CN202522995U - High-density power module device - Google Patents
High-density power module device Download PDFInfo
- Publication number
- CN202522995U CN202522995U CN2012201807955U CN201220180795U CN202522995U CN 202522995 U CN202522995 U CN 202522995U CN 2012201807955 U CN2012201807955 U CN 2012201807955U CN 201220180795 U CN201220180795 U CN 201220180795U CN 202522995 U CN202522995 U CN 202522995U
- Authority
- CN
- China
- Prior art keywords
- power module
- power
- power supply
- module device
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Images
Abstract
The utility model provides a high-density power module device, which belongs to the field of power. The high-density power module device structurally comprises a shell and a power backplane, wherein the power backplane is mounted in the shell; two power module circuit boards are mounted in the shell; each power module circuit board is connected to the power backplane respectively; and a radiating fin upper cover is mounted above the shell and connected with the shell. Compared with the prior art, the high-density power module device has the characteristics of reasonable design and simple structure, and high-power 1plus1 redundant power can be achieved in the 1U space.
Description
Technical field
The utility model relates to a kind of power supply, specifically a kind of high density power module device.
Background technology
Power supply provides the needed electric energy of all parts in the computing machine, and common 1U power supply function comparatively limits to,
Its inner space is less, can't realize redundant power, and this makes power supply after going wrong, just can't work, and causes system normally to move.
Summary of the invention
The technical assignment of the utility model is the deficiency to prior art, and a kind of reasonable in design, high density power module device that result of use is good is provided.
The utility model solves the technical scheme that its technical matters adopted: comprise casing and power supply backplane, power supply backplane is arranged in the casing, and two power module circuitry plates are set in the casing, and the power module circuitry plate is connected with power supply backplane respectively; The aforesaid chassis top is provided with heat radiator loam cake and coupled connecing.
The power module circuitry plate is connected with power supply backplane through golden finger.
The high density power module device of the utility model compared with prior art, the beneficial effect that is produced is:
1), adopt highdensity power module circuitry, can be implemented in the high-power 1+1 redundant power in the 1U space.
2), owing to integrated two high density power module circuitry in limited space can produce bigger heat.Therefore, on the basis of existed system temperature-controlled fan, adopt the device of big heat radiator,, guarantee the functional reliability of power source integral to strengthen the radiating effect of total system as the casing upper cover plate.
Description of drawings
Accompanying drawing 1 is the structural representation of the utility model.
Among the figure: 1, heat radiator loam cake, 2, casing, 3, the power module circuitry plate, 4, golden finger, 5, power supply backplane.
Embodiment
Below in conjunction with accompanying drawing the utility model is done following the detailed description.
Shown in accompanying drawing, according to the physical dimension of 1U power supply, place two power module circuitry plates 3 (realizing the conversion of AC/DC+12V) in power supply casing 2 the insides, two power module circuitry plates 3 are connected with the power supply backplane 5 of 1U through golden finger 4; Simultaneously, above 1U power supply casing 2, adopt big heat radiator loam cake 1, combine closely, to guarantee in the limited space that the heat of system's generation can dissipate timely through heat-conducting silicone grease and the heat radiator in two power module circuitry.
Except that the described technical characterictic of instructions, be this professional's known technology.
Claims (2)
1. a high density power module device comprises casing and power supply backplane, and power supply backplane is arranged in the casing, it is characterized in that being provided with in the casing two power module circuitry plates, and the power module circuitry plate is connected with power supply backplane respectively; The aforesaid chassis top is provided with heat radiator loam cake and coupled connecing.
2. a kind of high density power module device according to claim 1 is characterized in that the power module circuitry plate is connected with power supply backplane through golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201807955U CN202522995U (en) | 2012-04-26 | 2012-04-26 | High-density power module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201807955U CN202522995U (en) | 2012-04-26 | 2012-04-26 | High-density power module device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202522995U true CN202522995U (en) | 2012-11-07 |
Family
ID=47105937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201807955U Expired - Fee Related CN202522995U (en) | 2012-04-26 | 2012-04-26 | High-density power module device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202522995U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106920647A (en) * | 2017-04-21 | 2017-07-04 | 广东浪潮大数据研究有限公司 | A kind of new magnetic element heat dissipating method |
-
2012
- 2012-04-26 CN CN2012201807955U patent/CN202522995U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106920647A (en) * | 2017-04-21 | 2017-07-04 | 广东浪潮大数据研究有限公司 | A kind of new magnetic element heat dissipating method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20150426 |
|
| EXPY | Termination of patent right or utility model |