CN102802379A - Radiation component and electronic equipment - Google Patents

Radiation component and electronic equipment Download PDF

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Publication number
CN102802379A
CN102802379A CN2011101786427A CN201110178642A CN102802379A CN 102802379 A CN102802379 A CN 102802379A CN 2011101786427 A CN2011101786427 A CN 2011101786427A CN 201110178642 A CN201110178642 A CN 201110178642A CN 102802379 A CN102802379 A CN 102802379A
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CN
China
Prior art keywords
clamping
heat
plate
fin
shaped base
Prior art date
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Granted
Application number
CN2011101786427A
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Chinese (zh)
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CN102802379B (en
Inventor
刘若鹏
徐冠雄
吕晶
史世东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
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Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
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Publication date
Application filed by Kuang Chi Institute of Advanced Technology, Kuang Chi Innovative Technology Ltd filed Critical Kuang Chi Institute of Advanced Technology
Priority to CN201110178642.7A priority Critical patent/CN102802379B/en
Publication of CN102802379A publication Critical patent/CN102802379A/en
Application granted granted Critical
Publication of CN102802379B publication Critical patent/CN102802379B/en
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Abstract

The invention discloses a radiation component, which comprises a protective cover and a radiation unit. The radiation unit comprises a plate-like pedestal, and a first clamping part, a second clamping part and fins, which are arranged on the plate-like pedestal. The first and second clamping parts and the fins are arranged on the two opposite surfaces of the plate-like pedestal respectively. A pair of clamping hooks are formed on the protective cover, and are clamped in the first clamping part to buckle the protective cover and the radiation unit to form a cavity. The second clamping part is used for fixing a printed circuit board in the cavity. Heat produced by high-heat devices on the PCB is quickly conducted to the radiation component through the directional heat conduction PCB, and is externally dissipated, so that the temperature of the whole PCB is substantially kept consistent. The invention also provides electronic equipment with the radiation component.

