JP6473920B2 - Electronics - Google Patents

Description

  The present disclosure relates to an electronic device including a heat dissipation unit having a heat dissipating body including a plurality of heat dissipating fins for heat exchange.

  Conventionally, in an electronic device such as a personal computer, heat from an electronic component that generates heat during operation of a central processing unit (CPU) or the like is carried by a heat pipe to a heat radiating body where heat is exchanged with cooling air sent from a blower fan. In some cases, the electronic component is cooled by discharging the heated air to the outside of the casing of the electronic device.

  For example, Patent Document 1 discloses a structure in which one end of a heat pipe is brought into contact with a heating element and the other end is brought into contact with a heat radiation fin.

JP 2007-34699 A

  However, with this structure, an electromagnetic wave is generated at the position of the heat dissipating fin that contacts the other end of the heat pipe during operation of the CPU or the like, which may affect the operation of other electronic components in the housing.

  An object of the present disclosure is to solve the above problems, and to provide an electronic device that can radiate heat generated by a heating element such as a CPU well and suppress diffusion of electromagnetic waves generated by the heating element in a casing. The purpose is to provide.

  An electronic device according to the present disclosure accommodates a heating element, a radiator, a conductor that has conductivity and conducts heat generated by the heater to the radiator, and the heating element, the radiator, and the conductor. A conductor, and the conductor is fixed in a state where it is thermally and electrically connected to the heating element at one end, and is thermally and electrically connected to the radiator at a predetermined position between the one end and the other end. The other end is fixed in a state where it is connected, and the other end is fixed in a state where it is thermally and electrically connected to the metal casing.

  In the electronic device of the present disclosure, heat generated by the heating element is transmitted to the heat radiating body and the metal housing via the conductor. Moreover, the electromagnetic waves generated by the heating element are transmitted to the metal casing through the conductor. Therefore, the electromagnetic wave is suppressed from being radiated into the space in the metal casing. Therefore, heat generated by a heating element such as a CPU can be radiated well, and diffusion of electromagnetic waves generated by the heating element in the housing can be suppressed.

1 is a perspective view of a personal computer according to a first embodiment of the present disclosure. It is the schematic which shows the structure of a part of main body unit of the personal computer of FIG. It is a top view when the main body unit of FIG. 2 is seen from the bottom side. It is the schematic which shows the structure of the thermal radiation unit of FIG. It is a longitudinal cross-sectional view when it cuts along the A-A 'line of FIG. FIG. 5 is a longitudinal sectional view taken along line B-B ′ of FIG. 4. FIG. 5 is a longitudinal sectional view taken along line C-C ′ of FIG. 4. It is a longitudinal cross-sectional view when it cuts along the A-A 'line of FIG. 3 which concerns on the modification of Embodiment 1 of this indication.

  Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

  The inventor provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and is not intended to limit the subject matter described in the claims. Absent.

(Embodiment 1)
Hereinafter, Embodiment 1 will be described with reference to FIGS. 1 to 5C.

[1. Constitution]
[1-1. overall structure]
FIG. 1 is a perspective view of a personal computer 1 which is an example of the electronic apparatus of the present disclosure, and FIG. 2 is a schematic diagram illustrating a configuration of a part of a main body unit 2 of the personal computer 1 of FIG. FIG. 1 is a diagram showing an appearance of a state in which a laptop personal computer 1 is opened. As shown in FIGS. 1 and 2, the personal computer 1 includes a main body unit 2, a display unit 3, and a hinge portion 4 provided between the main body unit 2 and the display unit 3. The display unit 3 is connected to the main unit 2 via the hinge portion 4 so as to be openable and closable. The main unit 2 includes a metal casing 21 made of metal such as magnesium, a resin keyboard 22 (not shown in FIG. 1) and a pointing device 23 provided on the metal casing 21. The display unit 3 is provided with a liquid crystal display panel (LCD) 31.

