CN105357933B - Radiate workpiece and electronic equipment - Google Patents
Radiate workpiece and electronic equipment Download PDFInfo
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- CN105357933B CN105357933B CN201510697750.3A CN201510697750A CN105357933B CN 105357933 B CN105357933 B CN 105357933B CN 201510697750 A CN201510697750 A CN 201510697750A CN 105357933 B CN105357933 B CN 105357933B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
The embodiment of the invention discloses the heat dissipation workpiece of a kind of electronic equipment, the heat dissipation workpiece includes: at least two fixing layers and auxiliary functional layers；Wherein, the first fixing layer at least two fixing layer obtains the heat of the heat source for connecting with the heat source in the electronic equipment；The auxiliary functional layers are set on first fixing layer, for obtaining the heat of first fixing layer, to radiate to the heat source；The second fixing layer at least two fixing layer, is set in the auxiliary functional layers, for being fixedly connected with the electronic equipment.The embodiment of the invention also provides a kind of electronic equipment.
Description
Technical field
The present invention relates to the heat dissipation technologys more particularly to a kind of heat dissipation workpiece and electronic equipment in electronic equipment.
Background technique
Electronic equipment is already at not retrievable article in for people's lives；Moreover, requirement of the user to electronic equipment
Increasingly diversification, for example, ultra-thin laptop is increasingly favored by user；Existing ultra-thin laptop is usual
It is designed using fan-free (fan-less), reduces the weight of laptop；But existing fan-less design is passed by heat
It leads and heat radiation mode radiates, heat dissipation effect is bad；Therefore, how to be carried out in heat transfer and heat radiation mode scattered
Increase the problem of radiating efficiency becomes urgent need to resolve in the process of heat, to promote user experience.
Summary of the invention
To solve existing technical problem, the embodiment of the invention provides a kind of heat dissipation workpiece and electronic equipments.
The technical solution of the embodiment of the present invention is achieved in that
The embodiment of the invention provides the heat dissipation workpiece of a kind of electronic equipment, the heat dissipation workpiece includes: at least two solid
Given layer and auxiliary functional layers；Wherein,
The first fixing layer at least two fixing layer is obtained for connecting with the heat source in the electronic equipment
The heat of the heat source；
The auxiliary functional layers are set on first fixing layer, for obtaining the heat of first fixing layer, with
It radiates to the heat source；
The second fixing layer at least two fixing layer, is set in the auxiliary functional layers, is used for and the electricity
Sub- equipment is fixedly connected.
The embodiment of the invention also discloses a kind of electronic equipment, including at least one heat dissipation workpiece；It is described at least one dissipate
Heat dissipation workpiece in heated work pieces includes: at least two fixing layers and auxiliary functional layers；Wherein,
The first fixing layer at least two fixing layer is obtained for connecting with the heat source in the electronic equipment
The heat of the heat source；
The auxiliary functional layers are set on first fixing layer, for obtaining the heat of first fixing layer, with
It radiates to the heat source；
The second fixing layer at least two fixing layer, is set in the auxiliary functional layers, is used for and the electricity
Sub- equipment is fixedly connected.
The heat dissipation workpiece and electronic equipment of electronic equipment described in the embodiment of the present invention, it is auxiliary by being arranged between fixing layer
Assist ergosphere, and the heat of the heat source of the electronic equipment is obtained by auxiliary functional layers, realization radiates to the heat source
Purpose；In this way, heat dissipation workpiece described in the embodiment of the present invention can be improved the radiating efficiency of electronic equipment；Moreover, with existing
Fan-free (fanless) electronic equipment is compared by way of the material at the back side to be selected as to metal material and realizes heat dissipation, the present invention
Embodiment can realize the lightening of electronic equipment while improving the electronic equipment dissipating heat efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram one of the heat dissipation workpiece of electronic equipment of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram two of the heat dissipation workpiece of electronic equipment of the embodiment of the present invention；
Fig. 3 is the structural schematic diagram three of the heat dissipation workpiece of electronic equipment of the embodiment of the present invention；
Fig. 4 is the structural schematic diagram four of the heat dissipation workpiece of electronic equipment of the embodiment of the present invention；
Fig. 5 is the structural schematic diagram for two heat dissipation workpiece being arranged in electronic equipment of the embodiment of the present invention.
