CN105357933A - Radiating workpiece and electronic apparatus - Google Patents

Radiating workpiece and electronic apparatus Download PDF

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Publication number
CN105357933A
CN105357933A CN201510697750.3A CN201510697750A CN105357933A CN 105357933 A CN105357933 A CN 105357933A CN 201510697750 A CN201510697750 A CN 201510697750A CN 105357933 A CN105357933 A CN 105357933A
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heat
electronic equipment
fixed bed
auxiliary
fixed
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CN105357933B (en
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李金玉
杨帆
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Cold plates, e.g. multi-component heat spreader, support plates, non closed structures

Abstract

Embodiments of the invention disclose a radiating workpiece of an electronic apparatus. The radiating workpiece comprises at least two fixed layers and an auxiliary functional layer, wherein a first fixed layer of the at least two fixed layers is used for being connected with a heat source in the electronic apparatus for acquiring the heat of the heat source; the auxiliary functional layer is arranged on the first fixed layer for acquiring the heat of the first fixed layer for radiating the heat source; and a second fixed layer of the at least two fixed layers is arranged on the auxiliary functional layer for being fixedly connected with the electronic apparatus. The embodiments of the invention also provide the electronic apparatus.

Description

Heat radiation workpiece and electronic equipment
Technical field
The present invention relates to the heat dissipation technology in electronic equipment, particularly relate to a kind of heat radiation workpiece and electronic equipment.
Background technology
Electronic equipment becomes not retrievable article in people's life already; Such as, and user is to the requirement of electronic equipment also more and more diversification, and, ultra-thin notebook computer is more and more subject to user's favor; Existing ultra-thin notebook computer adopts fan-free (fan-less) to design usually, reduces the weight of notebook computer; But existing fan-less design is dispelled the heat by heat transfer and thermal radiation mode, and radiating effect is not good; Therefore, how to carry out in the process of dispelling the heat, increasing radiating efficiency at heat transfer and thermal radiation mode and become the problem needing solution badly, to promote Consumer's Experience.
Summary of the invention
For solving the technical problem of existing existence, embodiments provide a kind of heat radiation workpiece and electronic equipment.
The technical scheme of the embodiment of the present invention is achieved in that
Embodiments provide a kind of heat radiation workpiece of electronic equipment, described heat radiation workpiece comprises: at least two fixed beds and auxiliary functional layers; Wherein,
The first fixed bed in described at least two fixed beds, for being connected with the thermal source in described electronic equipment, obtains the heat of described thermal source;
Described auxiliary functional layers, is arranged on described first fixed bed, for obtaining the heat of described first fixed bed, to dispel the heat to described thermal source;
The second fixed bed in described at least two fixed beds, is arranged in described auxiliary functional layers, is connected for being fixed with described electronic equipment.
The embodiment of the invention also discloses a kind of electronic equipment, comprise at least one heat radiation workpiece; Heat radiation workpiece at least one heat radiation workpiece described comprises: at least two fixed beds and auxiliary functional layers; Wherein,
The first fixed bed in described at least two fixed beds, for being connected with the thermal source in described electronic equipment, obtains the heat of described thermal source;
Described auxiliary functional layers, is arranged on described first fixed bed, for obtaining the heat of described first fixed bed, to dispel the heat to described thermal source;
The second fixed bed in described at least two fixed beds, is arranged in described auxiliary functional layers, is connected for being fixed with described electronic equipment.
