CN201213344Y - Fixtures for heat sinks on sub-printed circuit boards - Google Patents
Fixtures for heat sinks on sub-printed circuit boards Download PDFInfo
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- CN201213344Y CN201213344Y CNU2008201142508U CN200820114250U CN201213344Y CN 201213344 Y CN201213344 Y CN 201213344Y CN U2008201142508 U CNU2008201142508 U CN U2008201142508U CN 200820114250 U CN200820114250 U CN 200820114250U CN 201213344 Y CN201213344 Y CN 201213344Y
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Abstract
本实用新型公开了一种子印制线路板散热器的固定装置,其包括至少两固定单元,各固定单元包括:螺柱,贯穿散热器;弹簧和垫套,分设在散热器的两侧的螺柱上,以将散热器与螺柱保持在一起。其中,螺柱一端为子印制线路板连接端,另一端为母印制线路板连接端。本实用新型既能将子PCB与散热器固定,同时又能将子PCB与母PCB固定,从而将子PCB上原有的两种安装螺柱合二为一,减少了零件及安装孔的个数,使子PCB上布局空间利用率大大提高,而且能提高装配效率和降低装配成本。
The utility model discloses a fixing device for a radiator of a printed circuit board, which comprises at least two fixing units, and each fixing unit includes: a stud, which runs through the radiator; on the studs to hold the heat sink to the studs. Wherein, one end of the stud is the connection end of the child printed circuit board, and the other end is the connection end of the female printed circuit board. The utility model can not only fix the sub-PCB and the heat sink, but also can fix the sub-PCB and the mother PCB, so that the original two kinds of mounting studs on the sub-PCB are combined into one, and the number of parts and mounting holes is reduced. , so that the utilization rate of the layout space on the sub-PCB is greatly improved, and the assembly efficiency can be improved and the assembly cost can be reduced.
Description
技术领域 technical field
本实用新型涉及通讯及电子技术领域,更具体地,涉及一种子印制线路板散热器的固定装置。The utility model relates to the technical fields of communication and electronics, and more particularly relates to a fixing device for a heat sink of a printed circuit board.
背景技术 Background technique
印制线路板(Printed Circuit Board,简称为PCB)的应用极其广泛。目前,在通讯和电子设备中,存在子PCB与母PCB的结构关系,以实现母PCB的扩容和功能的拓展,现有的安装结构是子PCB与母PCB的中间使用螺柱(母PCB与子PCB之间的距离为定距h),分别在子PCB和母PCB两侧用螺钉进行固定。对于子PCB上有散热器,特别是散热器面积较大时,需要方便将子PCB及散热器拆下进行维护。现有的技术方案是子PCB与母PCB固定螺钉(如图1所示)和子PCB与散热器固定螺钉(如图2所示)不在同一位置,该技术方案的缺点是子PCB上螺钉安装孔很多,而且安装孔需要相互错开,占用空间大,影响子PCB的布线和器件布局,同时也影响装配效率。Printed Circuit Board (PCB for short) is widely used. At present, in communication and electronic equipment, there is a structural relationship between the child PCB and the mother PCB to realize the expansion of the mother PCB and the expansion of functions. The existing installation structure uses studs in the middle of the child PCB and the mother PCB (the mother PCB and the mother PCB The distance between the sub-PCBs is a fixed distance h), which are respectively fixed with screws on both sides of the sub-PCB and the mother PCB. If there is a heat sink on the sub-PCB, especially when the area of the heat sink is large, it is necessary to easily remove the sub-PCB and the heat sink for maintenance. The existing technical solution is that the fixing screws of the sub-PCB and the mother PCB (as shown in Figure 1) and the fixing screws of the sub-PCB and the radiator (as shown in Figure 2) are not in the same position. The disadvantage of this technical solution is that the screw mounting holes on the sub-PCB There are many, and the mounting holes need to be staggered from each other, which takes up a lot of space, affects the wiring and device layout of the sub-PCB, and also affects the assembly efficiency.
实用新型内容Utility model content
本实用新型的目的在于克服现有技术的不足,提供一种子印制线路板散热器的固定装置,其结构紧凑、维护方便、可靠性高。The purpose of the utility model is to overcome the deficiencies of the prior art and provide a fixing device for a printed circuit board radiator, which has a compact structure, convenient maintenance and high reliability.
为达此目的,本实用新型提供了一种子印制线路板散热器的固定装置,其包括至少两固定单元,各固定单元包括:螺柱,贯穿散热器;以及弹簧和垫套,分设在散热器的两侧的螺柱上,以将散热器与螺柱保持在一起,其中,螺柱一端为子PCB连接端,另一端为母PCB连接端。In order to achieve this purpose, the utility model provides a fixing device for a printed circuit board heat sink, which includes at least two fixing units, each fixing unit includes: a stud, which runs through the heat sink; On the studs on both sides of the heat sink to keep the heat sink and the studs together, wherein one end of the studs is the connection end of the sub PCB, and the other end is the connection end of the mother PCB.
