CN105828571A - Shielding and heat-dissipation structure of electronic device chip and electronic device - Google Patents
Shielding and heat-dissipation structure of electronic device chip and electronic device Download PDFInfo
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- CN105828571A CN105828571A CN201510689889.3A CN201510689889A CN105828571A CN 105828571 A CN105828571 A CN 105828571A CN 201510689889 A CN201510689889 A CN 201510689889A CN 105828571 A CN105828571 A CN 105828571A
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Abstract
The invention provides a shielding and heat-dissipation structure of an electronic device chip and an electronic device. The shielding and heat-dissipation structure of the electronic device chip comprises a printed circuit board; a composite structure arranged on the printed circuit board and used for shielding and dissipating the heat of the chip; and a heat conduction frame. The chip is fixed on the printed circuit board. The composite structure and the e printed circuit board together form an accommodating space. The first part of the composite structure is made of thermal interface materials. The chip is disposed in the accommodating space and is in attached connection with the first part of the composite structure. Through the first part of the composite structure and the heat conduction frame, the heat of the chip is exported to the outside. According to the embodiments of the invention, the heat conduction efficiency is improved. Meanwhile, the electromagnetic shielding problem of the chip is solved, and the interference is prevented.
Description
Technical field
The present invention relates to field of computer technology, particularly relate to shielding radiator structure and the electronic equipment of a kind of electronic equipment chip.
Background technology
High speed development along with intelligent mobile terminal, processor is from monokaryon, double-core develops into four current cores, eight cores, the resolution of display screen and the pixel of photographic head are also constantly rising simultaneously, while mobile terminal performance constantly promotes, chip power-consumption is more and more higher, this temperature directly resulting in chip constantly rises, but owing to chip overheating can affect performance (the such as central processor temperature the highest meeting frequency reducing of chip performance, photographic head temperature is the highest can affect image quality and bolt down procedure etc.), even shorten the life-span of chip, so the heat radiation of chip seems more and more important；Meanwhile, how chip, often due to interference needs to do shielding construction, can realize the shielding that chip is good, the heat radiation that can take into account again inside the internal limited space of mobile terminal, be that intelligent mobile terminal designs the problem that have to solve.
The chip shielding radiator structure that currently intelligent mobile terminal is commonly used is as shown in Figure 1, radome 6 is enclosed in chip 2 surrounding fitted on printed circuit board 1, between radome 6 and chip 2, increase Heat Conduction Material 8 realize quickly being transmitted on radome 6 heat of chip 2, rely on the heat dissipation film 7 being attached to above radome 6 further even heat to be scattered simultaneously.
This structure is not the highest chip (within 1w) for power consumption, and cooling system substantially meets and reduces the requirement that chip is lowered the temperature, but the chip of rising further for power consumption, and the power consumption of such as one single chip is more than 2w, the most inapplicable.As in figure 2 it is shown, due to heat dissipation film 7 limited area of whole cooling system, its area is limited to the area of radome 6 self, and the area of heat dissipation film 7 is generally less than the region of printed circuit board 1, and therefore heat dissipation cannot improve further.Simultaneously because need the reason of shielding, between Heat Conduction Material and heat dissipation film, there is one layer of shielding material, chip can be increased to the thermal resistance between heat dissipation film, be unfavorable for that heat is quickly transmitted on heat dissipation film.
Summary of the invention
It is an object of the invention to provide shielding radiator structure and the electronic equipment of a kind of electronic equipment chip, chip shielding electromagnetism can be solved while promoting chip power-consumption heat conduction efficiency with jamming-proof problem.
To achieve these goals, the embodiment of the present invention provides the shielding radiator structure of a kind of electronic equipment chip, including:
Printed circuit board, described printed circuit board is fixed with chip；
Being arranged on described printed circuit board, form an accommodation space for the combinative structure to the shielding heat radiation of described chip, described combinative structure and the combination of described printed circuit board, the Part I of wherein said combinative structure is made up of thermal interfacial material；Described chip is arranged in described accommodation space, and is fitted and connected with described Part I；
The outside being arranged at described combinative structure and the heat conduction frame being fitted and connected with described Part I, derived the heat on described chip by described Part I and described heat conduction frame.