Specific embodiment
In order to more fully hereinafter understand the features of the present invention and technology contents, with reference to the accompanying drawing to reality of the invention
It is now described in detail, appended attached drawing purposes of discussion only for reference, is not used to limit the present invention.
Embodiment one
Fig. 1 is the structural schematic diagram one of the heat dissipation workpiece of electronic equipment of the embodiment of the present invention；As shown in Figure 1, the heat dissipation
Workpiece includes: at least two fixing layers and auxiliary functional layers；Wherein,
The first fixing layer 11 at least two fixing layer is obtained for connecting with the heat source in the electronic equipment
Take the heat of the heat source；
The auxiliary functional layers 12 are set on first fixing layer 11, for obtaining first fixing layer 11
Heat, to radiate to the heat source；
The second fixing layer 13 at least two fixing layer, is set in the auxiliary functional layers 12, is used for and institute
Electronic equipment is stated to be fixedly connected.
Here it is worth noting that auxiliary functional layers 12 described in the present embodiment are set on first fixing layer 11,
And second fixing layer 13 is set to the "upper" in the auxiliary functional layers 12, and it is fixed to be not intended to limit described first
To be upper in concept of space between layer 11, the auxiliary functional layers 12 and 13 three of the second fixing layer, but indicate
"upper" in a direction；Example as shown in figure 1 arrow shown in "upper" on direction；Or in Fig. 2 on direction shown in arrow
"upper", alternatively, the meaning for directly fitting, pasting or connecting can also be characterized.
In the present embodiment, the electronic equipment can be specially laptop, tablet computer etc..
In the present embodiment, the auxiliary functional layers are highly heat-conductive material；At least two fixing layer is high-strength material；
Wherein, the thermally conductive parameter of the high-strength material is less than the thermally conductive parameter of the highly heat-conductive material.
In practical applications, the material that each fixing layer at least two fixing layer uses for carbon fiber, namely
Fixing layer is carbon fiber layer, in this way, since carbon fiber has many advantages, such as intensity height, light weight, so, the heat dissipation workpiece is being protected
Under the premise of card is high-intensitive, it can lay the foundation for the more and more lightening requirement of electronic equipment.Further, the auxiliary function
The material that ergosphere uses is highly heat-conductive material namely highly heat-conductive material layer, here, the material selected due to the auxiliary functional layers
Has high thermal conductivity, the thermally conductive parameter of highly heat-conductive material is greater than the thermally conductive system for the high-strength material that the fixing layer is selected
Number, so, heat dissipation workpiece described in the present embodiment not only has the advantages that high intensity, light weight, but also can assist described
Electronic equipment radiates to the heat source, therefore, improves the heat-sinking capability of the electronic equipment.
In this way, the heat dissipation workpiece of electronic equipment described in the embodiment of the present invention, by the way that auxiliary function is arranged between fixing layer
Ergosphere, and the heat of the heat source of the electronic equipment is obtained by auxiliary functional layers, realize the mesh to radiate to the heat source
's；In this way, heat dissipation workpiece described in the embodiment of the present invention can be improved the radiating efficiency of electronic equipment；Moreover, with existing calm
Fan (fanless) electronic equipment is compared by way of the material at the back side to be selected as to metal material and realizes heat dissipation, and the present invention is implemented
Example can realize the lightening of electronic equipment while improving the electronic equipment dissipating heat efficiency.
In addition, when the auxiliary functional layers select highly heat-conductive material, fixing layer selects high-strength material, and the high intensity
When the thermally conductive parameter of material is less than the thermally conductive parameter of the highly heat-conductive material, heat dissipation workpiece described in the embodiment of the present invention not only has
The advantages that standby intensity height, light weight, but also the electronic equipment can be assisted to radiate the heat source, therefore, as general
When the heat dissipation workpiece setting is in the electronic equipment, user's requirement lightening to electronic equipment can not only be met, also
It can satisfy requirement of the user to heat dissipation, the user experience is improved.
