CN212970586U

CN212970586U - Terminal device

Info

Publication number: CN212970586U
Application number: CN202022102434.6U
Authority: CN
Inventors: 龙静
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-04-13
Anticipated expiration: 2030-09-23

Abstract

The present disclosure relates to a terminal device, including: one or more processors; a middle frame disposed above the processor; the flexible heat conduction layer is arranged on the lower surface of the middle frame in whole or in part; and the lower surface of the shielding layer is connected with the processor through heat-conducting glue, and the upper surface of the shielding layer is connected with the flexible heat-conducting layer through heat-conducting glue. Through setting up flexible heat-conducting layer, make whole or partial laminating in the lower surface of center of flexible heat-conducting layer to reduce the distance of the heat conduction to the center of treater, and then reduce the treater and carry out heat-conducting thermal resistance value, the heat that makes the treater produce in time conducts to the center fast and scatters, and then improves the holistic radiating effect of terminal equipment, is showing the temperature rise that improves the treater.

Description

Terminal device

Technical Field

The disclosure relates to the technical field of heat dissipation of electronic products, in particular to a terminal device.

Background

With the development of intelligent electronic products, the heat generation amount of the heating elements inside the intelligent electronic products is higher and higher while the intelligent electronic products are required to have high performance. If the heat generated by the heating element is not radiated in time, the performance of the intelligent electronic product is seriously reduced. For example, in a mobile phone product, when a mobile phone runs a high-performance high-frame-rate mobile phone game, the heat value of a heating element in the mobile phone is increased, so that a mobile phone game screen is jammed, and the game experience of a user is seriously affected.

In the related art, since one surface of the middle frame of the mobile phone facing the display screen is flat, the heat dissipation material is disposed on the surface of the middle frame, and thus the distance from the heat dissipation material to the heating element is greater than the thickness of the middle frame. Because the distance between the heat dissipation material and the heating element is large, the thermal resistance value of the heat productivity of the heating element in the heat dissipation material can be increased, so that the heat productivity of the heating element can not be quickly dispersed through the heat dissipation material, and the performance and temperature rise experience of the whole machine are seriously influenced.

SUMMERY OF THE UTILITY MODEL

To overcome the problems in the related art, the present disclosure provides a terminal device.

An embodiment of the present disclosure provides a terminal device, including: one or more processors; a middle frame disposed above the processor; the flexible heat conduction layer is arranged on the lower surface of the middle frame in whole or in part; and the lower surface of the shielding layer is connected with the processor through heat-conducting glue, and the upper surface of the shielding layer is connected with the flexible heat-conducting layer through heat-conducting glue.

In one embodiment, the lower surface of the middle frame is non-planar; the flexible heat conduction layer is attached to the lower surface of the middle frame.

In one embodiment, the middle frame is provided with a through hole; one end of the flexible heat conduction layer is arranged on the lower surface of the middle frame, and the other end of the flexible heat conduction layer penetrates through the through hole and is attached to the upper surface of the middle frame.

In one embodiment, the flexible heat conducting layer is a flexible temperature-equalizing plate or a flexible heat pipe.

In one embodiment, the terminal device further includes: the one or more processors are arranged on the upper surface of the mainboard; the shielding cover is arranged on the mainboard and comprises side walls and a top wall, the side walls surround the one or more processors, the top wall is connected with the top ends of the side walls and is positioned above the processors, and heat dissipation holes are formed in the top wall; wherein the shielding layer covers the heat dissipation hole.

In one embodiment, the shielding layer is a metal foil.

In one embodiment, the shielding layer is a flexible temperature-uniforming plate or a flexible heat pipe.

In one embodiment, the shielding layer is disposed on an upper side or a lower side of the top wall of the shielding cover.