Having the beneficial effect that of the technique scheme of invention:
In the scheme of the embodiment of the present invention, by being provided for chip is carried out the combinative structure of shielding heat radiation on a printed circuit board so that combinative structure and printed circuit board form the accommodation space of a receiving chip.The heat that chip produces is transferred to heat conduction frame by the Part I being made up of thermal interfacial material of combinative structure, and then the heat produced by chip is derived.Combinative structure and printed circuit board form a shielding construction simultaneously, can solve chip shielding electromagnetism with jamming-proof problem.The embodiment of the present invention is for not only needing to shield but also need the chip of good heat radiating, it is provided that a kind of preferably solution.
Accompanying drawing explanation
Fig. 1 is that prior art chip shields radiator structure schematic diagram one；
Fig. 2 is that prior art chip shields radiator structure schematic diagram two；
Fig. 3 is the shielding radiator structure schematic diagram one of embodiment of the present invention electronic equipment chip；
Fig. 4 is the shielding radiator structure schematic diagram two of embodiment of the present invention electronic equipment chip；
Fig. 5 is the shielding radiator structure schematic diagram three of embodiment of the present invention electronic equipment chip；
Fig. 6 is the shielding radiator structure heat transfer schematic diagram of embodiment of the present invention electronic equipment chip.
Wherein in figure: 1, printed circuit board；2, chip；3, combinative structure；31, Part I；32, Part II；33, the first side；4, heat conduction frame；5, conducting foam/conductive double sided adhesive tape；6, radome；7, heat dissipation film；8, Heat Conduction Material.
Detailed description of the invention
For making the technical problem to be solved in the present invention, technical scheme and advantage clearer, it is described in detail below in conjunction with the accompanying drawings and the specific embodiments.
Embodiment one
As it is shown on figure 3, the embodiment of the present invention provides the shielding radiator structure of a kind of electronic equipment chip, including:
Printed circuit board 1, described printed circuit board 1 is fixed with chip 2；
Being arranged on described printed circuit board 1, form an accommodation space for the combinative structure 3 to the shielding heat radiation of described chip 2, described combinative structure 3 and the combination of described printed circuit board 1, the Part I 31 of wherein said combinative structure 3 is made up of thermal interfacial material；Described chip 2 is arranged in described accommodation space, and is fitted and connected with described Part I 31；
The outside being arranged at described combinative structure 3 and the heat conduction frame 4 being fitted and connected with described Part I 31, derived the heat on described chip 2 by described Part I 31 and described heat conduction frame 4.
Concrete, fixed chip 2 on printed circuit board 1, a combinative structure 3 is set simultaneously, combinative structure 3 and printed circuit board 1 form an accommodation space, and chip 2 is positioned at accommodation space, and the Part I 31 of chip 2 and combinative structure 3 is fitted and connected.First the heat that chip 2 produces is transferred to the Part I 31 that thermal interfacial material is made, and then the heat received is transferred to the heat conduction frame 4 being fitted and connected with Part I 31 by Part I 31, and then the heat produced by chip 2 is derived.And the accommodation space that combinative structure 3 is formed with printed circuit board 1 combination, can carry out chip 2 shielding electromagnetism with anti-tampering.The embodiment of the present invention is for not only needing shielding electromagnetism but also need the chip of good heat radiating, it is provided that a kind of preferably solution.
The shielding radiator structure of a kind of electronic equipment chip that the embodiment of the present invention provides, by being provided for carrying out chip 2 combinative structure 3 of shielding heat radiation so that combinative structure 3 and printed circuit board 1 form the accommodation space of a receiving chip 2 on printed circuit board 1.The heat that chip 2 produces is transferred to heat conduction frame 4 by the Part I 31 being made up of thermal interfacial material of combinative structure 3, and then the heat produced by chip 2 is derived.Combinative structure 3 and printed circuit board 1 form a shielding construction simultaneously, can solve chip 2 and shield electromagnetism with jamming-proof problem.
Embodiment two
The shielding radiator structure of the embodiment of the present invention a kind of electronic equipment chip of offer, as shown in Figure 4, including:
Printed circuit board 1, described printed circuit board 1 is fixed with chip 2；
Being arranged on described printed circuit board 1, form an accommodation space for the combinative structure 3 to the shielding heat radiation of described chip 2, described combinative structure 3 and the combination of described printed circuit board 1, the Part I 31 of wherein said combinative structure 3 is made up of thermal interfacial material；Described chip 2 is arranged in described accommodation space, and is fitted and connected with described Part I 31；Described combinative structure 3 includes enclosing the Part II 32 being located at described chip 2 periphery, it is provided with perforate on first side 33 of described Part II 32, described Part I 31 is arranged at described tapping, and described Part II 32 combines with described Part I 31 and is formed as the accommodation space of a closing with printed circuit board 1.Wherein said first side 33 is relative with the first surface of described chip 2, and the second surface relative with described first surface on described chip 2 is fixedly connected on described printed circuit board 1；And it is arranged at the outside of described combinative structure 3 and the heat conduction frame 4 being fitted and connected with the first side 33 of described Part II 32, by described Part I 31 and described heat conduction frame 4, the heat on described chip 2 is derived.