  As shown by a broken line in FIG. 2, the circuit board 5 is accommodated on the back side of the keyboard inside the metal housing 21. For example, an antenna module for wireless LAN communication is mounted on the circuit board 5. An arithmetic processing device (an example of a heating element) 10 such as a CPU (Central Processing Unit), an MPU (Micro Processing Unit), or a GPU (Graphics Processing Unit) is mounted.

[1-1-1. Disclosure Background]
Here, the background that led to the present disclosure will be described. An arithmetic processing unit such as a CPU operates at a high frequency of, for example, 600 MHz to 2.6 GHz to generate heat and generate high frequency noise in units of MHz and GHz. That is, the arithmetic processing device 10 generates heat due to the internal circuit resistance during the arithmetic processing, and further emits electromagnetic waves that are high-frequency noise corresponding to the arithmetic processing speed. Since the antenna module mounted on the circuit board 5 uses a frequency band of 800 MHz to 5 GHz, electromagnetic waves generated from the arithmetic processing unit 10 affect other electronic circuits including the antenna module, and thus malfunction of the personal computer 1. It becomes a factor of. In order to solve this problem, the personal computer 1 of the present disclosure is generated by the arithmetic processing unit 10 by connecting the heat radiating unit 6 to the arithmetic processing unit 10 (that is, the heating element) and grounding the heat radiating unit 6. It is configured not to emit electromagnetic waves to other electronic circuits. Hereinafter, the configuration of the heat dissipation unit 6 will be described.

[1-2. Configuration of heat dissipation unit]
[1-2-1. Overview]
FIG. 3 is a plan view of the main unit 2 shown in FIG. 2 when viewed from the bottom side, and FIG. 4 is an enlarged view of the configuration of the heat dissipation unit 6 shown in FIG. 3 and the vicinity thereof. Here, FIG. 3 is a plan view when the main unit 2 is viewed from the bottom side with the bottom plate of the personal computer 1 of FIG. 1 removed. As shown in FIG. 3, the circuit board 5, the heat radiating unit 6, and various electronic components 30 are arranged in the metal housing 21.

  As shown in FIG. 4, the heat radiating unit 6 includes a heat radiating body 65, a blower fan unit 66, a heat pipe 60, and a heat receiving plate 61.

  The heat radiator 65 is provided in the vicinity of the rear wall 21a of the metal casing 21, and has a plurality of heat radiation fins 65a through which heat from the arithmetic processing device 10 is conducted.

  The blower fan unit 66 sends air (cooling air) to the radiator 65. The blower fan unit 66 includes a blower fan case 66a, a blower fan 66b, a suction port 66c, and an exhaust port 66d. The blower fan unit 66 is fixed to the metal casing 21 using a fixture 70. The blower fan 66b accommodated in the blower fan case 66a rotates about the rotation axis, takes ambient air from a suction port 66c formed on the upper surface of the blower fan case 66a, and the taken-in air dissipates heat. The heat radiating body 65 is sent to the heat radiating body 65 through an exhaust port 66 d provided at a connection portion between the body 65 and the blower fan unit 66, thereby cooling the heat radiating body 65.

  The heat receiving plate 61 is fixed to a heat receiving end 60 a that is one end of the heat pipe 60 in a state of being thermally and electrically connected. The heat receiving plate 61 is a metal plate and receives heat generated by the arithmetic processing device 10.

  The heat pipe 60 conducts heat generated in the arithmetic processing device 10 to the heat radiating body 65. The heat pipe 60 is, for example, a rod-shaped copper metal conductor. Specifically, the heat pipe 60 is a copper cylinder, and a small amount of pure water or an alcohol-based liquid is injected into the decompressed inside. A small amount of injected pure water or alcohol-based liquid becomes steam when heated, and heat is transported by this steam. The steam is liquefied at the heat radiating portion of the heat pipe 60 (the portion where the heat pipe 60 and the heat radiating body 65 are in contact with each other, the heat radiating end 60c of the heat pipe 60). It returns to the heat receiving part (heat receiving end 60a of the heat pipe 60). The heat pipe 60 is fixed to the metal casing 21 by using fixtures 62 provided at both ends of the heat receiving plate 61. The heat generated in the arithmetic processing unit 10 is conducted to the heat receiving end 60a of the heat pipe 60 through the heat receiving plate 61, and is further conducted from the heat receiving end 60a to the heat radiating end 60c through the conductive portion 60b.