In one embodiment, the shielding layer further covers the side wall of the shielding cover.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the terminal equipment that this disclosed embodiment provided, through setting up flexible heat-conducting layer, make whole or partial laminating in the lower surface of center of flexible heat-conducting layer to reduce the distance that the radiating heat conduction of treater reaches the center, and then reduce the treater and carry out heat-conducting thermal resistance value, the heat that makes the treater produce in time conducts to the center fast and scatters, and then improves the holistic radiating effect of terminal equipment, is showing the temperature rise that improves the treater.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a sectional view showing a terminal device according to a related exemplary embodiment.

Fig. 2 is a cross-sectional view of a terminal device shown in accordance with an exemplary embodiment of the present disclosure.

Fig. 3 is a cross-sectional view illustrating a terminal device according to still another exemplary embodiment of the present disclosure.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminal device in the embodiments of the present disclosure may be a smartphone, a tablet computer, a wearable device, a game machine, and the like, but is not limited thereto. The processor of the terminal device in the embodiment of the present disclosure may be a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and other processors, and is not limited thereto. The processor is used as a main heating source in the terminal equipment, and the heating value is larger along with the increase of the calculated amount, so that the heat dissipation is required to be faster. The damage to the processor under the condition of high heat is avoided, or the performance of the processor is forced to be reduced due to overhigh temperature, the performance of the processor is improved after the temperature is reduced, the performance of the terminal equipment is sacrificed while the processor is protected

As shown in fig. 1, during operation of the terminal device 100, heat generated by the processor 101 is conducted to the heat conducting layer 105 through the first layer of heat conducting paste 102, the copper foil 103 and the second layer of heat conducting paste 104, and it is understood that the first layer of heat conducting paste 102, the copper foil 103, the second layer of heat conducting paste 104 and the heat conducting layer 105 form a heat conducting channel of the processor 101. Because the upper surface of the terminal device middle frame 106 is attached to the terminal device display screen, the upper surface of the terminal device middle frame 106 is flat, and the heat conduction layer 105 is generally attached to the upper surface of the terminal device middle frame 106 to dissipate heat conducted.

In the related art, in order to conduct the heat of the processor 101 to the middle frame 106 through the heat conducting layer 105 for heat dissipation, a through hole 107 is usually formed in the middle frame 106 of the terminal device, and a thick heat conducting glue 104 is filled in the through hole 107 to connect the heat conducting layer 105 with the copper foil 103, so that the heat conducting distance of the processor 101 is increased.

As shown in fig. 1, the heat conduction distance of the processor 101 is generally greater than the thickness of the frame 106 of the terminal device, and an increase in the heat conduction distance will correspondingly increase the thermal resistance of the heat conduction, thereby resulting in a poor heat conduction effect of the processor 101. In addition, since the thermal conductivity of the thermal conductive paste 104 is lower than those of the copper foil 103 and the thermal conductive layer 105, the thermal resistance of thermal conduction is also increased by the thicker thermal conductive paste 104. Therefore, in the related art, the heat of the processor 101 cannot be dissipated timely and quickly by conducting the heat through the heat conducting layer 105 to the middle frame 106.

In order to solve the problems in the related art, the present disclosure provides a terminal device. In the disclosed embodiment, the processor is one of the heat generating elements, and the middle frame is one of the heat dissipating members. The heat dissipation principle is that the heat of the processor is conducted to the middle frame through the shielding layer and the flexible heat conduction layer to dissipate heat, and the shielding layer, the flexible heat conduction layer and the heating element can be connected through heat conduction glue.

Terminal device fig. 2 is a cross-sectional view of a terminal device shown in accordance with an exemplary embodiment of the present disclosure. Fig. 3 is a cross-sectional view illustrating a terminal device according to still another exemplary embodiment of the present disclosure.

As shown in fig. 2 and fig. 3, a terminal device 200 provided in the embodiment of the present disclosure includes: a processor 201, a middle frame 202, a flexible heat conducting layer 203, and a shielding layer 204.