Embodiment two
Fig. 3 is the structural schematic diagram three of the heat dissipation workpiece of electronic equipment of the embodiment of the present invention；As shown in figure 3, the heat dissipation
Workpiece includes: at least two fixing layers and auxiliary functional layers；Wherein,
The first fixing layer 11 at least two fixing layer is obtained for connecting with the heat source in the electronic equipment
Take the heat of the heat source；
The auxiliary functional layers 12 are set on first fixing layer 11, for obtaining first fixing layer 11
Heat, to radiate to the heat source；
The second fixing layer 13 at least two fixing layer, is set in the auxiliary functional layers 12, is used for and institute
Electronic equipment is stated to be fixedly connected.
In the present embodiment, the auxiliary functional layers 12 include: auxiliary heat dissipation layer 121 and thermal insulation layer 122；Wherein, it is described every
Thermosphere 122 is set on the auxiliary heat dissipation layer 121, and the heat for will acquire is isolated with second fixing layer 13, with
Reduce the surface temperature for the electronic equipment being fixedly connected with second fixing layer 13.Further, described heat-insulated
The thermally conductive parameter of layer 122 is less than the thermally conductive parameter of the corresponding air of the heat dissipation workpiece local environment, in order to by the auxiliary
The heat that heat dissipating layer 121 is got is spread in the auxiliary heat dissipation layer 121, and the temperature of the balanced auxiliary heat dissipation layer 121 is realized
The purpose to radiate to the heat source.
In practical applications, since first fixing layer 11 is directly connect with the heat source of the electronic equipment, so institute
The heat that the first fixing layer 11 can be directly obtained the heat source is stated, and the auxiliary heat dissipation layer 121 is set to described first
On fixing layer 11, therefore, the auxiliary heat dissipation layer 121 can get the heat of the heat source by first fixing layer 11
Amount, it is here, if the auxiliary heat dissipation layer 121 is directly arranged on second fixing layer 13, i.e., directly fixed with described second
Layer 13 connects, at this point, then can directly transfer heat to the surface of the electronic equipment by second fixing layer 13, uses
Heat is experienced at family, in this way, reducing the experience of user；So heat is not felt by user in order to during realizing heat dissipation
Know, or perceived on a small quantity, the embodiment of the present invention increases thermal insulation layer 122, i.e., the described thermal insulation layer 122 is set to the auxiliary heat dissipation
On layer 121, the heat that the auxiliary heat dissipation layer 121 obtains is isolated with second fixing layer 13 by the thermal insulation layer 122,
That is, the heat that the auxiliary heat dissipation layer 121 obtains is isolated with the surface of electronic equipment, so make the heat not by with
Family is perceived, and user experience is promoted.
Here, the thermal insulation layer can select graphite, correspondingly can be described as graphite linings, and the addition of graphite linings can not only incite somebody to action
Heat is isolated with the second fixing layer, namely is isolated with the surface of electronic equipment；Moreover, because the thermally conductive parameter of graphite is less than described
The thermally conductive parameter of the corresponding air of the workpiece local environment that radiates, so what the thermal insulation layer can also get auxiliary heat dissipation layer
Heat is spread in itself, and then realizes the purpose to radiate to the heat source.
Here it is worth noting that auxiliary functional layers 12 described in the present embodiment are set on first fixing layer 11,
And second fixing layer 13 is set to the "upper" in the auxiliary functional layers 12, and it is fixed to be not intended to limit described first
To be upper in concept of space between layer 11, the auxiliary functional layers 12 and 13 three of the second fixing layer, but indicate
"upper" in a direction；Example as shown in figure 1 arrow shown in "upper" on direction；Or in Fig. 2 on direction shown in arrow
"upper", alternatively, the meaning for directly fitting, pasting or connecting can also be characterized.Similarly, the thermal insulation layer 122 is set to described auxiliary
Helping the "upper" on heat dissipating layer 121 is also the "upper" indicated in one direction, at this point, when the thermal insulation layer 122 is set to institute
When stating on auxiliary heat dissipation layer 121, it can directly paste, can also set between the thermal insulation layer 122 and the auxiliary heat dissipation layer 121
It is equipped with other layers.