The heat radiation workpiece of the electronic equipment described in the embodiment of the present invention and electronic equipment, by arranging auxiliary functional layers between fixed bed, and being obtained the heat of the thermal source of described electronic equipment, realizing the object of dispelling the heat to described thermal source by auxiliary functional layers; So, the heat radiation workpiece described in the embodiment of the present invention can improve the radiating efficiency of electronic equipment; And, with existing fan-free (fanless) electronic equipment by compared with the mode the material at the back side being elected as metal material and realize dispelling the heat, the embodiment of the present invention while the described electronic equipment dissipating heat efficiency of raising, can realize the lightening of electronic equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation one of the heat radiation workpiece of embodiment of the present invention electronic equipment;
Fig. 2 is the structural representation two of the heat radiation workpiece of embodiment of the present invention electronic equipment;
Fig. 3 is the structural representation three of the heat radiation workpiece of embodiment of the present invention electronic equipment;
Fig. 4 is the structural representation four of the heat radiation workpiece of embodiment of the present invention electronic equipment;
Fig. 5 is the structural representation of two the heat radiation workpiece arranged in embodiment of the present invention electronic equipment.
Embodiment
In order to more at large understand feature of the present invention and technology contents, below in conjunction with accompanying drawing, realization of the present invention is described in detail, the use of appended accompanying drawing explanation only for reference, is not used for limiting the present invention.
Embodiment one
Fig. 1 is the structural representation one of the heat radiation workpiece of embodiment of the present invention electronic equipment; As shown in Figure 1, described heat radiation workpiece comprises: at least two fixed beds and auxiliary functional layers; Wherein,
The first fixed bed 11 in described at least two fixed beds, for being connected with the thermal source in described electronic equipment, obtains the heat of described thermal source;
Described auxiliary functional layers 12, is arranged on described first fixed bed 11, for obtaining the heat of described first fixed bed 11, to dispel the heat to described thermal source;
The second fixed bed 13 in described at least two fixed beds, being arranged in described auxiliary functional layers 12, being connected for being fixed with described electronic equipment.
Here, it should be noted that, auxiliary functional layers 12 described in the present embodiment is arranged on described first fixed bed 11, and described second fixed bed 13 be arranged at described auxiliary functional layers 12 upper " on ", not for limiting in concept of space between described first fixed bed 11, described auxiliary functional layers 12 and described second fixed bed 13 three, but to represent in one direction " on "; Such as, in Fig. 1 arrow shown on direction " on "; Or in Fig. 2 on direction shown in arrow " on ", or, the meaning that can also characterize direct laminating, paste or connect.
In the present embodiment, described electronic equipment can be specially notebook computer, panel computer etc.
In the present embodiment, described auxiliary functional layers is highly heat-conductive material; Described at least two fixed beds are high-strength material; Wherein, the heat conduction parameter of described high-strength material is less than the heat conduction parameter of described highly heat-conductive material.
In actual applications, the material that each fixed bed in described at least two fixed beds adopts is carbon fiber, also namely fixed bed is carbon fiber layer, so, because carbon fiber has the advantages such as intensity is high, quality is light, so described heat radiation workpiece, under the prerequisite ensureing high strength, can lay the foundation for the requirement that electronic equipment is more and more lightening.Further, the material that described auxiliary functional layers adopts is highly heat-conductive material, also be highly heat-conductive material layer, here, the material selected due to described auxiliary functional layers possesses high thermal conductivity, the heat conduction parameter of its highly heat-conductive material is greater than the conductive coefficient of the high-strength material that described fixed bed is selected, so, heat radiation workpiece described in the present embodiment not only possesses the advantages such as intensity is high, quality is light, but also described electronic equipment can be assisted to dispel the heat to described thermal source, therefore, the heat-sinking capability of described electronic equipment is improved.
Like this, the heat radiation workpiece of the electronic equipment described in the embodiment of the present invention, by arranging auxiliary functional layers between fixed bed, and being obtained the heat of the thermal source of described electronic equipment, realizing the object of dispelling the heat to described thermal source by auxiliary functional layers; So, the heat radiation workpiece described in the embodiment of the present invention can improve the radiating efficiency of electronic equipment; And, with existing fan-free (fanless) electronic equipment by compared with the mode the material at the back side being elected as metal material and realize dispelling the heat, the embodiment of the present invention while the described electronic equipment dissipating heat efficiency of raising, can realize the lightening of electronic equipment.