In some embodiments, the number of the processors 201 may be one, where one processor 201 only represents that the single processor 201 performs heat dissipation, and does not mean that the terminal device 200 only includes one processor 201; in other embodiments, a plurality of processors 201 (not shown), such as a formed processor array, may be included, and the heat dissipation may be performed on the plurality of processors together by the embodiments of the present disclosure.

The middle frame 202 may be disposed above the processor 201, and the terms of orientation such as upper in the present disclosure are only convenient for describing the relative position relationship between the components through the drawings, and the orientation may be changed due to the direction of the product being uncertain in the actual product. The middle frame 202 may be a middle frame of a mobile phone, and may serve as a heat dissipation component for dissipating heat from the processor 201.

The flexible heat conducting layer 203 may be disposed entirely on the lower surface of the middle frame 202 (as shown in fig. 2) for conducting heat from the processor 201 to the middle frame 202, or a part of the flexible heat conducting layer 203 may be disposed on the lower surface of the middle frame 202 (as shown in fig. 3).

The lower surface of the shielding layer 204 is connected to the processor 201 through a thermal conductive paste 208, and the upper surface of the shielding layer 204 is connected to the flexible thermal conductive layer 203 through the thermal conductive paste 208. The heat is transferred through the heat conducting glue 208, the heat of the processor 201 is transferred to the shielding layer 204 and then transferred to the flexible heat conducting layer 203, and finally the heat is radiated outwards through the middle frame 202 which is in large-area contact with the flexible heat conducting layer 204 to transfer the heat.

With the terminal device 200 provided by the embodiment of the present disclosure, all or part of the flexible heat conduction layer 203 is disposed on the lower surface of the middle frame 202 to reduce the distance between the middle frame 202 and the processor 201, thereby reducing the thermal resistance of the heat conduction of the processor 201. By reducing the thermal resistance of the processor 201, the heat dissipation effect of the processor 201 is further improved, so that the heat generated by the processor 201 can be timely and quickly conducted to the middle frame 202 for heat dissipation.

In the embodiment of the present disclosure, the flexible heat conducting layer 203 may be a flexible temperature-uniforming plate (VaporChamber, abbreviated as VC) or a flexible heat pipe (HeatPipe, abbreviated as HP). Because the flexible heat conduction layer 203 is flexible, the flexible heat conduction layer can be better attached to the middle frame 202 and other components, better contact is kept, corresponding arrangement can be carried out according to the shapes of the components, the flexible heat conduction layer 203 can change the shape of the flexible heat conduction layer 203 along with the structure of the components, and therefore heat conduction performance is improved.

Specifically, as shown in fig. 2, in a first embodiment of the present disclosure, there is provided a terminal device 200 including: a processor 201, a middle frame 202, a flexible heat conducting layer 203, and a shielding layer 204. Wherein, the whole of the flexible heat conduction layer 203 is arranged on the lower surface of the middle frame 202. In the embodiment of the present disclosure, the upper surface of the middle frame 202 may be used to attach to a display screen of a terminal device, the upper surface is relatively flat, and the lower surface of the middle frame 202 is not planar, and the flexible heat conduction layer 203 in the embodiment of the present disclosure may be attached to the lower surface of the middle frame 202. Because the flexible deformable characteristic of flexible heat-conducting layer 203 self, flexible heat-conducting layer 203 can carry out corresponding deformation based on the shape of center 202 lower surface to can realize the laminating purpose with center 202 lower surface through the double faced adhesive tape.

It will be appreciated that the conforming of the flexible heat conductive layer 203 to the lower surface of the middle frame 202 is achieved so that the heat conduction distance of the processor 201 is reduced by at least the thickness value of the middle frame 202 relative to the heat conduction distance of the related art. Moreover, the flexible heat conduction layer 203 can be attached to the lower surface of the middle frame 202 through double-sided adhesive tape, and the distance between the flexible heat conduction layer 203 and the middle frame 202 is close to zero.