[1-2-2. Fixing structure of heat pipe]
As shown in FIG. 4, the heat pipe 60 is fixed to the circuit board 5 via the heat receiving plate 61 by the fixture 62 at the heat receiving end 60 a, and the circuit board 5 is fixed to the metal casing 21. Furthermore, the heat pipe 60 is fixed to the metal casing 21 via the metal plate 69 by the fixture 64 at the heat radiating end 60c. Other portions of the heat pipe 60 are in a floating state without being in contact with the metal casing 21. Hereinafter, the fixing structure of the heat pipe 60 will be described more specifically.

  FIG. 5A is a longitudinal sectional view taken along the line A-A ′ of FIG. 4. 5A, the heat receiving end 60a of the heat pipe 60 is fixed to a metal heat receiving plate 61 by welding or a conductive adhesive or the like. As a result, the heat receiving plate 61 is electrically and thermally connected to the heat pipe 60. The heat receiving plate 61 is fixed by a fixture 62 such as a metal screw so as to press the arithmetic processing unit 10 as a heat source against the circuit board 5 and the metal casing 21 via the heat conductive sheet 63. As a result, the arithmetic processing device 10, the heat conductive sheet 63 and the heat receiving plate 61 (heat pipe 60) are in close contact with each other, and the heat generated in the arithmetic processing device 10 is transferred to the heat pipe via the heat conductive sheet 63 and the heat receiving plate 61. 60 is transmitted to the heat receiving end 60a.

  FIG. 5B is a longitudinal sectional view taken along the line B-B ′ of FIG. 4. In FIG. 5B, the heat pipe 60 is thermally connected to the metal casing 21 via the heat conductive sheet 67 at the heat radiating end 60 c of the heat pipe 60. As described above, the heat radiating end 60 c of the heat pipe 60 is thermally connected to the metal housing 21 via the heat conductive sheet 67, so that heat is favorably transmitted from the heat radiating end 60 c to the metal housing 21.

  FIG. 5C is a longitudinal sectional view taken along the line C-C ′ of FIG. 4. In FIG. 5C, the heat pipe 60 is fixed to the metal casing 21 using a metal plate 69 fixed in a state of being thermally and electrically connected to the heat radiating end 60 c of the heat pipe 60. Specifically, the heat pipe 60 includes a metal housing such that the metal plate 69 presses the heat pipe 60 against the metal housing 21 by a fixture 64 such as a metal screw at the heat radiating end 60 c of the heat pipe 60. It is fixed to the body 21. As a result, the heat radiating end 60 c of the heat pipe 60 is in close contact with the metal housing 21, and heat is transferred from the heat radiating end 60 c to the metal housing 21 in a favorable manner. Moreover, the contact resistance between the heat pipe 60 and the metal housing 21 can be reduced as much as possible. Therefore, the electromagnetic wave conducted on the heat pipe 60 is transmitted to the metal housing 21 satisfactorily.

