CN105357933A - Radiating workpiece and electronic apparatus - Google Patents
Radiating workpiece and electronic apparatus Download PDFInfo
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- CN105357933A CN105357933A CN201510697750.3A CN201510697750A CN105357933A CN 105357933 A CN105357933 A CN 105357933A CN 201510697750 A CN201510697750 A CN 201510697750A CN 105357933 A CN105357933 A CN 105357933A
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- 239000010410 layer Substances 0.000 claims abstract description 233
- 239000002346 layers by function Substances 0.000 claims abstract description 54
- 230000017525 heat dissipation Effects 0.000 claims description 116
- 239000000463 material Substances 0.000 claims description 41
- 238000009413 insulation Methods 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 15
- 238000002955 isolation Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 11
- 239000004917 carbon fiber Substances 0.000 description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000007769 metal material Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Embodiments of the invention disclose a radiating workpiece of an electronic apparatus. The radiating workpiece comprises at least two fixed layers and an auxiliary functional layer, wherein a first fixed layer of the at least two fixed layers is used for being connected with a heat source in the electronic apparatus for acquiring the heat of the heat source; the auxiliary functional layer is arranged on the first fixed layer for acquiring the heat of the first fixed layer for radiating the heat source; and a second fixed layer of the at least two fixed layers is arranged on the auxiliary functional layer for being fixedly connected with the electronic apparatus. The embodiments of the invention also provide the electronic apparatus.
Description
Technical Field
The present invention relates to heat dissipation technologies in electronic devices, and in particular, to a heat dissipation workpiece and an electronic device.
Background
Electronic devices have become an unavailable item in people's lives; moreover, the demands of users on electronic devices are becoming more diversified, for example, ultra-light and thin notebook computers are becoming more and more popular with users; the existing ultra-thin notebook computer usually adopts a fan-less design, so that the weight of the notebook computer is reduced; however, the conventional fan-less design is designed to dissipate heat in a heat conduction and heat radiation manner, and the heat dissipation effect is not good; therefore, how to increase the heat dissipation efficiency in the heat conduction and heat radiation manner becomes an urgent problem to be solved, so as to improve the user experience.
Disclosure of Invention
In order to solve the existing technical problems, the embodiment of the invention provides a heat dissipation workpiece and electronic equipment.
The technical scheme of the embodiment of the invention is realized as follows:
an embodiment of the present invention provides a heat dissipation workpiece for an electronic device, where the heat dissipation workpiece includes: at least two anchor layers and an auxiliary functional layer; wherein,
the first fixing layer of the at least two fixing layers is used for being connected with a heat source in the electronic equipment to obtain the heat of the heat source;
the auxiliary functional layer is arranged on the first fixing layer and used for obtaining the heat of the first fixing layer so as to dissipate the heat of the heat source;
and the second fixing layer of the at least two fixing layers is arranged on the auxiliary function layer and is used for fixedly connecting with the electronic equipment.
The embodiment of the invention also discloses electronic equipment which comprises at least one heat dissipation workpiece; a heat dissipating workpiece of the at least one heat dissipating workpiece comprises: at least two anchor layers and an auxiliary functional layer; wherein,
the first fixing layer of the at least two fixing layers is used for being connected with a heat source in the electronic equipment to obtain the heat of the heat source;
the auxiliary functional layer is arranged on the first fixing layer and used for obtaining the heat of the first fixing layer so as to dissipate the heat of the heat source;
and the second fixing layer of the at least two fixing layers is arranged on the auxiliary function layer and is used for fixedly connecting with the electronic equipment.
According to the heat dissipation workpiece of the electronic equipment and the electronic equipment, the auxiliary functional layer is arranged between the fixed layers, and the heat of the heat source of the electronic equipment is obtained through the auxiliary functional layer, so that the purpose of dissipating the heat of the heat source is achieved; therefore, the heat dissipation workpiece provided by the embodiment of the invention can improve the heat dissipation efficiency of the electronic equipment; compared with the conventional fanless electronic equipment which realizes heat dissipation by selecting a metal material as a material on the back surface, the electronic equipment provided by the embodiment of the invention can realize light weight and thinness while improving the heat dissipation efficiency of the electronic equipment.