Further, the terminal device 200 of the first embodiment of the present disclosure further includes: a motherboard 205 and a shield cover 206. The processor 201 is disposed on the upper surface of the motherboard 205, and is electrically connected to the motherboard 205, and the shielding cover 206 is also disposed on the motherboard 205. The shield cover 206 includes a side wall disposed around the processor 201, and a top wall connected to a top end of the side wall and located above the processor 201.

As shown in fig. 2, the wall of the shielding cover 206 around the processor 201 is the side wall of the shielding cover 206, and in practice, the side wall is disposed around the processor 201, and is not disposed on both sides of the processor 201 as shown in fig. 2. The sidewall may be disposed around the processor 201 in a circular shape, or may be disposed around the processor 201 in a polygonal shape. In the up-down direction, the wall of the shielding cover 206 above the processor 201 is the top wall of the shielding cover 206. The side walls and the top wall may be integrally formed, and the shielding cover 206 and the shielding layer 204 form a space for accommodating the processor 201, which has a function of shielding signal interference. Here, a side wall of the shield cover 206 facing the processor 201 in the left-right direction is defined as an inner side wall of the shield cover 206, and a side wall of the shield cover 206 facing away from the processor 201 in the left-right direction is defined as an outer side wall of the shield cover 206.

In the first embodiment of the present disclosure, the shielding cover 206 is disposed around the processor 201, and has a function of shielding signal interference. The shield cover 206 is typically made of stainless steel and cupronickel, which generally act as a signal shield for the processor 201, has relatively poor thermal conductivity, and the shield cover 206 is typically of a certain thickness, such as 0.2 mm. In order to reduce the thermal resistance of the shielding cover 206 in the process of dissipating heat from the processor 201, a heat dissipating hole 207 is provided on the top wall of the shielding cover 206. The heat dissipation hole 207 is filled with a heat conductive adhesive 208 having a higher thermal conductivity than the shielding cover 206, so that heat generated by the processor 201 can quickly pass through the shielding cover 206 and be conducted to the shielding layer 204 for further conduction.

Further, the shielding layer 204 has a certain extension in the left-right direction and covers the heat dissipation hole 207, so that a sealed cavity for accommodating the processor 201 is formed between the shielding cover 206 and the motherboard 205 and the shielding layer 204. The shielding layer 204 and the shielding cover 206 of the sealed cavity still play a role of shielding signal interference.

It is understood that, in the first embodiment of the present disclosure, the number of processors 201 disposed in the sealed cavity formed between the shielding cover 206 and the motherboard 205 and the shielding layer 204 may be one or more, depending on the performance requirement or production requirement of the terminal device 200.

In the first embodiment of the present disclosure, the top wall of the shielding cover 206 is provided with heat dissipation holes 207 for conducting heat of the processor 201 to the middle frame 202 through the heat dissipation holes 207, so as to avoid the top wall of the shielding cover 206 from hindering heat conduction of the processor 201. Further, in order to enhance the heat conduction effect of the processor 201, the heat dissipation holes 207 on the top of the shield cover 206 are preferably provided at positions just opposite to the processor 201, and the hole diameters of the heat dissipation holes 207 are preferably equal to the size of the processor 201.

With this arrangement, it can be ensured that the maximum heat value of the heat generated by the processor 201 is in the same straight line at the conduction positions of the heat conductive adhesive 208, the shielding layer 204 and the flexible heat conductive layer 203 during the heat conduction process, so that the heat generated by the processor 201 can be quickly conducted to the flexible heat conductive layer 203 and can be in large-area contact with the middle frame 202 for heat dissipation.