[1-2-3. Arrangement of each part of heat pipe 60]
The distance between the heat pipe 60 and the radiator 65 (predetermined position) and the heat radiating end 60c is such that the temperature of the metal casing 21 at the position where the heat radiating end 60c is connected to the metal casing 21 is predetermined. The distance is set to be lower than the temperature of the metal casing 21 at the position by a predetermined temperature or more. Here, the predetermined temperature is a temperature at which heat radiation at the heat radiation end 60c can be sufficiently performed. As shown in FIG. 4, a portion where the heat pipe 60 and the heat receiving plate 61 are connected (heat receiving end 60a of the heat pipe 60) and a portion where the heat pipe 60 and the metal housing 21 are connected (heat radiating end 60c of the heat pipe 60). ) Is positioned more inside in the metal casing 21 than a portion where the heat pipe 60 and the heat radiating body 65 are in contact (a part of the conductive portion 60b of the heat pipe 60). With this configuration, as shown in FIG. 2, the position where the heat pipe 60 is thermally connected to the metal housing 21 in the heat radiating end 60 c of the heat pipe 60 is within the region of the keyboard 22. A resin keyboard 22 exists between the heat radiating end 60 c of the heat pipe 60 and the liquid crystal display panel 31. Accordingly, even when the personal computer 1 is closed, the resin keyboard 22 exists between the heat radiating end 60 c of the heat pipe 60 and the liquid crystal display panel 31. The heat radiated to the body 21 is transmitted to the resin keyboard 22 having a low thermal conductivity, and is not directly transmitted to the liquid crystal display panel 31. Therefore, deterioration of the liquid crystal panel 31 due to high heat generated in the arithmetic processing device 10 is suppressed. Further, since the heat receiving end 60a and the heat radiating end 60c are separated from the region of the rear wall 21a that the user may touch, an effect of reducing the influence of heat on the user can be expected.

[2. Action]
With respect to the personal computer 1 configured as described above, the operation of the heat dissipation unit 6 will be described below.

[2-1. Electromagnetic absorption effect]
Electromagnetic waves generated during the operation of the arithmetic processing apparatus 10 propagate to the heat receiving plate 61 through the heat conductive sheet 63. A part of the electromagnetic wave propagated to the heat receiving plate 61 is propagated to the metal casing 21 through the metal fixture 62 (see FIG. 5A), and the remaining electromagnetic waves are transmitted to the heat receiving end 60a and the conductive portion of the heat pipe 60. It propagates to the heat radiating end 60c of the heat pipe 60 via 60b. The electromagnetic waves propagated to the heat radiating end 60c of the heat pipe 60 are propagated through the metal fixture 64 and directly to the metal casing 21 (see FIG. 5B), and through the heat conductive sheet 67, the metal casing. Propagated to the body 21 (see FIG. 5C). Since the metal casing 21 is grounded (connected to the ground potential), it is possible to prevent radiation of electromagnetic waves generated from the arithmetic processing unit 10. In addition, the capability (grounding capability) to reduce the radiation of electromagnetic waves increases as the contact area between the heat radiating end 60c of the heat pipe 60 and the fixtures 62 and 64 and the metal casing 21 increases.

[2-2. Heat dissipation]
Heat generated during operation of the arithmetic processing device 10 is conducted to the heat receiving end 60 a of the heat pipe 60 through the heat conductive sheet 63 and the heat receiving plate 61. The heat received at the heat receiving end 60 a is conducted through the conductive portion 60 b of the heat pipe 60. The heat conducted through the conductive portion 60b of the heat pipe 60 is conducted to the heat radiation fin 65, and the heat conducted to the heat radiation fin 65 is released from the surface. The released heat is released to the outside through the opening 21 b of the metal housing 21 by the wind from the blower fan unit 66. The remaining heat is conducted through the conductive portion 60 b of the heat pipe 60, and is conducted to the metal housing 21 directly from the heat radiating end 60 c of the heat pipe 60 or via the heat conductive sheet 67. The heat conducted to the metal casing 21 is radiated to the external space by the metal casing 21 itself functioning as a component (heat sink) intended to lower the temperature by diffusion of heat.

  Here, the metal casing 21 in the vicinity of the radiator 65 is already at a high temperature due to the heat released from the radiator 65. If the heat conducted through the heat pipe 60 is released to the metal casing 21 near the position where the heat radiating body 65 and the heat pipe 60 are in contact with each other, the temperature of the metal casing 21 near the heat radiating body 65 further increases. In order to cope with this, in the present embodiment, the heat pipe 60 is further extended from the heat radiating body 65 and connected to the metal casing 21 further inside the metal casing 21. With this configuration, heat is released to the metal housing 21 where the temperature is relatively low.