Drawings
Fig. 1 is a first schematic structural diagram of a heat dissipation workpiece of an electronic device according to an embodiment of the present invention;
FIG. 2 is a second schematic structural diagram of a heat dissipation workpiece of an electronic device according to an embodiment of the invention;
fig. 3 is a third schematic structural diagram of a heat dissipation workpiece of an electronic device according to an embodiment of the invention;
fig. 4 is a fourth schematic structural diagram of a heat dissipation workpiece of an electronic device according to an embodiment of the invention;
fig. 5 is a schematic structural diagram of two heat dissipation workpieces disposed in an electronic device according to an embodiment of the present invention.
Detailed Description
So that the manner in which the features and aspects of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.
Example one
Fig. 1 is a first schematic structural diagram of a heat dissipation workpiece of an electronic device according to an embodiment of the present invention; as shown in fig. 1, the heat dissipating workpiece includes: at least two anchor layers and an auxiliary functional layer; wherein,
the first fixing layer 11 of the at least two fixing layers is used for being connected with a heat source in the electronic equipment to obtain heat of the heat source;
the auxiliary functional layer 12 is disposed on the first fixed layer 11, and is configured to obtain heat of the first fixed layer 11 to dissipate heat of the heat source;
the second fixing layer 13 of the at least two fixing layers is disposed on the auxiliary functional layer 12, and is configured to be fixedly connected with the electronic device.
Here, it should be noted that, in the present embodiment, the auxiliary functional layer 12 is disposed on the first fixed layer 11, and the second fixed layer 13 is disposed on the auxiliary functional layer 12, which is not used to limit the space among the first fixed layer 11, the auxiliary functional layer 12, and the second fixed layer 13, but represents "up" in a certain direction; such as "up" in the direction indicated by the arrow in fig. 1; or "up" in the direction of the arrows in fig. 2, or may also be characterized as meaning directly attached, applied or connected.
In this embodiment, the electronic device may be a notebook computer, a tablet computer, or the like.
In this embodiment, the auxiliary functional layer is a high thermal conductive material; the at least two fixing layers are made of high-strength materials; wherein the thermal conductivity parameter of the high-strength material is less than the thermal conductivity parameter of the high-thermal conductivity material.
In practical application, the material adopted by each of the at least two fixing layers is carbon fiber, that is, the fixing layer is a carbon fiber layer, so that the carbon fiber has the advantages of high strength, light weight and the like, and the heat dissipation workpiece can lay a foundation for the requirement of increasingly thinning and lightening of electronic equipment on the premise of ensuring high strength. Furthermore, the auxiliary functional layer is made of a high thermal conductive material, that is, a high thermal conductive material layer, and here, the material selected for the auxiliary functional layer has high thermal conductivity, and the thermal conductivity parameter of the high thermal conductive material is greater than the thermal conductivity coefficient of the high-strength material selected for the fixed layer, so that the heat dissipation workpiece in this embodiment not only has the advantages of high strength, light weight and the like, but also can assist the electronic device in dissipating heat from the heat source, and therefore, the heat dissipation capability of the electronic device is improved.
In this way, in the heat dissipation workpiece of the electronic device according to the embodiment of the present invention, the auxiliary functional layer is disposed between the fixing layers, and the auxiliary functional layer obtains heat of the heat source of the electronic device, so as to achieve the purpose of dissipating heat of the heat source; therefore, the heat dissipation workpiece provided by the embodiment of the invention can improve the heat dissipation efficiency of the electronic equipment; compared with the conventional fanless electronic equipment which realizes heat dissipation by selecting a metal material as a material on the back surface, the electronic equipment provided by the embodiment of the invention can realize light weight and thinness while improving the heat dissipation efficiency of the electronic equipment.