Specifically, in the first embodiment of the present disclosure, the heat dissipation hole 207 is filled with a first layer of heat-conducting glue 208, the shielding layer 204 is pressed, so that the shielding layer 204 is connected to the processor 201 through the first layer of heat-conducting glue 208, and the heat dissipation hole 207 is covered by the shielding layer 204. Or after the heat dissipation hole 207 is filled with the first layer of heat-conducting glue 208, the shielding layer 204 is placed on the heat dissipation hole 207, the second layer of heat-conducting glue 208 is dotted on the upper surface of the shielding layer 204, and the middle frame 202 is pressed, so that the shielding layer 204 is connected with the processor 201 through the first layer of heat-conducting glue 208 and covers the heat dissipation hole 207, and a heat conduction channel of the processor 201 is formed. The structure of the heat conduction channel is as follows from bottom to top: a first layer of thermally conductive glue 208, a shield layer 204, a second layer of thermally conductive glue 208, a flexible thermally conductive layer 203, and a center frame 202.

It should be noted that the first layer of thermal conductive paste 208 and the second layer of thermal conductive paste 208 in the first embodiment of the disclosure are defined from bottom to top, and the sequence of dispensing the thermal conductive paste 208 may also be defined as the first layer of thermal conductive paste 208 and the second layer of thermal conductive paste 208.

In the first embodiment of the disclosure, the opening position of the heat dissipation hole 207 is right opposite to the processor 201, and the diameter of the opening of the heat dissipation hole 207 is equal to the size of the processor 201, so that the heat generated by the processor 201 is directly conducted through the heat conduction channel. It is understood that, in the case where the opening diameter of the heat dissipation hole 207 is larger than the size of the processor 201, the space of the sealed cavity formed by the shielding cover 206, the shielding layer 204 and the main board 205 is relatively increased, and a part of the heat generated by the processor 201 is conducted to the shielding layer 204 through the air. Since the thermal conductivity of air is lower than that of the thermal conductive adhesive 208, the heat cannot be timely and quickly transferred to the shielding layer 204, and the overall thermal conduction effect of the processor 201 is relatively reduced.

In the first embodiment of the present disclosure, the shielding layer 204 is a metal foil, such as a copper foil or an aluminum foil. The copper foil or aluminum foil may form a hermetic chamber with the shield cover 206 and the motherboard 205 to shield and protect the processor 201. Moreover, the thermal conductivity of the copper foil or the aluminum foil is relatively high, so that the processor 201 is shielded and protected, and the heat generated by the processor 201 can be rapidly dissipated. The shielding layer 204 may also be a flexible heat conducting layer 203 or a flexible HP, the flexible heat conducting layer 203 and the flexible HP may also shield and protect the processor 201 to a certain extent, and the thermal conductivity of the flexible heat conducting layer 203 and the flexible HP is higher than that of a copper foil and an aluminum foil, thereby further ensuring rapid heat dissipation of heat generated by the processor 201.

Further, the shielding layer 204 is used for conducting heat generated by the processor 201 and also used for covering the heat dissipation hole 207, so that a sealed cavity is formed between the shielding cover 206 and the shielding layer 204 and the motherboard, and the processor 201 is prevented from being interfered by an external electromagnetic field or from being externally diffused by an internal interference electromagnetic field.

In the first embodiment of the present disclosure, the shielding layer 204 may be disposed on an upper side or a lower side of the top wall of the shielding cover 206, and extend in the left-right direction to cover the heat dissipation hole 207. Preferably, the shielding layer 204 is disposed on the lower side of the top wall of the shielding cover 206, and it is understood that, when so disposed, the distance of conduction of the heat generated by the processor 201 to the shielding layer 204 is significantly reduced, so that the heat generated by the processor 201 can be conducted to the shielding layer 204 relatively more rapidly, and thus dissipated on the middle frame 202 more rapidly.

In order to further improve the heat dissipation effect of the processor 201, in the first embodiment of the disclosure, the shielding layer 204 may be extended such that the shielding layer 204 covers the sidewalls of the shielding cover 206, i.e., the shielding layer 204 covers the inner sidewall and/or the outer sidewall of the shielding cover 206. By extending the shielding layer 204 and covering the side wall of the shielding cover 206, the heat in the sealed cavity formed by the shielding cover 206, the shielding layer 204 and the motherboard 205 can also be quickly conducted to the middle frame 202 for heat dissipation, so that the processor 201 in the sealed cavity is prevented from being in a warm environment, and the performance of the processor 201 is further improved.