[3. Effect]
As described above, the personal computer 1 according to the present embodiment has the arithmetic processing device 10 that is a heat generator, the heat radiating body 65, and the heat generated in the arithmetic processing device 10 that has conductivity and the heat radiating body 65. A heat pipe 60 that conducts heat to the arithmetic processing unit 10, a heat radiating body 65, and a metal casing 21 that houses the heat pipe 60. The heat pipe 60 is thermally and electrically connected to the arithmetic processing unit 10 at one end. Fixed in a connected state, fixed in a thermally and electrically connected state to the radiator 65 at a predetermined position between the heat receiving end 60a and the heat radiating end 60c, and attached to the metal casing 21 at the heat radiating end 60c. It is fixed in a thermally and electrically connected state.

  With this configuration, the electromagnetic wave generated in the arithmetic processing device 10 can be propagated through the heat pipe 60 and absorbed by the metal casing 21 via the heat receiving end 60a and the heat radiating end 60c of the heat pipe 60. Therefore, electromagnetic waves generated by the arithmetic processing device 10 are suppressed from being emitted to electronic circuits other than the arithmetic processing device 10. For this reason, it is possible to prevent malfunction of the personal computer 1 based on electromagnetic waves. Further, the heat generated during the operation of the arithmetic processing device 10 is conducted to the heat radiating body 65 and the metal casing 21 through the heat pipe 60 and is radiated to the external space.

  In the personal computer 1 according to the present embodiment, the distance between the predetermined position and the other end is such that the temperature of the metal casing 21 at the connection position to the metal casing 21 at the other end is the same as the metal casing at the predetermined position. The distance is lower than the temperature of the body 21 by a predetermined temperature or more.

  With this configuration, the temperature of the metal casing 21 at the heat radiating end 60c is lower than the temperature of the metal casing 21 at a predetermined position where the heat pipe 60 and the heat radiator 65 are in contact with each other. Therefore, the heat generated in the arithmetic processing device 10 can be radiated to the metal casing 21 at a lower temperature position. Therefore, the heat dissipation performance is further improved.

  Further, in the personal computer 1 according to the present embodiment, the heat receiving end 60a and the heat radiating end 60c of the heat pipe 60 are located inside the metal casing 21 with respect to a predetermined position.

  With this configuration, the distance between the predetermined position and the heat receiving end 60a and the heat radiating end 60c can be easily increased. Accordingly, the portions that generate heat can be dispersed. Therefore, the heat dissipation performance is improved.

Further, in the personal computer 1 according to the present embodiment, the metal plate 69 fixed in a state of being thermally and electrically connected to the heat radiating end 60 c of the heat pipe 60 and the metal plate 69 are fixed to the metal casing 21. further comprising a first fastener 64, the heat pipe 60 via the metal plate 69 and the first fixture 64 is thermally and electrically connected to the metal casing 21.

With this configuration, the electromagnetic wave propagated through the heat pipe 60 is absorbed by the metal casing 21 through the metal plate 69 and the first fixture 64 at the heat radiating end 60c. Accordingly, it is possible to further prevent malfunction of the personal computer 1 based on electromagnetic waves. Further, the heat conducted through the heat pipe 60 can be radiated to the metal casing 21 through the metal plate 69 and the first fixture 64 at the heat radiating end 60c.

  Further, in the personal computer 1 according to the present embodiment, a heat conducting member such as the heat conducting rubber 90 is provided between the heat pipe 60 and the arithmetic processing unit 10.

  With this configuration, the heat pipe 60 and the arithmetic processing unit 10 are in close contact with each other via the heat conductive rubber 90. Therefore, it is possible to more reliably conduct the heat generated in the arithmetic processing device 10 to the heat receiving end 60a of the heat pipe 60 as compared with the case where the heat conductive rubber 90 is not disposed. Therefore, the heat dissipation performance is further improved.

