 ，對元器件 作時的溫度 件在適當的 的絕大多數 散熱部件， 的不同位置 置’特別涉及 裝置。 在工作時通常 的正常工作會 特別高。因此 溫度下正常工 pc機的中央處 且將散熱部件 有溫差，散熱 一種電子元器件 會產生 產生影 ，必須 作。 理器均 直接裝 不均勻 熱量，使 響。其中 安裝散熱 只採用散 在中央處 ，影響散 散熱鰭 更好的 片組成散 散熱條件 為了達到上述的目的，本創作的技術方案如下： 一種散熱裝置，包括與元器件接觸的散熱板和傳遞熱 量的多個散熱鰭片，還包括至少一個熱管；所述的散熱板 上與多個散熱鰭片結合的端面上設有至少一個容槽，熱管 埋在容槽中；所述的熱管與多個散熱鰭片均接觸。 在本創作的較佳方案中，所述的熱管通過焊接或導熱 膠或導熱樹脂埋在容槽中。 所述的散熱鰭片通過焊接或導熱膠或導熱樹脂與散熱 M243001 五、創作說明（2) 板及熱管連接。 由於採用上述的方案，提供了一種全新結構的散熱裝 置，熱管的熱傳導率是純銅的6 〇 〇多倍，傳熱迅速，利用 熱管將元器件產生的熱量迅速傳奚散熱板各處，保證散熱 板各處溫度均勻，這樣，不同位置的散熱板及散熱鰭片溫 差小，散熱均勻，效果好。 為使能更進一步瞭解本創作之特徵及技術内容，請參 閱以下有關本創作之詳細說明與附圖，然而所附圖式僅提 供參考與說明用，並非用來對本創作加以限制者。 【實施方式】 下面結合附圖和實施例對本創作作進一步詳細的說明 ^ 如第一圖所示，一種散熱裝置，包括與元器件接觸的 散熱板1、傳遞熱量的多個散熱鰭片2和三個熱管3 ;散熱 板^上與多個散熱鰭片2結合的端面11上設有三個容槽1 2， 熱管3埋在容槽1 2中並與散熱板1的端面丨丨齊平，熱管3通 ^焊接或導熱膠或導熱樹脂埋在容槽12中；熱管3與多個 ^熱縫片2均接觸。散熱鰭片2通過焊接或導熱膠或導熱樹 脂與散熱板1及熱管3連接。 、 、 由技術常識可知，本創作可以通過其他的不脫離其精 神實質或必要特徵的實施方案來實現。因此，上述公開的 實施方案，就各方面而言，都只是舉例說明，並不是僅有 2 °所有在本創作申請專利範圍内或在等同於本創作的申 請專利範圍内的改變均被本創作包含。M243001 V. Creation instructions [New type, original creation, especially electricity, prior art, computer, component temperature, central installation, etc. to confirm the current sound film and wind turbine. Thermal effect. [The technology of the (1) genus of the new intrinsic heat-generating component involves the brain.] The internal temperature riser is used as a heat sink. The purpose is to provide a heat pipe, heat dissipation The device provides a technical field for a central processing unit.] A heat-dissipating electronic component for heat-dissipating a device. The temperature of the component when the component is made is placed in different positions of the appropriate majority of the heat-dissipating components, and particularly relates to the device. Normal work is particularly high during work. Therefore, at normal temperature, there is a temperature difference between the central part of the PC and the heat-dissipating components. A type of electronic component that dissipates heat will produce a shadow, which must be done. The controllers are directly loaded with uneven heat, which makes the sound. The heat dissipation is only installed in the center, which affects the better heat dissipation conditions of the heat dissipation fins. In order to achieve the above purpose, the technical solution of this creation is as follows: A heat dissipation device includes a heat dissipation plate in contact with components and a heat transfer device. The plurality of heat radiating fins further includes at least one heat pipe; at least one receiving groove is provided on an end surface of the heat radiating plate combined with the plurality of heat radiating fins, and the heat pipe is buried in the receiving groove; The fins are all in contact. In a preferred solution of the present invention, the heat pipe is buried in the tank by welding or thermally conductive glue or thermally conductive resin. The heat-dissipating fins are connected to the heat-dissipating M243001 by welding or heat-conducting glue or heat-conducting resin. 5. Creation instructions (2) The board and the heat pipe are connected. As a result of adopting the above scheme, a new structure of heat dissipation device is provided. The heat conductivity of the heat pipe is more than 600 times that of pure copper, and the heat transfer is rapid. The heat generated by the components is quickly transferred to the heat sink through the heat pipe to ensure heat dissipation. The temperature is uniform throughout the board. In this way, the temperature difference between the heat sinks and the heat sink fins at different locations is small, the heat is uniform, and the effect is good. In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings about this creation, but the drawings are for reference and explanation only, and are not intended to limit this creation. [Embodiment] The present invention will be further described in detail with reference to the drawings and embodiments ^ As shown in the first figure, a heat dissipation device includes a heat dissipation plate 1, which is in contact with components, a plurality of heat dissipation fins 2 and Three heat pipes 3; three receiving grooves 12 are provided on the end surface 11 combined with the plurality of heat dissipation fins 2 on the heat dissipation plate ^, and the heat pipes 3 are buried in the grooves 12 and flush with the end surface of the heat dissipation plate 1; The heat pipe 3 is buried in the tank 12 through welding or thermally conductive glue or thermally conductive resin; the heat pipe 3 is in contact with a plurality of thermal seams 2. The radiating fins 2 are connected to the radiating plate 1 and the heat pipe 3 by welding or thermally conductive glue or thermally conductive resin. It can be known from technical common sense that this creation can be realized through other implementation schemes that do not depart from its essence or essential characteristics. Therefore, the above-disclosed embodiments are just examples for all aspects, and not only 2 ° All changes within the scope of the patent application for this creation or within the scope of the patent application equivalent to this creation are covered by this creation contain.
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