As shown in fig. 2, in the first embodiment of the present disclosure, the heat conducting channel of the processor 201 is composed of, from bottom to top, a first layer of heat conducting paste 208, a shielding layer 204, a second layer of heat conducting paste 208, a flexible heat conducting layer 203, and a middle frame 202. In the above-described heat conduction channel structure of the processor 201, the shielding layer 204 may be a metal foil, a flexible heat conduction layer 203, or a flexible HP. Since the flexible heat conducting layer 203 or the flexible HP can play a certain shielding role, in a possible manner of the present disclosure, the structure of the heat conducting channel of the processor 201 may be, from bottom to top: thermally conductive glue 208, flexible thermally conductive layer 203 or flexible HP, center frame 202. In the structure of the heat conduction channel, the shielding layer 204 with a heat conduction coefficient relatively poor to the flexible heat conduction layer 203 or the flexible HP is omitted, so that heat generated by the processor 201 can be conducted to the middle frame 202 for heat dissipation only through one flexible heat conduction layer, and the heat resistance value of heat conduction of the processor 201 is reduced to the minimum so as to improve the heat dissipation effect of the processor 201 to the maximum extent.

The terminal device 200 provided by the first embodiment of the present disclosure is configured to attach the flexible heat conduction layer 203 to the non-planar lower surface of the middle frame 202, so as to reduce a conduction distance of heat generated by the processor 201 and conducted to the middle frame 202, thereby reducing a thermal resistance value of heat conduction of the processor 201, and improving a heat dissipation effect of the terminal device 200 on the processor 201.

Further, as shown in fig. 3, an embodiment of the present disclosure further provides a terminal device 300, including: the processor 201, the middle frame 202, the flexible heat conduction layer 203, the shielding layer 204, the mainboard 205, the shielding cover 206, the heat dissipation holes 207 and the heat conduction glue 208. Among other things, the terminal device 300 in the embodiment of the present disclosure differs from the terminal device 200 in the first embodiment of the present disclosure in that the arrangement of the flexible heat conductive layer 203 on the center frame 202 is different. Other structures of the terminal device 300 in the embodiment of the present disclosure are the same as the structure of the terminal device 200 in the embodiment of the present disclosure, and are not described herein again.

Specifically, in the terminal device 300 in the embodiment of the present disclosure, the through hole 209 is disposed on the middle frame 202, and one end of the flexible heat conduction layer 203 is disposed on the lower surface of the middle frame 202, and may be attached to the lower surface of the middle frame 202 through a double-sided tape or the like. The other end of the flexible heat conducting layer 203 passes through the through hole 209 and is attached to the upper surface of the middle frame 202.

In the embodiment of the present disclosure, the other end of the flexible heat conducting layer 203 passes through the through hole 209 and is bent to be attached to the upper surface of the middle frame 202, so that heat conducted to the flexible heat conducting layer 203 can be quickly dissipated through the middle frame 202. In the embodiment of the present disclosure, since the upper surface of the middle frame 202 is a plane, the other end of the flexible heat conduction layer 203 is more closely attached to the plane of the middle frame 202, and the flexible heat conduction layer 203 is bent in sections, so that the attachment degree between the flexible heat conduction layer 203 and the middle frame 202 can be integrally improved, and further, the overall heat dissipation effect of the middle frame 202 on the heat conducted to the flexible heat conduction layer 203 is improved.

In the embodiment of the present disclosure, the opening position of the through hole 209 of the middle frame 202 is not particularly limited, and the through hole 209 is preferably formed at a position facing the heat dissipation hole 207. It can be understood that, the through holes 209 are formed on the left side or the right side of the heat dissipation hole 207, the heat of the processor 201 needs to be conducted to the other end through one end of the flexible heat conduction layer 203, and then the heat of the processor 201 can be dissipated on the upper surface of the middle frame 202, and the conduction distance from one end to the other end of the heat of the processor 201 in the flexible heat conduction layer 203 is the length of one end of the flexible heat conduction layer 203 in the left-right direction. When the through hole 209 faces the heat dissipation hole 207, the heat of the processor 201 is transferred from one end to the other end of the flexible heat conduction layer 203 by the thickness of the middle frame 202, so that the heat of the processor 201 can be dissipated on the upper and lower surfaces of the middle frame 202 timely and quickly.