In the present embodiment, the electronic equipment can be specially laptop, tablet computer etc..
In the present embodiment, the auxiliary functional layers are highly heat-conductive material；At least two fixing layer is high-strength material；
Wherein, the thermally conductive parameter of the high-strength material is less than the thermally conductive parameter of the highly heat-conductive material.
In practical applications, the material that each fixing layer at least two fixing layer uses for carbon fiber, namely
Fixing layer is carbon fiber layer, in this way, since carbon fiber has many advantages, such as intensity height, light weight, so, the heat dissipation workpiece is being protected
Under the premise of card is high-intensitive, it can lay the foundation for the more and more lightening requirement of electronic equipment.Further, the auxiliary function
The material that ergosphere uses is highly heat-conductive material namely highly heat-conductive material layer, here, the material selected due to the auxiliary functional layers
Has high thermal conductivity, the thermally conductive parameter of highly heat-conductive material is greater than the thermally conductive system for the high-strength material that the fixing layer is selected
Number, so, heat dissipation workpiece described in the present embodiment not only has the advantages that high intensity, light weight, but also can assist described
Electronic equipment radiates to the heat source, therefore, improves the heat-sinking capability of the electronic equipment.
In practical applications, as shown in figure 4, the heat dissipation workpiece further includes separation layer 14；Wherein, the separation layer 14 is set
It is placed between the auxiliary heat dissipation layer 121 and thermal insulation layer 122, the auxiliary heat dissipation layer 121 and thermal insulation layer 122 is isolated, such as
This, further increases radiating efficiency.Here, the separation layer can use high-strength material, such as carbon fiber, can also select
Highly heat-conductive material.
In this way, the heat dissipation workpiece of electronic equipment described in the embodiment of the present invention, by the way that auxiliary function is arranged between fixing layer
Ergosphere, and the heat of the heat source of the electronic equipment is obtained by auxiliary functional layers, realize the mesh to radiate to the heat source
's；In this way, heat dissipation workpiece described in the embodiment of the present invention can be improved the radiating efficiency of electronic equipment；Moreover, with existing calm
Fan (fanless) electronic equipment is compared by way of the material at the back side to be selected as to metal material and realizes heat dissipation, and the present invention is implemented
Example can realize the lightening of electronic equipment while improving the electronic equipment dissipating heat efficiency.
In addition, when the auxiliary functional layers select highly heat-conductive material, fixing layer selects high-strength material, and the high intensity
When the thermally conductive parameter of material is less than the thermally conductive parameter of the highly heat-conductive material, heat dissipation workpiece described in the embodiment of the present invention not only has
The advantages that standby intensity height, light weight, but also the electronic equipment can be assisted to radiate the heat source, therefore, as general
When the heat dissipation workpiece setting is in the electronic equipment, user's requirement lightening to electronic equipment can not only be met, also
It can satisfy requirement of the user to heat dissipation, the user experience is improved.
Embodiment three
The embodiment of the invention provides a kind of electronic equipment, including at least one heat dissipation workpiece；As shown in figure 3, it is described extremely
Heat dissipation workpiece in few heat dissipation workpiece includes: at least two fixing layers and auxiliary functional layers；Wherein,
The first fixing layer 11 at least two fixing layer is obtained for connecting with the heat source in the electronic equipment
Take the heat of the heat source；
The auxiliary functional layers 12 are set on first fixing layer 11, for obtaining first fixing layer 11
Heat, to radiate to the heat source；
The second fixing layer 13 at least two fixing layer, is set in the auxiliary functional layers 12, is used for and institute
Electronic equipment is stated to be fixedly connected.
In the present embodiment, the auxiliary functional layers 12 include: auxiliary heat dissipation layer 121 and thermal insulation layer 122；Wherein, it is described every
Thermosphere 122 is set on the auxiliary heat dissipation layer 121, and the heat for will acquire is isolated with second fixing layer 13, with
Reduce the surface temperature for the electronic equipment being fixedly connected with second fixing layer 13.Further, described heat-insulated
The thermally conductive parameter of layer 122 is less than the thermally conductive parameter of the corresponding air of the heat dissipation workpiece local environment, in order to by the auxiliary
The heat that heat dissipating layer 121 is got is spread in the auxiliary heat dissipation layer 121, and the temperature of the balanced auxiliary heat dissipation layer 121 is realized
The purpose to radiate to the heat source.
