CN102802379B - Radiating subassembly and electronic equipment - Google Patents
Radiating subassembly and electronic equipment Download PDFInfo
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- CN102802379B CN102802379B CN201110178642.7A CN201110178642A CN102802379B CN 102802379 B CN102802379 B CN 102802379B CN 201110178642 A CN201110178642 A CN 201110178642A CN 102802379 B CN102802379 B CN 102802379B
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Abstract
A kind of radiating subassembly comprises protective cover and a heat-sink unit, described heat-sink unit comprises a plate-shaped base, is arranged at the first clamping part in plate-shaped base, the second clamping part and fin, and the first clamping part and the second clamping part and fin are arranged on the relative two sides of plate-shaped base respectively; Described protective cover is formed a pair snap fit, described snap fit is arranged in make protective cover and heat-sink unit mutually fasten to form a cavity in the first clamping part, and the second clamping part is used for a pcb board to fix in described cavity.The heat that on pcb board, the device of golf calorific value produces conducts to radiating subassembly by directed conductivity printed circuit board (PCB) rapidly and outside distribute heat, and the temperature of whole pcb board is consistent substantially.The present invention also provides in one the electronic equipment applying above-mentioned radiating subassembly.
Description
Technical field
The present invention relates to a kind of field of radiating of electronic equipment, particularly relate to a kind of radiating subassembly for pcb board and apply the electronic equipment of this radiating subassembly.
Background technology
At present, when pcb board there being minority device heating amount larger, radiator or heat pipe can be added on heater members, if when temperature can't lower, the radiator of band fan can be adopted, to strengthen radiating effect.When pcb board there being heater members amount more, can adopt large heat dissipating housing, it is the heat radiator dedicated of the customization by the position of heater members on pcb board and height or plucks out different element high and low positions on a large flat radiator.Heat dissipating housing entirety is buckled on component side, contacts with each element and dispel the heat.But because during components and parts welding equipment, height consistency is poor, radiating effect is also bad.Function along with circuit strengthen and along with the height of product chips integrated, electronic component high-speed cruising must produce a large amount of heats, and in order to ensure that components and parts work efficiently below normal working temperature, relevant heat dissipation technology has just more and more embodied bottleneck effect.
Summary of the invention
Based on this, the invention provides a kind of radiating subassembly of and high efficiency and heat radiation directed for pcb board.
A kind of radiating subassembly comprises protective cover and a heat-sink unit, described heat-sink unit comprises a plate-shaped base, is arranged at the first clamping part in plate-shaped base, the second clamping part and fin, and the first clamping part and the second clamping part and fin are arranged on the relative two sides of plate-shaped base respectively; Described protective cover is formed a pair snap fit, described snap fit is arranged in make protective cover and heat-sink unit mutually fasten to form a cavity in the first clamping part, and the second clamping part is used for a pcb board to fix in described cavity.
Further, described fin is different and shortened gradually to both sides by centre along the vertically extending length of plate-shaped base.
Further, the fin of the both wings of described plate-shaped base bends to certain radian and highly at least higher than adjacent fin.
Further, described first clamping part and the second clamping part are by two projections and form two catch arm in end, and described two protruding opposing two grooves form one first clamping parts, and described two protruding two relative grooves form one second clamping parts.
Further, described protective cover adopts metal radiation proof material to make.
Further, described plate-shaped base first clamping part, the second clamping part and the one-body molded processing technology of fin are made.
The present invention also provides a kind of electronic equipment applying radiating subassembly, described electronic equipment comprises described radiating subassembly and a pcb board, described radiating subassembly comprises protective cover and a heat-sink unit, described heat-sink unit comprises a plate-shaped base, is arranged at the first clamping part in plate-shaped base, the second clamping part and fin, and the first clamping part and the second clamping part and fin are arranged on the relative two sides of plate-shaped base respectively; Described protective cover is formed a pair snap fit, described snap fit is arranged in make protective cover and heat-sink unit mutually fasten to form a cavity in the first clamping part, and the second clamping part is used for described pcb board to fix in described cavity.
Further, institute's pcb board comprises the first metal layer, heat-conducting medium layer, the second metal level and copper clad layers, the electronic devices and components that copper clad layers is arranged.
Further, described the first metal layer and the second metal level all adopt metallic aluminium to make, and heat-conducting medium layer adopts heat conductive silica gel to make.
Further, described fin is different and shortened gradually to both sides by centre along the vertically extending length of plate-shaped base, and the fin of the both wings of described plate-shaped base bends to certain radian and length is at least longer than adjacent fin.
Hinge structure, electronic equipment adopt above-mentioned directed conductivity printed circuit board (PCB) can make the circuit of whole electronic equipment dispel the heat by the upwards heat-conducting mode of routine change over along under mode heat conduction, and then the internal structure layout of electronic equipment is more flexible.Above-mentioned pcb board heat conduction is even, and thermal resistivity is little.Further employing is to the inside structure of radiating subassembly and directed conductivity printed circuit board (PCB) design of electronic devices, and the heat that on pcb board, the device of golf calorific value produces conducts to radiating subassembly by directed conductivity printed circuit board (PCB) rapidly, and the temperature of whole pcb board is consistent substantially.Adopt the protective cover of metal that environment can also be prevented the electromagnetic interference of pcb board.