Concrete, fixed chip 2 on printed circuit board 1, a combinative structure 3 is set simultaneously, combinative structure 3 and printed circuit board 1 form an accommodation space, and chip 2 is positioned at accommodation space.And the Part I 31 of chip 2 and combinative structure 3 is fitted and connected.Combinative structure 3 encloses and is provided with a perforate on the first side 33 that the first surface with chip 2 of the Part II 32 being located at chip 2 periphery is relative, Part I 31 is positioned at position of opening, and Part II 32 combines with Part I 31 and is formed as the accommodation space of a closing with printed circuit board 1, play shielding electromagnetism in case interference effect.And the first side 33 of Part II 32 is fitted and connected with heat conduction frame 4, the heat that chip 2 produces passes sequentially through the Part I 31 on combinative structure 3 and accommodation space derived by heat conduction frame 4.
The shielding radiator structure of a kind of electronic equipment chip that the embodiment of the present invention provides, by being provided for carrying out chip 2 combinative structure 3 of shielding heat radiation so that combinative structure 3 and printed circuit board 1 form the accommodation space of a receiving chip 2 on printed circuit board 1.The heat that chip 2 produces is transferred to heat conduction frame 4 by the Part I 31 being made up of thermal interfacial material of combinative structure 3, and the first side 33 of heat conduction frame 4 and Part II 32 is fitted and connected, ensure that effective transmission of heat, the heat produced by chip 2 derives accommodation space.Combinative structure 3 and printed circuit board 1 form the shielding construction of a closing simultaneously, can solve chip 2 and shield electromagnetism with jamming-proof problem.
Embodiment three
The embodiment of the present invention provides the shielding radiator structure of a kind of electronic equipment chip, as it is shown in figure 5, include:
Printed circuit board 1, described printed circuit board 1 is fixed with chip 2；
Being arranged on described printed circuit board 1, form an accommodation space for the combinative structure 3 to the shielding heat radiation of described chip 2, described combinative structure 3 and the combination of described printed circuit board 1, the Part I 31 of wherein said combinative structure 3 is made up of thermal interfacial material；Described chip 2 is arranged in described accommodation space, and is fitted and connected with described Part I 31；Described combinative structure 3 includes enclosing the Part II 32 being located at described chip 2 periphery, it is provided with perforate on first side 33 of described Part II 32, described Part I 31 is arranged at described tapping, it is additionally provided with conducting foam or conductive double sided adhesive tape 5 on first side 33 of described Part II 32, and it is arranged at the outside of described combinative structure 3 and the heat conduction frame 4 being fitted and connected with described Part I 31, by described Part I 31 and described heat conduction frame 4, the heat on described chip 2 is derived.
Concrete, the Part II 32 of combinations thereof structure 3 is the metal material that can shield electromagnetism, such as copper, aluminum, ferrum etc..Due to the above-mentioned Part I 31 being made up of thermal interfacial material, its filling thickness, commonly greater than the thickness of the first side 33 of Part II 32, may cause being formed between the first side 33 and heat conduction frame 4 gap.In order to ensure to shield the effect of electromagnetism, the preferred embodiments of the present invention form gap between the first side 33 and heat conduction frame 4 and are provided with conducting foam or conductive double sided adhesive tape 5.This preferred conducting foam or conductive double sided adhesive tape 5 can also avoid the first side 33 directly to contact with heat conduction frame 4, thus avoid the collision between two kinds of metal racks and friction.Wherein, described conducting foam or conductive double sided adhesive tape 5 are positioned at the both sides of described perforate and are fitted and connected with described heat conduction frame 4, described first side 33 is relative with the first surface of described chip 2, and the second surface relative with described first surface on described chip 2 is fixedly connected on described printed circuit board 1.