  Further, in the personal computer 1 according to the present embodiment, the heat receiving plate 61 fixed in a state of being thermally and electrically connected to the heat receiving end 60 a of the heat pipe 60 and the heat receiving plate 61 are fixed to the metal casing 21. The heat pipe 60 is thermally and electrically connected to the metal housing 21 via the heat receiving plate 61 and the second fixture 62.

With this configuration, the electromagnetic wave generated in the arithmetic processing unit 10 propagates to the heat receiving end 60a of the heat pipe 60 via the heat receiving plate 61 and the second fixture 62 at the heat receiving end 60a, and passes through the conductive portion 60b and the heat radiating end 60c. It becomes possible to make it absorb in the metal housing | casing 21. Therefore, it is possible to more reliably suppress malfunction of the personal computer 1 due to electromagnetic waves. In addition, the heat generated in the arithmetic processing device 10 can be conducted to the heat receiving end 60a through the heat receiving plate 61 and the second fixture 62. Therefore, the heat dissipation performance is improved.

  Moreover, in the personal computer 1 according to the present embodiment, the heat pipe 60 is made of metal.

With this configuration, heat and electromagnetic waves can be conducted (propagated) to the heat pipe 60. Therefore, the electromagnetic wave generated in the arithmetic processing unit 10 propagates to the heat receiving end 60a of the heat pipe 60 via the heat receiving plate 61 and the second fixture 62 at the heat receiving end 60a, and passes through the conductive portion 60b and the heat radiating end 60c. It can be absorbed by the metal casing 21. Therefore, it is possible to more reliably suppress malfunction of the personal computer 1 due to electromagnetic waves. In addition, the heat generated in the arithmetic processing device 10 can be conducted to the heat receiving end 60a through the heat receiving plate 61 and the second fixture 62. Therefore, the heat dissipation performance is improved.

(Other embodiments)
As described above, the first embodiment has been described as an example of the technique disclosed in the present application. However, the technology in the present disclosure is not limited to this, and can also be applied to an embodiment in which changes, replacements, additions, omissions, and the like are appropriately performed. Moreover, it is also possible to combine each component demonstrated in the said Embodiment 1, and it can also be set as a new embodiment.

  For example, in Embodiment 1 described above, the arithmetic processing unit 10 is electrically and thermally connected to the heat receiving plate 61 via the heat conductive sheet 63 as illustrated in FIG. 5A. It is not limited. For example, as illustrated in FIG. 6, a heat conductive member such as a heat conductive rubber 90 may be further provided below the heat receiving plate 61. Note that a metal plate may be provided in place of the heat conductive rubber 90. Further, a member such as a spring of the fixture 62 may be inserted between the heat receiving plate 61 and the circuit board 5. With this configuration, the pressing force can be uniformly dispersed by the biasing force of the spring. In the above-described embodiment, an example in which the electronic apparatus is the personal computer 1 has been described, but the present disclosure is not limited thereto. For example, the present invention can be widely applied to electronic devices such as tablet terminals, mobile phones, movies, mobile TVs, and portable BD players.

  Moreover, in Embodiment 1 mentioned above, although the heat pipe 60 was fixed to the metal housing | casing 21 in the thermal radiation end 60c of the heat pipe 60, this indication is not limited to this. For example, at the heat radiating end 60c of the heat pipe 60, the heat pipe 60 may be fixed to a ground electrode of a circuit board (not shown) on which another electronic circuit is mounted. In this case, the ground potential of the circuit board 5 and the ground potential of the circuit board (not shown) need to be the same potential. By adopting this configuration, it is possible to obtain the same effects as those of the first embodiment described above.

  Moreover, in Embodiment 1 mentioned above, the heat receiving end 60a of the heat pipe 60 and the heat radiating end 60c of the heat pipe 60 are more inside in the metal housing 21 than the part where the heat pipe 60 and the heat radiating body 65 are in contact. Although positioned, the present disclosure is not so limited. For example, the heat pipe 60 may extend straight along the rear wall 21a of the personal computer 1 from a position where the heat pipe 60 and the heat radiating body 65 are in contact with each other. Also with this configuration, the electromagnetic wave generated in the arithmetic processing device 10 can be propagated through the heat pipe 60 and absorbed by the metal casing 21 via the heat receiving end 60a and the heat radiating end 60c of the heat pipe 60. Further, the heat generated during the operation of the arithmetic processing device 10 is conducted to the heat radiating body 65 and the metal casing 21 through the heat pipe 60 and is radiated to the external space.