In the embodiment of the present disclosure, the opening diameter of the through hole 209 on the middle frame 202 is enough to allow the flexible heat conduction layer 203 to pass through the through hole 209, and the structural strength of the whole terminal device 300 and the appearance of the whole terminal device are not affected. It is understood that the opening diameter of the through hole 209 is optimally matched with the thickness of the flexible heat conduction layer 203, so that the side wall of the through hole 209 is also attached to the flexible heat conduction layer 203 in the through hole 209, and the heat dissipation effect of the middle frame 202 is improved.

Therefore, the terminal device provided by the embodiment of the present disclosure makes the flexible heat conduction layer and the heating element closely contact by setting the flexible heat conduction layer, so as to reduce the thermal resistance value of heat conduction between the flexible heat conduction layer and the heating element, and can timely and quickly dissipate heat generated by the heating element, thereby significantly improving the temperature rise of the heating element. Meanwhile, based on the arrangement of the flexible heat conduction layer, the terminal equipment provided by the embodiment of the disclosure can design the thickness of the middle frame and the position of the heating element in the terminal equipment more flexibly.

It is understood that "a plurality" in this disclosure means two or more, and other words are analogous. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. The singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms "first," "second," and the like are used to describe various information and that such information should not be limited by these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the terms "first," "second," and the like are fully interchangeable. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "central," "longitudinal," "lateral," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present embodiment and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation.

It will be further understood that, unless otherwise specified, "connected" includes direct connections between the two without the presence of other elements, as well as indirect connections between the two with the presence of other elements.

It is further to be understood that while operations are depicted in the drawings in a particular order, this is not to be understood as requiring that such operations be performed in the particular order shown or in serial order, or that all illustrated operations be performed, to achieve desirable results. In certain environments, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A terminal device, characterized in that the terminal device comprises:

one or more processors;

a middle frame disposed above the processor;

the flexible heat conduction layer is arranged on the lower surface of the middle frame in whole or in part; and

the lower surface of the shielding layer is connected with the processor through heat-conducting glue, and the upper surface of the shielding layer is connected with the flexible heat-conducting layer through heat-conducting glue.

2. The terminal device of claim 1,

the lower surface of the middle frame is non-planar;

the flexible heat conduction layer is attached to the lower surface of the middle frame.

3. The terminal device of claim 1,

the middle frame is provided with a through hole;

one end of the flexible heat conduction layer is arranged on the lower surface of the middle frame, and the other end of the flexible heat conduction layer penetrates through the through hole and is attached to the upper surface of the middle frame.

4. The terminal device of claim 1,

the flexible heat conduction layer is a flexible temperature equalization plate or a flexible heat pipe.

5. The terminal device according to any of claims 1 to 4,

the terminal device further includes:

the one or more processors are arranged on the upper surface of the mainboard;

the shielding cover is arranged on the mainboard and comprises side walls and a top wall, the side walls surround the one or more processors, the top wall is connected with the top ends of the side walls and is positioned above the processors, and heat dissipation holes are formed in the top wall;

wherein the shielding layer covers the heat dissipation hole.

6. The terminal device of claim 5,

the shielding layer is a metal foil.

7. The terminal device of claim 5,

the shielding layer is a flexible temperature-equalizing plate or a flexible heat pipe.

8. The terminal device of claim 7,

the shielding layer is disposed on an upper side or a lower side of the top wall of the shielding cover.

9. The terminal device of claim 8,

the shielding layer also covers the side wall of the shielding cover.