Accompanying drawing explanation
Fig. 1 is the stereogram of radiating subassembly in electronic equipment of the present invention;
Fig. 2 is the exploded view of Fig. 1 radiating subassembly;
Fig. 3 is the sectional view that Fig. 1 radiating subassembly installs a pcb board;
Fig. 4 is the sectional view of pcb board in electronic equipment of the present invention.
Embodiment
Referring to Fig. 1, is radiating subassembly stereogram in electronic equipment of the present invention.Described electronic equipment comprises a radiating subassembly 10.Described radiating subassembly 10 is applied in electronic equipments such as including but not limited to various consumer electronics device, server, radio-frequency apparatus, electronics and LED.
See also Fig. 2, the heat-sink unit 12 that described radiating subassembly 10 comprises a protective cover 11 and mutually fastens with described protective cover 11.Described protective cover 11 and heat-sink unit 12 fasten formation one cavity 9 mutually for an accommodating pcb board 13 (as shown in Figure 3).Described heat-sink unit 12 is provided with the first clamping part 123 and the second clamping part 124, described first clamping part 123 and the second clamping part 124 are formed by a pair groove.First clamping part 123 is for mutually fastening protective cover 11 and heat-sink unit 12.Second clamping part 124 is for being fixedly installed on pcb board 13 in cavity 9.
Described heat-sink unit 12 comprise a plate-shaped base 120, with plate-shaped base 120 integrated several fin 122, first clamping part 123 and second clamping parts 124.Described fin 122 lays respectively in the relative two panels of plate-shaped base 120 with clamping part 123,124.
Refer to Fig. 2, in the present embodiment, the first clamping part 123 and the second clamping part 124 are by two projections 125 and form two arms in end, and namely the projection 125 of cross section in " T " word shape is formed, and described two projections 125 be arranged in parallel.Described two protruding 125 opposing two grooves form one first clamping part 123, and two grooves formation one second clamping parts 124 that described two projections 125 are relative.
Described fin 122 is different along the vertically extending length of plate-shaped base 120, and is shortened gradually to both sides by centre.Further preferably, certain radian is become and length is at least longer than adjacent fin 122 at the fin 1210 of the both wings of plate-shaped base 120 to bent intermediate.
The both wings of protective cover 11 form a pair snap fit 101 to same direction, and described snap fit 101 is arranged in the first clamping part 123 to make protective cover 11 and heat-sink unit 12 mutually fasten.In the present embodiment, protective cover 11 adopts metal radiation proof material to make.
Refer to Fig. 4, in the present embodiment, the pcb board 13 that electronic equipment adopts comprises the first metal layer 97, heat-conducting medium layer 98, second metal level 99 and copper clad layers 100.Described copper clad layers 100 and heat-conducting medium layer 98 are arranged at the both sides of the second metal level 99 respectively, and the first metal layer 97 is arranged on described heat-conducting medium layer 98 side relative to the second metal level 99.
In the present embodiment, the first metal layer 97 adopts metallic aluminium, copper, silver etc. to make.
Described heat-conducting medium layer 98 for isolating described the first metal layer 97 and the second metal level 99, and adopts heat conductive silica gel to make.Due to the class adhesive that heat conductive silica gel adhesive is monocomponent room-temperature cured, rely on hydrone in ingress of air and solidify.Heat conductive silica gel is bi-component, comprising additivity and condensed type two class.Heat-conducting silica gel sheet has heat conduction and insulation characterisitic, and the first metal layer 97 and the second metal level 99 therefore can be easy to be bonded into one.Especially adopt the heat conductive silica gel being added with glass fibre (or carbon fiber) to increase its mechanical strength.
Described second metal level 99 also can adopt the metal materials such as aluminium, copper, silver.In the present embodiment, described the first metal layer and the second metal level select identical material aluminium.In other embodiments, described the first metal layer is not identical with the material that the second metal level is selected.
The directional heat conduction principle of above-mentioned pcb board: when the electronic devices and components that copper clad layers 100 is arranged, such as, when resistance, LED light-emitting diode, integrated circuit operation are with the heat produced, because the second metal level 99 conductive coefficient is greater than the conductive coefficient of air, therefore, most heat conduction to the second metal levels 99 that the electronic component being arranged at copper clad layers 100 produces; Then heat is conducted to 98 layers, heat-conducting medium layer, the first metal layer 97 successively fast, reception heat conduction is gone out by last the first metal layer 97, thus realize by traditional circuit dispel the heat by the upwards heat-conducting mode of routine change over along under mode heat conduction, make electronic equipment internal structure arrangement more flexible; And adopt between two metal levels and press from both sides every a heat conductive silica gel, make pcb board heat conduction even, thermal resistivity is little.
Refer to Fig. 3, the schematic diagram that pcb board 13 dispels the heat based on described radiating subassembly 10, when designing the electronic equipment containing circuit board, by adopting above-mentioned pcb board 13 to be arranged among radiating subassembly 10, heat conduction to plate-shaped base 120 is also passed through fin 122 outwards transferring heat by the first metal layer 97 of pcb board 13.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; do not departing under the ambit that present inventive concept and claim protect, also can make a lot of form, these all belong within protection of the present invention.