Concrete, fixed chip 2 on printed circuit board 1, a combinative structure 3 is set simultaneously, combinative structure 3 and printed circuit board 1 form an accommodation space, and chip 2 is positioned at accommodation space, and the Part I 31 of chip 2 and combinative structure 3 is fitted and connected.Combinative structure 3 encloses and is provided with a perforate on the first side 33 that the first surface with chip 2 of the Part II 32 being located at chip 2 periphery is relative, Part I 31 is positioned at position of opening, and the both sides of perforate are provided with conducting foam or conductive double sided adhesive tape 5, conducting foam or conductive double sided adhesive tape 5 and are fitted and connected with the first side 33 and heat conduction frame 4 respectively.Conducting foam or conductive double sided adhesive tape 5, combinative structure 3, printed circuit board 1 and heat conduction frame 4 combination form an enclosed construction, can solve chip 2 and shield electromagnetism with jamming-proof problem.As shown in Figure 6, the heat that chip 2 produces passes sequentially through Part I 31 and accommodation space derived by heat conduction frame 4, improves radiating efficiency.
The shielding radiator structure of the embodiment of the present invention a kind of electronic equipment chip, by being provided for carrying out chip 2 combinative structure 3 of shielding heat radiation so that combinative structure 3 and printed circuit board 1 form the accommodation space of a receiving chip 2 on printed circuit board 1.The heat that chip 2 produces is transferred to heat conduction frame 4 by the Part I 31 being made up of thermal interfacial material of combinative structure 3, and the heat produced by chip 2 derives accommodation space.Conducting foam or conductive double sided adhesive tape 5, combinative structure 3, printed circuit board 1 and heat conduction frame 4 combination simultaneously forms an enclosed construction, can solve chip 2 and shield electromagnetism with jamming-proof problem.
Embodiment four
The embodiment of the present invention provides the shielding radiator structure of a kind of electronic equipment chip, as it is shown on figure 3, include:
Printed circuit board 1, described printed circuit board 1 is fixed with chip 2；
Being arranged on described printed circuit board 1, form an accommodation space for the combinative structure 3 to the shielding heat radiation of described chip 2, described combinative structure 3 and the combination of described printed circuit board 1, the Part I 31 of wherein said combinative structure 3 is made up of thermal interfacial material；Described chip 2 is arranged in described accommodation space, and is fitted and connected with described Part I 31, and the area of described Part I 31 is more than the area of described chip 2；
The outside being arranged at described combinative structure 3 and the heat conduction frame 4 being fitted and connected with described Part I 31, the area of described heat conduction frame 4 is more than the area of described Part I 31, the inner surface of described Part I 31 is pasted onto on described chip 2, the outer surface of described Part I 31 is pasted onto on described heat conduction frame 4, is derived by the heat on described chip 2 by described Part I 31 and described heat conduction frame 4.
Concrete, fixed chip 2 on printed circuit board 1, a combinative structure 3 is set simultaneously, combinative structure 3 and printed circuit board 1 form an accommodation space, and chip 2 is positioned at accommodation space.And the Part I 31 of chip 2 and combinative structure 3 is fitted and connected, the area of Part I 31 is more than the area of chip 2, it is ensured that in heat transfer process, the heat that chip 2 distributes effectively can be absorbed by the Part I 31 of thermal interfacial material.Part I 31 transfers heat to the heat conduction frame 4 being fitted and connected with Part I 31 after obtaining heat, the area of heat conduction frame 4 is more than the area of Part I 31, it is ensured that effective transmission of heat, and then the heat produced by chip 2 is derived.The inner surface of Part I 31 is pasted onto on chip 2, and outer surface is pasted onto on heat conduction frame 4, and this connected mode simply firmly and is easy to heat transmission.Combinative structure 3 and printed circuit board 1 form a shielding construction simultaneously, can solve chip 2 and shield electromagnetism with jamming-proof problem.
The heat that embodiment of the present invention chip 2 produces is directly transferred on heat conduction frame 4 via thermal interfacial material, and thermal resistance is lower, is more beneficial for the heat radiation of chip 2.And the area of heat conduction frame 4 is more than the area of heat dissipation film 7 on traditional radome 6, and more than 3-4 times of its area often, according to newton heat convection formula:
Q=α A (Tw-Tair)
Wherein Q is the heat of exchange, and α is convection transfer rate, and A is heat exchange area, and Tw is heat dissipation film 7 or the temperature of heat conduction frame 4, and Tair is the temperature of air.For mobile terminal heat transfer free convection, convection transfer rate is certain, and heat dissipation film 7 or heat conduction frame 4 are with difference in air temperature one timing, and heat exchange area A is the biggest, dispels the heat the most.So large-area heat conduction frame 4 radiating efficiency is more than several times of heat dissipation film 7 in conventional shields 6.