In practical applications, since first fixing layer 11 is directly connect with the heat source of the electronic equipment, so institute
The heat that the first fixing layer 11 can be directly obtained the heat source is stated, and the auxiliary heat dissipation layer 121 is set to described first
On fixing layer 11, therefore, the auxiliary heat dissipation layer 121 can get the heat of the heat source by first fixing layer 11
Amount, it is here, if the auxiliary heat dissipation layer 121 is directly arranged on second fixing layer 13, i.e., directly fixed with described second
Layer 13 connects, at this point, then can directly transfer heat to the surface of the electronic equipment by second fixing layer 13, uses
Heat is experienced at family, in this way, reducing the experience of user；So heat is not felt by user in order to during realizing heat dissipation
Know, or perceived on a small quantity, the embodiment of the present invention increases thermal insulation layer 122, i.e., the described thermal insulation layer 122 is set to the auxiliary heat dissipation
On layer 121, the heat that the auxiliary heat dissipation layer 121 obtains is isolated with second fixing layer 13 by the thermal insulation layer 122,
That is, the heat that the auxiliary heat dissipation layer 121 obtains is isolated with the surface of electronic equipment, so make the heat not by with
Family is perceived, and user experience is promoted.
Here, the thermal insulation layer can select graphite, correspondingly can be described as graphite linings, and the addition of graphite linings can not only incite somebody to action
Heat is isolated with the second fixing layer, namely is isolated with the surface of electronic equipment；Moreover, because the thermally conductive parameter of graphite is less than described
The thermally conductive parameter of the corresponding air of the workpiece local environment that radiates, so what the thermal insulation layer can also get auxiliary heat dissipation layer
Heat is spread in itself, and then realizes the purpose to radiate to the heat source.
In one embodiment, described when the first surface of the electronic equipment is connect with second fixing layer
Reduce the surface temperature for the electronic equipment being fixedly connected with second fixing layer, comprising: reduce and described second
The surface temperature for the first surface that fixing layer is fixedly connected；Wherein, the first surface is the electronic equipment
The back side of ontology where processing unit；Alternatively, for the input of the input unit of ontology where the input unit of the electronic equipment
Face.For example, the first surface is the back side of ontology where the non-display screen of the electronic equipment, such as the bottom of laptop；
Alternatively, the first surface is surface where the keyboard of the electronic equipment, that is to say, that the thermal insulation layer is by the heat source
Heat is isolated with the bottom of laptop, prevent user from perceive the heat or the thermal insulation layer by the heat with
Face isolation where the keyboard of laptop makes user not perceive the heat when inputting operation, and then promotes the body of user
It tests.
In practical applications, the heat dissipation workpiece there are two can be set in the electronic equipment, for example, as shown in figure 5,
Two heat dissipation workpiece are connect with heat source 15 respectively；Specifically, the first fixing layer 11 difference in two heat dissipation workpiece
It is connect with heat source 15；And the back side of ontology where the corresponding processing unit with the electronic equipment of two second fixing layers 13
Connection is connect with the input face of the input unit of ontology where the input unit of the electronic equipment, in this way, avoiding the heat source
Heat transfer to the back side of ontology where the processing unit, and avoid the heat transfer of the heat source to the input singly
The input face of the input unit of ontology where first, and then user is made not perceive heat in the input face and the back side
Amount, the user experience is improved.