Claims (9)
1. a radiating subassembly, it is characterized in that, described radiating subassembly comprises protective cover and a heat-sink unit, described heat-sink unit comprises a plate-shaped base, the first clamping part be arranged in plate-shaped base, the second clamping part and fin, and the first clamping part is arranged on the relative two sides of plate-shaped base with the second clamping part and fin respectively; Described protective cover is formed a pair snap fit, described snap fit is arranged in make protective cover and heat-sink unit mutually fasten to form a cavity in the first clamping part, and the second clamping part is used for a pcb board to be fixed in described cavity;
Described first clamping part and the second clamping part convexing to form by two cross section shapes in T shape, the end of described projection forms two arms, two pairs of grooves are formed between two arms of described projection and described plate-shaped base, described two protruding two opposing grooves form one first clamping part, and described two protruding two relative grooves form one second clamping part.
2. radiating subassembly according to claim 1, is characterized in that, described fin is different and shortened gradually to both sides by centre along the vertically extending length of plate-shaped base.
3. radiating subassembly according to claim 2, is characterized in that, the fin of the both wings of described plate-shaped base bends to certain radian and highly at least higher than adjacent fin.
4. radiating subassembly according to claim 1, is characterized in that, described protective cover adopts metal radiation proof material to make.
5. radiating subassembly according to claim 3, is characterized in that, the first clamping part, the second clamping part and fin and described plate-shaped base are made up of one processing and forming technology.
6. an electronic equipment, it is characterized in that, described electronic equipment comprises a radiating subassembly and a pcb board, described radiating subassembly comprises protective cover and a heat-sink unit, described heat-sink unit comprises a plate-shaped base, the first clamping part be arranged in plate-shaped base, the second clamping part and fin, and the first clamping part is arranged on the relative two sides of plate-shaped base with the second clamping part and fin respectively; Described protective cover is formed a pair snap fit, described snap fit is arranged in make protective cover and heat-sink unit mutually fasten to form a cavity in the first clamping part, and the second clamping part is used for described pcb board to fix in described cavity;
Described first clamping part and the second clamping part convexing to form by two cross section shapes in T shape, the end of described projection forms two catch arm, two pairs of grooves are formed between the catch arm of described projection and described plate-shaped base, described two protruding two opposing grooves form one first clamping part, and described two protruding two relative grooves form one second clamping part.
7. electronic equipment according to claim 6, is characterized in that, described pcb board comprises the first metal layer, heat-conducting medium layer, the second metal level and copper clad layers, and copper clad layers is provided with electronic devices and components.
8. electronic equipment according to claim 7, is characterized in that, described the first metal layer and the second metal level all adopt metallic aluminium to make, and heat-conducting medium layer adopts heat conductive silica gel to make.
9. electronic equipment according to claim 7, it is characterized in that, described fin is different and shortened gradually to both sides by centre along the vertically extending length of plate-shaped base, and the fin of the both wings of described plate-shaped base bends to certain radian and length is at least longer than adjacent fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110178642.7A CN102802379B (en) | 2011-06-29 | 2011-06-29 | Radiating subassembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110178642.7A CN102802379B (en) | 2011-06-29 | 2011-06-29 | Radiating subassembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN102802379A CN102802379A (en) | 2012-11-28 |
| CN102802379B true CN102802379B (en) | 2015-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110178642.7A Active CN102802379B (en) | 2011-06-29 | 2011-06-29 | Radiating subassembly and electronic equipment |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159391A (en) * | 2013-05-15 | 2014-11-19 | 中兴通讯股份有限公司 | Heat dissipation device for terminal, and terminal |
| CN105357933B (en) * | 2015-10-23 | 2019-01-15 | 联想(北京)有限公司 | Radiate workpiece and electronic equipment |
| TWI633831B (en) | 2017-09-29 | 2018-08-21 | 威剛科技股份有限公司 | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101769524A (en) * | 2009-01-06 | 2010-07-07 | 富准精密工业(深圳)有限公司 | Light emitting diode lamp and light engine thereof |
| CN201827739U (en) * | 2010-09-15 | 2011-05-11 | 深圳市大族元亨光电股份有限公司 | Led light bar module |
| CN201827690U (en) * | 2010-07-23 | 2011-05-11 | 苏州京东方茶谷电子有限公司 | LED fluorescent tube |
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2011
- 2011-06-29 CN CN201110178642.7A patent/CN102802379B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101769524A (en) * | 2009-01-06 | 2010-07-07 | 富准精密工业(深圳)有限公司 | Light emitting diode lamp and light engine thereof |
| CN201827690U (en) * | 2010-07-23 | 2011-05-11 | 苏州京东方茶谷电子有限公司 | LED fluorescent tube |
| CN201827739U (en) * | 2010-09-15 | 2011-05-11 | 深圳市大族元亨光电股份有限公司 | Led light bar module |
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| Publication number | Publication date |
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| CN102802379A (en) | 2012-11-28 |
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