优选地,上述螺柱的母PCB连接端形成止挡台阶,弹簧的一端抵靠止挡台阶,另一端向散热器偏压。Preferably, the female PCB connection end of the above-mentioned stud forms a stopper step, one end of the spring abuts against the stopper step, and the other end is biased toward the radiator.
优选地,上述螺柱的子PCB连接端形成可涨开的铆合部,垫套铆接于铆合部。可选择地,垫套螺接于螺柱上,或者垫套焊接于所述螺柱上。Preferably, the connection end of the sub-PCB of the above-mentioned stud forms an expandable riveting part, and the gasket is riveted to the riveting part. Optionally, the washer is screwed onto the stud, or the washer is welded to said stud.
优选地,上述母PCB连接端和子PCB连接端之间的距离等于子PCB与母PCB之间的连接器的安装距离。Preferably, the distance between the connection end of the mother PCB and the connection end of the sub-PCB is equal to the installation distance of the connector between the sub-PCB and the mother PCB.
本实用新型中的弹簧起到在散热器安装到子PCB上后,使得散热器对芯片的压力是浮动的,保证散热器通过导热垫或导热硅脂与芯片表面的可靠接触。The spring in the utility model plays a role in making the pressure of the radiator on the chip float after the radiator is installed on the sub-PCB, so as to ensure reliable contact between the radiator and the surface of the chip through the heat conduction pad or heat conduction silicone grease.
本实用新型中的散热器装配完成后,先将散热器压在子PCB芯片上并用螺钉与子PCB固定好,然后将安装了散热器的子PCB插入到母PCB上,并用螺钉将子PCB与母PCB固定好,完成装配。After the radiator in the utility model is assembled, the radiator is first pressed on the sub-PCB chip and fixed with the sub-PCB with screws, then the sub-PCB with the radiator installed is inserted into the mother PCB, and the sub-PCB and the sub-PCB are fixed with screws. The mother PCB is fixed and the assembly is complete.
本实用新型的结构,适用于通讯和电子设备中带散热器的子PCB结构或其它类似结构上。The structure of the utility model is suitable for sub-PCB structures with radiators or other similar structures in communication and electronic equipment.
本实用新型的有益效果是:依照本实用新型的子PCB散热器的固定装置,既能实现子PCB与芯片上的散热器固定,又能解决子PCB与母PCB之间的固定,有效地将子PCB上的两种安装螺柱合二为一,从而使子PCB上布局空间利用率大大提高,装配效率更高,可靠性更高,成本更低。The beneficial effects of the utility model are: according to the fixing device of the sub-PCB radiator of the utility model, it can not only realize the fixation of the sub-PCB and the radiator on the chip, but also solve the problem of fixing between the sub-PCB and the mother PCB, effectively The two types of mounting studs on the sub-PCB are combined into one, so that the layout space utilization rate on the sub-PCB is greatly improved, the assembly efficiency is higher, the reliability is higher, and the cost is lower.
应该指出,以上说明和以下详细说明都是例示性的,旨在对所要求的本实用新型提供进一步的说明。It should be noted that both the above description and the following detailed description are exemplary and are intended to provide further explanation of the claimed invention.
除了上面所描述的目的、特征和优点之外,本实用新型还有其它的目的、特征和优点。下面将参照图,对本实用新型的其它的目的、特征和效果作进一步详细的说明。In addition to the purposes, features and advantages described above, the present invention has other purposes, features and advantages. Other purposes, features and effects of the present utility model will be further described in detail with reference to the drawings.
附图说明 Description of drawings
附图用来提供对本实用新型的进一步理解,并且构成说明书的一部分,与本实用新型的实施例一起用于解释本实用新型,并不构成对本实用新型的限制。在附图中:The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the description, and are used to explain the utility model together with the embodiments of the utility model, and do not constitute a limitation to the utility model. In the attached picture:
图1是根据现有技术的子PCB与母PCB的安装示意图;FIG. 1 is a schematic diagram of installation of a sub PCB and a mother PCB according to the prior art;
图2是根据现有技术的散热器与PCB的常规安装螺柱示意图;FIG. 2 is a schematic diagram of conventional mounting studs for a heat sink and a PCB according to the prior art;
图3a是根据本实用新型优选实施例的子PCB散热器的固定装置的结构示意图;Fig. 3a is a schematic structural view of a fixing device for a sub-PCB radiator according to a preferred embodiment of the present invention;
图3b示出了子PCB与母PCB的安装示意图,其中,子PCB与母PCB通过图3a所示的固定装置安装在一起。Fig. 3b shows a schematic diagram of the installation of the sub-PCB and the mother PCB, wherein the sub-PCB and the mother PCB are installed together through the fixing device shown in Fig. 3a.
具体实施方式 Detailed ways
以下结合附图下面结合附图对本实用新型的子PCB散热器的固定装置进行详细描述。The fixing device of the sub-PCB radiator of the present invention will be described in detail below in conjunction with the accompanying drawings.