In addition, when the auxiliary functional layer is made of a high-heat-conduction material, the fixing layer is made of a high-strength material, and the heat conduction parameter of the high-strength material is smaller than that of the high-heat-conduction material, the heat dissipation workpiece disclosed by the embodiment of the invention not only has the advantages of high strength, light weight and the like, but also can assist the electronic equipment to dissipate heat of the heat source, so that when the heat dissipation workpiece is arranged in the electronic equipment, the requirement of a user on lightness and thinness of the electronic equipment can be met, the requirement of the user on heat dissipation can be met, and the user experience is improved.
Example two
Fig. 3 is a third schematic structural diagram of a heat dissipation workpiece of an electronic device according to an embodiment of the invention; as shown in fig. 3, the heat dissipation workpiece includes: at least two anchor layers and an auxiliary functional layer; wherein,
the first fixing layer 11 of the at least two fixing layers is used for being connected with a heat source in the electronic equipment to obtain heat of the heat source;
the auxiliary functional layer 12 is disposed on the first fixed layer 11, and is configured to obtain heat of the first fixed layer 11 to dissipate heat of the heat source;
the second fixing layer 13 of the at least two fixing layers is disposed on the auxiliary functional layer 12, and is configured to be fixedly connected with the electronic device.
In this embodiment, the auxiliary functional layer 12 includes: an auxiliary heat dissipation layer 121 and a heat insulation layer 122; the heat insulation layer 122 is disposed on the auxiliary heat dissipation layer 121, and is configured to isolate the obtained heat from the second fixing layer 13, so as to reduce a surface temperature of the electronic device fixedly connected to the second fixing layer 13. Further, the heat conduction parameter of the heat insulation layer 122 is smaller than the heat conduction parameter of the air corresponding to the environment where the heat dissipation workpiece is located, so that the heat acquired by the auxiliary heat dissipation layer 121 is diffused in the auxiliary heat dissipation layer 121, the temperature of the auxiliary heat dissipation layer 121 is balanced, and the purpose of dissipating heat from the heat source is achieved.
In practical applications, since the first fixed layer 11 is directly connected to a heat source of the electronic device, the first fixed layer 11 can directly obtain heat of the heat source, and the auxiliary heat dissipation layer 121 is disposed on the first fixed layer 11, so that the auxiliary heat dissipation layer 121 can obtain heat of the heat source through the first fixed layer 11, where if the auxiliary heat dissipation layer 121 is directly disposed on the second fixed layer 13, that is, directly connected to the second fixed layer 13, at this time, heat can be directly transferred to a surface of the electronic device through the second fixed layer 13, so that a user can feel heat, and thus, user experience is reduced; therefore, in order to realize the heat dissipation process, the heat is not sensed by the user or is sensed a little, in the embodiment of the present invention, the heat insulation layer 122 is added, that is, the heat insulation layer 122 is disposed on the auxiliary heat dissipation layer 121, and the heat acquired by the auxiliary heat dissipation layer 121 is isolated from the second fixing layer 13 by the heat insulation layer 122, that is, the heat acquired by the auxiliary heat dissipation layer 121 is isolated from the surface of the electronic device, so that the heat is not sensed by the user, and the user experience is improved.
The heat insulation layer can be made of graphite, and accordingly can be called as a graphite layer, and the heat can be isolated from the second fixed layer, namely the surface of the electronic device, due to the addition of the graphite layer; moreover, as the heat conduction parameter of the graphite is smaller than that of the air corresponding to the environment where the heat dissipation workpiece is located, the heat insulation layer can also diffuse the heat acquired by the auxiliary heat dissipation layer in the heat insulation layer, so that the purpose of dissipating the heat of the heat source is achieved.
Here, it should be noted that, in the present embodiment, the auxiliary functional layer 12 is disposed on the first fixed layer 11, and the second fixed layer 13 is disposed on the auxiliary functional layer 12, which is not used to limit the space among the first fixed layer 11, the auxiliary functional layer 12, and the second fixed layer 13, but represents "up" in a certain direction; such as "up" in the direction indicated by the arrow in fig. 1; or "up" in the direction of the arrows in fig. 2, or may also be characterized as meaning directly attached, applied or connected. Similarly, the "upper" of the thermal insulation layer 122 disposed on the auxiliary heat dissipation layer 121 also means "upper" in a certain direction, and at this time, when the thermal insulation layer 122 is disposed on the auxiliary heat dissipation layer 121, the thermal insulation layer 122 and the auxiliary heat dissipation layer 121 may be directly attached to each other, or other layers may be disposed.