Here it is worth noting that auxiliary functional layers 12 described in the present embodiment are set on first fixing layer 11,
And second fixing layer 13 is set to the "upper" in the auxiliary functional layers 12, and it is fixed to be not intended to limit described first
To be upper in concept of space between layer 11, the auxiliary functional layers 12 and 13 three of the second fixing layer, but indicate
"upper" in a direction；Example as shown in figure 1 arrow shown in "upper" on direction；Or in Fig. 2 on direction shown in arrow
"upper", alternatively, the meaning for directly fitting, pasting or connecting can also be characterized.Similarly, the thermal insulation layer 122 is set to described auxiliary
Helping the "upper" on heat dissipating layer 121 is also the "upper" indicated in one direction, at this point, when the thermal insulation layer 122 is set to institute
When stating on auxiliary heat dissipation layer 121, it can directly paste, can also set between the thermal insulation layer 122 and the auxiliary heat dissipation layer 121
It is equipped with other layers.
In the present embodiment, the electronic equipment can be specially laptop, tablet computer etc..
In the present embodiment, the auxiliary functional layers are highly heat-conductive material；At least two fixing layer is high-strength material；
Wherein, the thermally conductive parameter of the high-strength material is less than the thermally conductive parameter of the highly heat-conductive material.
In practical applications, the material that each fixing layer at least two fixing layer uses for carbon fiber, namely
Fixing layer is carbon fiber layer, in this way, since carbon fiber has many advantages, such as intensity height, light weight, so, the heat dissipation workpiece is being protected
Under the premise of card is high-intensitive, it can lay the foundation for the more and more lightening requirement of electronic equipment.Further, the auxiliary function
The material that ergosphere uses is highly heat-conductive material namely highly heat-conductive material layer, here, the material selected due to the auxiliary functional layers
Has high thermal conductivity, the thermally conductive parameter of highly heat-conductive material is greater than the thermally conductive system for the high-strength material that the fixing layer is selected
Number, so, heat dissipation workpiece described in the present embodiment not only has the advantages that high intensity, light weight, but also can assist described
Electronic equipment radiates to the heat source, therefore, improves the heat-sinking capability of the electronic equipment.
In practical applications, as shown in figure 4, the heat dissipation workpiece further includes separation layer 14；Wherein, the separation layer 14 is set
It is placed between the auxiliary heat dissipation layer 121 and thermal insulation layer 122, the auxiliary heat dissipation layer 121 and thermal insulation layer 122 is isolated, such as
This, further increases radiating efficiency.Here, the separation layer can use high-strength material, such as carbon fiber, can also select
Highly heat-conductive material.
In this way, heat dissipation workpiece and electronic equipment described in the embodiment of the present invention, by the way that auxiliary function is arranged between fixing layer
Ergosphere, and the heat of the heat source of the electronic equipment is obtained by auxiliary functional layers, realize the mesh to radiate to the heat source
's；In this way, heat dissipation workpiece described in the embodiment of the present invention can be improved the radiating efficiency of electronic equipment；Moreover, with existing calm
Fan (fanless) electronic equipment is compared by way of the material at the back side to be selected as to metal material and realizes heat dissipation, and the present invention is implemented
Example can realize the lightening of electronic equipment while improving the electronic equipment dissipating heat efficiency.
In addition, when the auxiliary functional layers select highly heat-conductive material, fixing layer selects high-strength material, and the high intensity
When the thermally conductive parameter of material is less than the thermally conductive parameter of the highly heat-conductive material, heat dissipation workpiece described in the embodiment of the present invention not only has
The advantages that standby intensity height, light weight, but also the electronic equipment can be assisted to radiate the heat source, therefore, as general
When the heat dissipation workpiece setting is in the electronic equipment, user's requirement lightening to electronic equipment can not only be met, also
It can satisfy requirement of the user to heat dissipation, the user experience is improved.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (7)
1. the heat dissipation workpiece of a kind of electronic equipment, the heat dissipation workpiece includes: at least two fixing layers and auxiliary functional layers；Its
In,
The first fixing layer at least two fixing layer, for being connect with the heat source in the electronic equipment, described in acquisition
The heat of heat source；
The auxiliary functional layers are set on first fixing layer, for obtaining the heat of first fixing layer, to institute
It states heat source to radiate, the auxiliary functional layers include: auxiliary heat dissipation layer and thermal insulation layer；Wherein, the thermal insulation layer is set to institute
It states on auxiliary heat dissipation layer, the heat for will acquire is isolated with the second fixing layer, is carried out with reducing with second fixing layer
The surface temperature for the electronic equipment being fixedly connected；The thermally conductive parameter of the thermal insulation layer is less than the heat dissipation workpiece local environment
The thermally conductive parameter of corresponding air, in order to which the heat for getting the auxiliary heat dissipation layer is spread in the auxiliary heat dissipation layer,
The temperature of the balanced auxiliary heat dissipation layer；
The second fixing layer at least two fixing layer, is set in the auxiliary functional layers, for setting with the electronics
It is standby to be fixedly connected；
Wherein, the material that each fixing layer at least two fixing layer uses is carbon fiber.