Description

Radiating subassembly and electronic equipment
Technical field
The present invention relates to a kind of heat radiation field of electronic equipment, relate in particular to a kind of electronic equipment that is used for the radiating subassembly of pcb board and uses this radiating subassembly.
Background technology
At present, when having minority device heating amount big on the pcb board, radiator or heat pipe can be on heater members, added, in the time of can't lowering as if temperature, the radiator of band fan can be adopted, to strengthen radiating effect.The heater members amount is arranged on pcb board more for a long time, can adopt big heat dissipating housing, and it is with height and customization heat radiator dedicated or on a big flat radiator, pluck out different element high and low positions by the position of heater members on the pcb board.Heat dissipating housing integral body is buckled on the component side, contacts with each element and dispel the heat.But just consistency is poor when welding because components and parts are adorned, and radiating effect is also bad.Along with the increased functionality of circuit and along with the height of product chips is integrated, the electronic component high-speed cruising must produce great amount of heat, works efficiently below normal working temperature in order to guarantee components and parts, and relevant heat dissipation technology has just more and more embodied bottleneck effect.
Summary of the invention
Based on this, the present invention provides a kind of radiating subassembly that is used for pcb board orientation and high efficiency and heat radiation.
A kind of radiating subassembly comprises a protective cover and a heat-sink unit; Said heat-sink unit comprises a plate-shaped base, is arranged at first clamping part on the plate-shaped base, second clamping part and fin, and first clamping part and second clamping part and fin are arranged at respectively on the relative two sides of plate-shaped base; Form a pair of trip on the said protective cover, it is interior so that protective cover and heat-sink unit fasten to form a cavity each other that said trip is arranged in first clamping part, and second clamping part is used in the fixing said cavity of a pcb board.
Further, said fin shortens to both sides along the vertically extending length difference of plate-shaped base and by the centre gradually.
Further, the fin of the both wings of said plate-shaped base bends to certain radian and is higher than adjacent fin highly at least.
Further, said first clamping part and second clamping part form two catch arm by two convexities and in end, and said two protruding opposing two grooves form one first clamping part, and said two protruding two relative grooves form one second clamping part.
Further, said protective cover adopts the metal radiation proof material to process.
Further, said plate-shaped base first clamping part, second clamping part and the one-body molded processing technology of fin are processed.
The present invention also provides a kind of electronic equipment of using radiating subassembly; Said electronic equipment comprises a said radiating subassembly and a pcb board; Said radiating subassembly comprises a protective cover and a heat-sink unit; Said heat-sink unit comprises a plate-shaped base, is arranged at first clamping part on the plate-shaped base, second clamping part and fin, and first clamping part and second clamping part and fin are arranged at respectively on the relative two sides of plate-shaped base; Form a pair of trip on the said protective cover, it is interior so that protective cover and heat-sink unit fasten to form a cavity each other that said trip is arranged in first clamping part, and second clamping part is used in the fixing said cavity of said pcb board.
Further, institute's pcb board comprises the first metal layer, heat-conducting medium layer, second metal level and covers the copper layer, covers the electronic devices and components that are provided with on the copper layer.
Further, the said the first metal layer and second metal level all adopt metallic aluminium to process, and the heat-conducting medium layer adopts heat conductive silica gel to process.
Further, said fin shortens to both sides along the vertically extending length difference of plate-shaped base and by the centre gradually, and the fin of the both wings of said plate-shaped base bends to certain radian and length is longer than adjacent fin at least.
Relative prior art, electronic equipment adopt circuit heat radiation that above-mentioned directed conductivity printed circuit board (PCB) can make whole electric equipment by the upwards heat-conducting mode of routine change over along under mode heat conduction, and then the internal structure layout of electronic equipment is more flexible.Above-mentioned pcb board heat conduction is even, and thermal resistivity is little.Further adopt the inside structure of giving radiating subassembly and directed conductivity printed circuit board (PCB) design of electronic devices, the heat that the device of golf calorific value produces on the pcb board conducts to radiating subassembly through directed conductivity printed circuit board (PCB) rapidly, and the temperature of whole pcb board is consistent basically.Adopt the protective cover of metal can also prevent the electromagnetic interference of environment to pcb board.
Description of drawings
Fig. 1 is the stereogram of radiating subassembly in the electronic equipment of the present invention;
Fig. 2 is the exploded view of Fig. 1 radiating subassembly;
Fig. 3 installs the sectional view of a pcb board for Fig. 1 radiating subassembly;
Fig. 4 is the sectional view of pcb board in the electronic equipment of the present invention.
Embodiment