In addition, when described auxiliary functional layers selects highly heat-conductive material, high-strength material selected by fixed bed, and the heat conduction parameter of described high-strength material is when being less than the heat conduction parameter of described highly heat-conductive material, it is high that heat radiation workpiece described in the embodiment of the present invention not only possesses intensity, the advantages such as quality is light, but also described electronic equipment can be assisted to dispel the heat to described thermal source, therefore, when by described heat radiation workpiece setting in described electronic equipment time, user can not only be met to the lightening requirement of electronic equipment, the requirement of user to heat radiation can also be met, improve Consumer's Experience.
Embodiment two
Fig. 3 is the structural representation three of the heat radiation workpiece of embodiment of the present invention electronic equipment; As shown in Figure 3, described heat radiation workpiece comprises: at least two fixed beds and auxiliary functional layers; Wherein,
The first fixed bed 11 in described at least two fixed beds, for being connected with the thermal source in described electronic equipment, obtains the heat of described thermal source;
Described auxiliary functional layers 12, is arranged on described first fixed bed 11, for obtaining the heat of described first fixed bed 11, to dispel the heat to described thermal source;
The second fixed bed 13 in described at least two fixed beds, being arranged in described auxiliary functional layers 12, being connected for being fixed with described electronic equipment.
In the present embodiment, described auxiliary functional layers 12 comprises: auxiliary heat dissipation layer 121 and thermal insulation layer 122; Wherein, described thermal insulation layer 122 is arranged on described auxiliary heat dissipation layer 121, for the heat got and described second fixed bed 13 being isolated, to reduce the surface temperature being fixed the described electronic equipment be connected with described second fixed bed 13.Further, the heat conduction parameter of described thermal insulation layer 122 is less than the heat conduction parameter of the air that environment is corresponding residing for described heat radiation workpiece, so that the heat got by described auxiliary heat dissipation layer 121 spreads at described auxiliary heat dissipation layer 121, the temperature of balanced described auxiliary heat dissipation layer 121, realizes the object of dispelling the heat to described thermal source.
In actual applications, because described first fixed bed 11 is directly connected with the thermal source of described electronic equipment, so described first fixed bed 11 directly can get the heat of described thermal source, and described auxiliary heat dissipation layer 121 is arranged on described first fixed bed 11, therefore, described auxiliary heat dissipation layer 121 can get the heat of described thermal source by described first fixed bed 11, here, if described auxiliary heat dissipation layer 121 is directly arranged on described second fixed bed 13, namely be directly connected with described second fixed bed 13, now, directly heat can be delivered to the surface of described electronic equipment by described second fixed bed 13, user is made to experience heat, like this, reduce the experience of user, so, in order in the process realizing heat radiation, heat is not perceived by the user, or by a small amount of perception, the embodiment of the present invention increases thermal insulation layer 122, namely described thermal insulation layer 122 is arranged on described auxiliary heat dissipation layer 121, the heat obtained by described auxiliary heat dissipation layer 121 by described thermal insulation layer 122 and described second fixed bed 13 are isolated, and that is, the heat obtain described auxiliary heat dissipation layer 121 and the surface of electronic equipment isolate, and then make this heat not by the perception of user institute, promote Consumer's Experience.
Here, described thermal insulation layer can select graphite, correspondingly can be described as graphite linings, and heat and the second fixed bed can not only be isolated by adding of graphite linings, also namely isolate with the surface of electronic equipment; And the heat conduction parameter due to graphite is less than the heat conduction parameter of the air that environment is corresponding residing for described heat radiation workpiece, so the heat that auxiliary heat dissipation layer gets can also spread by described thermal insulation layer in self, and then the object that realization is dispelled the heat to described thermal source.