In this embodiment, the electronic device may be a notebook computer, a tablet computer, or the like.
In this embodiment, the auxiliary functional layer is a high thermal conductive material; the at least two fixing layers are made of high-strength materials; wherein the thermal conductivity parameter of the high-strength material is less than the thermal conductivity parameter of the high-thermal conductivity material.
In practical application, the material adopted by each of the at least two fixing layers is carbon fiber, that is, the fixing layer is a carbon fiber layer, so that the carbon fiber has the advantages of high strength, light weight and the like, and the heat dissipation workpiece can lay a foundation for the requirement of increasingly thinning and lightening of electronic equipment on the premise of ensuring high strength. Furthermore, the auxiliary functional layer is made of a high thermal conductive material, that is, a high thermal conductive material layer, and here, the material selected for the auxiliary functional layer has high thermal conductivity, and the thermal conductivity parameter of the high thermal conductive material is greater than the thermal conductivity coefficient of the high-strength material selected for the fixed layer, so that the heat dissipation workpiece in this embodiment not only has the advantages of high strength, light weight and the like, but also can assist the electronic device in dissipating heat from the heat source, and therefore, the heat dissipation capability of the electronic device is improved.
In practical applications, as shown in fig. 4, the heat dissipation workpiece further includes an isolation layer 14; the isolation layer 14 is disposed between the auxiliary heat dissipation layer 121 and the thermal insulation layer 122 to isolate the auxiliary heat dissipation layer 121 from the thermal insulation layer 122, so as to further improve heat dissipation efficiency. Here, the isolation layer may be made of a high-strength material, such as carbon fiber, or a high-thermal conductive material.
In this way, in the heat dissipation workpiece of the electronic device according to the embodiment of the present invention, the auxiliary functional layer is disposed between the fixing layers, and the auxiliary functional layer obtains heat of the heat source of the electronic device, so as to achieve the purpose of dissipating heat of the heat source; therefore, the heat dissipation workpiece provided by the embodiment of the invention can improve the heat dissipation efficiency of the electronic equipment; compared with the conventional fanless electronic equipment which realizes heat dissipation by selecting a metal material as a material on the back surface, the electronic equipment provided by the embodiment of the invention can realize light weight and thinness while improving the heat dissipation efficiency of the electronic equipment.
In addition, when the auxiliary functional layer is made of a high-heat-conduction material, the fixing layer is made of a high-strength material, and the heat conduction parameter of the high-strength material is smaller than that of the high-heat-conduction material, the heat dissipation workpiece disclosed by the embodiment of the invention not only has the advantages of high strength, light weight and the like, but also can assist the electronic equipment to dissipate heat of the heat source, so that when the heat dissipation workpiece is arranged in the electronic equipment, the requirement of a user on lightness and thinness of the electronic equipment can be met, the requirement of the user on heat dissipation can be met, and the user experience is improved.
EXAMPLE III
The embodiment of the invention provides electronic equipment, which comprises at least one heat dissipation workpiece; as shown in fig. 3, a heat dissipating workpiece of the at least one heat dissipating workpiece comprises: at least two anchor layers and an auxiliary functional layer; wherein,
the first fixing layer 11 of the at least two fixing layers is used for being connected with a heat source in the electronic equipment to obtain heat of the heat source;
the auxiliary functional layer 12 is disposed on the first fixed layer 11, and is configured to obtain heat of the first fixed layer 11 to dissipate heat of the heat source;
the second fixing layer 13 of the at least two fixing layers is disposed on the auxiliary functional layer 12, and is configured to be fixedly connected with the electronic device.