See also Fig. 1, be radiating subassembly stereogram in the electronic equipment of the present invention.Said electronic equipment comprises a radiating subassembly 10.Said radiating subassembly 10 is applied to include but not limited in the electronic equipments such as various consumer electronics device, server, radio-frequency apparatus, electronics and LED lamp.
Please consult Fig. 2 in the lump, said radiating subassembly 10 comprises a protective cover 11 and a heat-sink unit 12 that fastens each other with said protective cover 11.Said protective cover 11 fastens each other with heat-sink unit 12 and forms a cavity 9 to be used for a ccontaining pcb board 13 (as shown in Figure 3).Said heat-sink unit 12 is provided with first clamping part 123 and second clamping part 124, and said first clamping part 123 and second clamping part 124 form by a pair of groove.First clamping part 123 is used for protective cover 11 and heat-sink unit 12 are fastened each other.Second clamping part 124 is used for pcb board 13 is fixedly set in the cavity 9.
Said heat-sink unit 12 comprise a plate-shaped base 120, with plate-shaped base 120 integrated several fins 122, first clamping part 123 and second clamping part 124.Said fin 122 and clamping part 123,124 lay respectively on the relative two panels of plate-shaped base 120.
See also Fig. 2, in this execution mode, first clamping part 123 and second clamping part 124 form two arms by two convexities 125 and in end, and promptly the cross section is convexity 125 formation of " T " word shape, and said two protruding 125 laterally arrange.Said two protruding 125 opposing two grooves form one first clamping part 123, and said two protruding 125 two relative grooves form one second clamping part 124.
Said fin 122 is different along plate-shaped base 120 vertically extending length, and is shortened gradually to both sides by the centre.Further preferably, the fin 1210 at the both wings of plate-shaped base 120 becomes certain radian and length to be longer than adjacent fin 122 at least to bent intermediate.
The both wings of protective cover 11 form a pair of trip 101 to same direction, and said trip 101 is arranged in first clamping part 123 so that protective cover 11 fastens with heat-sink unit 12 each other.In this execution mode, protective cover 11 adopts the metal radiation proof material to process.
See also Fig. 4, in this execution mode, the pcb board 13 that electronic equipment adopts comprises the first metal layer 97, heat-conducting medium layer 98, second metal level 99 and covers copper layer 100.Saidly cover the both sides that copper layer 100 and heat-conducting medium layer 98 are arranged at second metal level 99 respectively, the first metal layer 97 is arranged on said heat-conducting medium layer 98 1 side with respect to second metal level 99.
In this execution mode, the first metal layer 97 adopts metallic aluminium, copper, silver etc. to process.
Said heat-conducting medium layer 98 is used to isolate the said the first metal layer 97 and second metal level 99, and adopts heat conductive silica gel to process.Because the heat conductive silica gel adhesive is one type of monocomponent room-temperature cured adhesive, relies on hydrone in the ingress of air and solidify.Heat conductive silica gel is a bi-component, comprising two types of additivity and condensed types.The thermal conductive silicon film has heat conduction and insulation characterisitic, therefore can be easy to the first metal layer 97 and second metal level 99 are bonded into one.Especially adopt the heat conductive silica gel that is added with glass fiber (or carbon fiber) to increase its mechanical strength.
Said second metal level 99 also can adopt metal materials such as aluminium, copper, silver.In this execution mode, said the first metal layer is selected identical material aluminium for use with second metal level.In other embodiments, the material selected for use of the said the first metal layer and second metal level is inequality.
The directional heat conduction principle of above-mentioned pcb board: when covering the electronic devices and components that are provided with on the copper layer 100; When for example resistance, LED light-emitting diode, integrated circuit work are with the heat that produces; Because second metal level, 99 conductive coefficients are greater than the conductive coefficient of air; Therefore, be arranged at most heats that the electronic component that covers copper layer 100 produces and conduct to second metal level 99; Then heat is conducted to 98 layers on heat-conducting medium layer, the first metal layer 97 successively fast; Last the first metal layer 97 will receive heat and conduct; Thereby realize by the traditional circuit heat radiation by the upwards heat-conducting mode of routine change over along under mode heat conduction, make that the electronic equipment internal structure arrangement is more flexible; Folder makes pcb board heat conduction even at a distance from a heat conductive silica gel between two metal levels and adopt, and thermal resistivity is little.
See also Fig. 3; Pcb board 13 is based on the schematic diagram of said radiating subassembly 10 heat radiations; When design contains the electronic equipment of circuit board; Through adopting above-mentioned pcb board 13 to be arranged among the radiating subassembly 10, the first metal layer 97 of pcb board 13 conducts to heat plate-shaped base 120 and outwards transmits heats through fin 122.
Combine accompanying drawing that embodiments of the invention are described above; But the present invention is not limited to above-mentioned embodiment, and above-mentioned embodiment only is schematically, rather than restrictive; Those of ordinary skill in the art is under enlightenment of the present invention; Not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.