Here, it should be noted that, auxiliary functional layers 12 described in the present embodiment is arranged on described first fixed bed 11, and described second fixed bed 13 be arranged at described auxiliary functional layers 12 upper " on ", not for limiting in concept of space between described first fixed bed 11, described auxiliary functional layers 12 and described second fixed bed 13 three, but to represent in one direction " on "; Such as, in Fig. 1 arrow shown on direction " on "; Or in Fig. 2 on direction shown in arrow " on ", or, the meaning that can also characterize direct laminating, paste or connect.In like manner, described thermal insulation layer 122 be arranged at described auxiliary heat dissipation layer 121 upper " on " be also represent in one direction " on ", now, when described thermal insulation layer 122 is arranged on described auxiliary heat dissipation layer 121, directly can paste between described thermal insulation layer 122 and described auxiliary heat dissipation layer 121, other layers can also be provided with.
In the present embodiment, described electronic equipment can be specially notebook computer, panel computer etc.
In the present embodiment, described auxiliary functional layers is highly heat-conductive material; Described at least two fixed beds are high-strength material; Wherein, the heat conduction parameter of described high-strength material is less than the heat conduction parameter of described highly heat-conductive material.
In actual applications, the material that each fixed bed in described at least two fixed beds adopts is carbon fiber, also namely fixed bed is carbon fiber layer, so, because carbon fiber has the advantages such as intensity is high, quality is light, so described heat radiation workpiece, under the prerequisite ensureing high strength, can lay the foundation for the requirement that electronic equipment is more and more lightening.Further, the material that described auxiliary functional layers adopts is highly heat-conductive material, also be highly heat-conductive material layer, here, the material selected due to described auxiliary functional layers possesses high thermal conductivity, the heat conduction parameter of its highly heat-conductive material is greater than the conductive coefficient of the high-strength material that described fixed bed is selected, so, heat radiation workpiece described in the present embodiment not only possesses the advantages such as intensity is high, quality is light, but also described electronic equipment can be assisted to dispel the heat to described thermal source, therefore, the heat-sinking capability of described electronic equipment is improved.
In actual applications, as shown in Figure 4, described heat radiation workpiece also comprises separator 14; Wherein, described separator 14 is arranged between described auxiliary heat dissipation layer 121 and thermal insulation layer 122, described auxiliary heat dissipation layer 121 and thermal insulation layer 122 to be isolated, so, improves radiating efficiency further.Here, described separator can adopt high-strength material, such as carbon fiber, also can select highly heat-conductive material.
Like this, the heat radiation workpiece of the electronic equipment described in the embodiment of the present invention, by arranging auxiliary functional layers between fixed bed, and being obtained the heat of the thermal source of described electronic equipment, realizing the object of dispelling the heat to described thermal source by auxiliary functional layers; So, the heat radiation workpiece described in the embodiment of the present invention can improve the radiating efficiency of electronic equipment; And, with existing fan-free (fanless) electronic equipment by compared with the mode the material at the back side being elected as metal material and realize dispelling the heat, the embodiment of the present invention while the described electronic equipment dissipating heat efficiency of raising, can realize the lightening of electronic equipment.
In addition, when described auxiliary functional layers selects highly heat-conductive material, high-strength material selected by fixed bed, and the heat conduction parameter of described high-strength material is when being less than the heat conduction parameter of described highly heat-conductive material, it is high that heat radiation workpiece described in the embodiment of the present invention not only possesses intensity, the advantages such as quality is light, but also described electronic equipment can be assisted to dispel the heat to described thermal source, therefore, when by described heat radiation workpiece setting in described electronic equipment time, user can not only be met to the lightening requirement of electronic equipment, the requirement of user to heat radiation can also be met, improve Consumer's Experience.
Embodiment three
Embodiments provide a kind of electronic equipment, comprise at least one heat radiation workpiece; As shown in Figure 3, the heat radiation workpiece at least one heat radiation workpiece described comprises: at least two fixed beds and auxiliary functional layers; Wherein,
The first fixed bed 11 in described at least two fixed beds, for being connected with the thermal source in described electronic equipment, obtains the heat of described thermal source;
Described auxiliary functional layers 12, is arranged on described first fixed bed 11, for obtaining the heat of described first fixed bed 11, to dispel the heat to described thermal source;
The second fixed bed 13 in described at least two fixed beds, being arranged in described auxiliary functional layers 12, being connected for being fixed with described electronic equipment.