In this embodiment, the auxiliary functional layer 12 includes: an auxiliary heat dissipation layer 121 and a heat insulation layer 122; the heat insulation layer 122 is disposed on the auxiliary heat dissipation layer 121, and is configured to isolate the obtained heat from the second fixing layer 13, so as to reduce a surface temperature of the electronic device fixedly connected to the second fixing layer 13. Further, the heat conduction parameter of the heat insulation layer 122 is smaller than the heat conduction parameter of the air corresponding to the environment where the heat dissipation workpiece is located, so that the heat acquired by the auxiliary heat dissipation layer 121 is diffused in the auxiliary heat dissipation layer 121, the temperature of the auxiliary heat dissipation layer 121 is balanced, and the purpose of dissipating heat from the heat source is achieved.
In practical applications, since the first fixed layer 11 is directly connected to a heat source of the electronic device, the first fixed layer 11 can directly obtain heat of the heat source, and the auxiliary heat dissipation layer 121 is disposed on the first fixed layer 11, so that the auxiliary heat dissipation layer 121 can obtain heat of the heat source through the first fixed layer 11, where if the auxiliary heat dissipation layer 121 is directly disposed on the second fixed layer 13, that is, directly connected to the second fixed layer 13, at this time, heat can be directly transferred to a surface of the electronic device through the second fixed layer 13, so that a user can feel heat, and thus, user experience is reduced; therefore, in order to realize the heat dissipation process, the heat is not sensed by the user or is sensed a little, in the embodiment of the present invention, the heat insulation layer 122 is added, that is, the heat insulation layer 122 is disposed on the auxiliary heat dissipation layer 121, and the heat acquired by the auxiliary heat dissipation layer 121 is isolated from the second fixing layer 13 by the heat insulation layer 122, that is, the heat acquired by the auxiliary heat dissipation layer 121 is isolated from the surface of the electronic device, so that the heat is not sensed by the user, and the user experience is improved.
The heat insulation layer can be made of graphite, and accordingly can be called as a graphite layer, and the heat can be isolated from the second fixed layer, namely the surface of the electronic device, due to the addition of the graphite layer; moreover, as the heat conduction parameter of the graphite is smaller than that of the air corresponding to the environment where the heat dissipation workpiece is located, the heat insulation layer can also diffuse the heat acquired by the auxiliary heat dissipation layer in the heat insulation layer, so that the purpose of dissipating the heat of the heat source is achieved.
In a specific embodiment, when the first surface of the electronic device is connected to the second fixed layer, the reducing the surface temperature of the electronic device fixedly connected to the second fixed layer includes: reducing the surface temperature of the first surface in fixed connection with the second fixing layer; the first surface is the back surface of the body where a processing unit of the electronic equipment is located; or the input surface of the input unit of the body of the electronic equipment where the input unit is located. For example, the first surface is a back surface of a body where the non-display screen of the electronic device is located, such as a bottom of a notebook computer; or the first surface is a surface where a keyboard of the electronic device is located, that is, the heat of the heat source is isolated from the bottom of the notebook computer by the heat insulation layer, so that a user cannot perceive the heat, or the heat is isolated from the surface where the keyboard of the notebook computer is located by the heat insulation layer, so that the user cannot perceive the heat during input operation, and further user experience is improved.
In practical applications, two heat dissipation workpieces may be disposed in the electronic device, for example, as shown in fig. 5, two heat dissipation workpieces are respectively connected to a heat source 15; specifically, the first fixing layers 11 in the two heat dissipation workpieces are respectively connected with a heat source 15; and the two second fixing layers 13 are correspondingly connected with the back surface of the body where the processing unit of the electronic equipment is located and connected with the input surface of the input unit of the body where the input unit of the electronic equipment is located, so that the heat of the heat source is prevented from being transferred to the back surface of the body where the processing unit is located and the heat of the heat source is prevented from being transferred to the input surface of the input unit of the body where the input unit is located, a user can not sense the heat at the input surface and the back surface, and the user experience is improved.