图1为现有的子PCB与母PCB安装示意图。如图1所示,母PCB11与子PCB12通过中间的常规螺柱13相连,然后分别在子PCB和母PCB两侧用螺钉14进行固定。FIG. 1 is a schematic diagram of the existing sub PCB and mother PCB installation. As shown in FIG. 1 , the
图2为现有的散热器与PCB间的常规安装螺柱示意图。按图2将螺柱21从散热器24反面套入散热器24,再套入弹簧22,然后用螺钉23拧入螺柱21中,使得螺柱21与散热器24固定在一起。然后将散热器24压在PCB25上需要散热的芯片26表面,再从PCB25的反面用螺钉23穿过PCB25拧入到螺柱21中,完成散热器与PCB的固定。FIG. 2 is a schematic diagram of conventional mounting studs between a conventional radiator and a PCB. According to Fig. 2, the
图3a为本实用新型优选实施例的子PCB散热器的固定装置的结构示意图。按图3将螺柱39套入弹簧38后,再从散热器36正面套入散热器36中,然后将垫套37套入螺柱39的头部,最后用专用铆接工具涨开螺柱39的头部达到与垫套37的铆接,注意铆接后端面平整,螺柱39为内部全长螺纹,从螺柱两端都可以安装螺钉,铆接后螺柱的高度为定距h,正好是子PCB插入母PCB后要保持的高度。Fig. 3a is a structural schematic diagram of a fixing device for a sub-PCB radiator in a preferred embodiment of the present invention. After inserting the
图3b示出了子PCB与母PCB的安装示意图,其中,子PCB与母PCB通过图3a所示的固定装置安装在一起。将固定好螺柱39的散热器36压在子PCB31上需要散热的芯片32表面,安装前芯片32表面要贴导热垫或涂导热硅脂,然后用螺钉33将子PCB31与散热器36固定,然后将安装了散热器36的子PCB31插入到母PCB35上相应的连接器插座34中,并用螺钉将子PCB31与母PCB35固定好,完成装配。Fig. 3b shows a schematic diagram of the installation of the sub-PCB and the mother PCB, wherein the sub-PCB and the mother PCB are installed together through the fixing device shown in Fig. 3a. Press the
如上所述的固定装置可用于各种电子和通讯设备上。The fastening device as described above can be used on various electronic and communication equipment.
与现有技术相比,本实用新型的子PCB散热器的固定装置通过合二为一的螺柱,解决子PCB既要与散热器固定又要与母PCB固定的问题。Compared with the prior art, the fixing device of the sub-PCB heat sink of the utility model solves the problem that the sub-PCB must be fixed with the heat sink and with the mother PCB through the two-in-one stud.
以上所述仅为本实用新型的优选实施例而已,并不用于限制本实用新型。对于本领域的技术人员来说,本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201142508U CN201213344Y (en) | 2008-06-12 | 2008-06-12 | Fixtures for heat sinks on sub-printed circuit boards |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201142508U CN201213344Y (en) | 2008-06-12 | 2008-06-12 | Fixtures for heat sinks on sub-printed circuit boards |
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| CN201213344Y true CN201213344Y (en) | 2009-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNU2008201142508U Expired - Fee Related CN201213344Y (en) | 2008-06-12 | 2008-06-12 | Fixtures for heat sinks on sub-printed circuit boards |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103414036A (en) * | 2013-07-31 | 2013-11-27 | 昆山维金五金制品有限公司 | Radiator connecting assembly |
| CN110148590A (en) * | 2018-02-14 | 2019-08-20 | 华为技术有限公司 | Heat sinks and electronics |
| CN110831394A (en) * | 2018-08-13 | 2020-02-21 | 中兴通讯股份有限公司 | Heat dissipation structure and electronic equipment |
| WO2021103848A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Single-board heat dissipation structure |
-
2008
- 2008-06-12 CN CNU2008201142508U patent/CN201213344Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103414036A (en) * | 2013-07-31 | 2013-11-27 | 昆山维金五金制品有限公司 | Radiator connecting assembly |
| CN110148590A (en) * | 2018-02-14 | 2019-08-20 | 华为技术有限公司 | Heat sinks and electronics |
| WO2019157807A1 (en) * | 2018-02-14 | 2019-08-22 | 华为技术有限公司 | Heat-dissipation unit and electronic device |
| CN110148590B (en) * | 2018-02-14 | 2021-07-16 | 华为技术有限公司 | Heat sinks and electronics |
| CN110831394A (en) * | 2018-08-13 | 2020-02-21 | 中兴通讯股份有限公司 | Heat dissipation structure and electronic equipment |
| CN110831394B (en) * | 2018-08-13 | 2022-04-29 | 中兴通讯股份有限公司 | Heat dissipation structure and electronic equipment |
| WO2021103848A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Single-board heat dissipation structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090325 Termination date: 20170612 |