In the present embodiment, described auxiliary functional layers 12 comprises: auxiliary heat dissipation layer 121 and thermal insulation layer 122; Wherein, described thermal insulation layer 122 is arranged on described auxiliary heat dissipation layer 121, for the heat got and described second fixed bed 13 being isolated, to reduce the surface temperature being fixed the described electronic equipment be connected with described second fixed bed 13.Further, the heat conduction parameter of described thermal insulation layer 122 is less than the heat conduction parameter of the air that environment is corresponding residing for described heat radiation workpiece, so that the heat got by described auxiliary heat dissipation layer 121 spreads at described auxiliary heat dissipation layer 121, the temperature of balanced described auxiliary heat dissipation layer 121, realizes the object of dispelling the heat to described thermal source.
In actual applications, because described first fixed bed 11 is directly connected with the thermal source of described electronic equipment, so described first fixed bed 11 directly can get the heat of described thermal source, and described auxiliary heat dissipation layer 121 is arranged on described first fixed bed 11, therefore, described auxiliary heat dissipation layer 121 can get the heat of described thermal source by described first fixed bed 11, here, if described auxiliary heat dissipation layer 121 is directly arranged on described second fixed bed 13, namely be directly connected with described second fixed bed 13, now, directly heat can be delivered to the surface of described electronic equipment by described second fixed bed 13, user is made to experience heat, like this, reduce the experience of user, so, in order in the process realizing heat radiation, heat is not perceived by the user, or by a small amount of perception, the embodiment of the present invention increases thermal insulation layer 122, namely described thermal insulation layer 122 is arranged on described auxiliary heat dissipation layer 121, the heat obtained by described auxiliary heat dissipation layer 121 by described thermal insulation layer 122 and described second fixed bed 13 are isolated, and that is, the heat obtain described auxiliary heat dissipation layer 121 and the surface of electronic equipment isolate, and then make this heat not by the perception of user institute, promote Consumer's Experience.
Here, described thermal insulation layer can select graphite, correspondingly can be described as graphite linings, and heat and the second fixed bed can not only be isolated by adding of graphite linings, also namely isolate with the surface of electronic equipment; And the heat conduction parameter due to graphite is less than the heat conduction parameter of the air that environment is corresponding residing for described heat radiation workpiece, so the heat that auxiliary heat dissipation layer gets can also spread by described thermal insulation layer in self, and then the object that realization is dispelled the heat to described thermal source.
In one embodiment, when the first surface of described electronic equipment is connected with described second fixed bed, described reduction is fixed the surface temperature of the described electronic equipment be connected with described second fixed bed, comprising: reduce the surface temperature being fixed the described first surface be connected with described second fixed bed; Wherein, described first surface is the back side of the processing unit place body of described electronic equipment; Or, be the input face of the input unit of the input unit place body of described electronic equipment.Such as, described first surface is the back side of described electronic equipment non-display screen place body, as the bottom of notebook computer; Or, described first surface is the surface, keyboard place of described electronic equipment, that is, the bottom of the heat of described thermal source and notebook computer isolates by described thermal insulation layer, make user can not perceive described heat, or the face, keyboard place of this heat and notebook computer isolates by described thermal insulation layer, make can not perceive this heat during user's input operation, and then promote the experience of user.
In actual applications, can be provided with two described heat radiation workpiece in described electronic equipment, such as, as shown in Figure 5, two described heat radiation workpiece are connected with thermal source 15 respectively; Particularly, the first fixed bed 11 in two described heat radiation workpiece is connected with thermal source 15 respectively; And two described second fixed bed 13 correspondences are connected with the back side of the processing unit place body of described electronic equipment, are connected with the input face of the input unit of the input unit place body of described electronic equipment, so, the heat of described thermal source is avoided to be delivered to the back side of described processing unit place body, and avoid the heat of described thermal source to be delivered to the input face of the input unit of described input unit place body, and then make user all can not perceive heat at described input face and the described back side, improve Consumer's Experience.