Here, it should be noted that, in the present embodiment, the auxiliary functional layer 12 is disposed on the first fixed layer 11, and the second fixed layer 13 is disposed on the auxiliary functional layer 12, which is not used to limit the space among the first fixed layer 11, the auxiliary functional layer 12, and the second fixed layer 13, but represents "up" in a certain direction; such as "up" in the direction indicated by the arrow in fig. 1; or "up" in the direction of the arrows in fig. 2, or may also be characterized as meaning directly attached, applied or connected. Similarly, the "upper" of the thermal insulation layer 122 disposed on the auxiliary heat dissipation layer 121 also means "upper" in a certain direction, and at this time, when the thermal insulation layer 122 is disposed on the auxiliary heat dissipation layer 121, the thermal insulation layer 122 and the auxiliary heat dissipation layer 121 may be directly attached to each other, or other layers may be disposed.
In this embodiment, the electronic device may be a notebook computer, a tablet computer, or the like.
In this embodiment, the auxiliary functional layer is a high thermal conductive material; the at least two fixing layers are made of high-strength materials; wherein the thermal conductivity parameter of the high-strength material is less than the thermal conductivity parameter of the high-thermal conductivity material.
In practical application, the material adopted by each of the at least two fixing layers is carbon fiber, that is, the fixing layer is a carbon fiber layer, so that the carbon fiber has the advantages of high strength, light weight and the like, and the heat dissipation workpiece can lay a foundation for the requirement of increasingly thinning and lightening of electronic equipment on the premise of ensuring high strength. Furthermore, the auxiliary functional layer is made of a high thermal conductive material, that is, a high thermal conductive material layer, and here, the material selected for the auxiliary functional layer has high thermal conductivity, and the thermal conductivity parameter of the high thermal conductive material is greater than the thermal conductivity coefficient of the high-strength material selected for the fixed layer, so that the heat dissipation workpiece in this embodiment not only has the advantages of high strength, light weight and the like, but also can assist the electronic device in dissipating heat from the heat source, and therefore, the heat dissipation capability of the electronic device is improved.
In practical applications, as shown in fig. 4, the heat dissipation workpiece further includes an isolation layer 14; the isolation layer 14 is disposed between the auxiliary heat dissipation layer 121 and the thermal insulation layer 122 to isolate the auxiliary heat dissipation layer 121 from the thermal insulation layer 122, so as to further improve heat dissipation efficiency. Here, the isolation layer may be made of a high-strength material, such as carbon fiber, or a high-thermal conductive material.
In this way, according to the heat dissipation workpiece and the electronic device provided by the embodiment of the invention, the auxiliary functional layer is arranged between the fixed layers, and the heat of the heat source of the electronic device is obtained through the auxiliary functional layer, so that the purpose of dissipating heat of the heat source is realized; therefore, the heat dissipation workpiece provided by the embodiment of the invention can improve the heat dissipation efficiency of the electronic equipment; compared with the conventional fanless electronic equipment which realizes heat dissipation by selecting a metal material as a material on the back surface, the electronic equipment provided by the embodiment of the invention can realize light weight and thinness while improving the heat dissipation efficiency of the electronic equipment.
In addition, when the auxiliary functional layer is made of a high-heat-conduction material, the fixing layer is made of a high-strength material, and the heat conduction parameter of the high-strength material is smaller than that of the high-heat-conduction material, the heat dissipation workpiece disclosed by the embodiment of the invention not only has the advantages of high strength, light weight and the like, but also can assist the electronic equipment to dissipate heat of the heat source, so that when the heat dissipation workpiece is arranged in the electronic equipment, the requirement of a user on lightness and thinness of the electronic equipment can be met, the requirement of the user on heat dissipation can be met, and the user experience is improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A heat dissipating workpiece for an electronic device, the heat dissipating workpiece comprising: at least two anchor layers and an auxiliary functional layer; wherein,
the first fixing layer of the at least two fixing layers is used for being connected with a heat source in the electronic equipment to obtain the heat of the heat source;
the auxiliary functional layer is arranged on the first fixing layer and used for obtaining the heat of the first fixing layer so as to dissipate the heat of the heat source;
and the second fixing layer of the at least two fixing layers is arranged on the auxiliary function layer and is used for fixedly connecting with the electronic equipment.
2. The method of claim 1, wherein the secondary functional layer is a highly thermally conductive material; the at least two fixing layers are made of high-strength materials; wherein the thermal conductivity parameter of the high-strength material is less than the thermal conductivity parameter of the high-thermal conductivity material.