Embodiment five
The embodiment of the present invention provides the shielding radiator structure of a kind of electronic equipment chip, as it is shown on figure 3, include:
Printed circuit board 1, described printed circuit board 1 is fixed with chip 2；
It is arranged on described printed circuit board 1, for the combinative structure 3 to the shielding heat radiation of described chip 2, described combinative structure 3 forms an accommodation space with the combination of described printed circuit board 1, the Part I 31 of wherein said combinative structure 3 is made up of thermal interfacial material, and described thermal interfacial material is thermally conductive gel or heat conductive silica gel；Described chip 2 is arranged in described accommodation space, and is fitted and connected with described Part I 31；
It is arranged at the outside of described combinative structure 3 and the aluminium alloy being fitted and connected with described Part I 31 or heat conduction frame 4 that magnesium-aluminium alloy material is made, by described Part I 31 and described heat conduction frame 4, the heat on described chip 2 is derived.This aluminium alloy or magnesium-aluminium alloy material support are the metal rack of high thermal conductivity, further help in the heat that conduction chip 2 produces.
Concrete, fixed chip 2 on printed circuit board 1, a combinative structure 3 is set simultaneously, combinative structure 3 and printed circuit board 1 form an accommodation space, and chip 2 is positioned at accommodation space.And the Part I 31 of chip 2 and combinative structure 3 is fitted and connected, first the heat that chip 2 produces is transferred to the Part I 31 that thermal interfacial material is made.Preferably, this thermal interfacial material uses thermally conductive gel or the heat conductive silica gel with stronger heat conductivility, it is ensured that the high efficiency transmission of heat；And this preferred thermally conductive gel or heat conductive silica gel are gel or flexible glue shape, are arranged between heat conduction frame 4 and chip 2, thus strengthen radiating effect.Then the heat received is transferred to the heat conduction frame 4 being fitted and connected with Part I 31 by Part I 31, and then the heat produced by chip 2 derives accommodation space.Heat conduction frame 4 uses aluminium alloy that heat conductivity is higher or magnesium-aluminium alloy material to make, and can be further ensured that effective transmission of heat.And the accommodation space that combinative structure 3 is formed with printed circuit board 1 combination, chip 2 can be shielded.
Embodiment six
The embodiment of the present invention provides a kind of electronic equipment, and described electronic equipment includes the shielding radiator structure of above-mentioned electronic equipment chip, and described heat conduction frame 4 is formed as a wherein support of described electronic equipment.
By being provided for chip 2 is carried out the combinative structure 3 of shielding heat radiation on printed circuit board 1 so that combinative structure 3 and printed circuit board 1 form the accommodation space of a receiving chip 2.The heat that chip 2 produces is transferred to heat conduction frame 4 by the Part I 31 being made up of thermal interfacial material of combinative structure 3, and then the heat produced by chip 2 is derived.Combinative structure 3 and printed circuit board 1 form a shielding construction simultaneously, can solve chip 2 and shield electromagnetism with jamming-proof problem.
Further, above-mentioned electronic equipment includes but not limited to the mobile terminal devices such as mobile phone, navigation, panel computer, digital camera.
The embodiment of the present invention provides ingenious and utilizes the internal large-area metal rack of mobile terminal device (especially smart mobile phone), by directly being contacted with interior metal support by thermal interfacial material, thus reduces the chip thermal resistance to cooling stand；Owing to area of dissipation increases considerably, the heat dissipation of mobile terminal device is increased dramatically.And, by increasing by circle conducting foam or a conductive double sided adhesive tape between shield bracket (i.e. combinations thereof structure 3) and interior metal support (the most above-mentioned heat conduction frame 4), also well solve chip simultaneously need to shielding electromagnetism is with jamming-proof problem.
Each embodiment in this specification all uses the mode gone forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, and between each embodiment, identical similar part sees mutually.
Although having been described for the preferred embodiment of the embodiment of the present invention, but those skilled in the art once know basic creative concept, then these embodiments can be made other change and amendment.So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of range of embodiment of the invention.
