CN204014377U - Multilayered thermally-conductive formula switch - Google Patents
Multilayered thermally-conductive formula switch Download PDFInfo
- Publication number
- CN204014377U CN204014377U CN201420257201.5U CN201420257201U CN204014377U CN 204014377 U CN204014377 U CN 204014377U CN 201420257201 U CN201420257201 U CN 201420257201U CN 204014377 U CN204014377 U CN 204014377U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- casing
- fixed
- formula switch
- source module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011229 interlayer Substances 0.000 claims abstract description 8
- 238000010622 cold drawing Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of multilayered thermally-conductive formula switch, comprises casing, is fixed with main power source module, mainboard, power panel and two or more circuit board in described casing; Described main power source module, power panel, mainboard and circuit board are all fixed on described casing by joint pin; At each described circuit board, external place is provided with the interlayer radiator being fixed on described casing.The utility model is mainly for the heat dissipation problem of the multilayer circuit board in casing, by every layer circuit board is increased to interlayer radiator, thereby the heat that utilizes this radiator that every layer circuit board is produced is transmitted on casing, and then distributed by the upper and lower cover plates with radiating groove of casing, reach a good radiating effect.
Description
Technical field
The utility model relates to industrial control field, relates in particular to a kind of multilayered thermally-conductive formula switch.
Background technology
Each parts annexation complexity in existing switch, assembling is used loaded down with trivial details, clumsy, poor radiation, can not dispel the heat above and below in inside simultaneously, every layer circuit board can not independently dispel the heat, and need to increase ventilation hole, rely on convection current auxiliary heat dissipation, business classification panel is one with complete machine main body, can not change, and shields, dust-proof effect is poor.
Utility model content
For the problems referred to above, the purpose of this utility model is to provide a kind of multilayered thermally-conductive formula switch.
For achieving the above object, a kind of multilayered thermally-conductive formula switch described in the utility model, comprises casing, is fixed with main power source module, mainboard, power panel and two or more circuit board in described casing;
Described main power source module, power panel, mainboard and circuit board are all fixed on described casing by joint pin;
At each described circuit board, external place is provided with the interlayer radiator being fixed on described casing.
Preferably, be equipped with radiating groove at the upper cover plate of described casing and the outer surface of lower cover.
Preferably, be fixed with power supply heat conductive pad at the inner surface of described upper cover plate, on described power supply heat conductive pad, fix described main power source module; Be fixed with main control chip heat conductive pad at the inner surface of described lower cover, on described main control chip heat conductive pad, be fixed with main control chip.
Preferably, described casing adopts zinc-plated cold drawing to make.
The beneficial effects of the utility model are:
The utility model is mainly for the heat dissipation problem of the multilayer circuit board in casing, by every layer circuit board is increased to interlayer radiator, thereby the heat that utilizes this radiator that every layer circuit board is produced is transmitted on casing, and then distributed by the upper and lower cover plates with radiating groove of casing, reach a good radiating effect.
Brief description of the drawings
Fig. 1 is the structural plan figure of multilayered thermally-conductive formula switch described in the utility model embodiment;
Fig. 2 is the end view of Fig. 1.
Embodiment
Below in conjunction with Figure of description, the utility model is further described.
Be a kind of multilayered thermally-conductive formula switch as Figure 1-Figure 2, comprise the casing 6 that adopts zinc-plated cold drawing to make, adopt zinc-plated cold drawing to make complete machine main body firmly not yielding, and with low cost.In described casing, be fixed with main power source module 2, mainboard 10, power panel 11 and two or more circuit board 4; Described main power source module, power panel, mainboard and circuit board are all fixed on described casing by joint pin; At each described circuit board, external place is provided with the interlayer radiator 7 being fixed on described casing.The heat that described circuit board produces just can, by interlayer radiator heat-dissipation to casing, reach heat radiation object.Be equipped with radiating groove at the upper cover plate 3 of described casing and the outer surface of lower cover 5, can increase integral heat sink area.Be fixed with power supply heat conductive pad 1 at the inner surface of described upper cover plate, on described power supply heat conductive pad, fix described main power source module; Be fixed with main control chip heat conductive pad 9 at the inner surface of described lower cover, on described main control chip heat conductive pad, be fixed with main control chip 8.The heat producing when work is transmitted to top heat sink by the internal electric source heat conductive pad of direct contact respectively and distributes and be transmitted to bottom heat spreader with the main control chip heat conductive pad by directly contacting and distribute.The business classification panel of described casing is by the extending part of complete machine front portion, and simple insertion, realizes easily assembling.