Here, it should be noted that, auxiliary functional layers 12 described in the present embodiment is arranged on described first fixed bed 11, and described second fixed bed 13 be arranged at described auxiliary functional layers 12 upper " on ", not for limiting in concept of space between described first fixed bed 11, described auxiliary functional layers 12 and described second fixed bed 13 three, but to represent in one direction " on "; Such as, in Fig. 1 arrow shown on direction " on "; Or in Fig. 2 on direction shown in arrow " on ", or, the meaning that can also characterize direct laminating, paste or connect.In like manner, described thermal insulation layer 122 be arranged at described auxiliary heat dissipation layer 121 upper " on " be also represent in one direction " on ", now, when described thermal insulation layer 122 is arranged on described auxiliary heat dissipation layer 121, directly can paste between described thermal insulation layer 122 and described auxiliary heat dissipation layer 121, other layers can also be provided with.
In the present embodiment, described electronic equipment can be specially notebook computer, panel computer etc.
In the present embodiment, described auxiliary functional layers is highly heat-conductive material; Described at least two fixed beds are high-strength material; Wherein, the heat conduction parameter of described high-strength material is less than the heat conduction parameter of described highly heat-conductive material.
In actual applications, the material that each fixed bed in described at least two fixed beds adopts is carbon fiber, also namely fixed bed is carbon fiber layer, so, because carbon fiber has the advantages such as intensity is high, quality is light, so described heat radiation workpiece, under the prerequisite ensureing high strength, can lay the foundation for the requirement that electronic equipment is more and more lightening.Further, the material that described auxiliary functional layers adopts is highly heat-conductive material, also be highly heat-conductive material layer, here, the material selected due to described auxiliary functional layers possesses high thermal conductivity, the heat conduction parameter of its highly heat-conductive material is greater than the conductive coefficient of the high-strength material that described fixed bed is selected, so, heat radiation workpiece described in the present embodiment not only possesses the advantages such as intensity is high, quality is light, but also described electronic equipment can be assisted to dispel the heat to described thermal source, therefore, the heat-sinking capability of described electronic equipment is improved.
In actual applications, as shown in Figure 4, described heat radiation workpiece also comprises separator 14; Wherein, described separator 14 is arranged between described auxiliary heat dissipation layer 121 and thermal insulation layer 122, described auxiliary heat dissipation layer 121 and thermal insulation layer 122 to be isolated, so, improves radiating efficiency further.Here, described separator can adopt high-strength material, such as carbon fiber, also can select highly heat-conductive material.
Like this, the heat radiation workpiece described in the embodiment of the present invention and electronic equipment, by arranging auxiliary functional layers between fixed bed, and being obtained the heat of the thermal source of described electronic equipment, realizing the object of dispelling the heat to described thermal source by auxiliary functional layers; So, the heat radiation workpiece described in the embodiment of the present invention can improve the radiating efficiency of electronic equipment; And, with existing fan-free (fanless) electronic equipment by compared with the mode the material at the back side being elected as metal material and realize dispelling the heat, the embodiment of the present invention while the described electronic equipment dissipating heat efficiency of raising, can realize the lightening of electronic equipment.
In addition, when described auxiliary functional layers selects highly heat-conductive material, high-strength material selected by fixed bed, and the heat conduction parameter of described high-strength material is when being less than the heat conduction parameter of described highly heat-conductive material, it is high that heat radiation workpiece described in the embodiment of the present invention not only possesses intensity, the advantages such as quality is light, but also described electronic equipment can be assisted to dispel the heat to described thermal source, therefore, when by described heat radiation workpiece setting in described electronic equipment time, user can not only be met to the lightening requirement of electronic equipment, the requirement of user to heat radiation can also be met, improve Consumer's Experience.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.