2. heat dissipation workpiece according to claim 1, which is characterized in that the auxiliary functional layers are highly heat-conductive material；It is described
At least two fixing layers are high-strength material；Wherein, the thermally conductive parameter of the high-strength material is less than the highly heat-conductive material
Thermally conductive parameter.
3. heat dissipation workpiece according to claim 1, which is characterized in that the heat dissipation workpiece further includes separation layer；Wherein, institute
It states separation layer to be set between the auxiliary heat dissipation layer and thermal insulation layer, the auxiliary heat dissipation layer and thermal insulation layer is isolated.
4. heat dissipation workpiece according to claim 3, which is characterized in that the separation layer is high-strength material, or is height
Heat Conduction Material.
5. a kind of electronic equipment, including at least one heat dissipation workpiece；It is described at least one heat dissipation workpiece in heat dissipation workpiece include:
At least two fixing layers and auxiliary functional layers；Wherein,
The first fixing layer at least two fixing layer, for being connect with the heat source in the electronic equipment, described in acquisition
The heat of heat source；
The auxiliary functional layers are set on first fixing layer, for obtaining the heat of first fixing layer, to institute
It states heat source to radiate, the auxiliary functional layers include: auxiliary heat dissipation layer and thermal insulation layer；Wherein, the thermal insulation layer is set to institute
It states on auxiliary heat dissipation layer, the heat for will acquire is isolated with the second fixing layer, is carried out with reducing with second fixing layer
The surface temperature for the electronic equipment being fixedly connected；The thermally conductive parameter of the thermal insulation layer is less than the heat dissipation workpiece local environment
The thermally conductive parameter of corresponding air, in order to which the heat for getting the auxiliary heat dissipation layer is spread in the auxiliary heat dissipation layer,
The temperature of the balanced auxiliary heat dissipation layer；
The second fixing layer at least two fixing layer, is set in the auxiliary functional layers, for setting with the electronics
It is standby to be fixedly connected；
Wherein, the material that each fixing layer at least two fixing layer uses is carbon fiber.
6. electronic equipment according to claim 5, which is characterized in that when the first surface and described second of the electronic equipment
When fixing layer connects, the surface temperature for the electronic equipment that the reduction is fixedly connected with second fixing layer, packet
It includes:
Reduce the surface temperature for the first surface being fixedly connected with second fixing layer；
Wherein, the first surface is the back side of ontology where the processing unit of the electronic equipment；Alternatively, being set for the electronics
The input face of the input unit of ontology where standby input unit.
7. electronic equipment according to claim 5 or 6, which is characterized in that the heat dissipation workpiece further includes separation layer；Its
In, the separation layer is set between the auxiliary heat dissipation layer and thermal insulation layer, and the auxiliary heat dissipation layer and thermal insulation layer are isolated.
Priority Applications (1)
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| CN201510697750.3A CN105357933B (en) | 2015-10-23 | 2015-10-23 | Radiate workpiece and electronic equipment |
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| CN201510697750.3A CN105357933B (en) | 2015-10-23 | 2015-10-23 | Radiate workpiece and electronic equipment |
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| CN105357933A CN105357933A (en) | 2016-02-24 |
| CN105357933B true CN105357933B (en) | 2019-01-15 |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203251562U (en) * | 2013-04-22 | 2013-10-23 | 孙利庆 | Heat dissipation sheet |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN204047017U (en) * | 2014-09-26 | 2014-12-24 | 络派模切（北京）有限公司 | A kind of heat conductive pad |
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| CN105357933A (en) | 2016-02-24 |
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