Finally, it can further be stated that, in this article, the relational terms of such as first and second or the like is used merely to separate an entity or operation with another entity or operating space, and not necessarily requires or imply the relation or sequentially that there is any this reality between these entities or operation.And, term " includes ", " comprising " or its any other variant are intended to comprising of nonexcludability, so that include that the process of a series of key element, method, article or terminal unit not only include those key elements, but also include other key elements being not expressly set out, or also include the key element intrinsic for this process, method, article or terminal unit.In the case of there is no more restriction, statement " including ... " key element limited, it is not excluded that there is also other identical element in including the process of described key element, method, article or terminal unit.
The above is the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, on the premise of without departing from principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (13)
1. the shielding radiator structure of an electronic equipment chip, it is characterised in that including:
Printed circuit board, described printed circuit board is fixed with chip；
Being arranged on described printed circuit board, form an accommodation space for the combinative structure to the shielding heat radiation of described chip, described combinative structure and the combination of described printed circuit board, the Part I of wherein said combinative structure is made up of thermal interfacial material；Described chip is arranged in described accommodation space, and is fitted and connected with described Part I；
The outside being arranged at described combinative structure and the heat conduction frame being fitted and connected with described Part I, derived the heat on described chip by described Part I and described heat conduction frame.
2. the shielding radiator structure of electronic equipment chip as claimed in claim 1, it is characterized in that, described combinative structure includes enclosing the Part II being located at described chip periphery, and the first side of described Part II is provided with perforate, and described Part I is arranged at described tapping；Wherein said first side is relative with the first surface of described chip, and the second surface relative with described first surface on described chip is fixedly connected on described printed circuit board.
3. the shielding radiator structure of electronic equipment chip as claimed in claim 2, it is characterised in that described Part II combines with described Part I and is formed as the accommodation space of a closing with described printed circuit board.
4. the shielding radiator structure of electronic equipment chip as claimed in claim 3, it is characterised in that described heat conduction frame is fitted and connected with the first side of described Part II.
5. the shielding radiator structure of electronic equipment chip as claimed in claim 2, it is characterised in that be provided with conducting foam or conductive double sided adhesive tape, described conducting foam or conductive double sided adhesive tape on the first side of described Part II and be fitted and connected with described heat conduction frame.
6. the shielding radiator structure of electronic equipment chip as claimed in claim 1, it is characterised in that the area of described Part I is more than the area of described chip.
7. the shielding radiator structure of electronic equipment chip as claimed in claim 1, it is characterised in that the inner surface of described Part I is pasted on the chip, and the outer surface of described Part I is pasted onto on described heat conduction frame.
8. the shielding radiator structure of electronic equipment chip as claimed in claim 1, it is characterised in that the area of described heat conduction frame is more than the area of described Part I.
9. the shielding radiator structure of electronic equipment chip as claimed in claim 1, it is characterised in that described thermal interfacial material is thermally conductive gel or heat conductive silica gel.
10. the shielding radiator structure of electronic equipment chip as claimed in claim 1, it is characterised in that described heat conduction frame is made up of aluminium alloy or magnesium-aluminium alloy material.
11. 1 kinds of electronic equipments, it is characterised in that described electronic equipment includes the shielding radiator structure of the electronic equipment chip as described in any one of claim 1～10.
12. electronic equipments as claimed in claim 11, it is characterised in that described heat conduction frame is formed as a wherein support of described electronic equipment.
13. electronic equipments as claimed in claim 11, it is characterised in that described electronic equipment includes at least one in mobile phone, navigation, panel computer, digital camera.
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| CN201510689889.3A CN105828571A (en) | 2015-10-21 | 2015-10-21 | Shielding and heat-dissipation structure of electronic device chip and electronic device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN203136420U (en) * | 2013-03-06 | 2013-08-14 | 惠州Tcl移动通信有限公司 | Terminal and shield with heat radiation structure |
| CN203279435U (en) * | 2013-04-22 | 2013-11-06 | 青岛海信移动通信技术股份有限公司 | Portable mobile terminal |
| CN104813760A (en) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | Heat radiation assembly and electric device |
| CN105188329A (en) * | 2015-09-24 | 2015-12-23 | 山东超越数控电子有限公司 | Electromagnetic shielding cover and electronic device |
-
2015
- 2015-10-21 CN CN201510689889.3A patent/CN105828571A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
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Application publication date: 20160803 |