Claims (10)

1. a heat radiation workpiece for electronic equipment, described heat radiation workpiece comprises: at least two fixed beds and auxiliary functional layers; Wherein,
The first fixed bed in described at least two fixed beds, for being connected with the thermal source in described electronic equipment, obtains the heat of described thermal source;
Described auxiliary functional layers, is arranged on described first fixed bed, for obtaining the heat of described first fixed bed, to dispel the heat to described thermal source;
The second fixed bed in described at least two fixed beds, is arranged in described auxiliary functional layers, is connected for being fixed with described electronic equipment.
2. method according to claim 1, is characterized in that, described auxiliary functional layers is highly heat-conductive material; Described at least two fixed beds are high-strength material; Wherein, the heat conduction parameter of described high-strength material is less than the heat conduction parameter of described highly heat-conductive material.
3. heat radiation workpiece according to claim 1, is characterized in that, described auxiliary functional layers comprises: auxiliary heat dissipation layer and thermal insulation layer; Wherein,
Described thermal insulation layer is arranged on described auxiliary heat dissipation layer, isolates for the heat that will get and described second fixed bed, to reduce the surface temperature being fixed the described electronic equipment be connected with described second fixed bed.
4. heat radiation workpiece according to claim 3, it is characterized in that, the heat conduction parameter of described thermal insulation layer is less than the heat conduction parameter of the air that environment is corresponding residing for described heat radiation workpiece, so that the heat got by described auxiliary heat dissipation layer spreads at described auxiliary heat dissipation layer, the temperature of balanced described auxiliary heat dissipation layer.
5. the heat radiation workpiece according to claim 3 or 4, is characterized in that, described heat radiation workpiece also comprises separator; Wherein, described separator is arranged between described auxiliary heat dissipation layer and thermal insulation layer, described auxiliary heat dissipation layer and thermal insulation layer to be isolated.
6. heat radiation workpiece according to claim 5, is characterized in that, described separator is high-strength material, or is highly heat-conductive material.
7. an electronic equipment, comprises at least one heat radiation workpiece; Heat radiation workpiece at least one heat radiation workpiece described comprises: at least two fixed beds and auxiliary functional layers; Wherein,
The first fixed bed in described at least two fixed beds, for being connected with the thermal source in described electronic equipment, obtains the heat of described thermal source;
Described auxiliary functional layers, is arranged on described first fixed bed, for obtaining the heat of described first fixed bed, to dispel the heat to described thermal source;
The second fixed bed in described at least two fixed beds, is arranged in described auxiliary functional layers, is connected for being fixed with described electronic equipment.
8. electronic equipment according to claim 7, described auxiliary functional layers comprises: auxiliary heat dissipation layer and thermal insulation layer; Wherein,
Described thermal insulation layer is arranged on described auxiliary heat dissipation layer, isolates for the heat that will get and described second fixed bed, to reduce the surface temperature being fixed the described electronic equipment be connected with described second fixed bed.
9. electronic equipment according to claim 8, it is characterized in that, when the first surface of described electronic equipment is connected with described second fixed bed, described reduction is fixed the surface temperature of the described electronic equipment be connected with described second fixed bed, comprising:
Reduce the surface temperature being fixed the described first surface be connected with described second fixed bed;
Wherein, described first surface is the back side of the processing unit place body of described electronic equipment; Or, be the input face of the input unit of the input unit place body of described electronic equipment.
10. method according to claim 8 or claim 9, it is characterized in that, described heat radiation workpiece also comprises separator; Wherein, described separator is arranged between described auxiliary heat dissipation layer and thermal insulation layer, described auxiliary heat dissipation layer and thermal insulation layer to be isolated.
CN201510697750.3A 2015-10-23 2015-10-23 Radiate workpiece and electronic equipment Active CN105357933B (en)

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