  Furthermore, in Embodiment 1 mentioned above, although the metal heat pipe 60 was used, this indication is not limited to this. For example, the heat pipe 60 may be formed using a member that can transmit heat and electricity (electromagnetic waves), such as carbon. By adopting this configuration, it is possible to obtain the same effects as those of the first embodiment described above.

  As described above, the embodiments have been described as examples of the technology in the present disclosure. For this purpose, the accompanying drawings and detailed description are provided.

  Accordingly, among the components described in the accompanying drawings and the detailed description, not only the components essential for solving the problem, but also the components not essential for solving the problem in order to illustrate the above technique. May also be included. Therefore, it should not be immediately recognized that these non-essential components are essential as those non-essential components are described in the accompanying drawings and detailed description.

  Moreover, since the above-mentioned embodiment is for demonstrating the technique in this indication, a various change, replacement, addition, abbreviation, etc. can be performed in a claim or its equivalent range.

  The present disclosure can be applied to any electronic device that generates electromagnetic waves and heat. Specifically, the present disclosure is applicable to tablet terminals, mobile phones, movies, mobile TVs, portable BD players, and the like.

1 ... Personal computer,
2 ... Main unit,
3. Display unit,
4 ... Hinge part,
5 ... Circuit board,
6 ... Heat dissipation unit,
10 ... heating element,
21 ... Metal casing,
21a ... rear wall,
21b ... opening,
22 ... Keyboard,
23 ... pointing device,
31 ... Liquid crystal display panel (LCD),
60 ... heat pipe,
60a ... heat receiving end,
60b ... conduction part,
60c ... radiation end,
61 ... heat receiving plate,
62, 64, 67, 70 ... a fixture,
63, 67 ... heat conduction sheet,
65 ... radiator,
65a ... fin for heat radiation,
66 ... Blower fan unit,
66a ... Blower fan case,
66b ... Blower fan,
66c ... suction port,
66d ... exhaust port,
69 ... metal plate,
90: Thermally conductive rubber.

Claims (7)

A heating element;
A radiator,
A conductor having conductivity and conducting heat generated in the heating element to the radiator;
A housing for housing the heating element, the heat radiator, and the conductor;
The conductor is in contact while thermally connected to the heating body at one end in contact while thermally connected to the heat radiator in a predetermined position between the one end and the other end, the predetermined position thermally contacting contact with connection state in the housing at the other end at a location extending from,
The one end and the other end of the conductor are located on the inner side of the casing relative to the predetermined position with respect to the side wall of the casing closest to the predetermined position.
Electronics. The distance between the predetermined position and the other end, the temperature of the housing at the connection position to the housing of said other end, than the temperature of the housing in the predetermined position is lower than a predetermined temperature The electronic device according to claim 1, wherein the electronic device is a distance. Further comprising a metal plate in contact in a state of thermally connected to the other end of the conductor, and a first fastener for securing the metal plate to the housing,
The conductor is via the metal plate and the first fastener, the electronic device according to claim 1 or 2, characterized in that it is thermally connected to the housing. Electronic device according to any one of claims 1-3, characterized in that it comprises a heat conducting member between the conductor and the heating element. Comprising a heat-receiving plate in contact in a state of thermally connected to the one end of the conductor, a second fastener for securing said heat-receiving plate in the housing,
The conductor, through the heat-receiving plate and the second fixture according to any one of claims 1-4, characterized in that it is thermally connected to the housing Electronics. The electronic device according to the conductor, any one of claims 1-5, characterized in that it is formed of a metal. The electronic device according to any one of claims 1 to 6 , wherein the conductor is a heat pipe.

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