The utility model is mainly strengthened the heat-sinking capability of the above thermal component of multilayer.As shown in embodiment accompanying drawing, totally four layers of main power source module, two circuit boards and power panels, all install interlayer radiator additional at every circuit board position place, and be connected with casing rear portion with two screws, heat is conducted to top heat sink and bottom heat spreader by housing rear portion, make circuit board obtain heat radiation fully and ensure, reach the object that every layer circuit board independently dispels the heat.Improve the high-temperature stability of industrial switch.Without relying on convection current, improved the sealing of product without ventilation hole, ensure heat radiation and dustproof, the shield effectiveness of product.
Above; it is only preferred embodiment of the present utility model; but protection range of the present utility model is not limited to this; any be familiar with those skilled in the art the utility model disclose technical scope in; the variation that can expect easily or replacement, within all should being encompassed in protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range that claim was defined.
Claims (4)
1. a multilayered thermally-conductive formula switch, is characterized in that, comprises casing, is fixed with main power source module, mainboard, power panel and two or more circuit board in described casing;
Described main power source module, power panel, mainboard and circuit board are all fixed on described casing by joint pin;
At each described circuit board, external place is provided with the interlayer radiator being fixed on described casing.
2. multilayered thermally-conductive formula switch according to claim 1, is characterized in that, is equipped with radiating groove at the upper cover plate of described casing and the outer surface of lower cover.
3. multilayered thermally-conductive formula switch according to claim 2, is characterized in that, is fixed with power supply heat conductive pad at the inner surface of described upper cover plate, on described power supply heat conductive pad, fixes described main power source module; Be fixed with main control chip heat conductive pad at the inner surface of described lower cover, on described main control chip heat conductive pad, be fixed with main control chip.
4. multilayered thermally-conductive formula switch according to claim 1, is characterized in that, described casing adopts zinc-plated cold drawing to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420257201.5U CN204014377U (en) | 2014-05-20 | 2014-05-20 | Multilayered thermally-conductive formula switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420257201.5U CN204014377U (en) | 2014-05-20 | 2014-05-20 | Multilayered thermally-conductive formula switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204014377U true CN204014377U (en) | 2014-12-10 |
Family
ID=52054309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420257201.5U Expired - Lifetime CN204014377U (en) | 2014-05-20 | 2014-05-20 | Multilayered thermally-conductive formula switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204014377U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106196460A (en) * | 2016-07-20 | 2016-12-07 | 广东网域科技有限公司 | A kind of air-purifying exchanger |
| CN107911961A (en) * | 2017-10-26 | 2018-04-13 | 中山市欧派克五金制品有限公司 | A kind of sliding door linear electric motor controller structure |
| CN108205366A (en) * | 2016-12-19 | 2018-06-26 | 研祥智能科技股份有限公司 | Micro embedded industrial control computer |
-
2014
- 2014-05-20 CN CN201420257201.5U patent/CN204014377U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106196460A (en) * | 2016-07-20 | 2016-12-07 | 广东网域科技有限公司 | A kind of air-purifying exchanger |
| CN108205366A (en) * | 2016-12-19 | 2018-06-26 | 研祥智能科技股份有限公司 | Micro embedded industrial control computer |
| CN107911961A (en) * | 2017-10-26 | 2018-04-13 | 中山市欧派克五金制品有限公司 | A kind of sliding door linear electric motor controller structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141210 |