3. The heat dissipating workpiece according to claim 1, wherein the auxiliary functional layer comprises: an auxiliary heat dissipation layer and a heat insulation layer; wherein,
the heat insulation layer is arranged on the auxiliary heat dissipation layer and used for isolating the obtained heat from the second fixing layer so as to reduce the surface temperature of the electronic equipment fixedly connected with the second fixing layer.
4. The heat dissipation workpiece according to claim 3, wherein a heat conduction parameter of the heat insulation layer is smaller than a heat conduction parameter of air corresponding to an environment in which the heat dissipation workpiece is located, so that heat acquired by the auxiliary heat dissipation layer is diffused in the auxiliary heat dissipation layer, and the temperature of the auxiliary heat dissipation layer is equalized.
5. The heat dissipating workpiece of claim 3 or 4, further comprising an isolation layer; the isolation layer is arranged between the auxiliary heat dissipation layer and the heat insulation layer to isolate the auxiliary heat dissipation layer from the heat insulation layer.
6. The heat dissipating workpiece of claim 5, wherein the isolation layer is a high strength material or a high thermal conductivity material.
7. An electronic device includes at least one heat-dissipating workpiece; a heat dissipating workpiece of the at least one heat dissipating workpiece comprises: at least two anchor layers and an auxiliary functional layer; wherein,
the first fixing layer of the at least two fixing layers is used for being connected with a heat source in the electronic equipment to obtain the heat of the heat source;
the auxiliary functional layer is arranged on the first fixing layer and used for obtaining the heat of the first fixing layer so as to dissipate the heat of the heat source;
and the second fixing layer of the at least two fixing layers is arranged on the auxiliary function layer and is used for fixedly connecting with the electronic equipment.
8. The electronic device of claim 7, the auxiliary functional layer comprising: an auxiliary heat dissipation layer and a heat insulation layer; wherein,
the heat insulation layer is arranged on the auxiliary heat dissipation layer and used for isolating the obtained heat from the second fixing layer so as to reduce the surface temperature of the electronic equipment fixedly connected with the second fixing layer.
9. The electronic device of claim 8, wherein the reducing the surface temperature of the electronic device in fixed connection with the second fixed layer when the first surface of the electronic device is connected with the second fixed layer comprises:
reducing the surface temperature of the first surface in fixed connection with the second fixing layer;
the first surface is the back surface of the body where a processing unit of the electronic equipment is located; or the input surface of the input unit of the body of the electronic equipment where the input unit is located.
10. The method of claim 8 or 9, wherein the heat dissipating workpiece further comprises an isolation layer; the isolation layer is arranged between the auxiliary heat dissipation layer and the heat insulation layer to isolate the auxiliary heat dissipation layer from the heat insulation layer.
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| CN201510697750.3A CN105357933B (en) | 2015-10-23 | 2015-10-23 | Radiate workpiece and electronic equipment |
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| CN101087511A (en) * | 2006-06-08 | 2007-12-12 | 保力马科技株式会社 | Thermally conductive forming body and method of manufacturing the same |
| CN101483988A (en) * | 2008-01-11 | 2009-07-15 | 久正光电股份有限公司 | Heat radiation substrate |
| CN101505029A (en) * | 2008-02-04 | 2009-08-12 | 北京中视中科光电技术有限公司 | Laser and heat radiation device |
| US20130065011A1 (en) * | 2010-03-10 | 2013-03-14 | Nitto Denko Corporation | Heat insulation/heat dissipation sheet and intra-device structure |
| CN102802379A (en) * | 2011-06-29 | 2012-11-28 | 深圳光启高等理工研究院 | Radiation component and electronic equipment |
| CN203251562U (en) * | 2013-04-22 | 2013-10-23 | 孙利庆 | Heat dissipation sheet |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN204047017U (en) * | 2014-09-26 | 2014-12-24 | 络派模切（北京）有限公司 | A kind of heat conductive pad |
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| CN105357933B (en) | 2019-01-15 |
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