Claims (10)

1. radiating subassembly; It is characterized in that; Said radiating subassembly comprises a protective cover and a heat-sink unit; Said heat-sink unit comprises a plate-shaped base, is arranged at first clamping part on the plate-shaped base, second clamping part and fin, and first clamping part and second clamping part and fin are arranged at respectively on the relative two sides of plate-shaped base; Form a pair of trip on the said protective cover, it is interior so that protective cover and heat-sink unit fasten to form a cavity each other that said trip is arranged in first clamping part, and second clamping part is used in the fixing said cavity of a pcb board.
2. radiating subassembly according to claim 1 is characterized in that, said fin shortens to both sides along the vertically extending length difference of plate-shaped base and by the centre gradually.
3. radiating subassembly according to claim 2 is characterized in that, the fin of the both wings of said plate-shaped base bends to certain radian and is higher than adjacent fin highly at least.
4. radiating subassembly according to claim 3; It is characterized in that; Said first clamping part and second clamping part form two catch arm by two convexities and in end, and said two protruding opposing two grooves form one first clamping part, and said two protruding two relative grooves form one second clamping part.
5. radiating subassembly according to claim 1 is characterized in that, said protective cover adopts the metal radiation proof material to process.
6. radiating subassembly according to claim 4 is characterized in that, said plate-shaped base first clamping part, second clamping part and the one-body molded processing technology of fin are processed.
7. electronic equipment; It is characterized in that; Said electronic equipment comprises a radiating subassembly and a pcb board; Said radiating subassembly comprises a protective cover and a heat-sink unit, and said heat-sink unit comprises a plate-shaped base, is arranged at first clamping part on the plate-shaped base, second clamping part and fin, and first clamping part and second clamping part and fin are arranged at respectively on the relative two sides of plate-shaped base; Form a pair of trip on the said protective cover, it is interior so that protective cover and heat-sink unit fasten to form a cavity each other that said trip is arranged in first clamping part, and second clamping part is used in the fixing said cavity of said pcb board.
8. electronic equipment according to claim 1 is characterized in that, institute's pcb board comprises the first metal layer, heat-conducting medium layer, second metal level and covers the copper layer, covers the copper layer and is provided with electronic devices and components.
9. electronic equipment according to claim 8 is characterized in that, the said the first metal layer and second metal level all adopt metallic aluminium to process, and the heat-conducting medium layer adopts heat conductive silica gel to process.
10. electronic equipment according to claim 8; It is characterized in that; Said fin shortens to both sides along the vertically extending length difference of plate-shaped base and by the centre gradually, and the fin of the both wings of said plate-shaped base bends to certain radian and length is longer than adjacent fin at least.
CN201110178642.7A 2011-06-29 2011-06-29 Radiating subassembly and electronic equipment Active CN102802379B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN102802379A true CN102802379A (en) 2012-11-28
CN102802379B CN102802379B (en) 2015-12-16

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013189463A2 (en) * 2013-05-15 2013-12-27 中兴通讯股份有限公司 Heat dispersion device and terminal
CN105357933A (en) * 2015-10-23 2016-02-24 联想(北京)有限公司 Radiating workpiece and electronic apparatus
TWI633831B (en) * 2017-09-29 2018-08-21 威剛科技股份有限公司 Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101769524A (en) * 2009-01-06 2010-07-07 富准精密工业(深圳)有限公司 Light emitting diode lamp and light engine thereof
CN201827690U (en) * 2010-07-23 2011-05-11 苏州京东方茶谷电子有限公司 LED fluorescent tube
CN201827739U (en) * 2010-09-15 2011-05-11 深圳市大族元亨光电股份有限公司 Led light bar module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101769524A (en) * 2009-01-06 2010-07-07 富准精密工业(深圳)有限公司 Light emitting diode lamp and light engine thereof
CN201827690U (en) * 2010-07-23 2011-05-11 苏州京东方茶谷电子有限公司 LED fluorescent tube
CN201827739U (en) * 2010-09-15 2011-05-11 深圳市大族元亨光电股份有限公司 Led light bar module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013189463A2 (en) * 2013-05-15 2013-12-27 中兴通讯股份有限公司 Heat dispersion device and terminal
WO2013189463A3 (en) * 2013-05-15 2014-04-17 中兴通讯股份有限公司 Heat dispersion device and terminal
CN104159391A (en) * 2013-05-15 2014-11-19 中兴通讯股份有限公司 Heat dissipation device for terminal, and terminal
CN105357933A (en) * 2015-10-23 2016-02-24 联想(北京)有限公司 Radiating workpiece and electronic apparatus
TWI633831B (en) * 2017-09-29 2018-08-21 威剛科技股份有限公司 Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function
US10152097B1 (en) 2017-09-29 2018-12-11 Adata Technology Co., Ltd. Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function

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