JP2002123336A - Information processor - Google Patents
Information processorInfo
- Publication number
- JP2002123336A JP2002123336A JP2000312720A JP2000312720A JP2002123336A JP 2002123336 A JP2002123336 A JP 2002123336A JP 2000312720 A JP2000312720 A JP 2000312720A JP 2000312720 A JP2000312720 A JP 2000312720A JP 2002123336 A JP2002123336 A JP 2002123336A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- information processing
- processing apparatus
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はノート型パソコンに
代表される薄型の情報処理装置に関し、特に情報処理装
置内部の、発熱部品からの熱を放散する放熱プレートに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin information processing device represented by a notebook personal computer, and more particularly to a heat radiation plate for dissipating heat from a heat-generating component inside the information processing device.
【０００２】[0002]
【従来の技術】近年、半導体装置の小型化、高集積化に
より持ち運びに便利な情報処理装置としてノート型パソ
コンが普及している。通常のノート型パソコンは、キー
ボードを備えた平らな本体部に対してディスプレイ部を
開閉自在に取り付けた構成である。この本体部の構造は
製品によって仕様が異なるが、本体部を形成する筐体の
上部にキーボードが配置され、かつ筐体の内部に中央演
算処理装置であるＣＰＵを搭載した回路基板が配置され
ている点ではどの製品も同じである。2. Description of the Related Art In recent years, notebook personal computers have become widespread as portable information processing devices due to miniaturization and high integration of semiconductor devices. A typical notebook personal computer has a configuration in which a display unit is attached to a flat main unit having a keyboard so that the display unit can be opened and closed. Although the structure of the main body differs in specifications depending on the product, a keyboard is arranged at the top of a housing forming the main body, and a circuit board having a CPU as a central processing unit is arranged inside the housing. All products are the same.
【０００３】このような本体部の従来構造の断面概略図
を図７，図８に示す。図７を参照すると、ＣＰＵ６を搭
載した回路基板５がキーボード（不図示）に沿って配置
されている。ＣＰＵ６は熱を発するため、パソコン利用
者が触れるキーボード側とは反対側の基板面に搭載され
ている。ＣＰＵ６と筐体７の間には放熱プレート８がＣ
ＰＵ６の反搭載面６ａと接するように配置され、かつ本
体部を形成する筐体の側面へ向かって延びている。この
構成により、発熱体であるＣＰＵ６からの熱を放熱プレ
ート８を通じて前記筐体の側面へと放熱している。ま
た、ＣＰＵ６の熱を効率良く放熱させるために、放熱プ
レート８については図８に示すように、ＣＰＵ６と接す
る部分の厚みを厚くする場合もあった。FIGS. 7 and 8 are schematic cross-sectional views of a conventional structure of such a main body. Referring to FIG. 7, a circuit board 5 on which a CPU 6 is mounted is arranged along a keyboard (not shown). Since the CPU 6 generates heat, it is mounted on the board surface opposite to the keyboard side touched by the personal computer user. A radiation plate 8 is provided between the CPU 6 and the housing 7.
It is arranged so as to be in contact with the anti-mounting surface 6a of the PU 6, and extends toward the side surface of the housing forming the main body. With this configuration, heat from the CPU 6, which is a heating element, is radiated to the side surface of the housing through the heat radiation plate 8. In addition, in order to efficiently radiate the heat of the CPU 6, the thickness of a portion of the heat dissipation plate 8 that is in contact with the CPU 6 may be increased as shown in FIG.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上述したよう
な従来の放熱プレート形状では、放熱プレートにおける
発熱体周辺の部分が本体部の薄型化によって筐体に接近
しているため、熱が筐体に伝導しやすく、利用者の触れ
る筐体表面のキーボードが熱くなったり、机との接触部
分が熱くなってしまう。あるいは、パソコン筐体の側面
付近に配置された放熱のためのファンにまで熱が伝わら
ずに放熱効果が薄れていた。However, in the above-described conventional heat-dissipating plate shape, since the portion of the heat-dissipating plate around the heat generating element is close to the housing due to the thinning of the main body, heat is transferred to the housing. The keyboard on the surface of the housing touched by the user becomes hot, and the part in contact with the desk becomes hot. Alternatively, the heat dissipating effect is weakened without transferring heat to the heat dissipating fan arranged near the side surface of the personal computer housing.
【０００５】また、放熱プレートと筐体の間の、空気の
流れる空間の狭さから、前記ファンによる風の流れも十
分に確保できないことが多かった。[0005] In addition, due to the narrow space in which air flows between the heat dissipation plate and the housing, the flow of wind by the fan cannot often be sufficiently ensured.
【０００６】本発明の目的は上述した従来技術の問題点
に鑑み、情報処理装置の本体部内の放熱効果を高めて筐
体表面の高熱化を防止できる本体部の内部構造、および
放熱プレートの形状を提供することにある。SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, an object of the present invention is to improve the heat radiation effect in the main body of an information processing apparatus, thereby preventing the surface of the housing from being heated, and the shape of the heat radiation plate. Is to provide.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明は、回路基板上に発熱部品が搭載され、該回路
基板が筐体内に収容された情報処理装置において、前記
発熱部品には放熱体が取り付けられており、該放熱体
は、前記発熱部品が搭載された回路基板方向に向かって
少なくとも一つの屈曲部を有すること、あるいは、前記
発熱部品に放熱体が取り付けられ、該放熱体とこれに対
向する前記筐体との距離は前記発熱部品が接する部分に
おける距離より、前記発熱部品の周辺部における距離の
方が大きいことを特徴とする。In order to achieve the above object, the present invention provides an information processing apparatus in which a heat generating component is mounted on a circuit board and the circuit board is housed in a housing. A heat radiator is attached, and the heat radiator has at least one bent portion toward a circuit board on which the heat-generating component is mounted, or a heat radiator is attached to the heat-generating component, The distance between the heat-generating component and the housing facing the heat-generating component is larger at a peripheral portion of the heat-generating component than at a portion where the heat-generating component contacts.
【０００８】上記の情報処理装置において、前記筐体の
上部に操作盤が設けられており、前記筐体の内部におい
て前記放熱体は前記発熱部品の回路基板への搭載面とは
反対側と接し、かつ前記回路基板と前記放熱体が前記操
作盤に沿って配置されていることが好ましい。In the above information processing apparatus, an operation panel is provided on an upper portion of the housing, and the heat radiator is in contact with a side opposite to a surface of the heat-generating component mounted on a circuit board inside the housing. It is preferable that the circuit board and the heat radiator are arranged along the operation panel.
【０００９】この場合、前記回路基板の前記操作盤とは
反対側面に前記発熱部品が搭載されているものや、前記
回路基板の前記操作盤側の面に前記発熱部品が搭載され
ているものが適用できる。In this case, the circuit board may have the heat-generating component mounted on the side opposite to the operation panel, or the circuit board may have the heat-generating component mounted on the operation panel-side surface. Applicable.
【００１０】これらの構成の情報処理装置では、前記筐
体の側面付近に筐体内冷却用ファンを設置可能な空間を
設けている。この場合、前記空間は、前記回路基板の端
部に切り欠きを設けることで開けられている。さらに、
前記放熱体における前記発熱部品の周辺部分が前記切り
欠き内へ延びて配置されていることが好ましい。In the information processing apparatus having such a configuration, a space is provided near the side surface of the housing so that the cooling fan in the housing can be installed. In this case, the space is opened by providing a notch at an end of the circuit board. further,
It is preferable that a peripheral portion of the heat radiator in the heat radiator extends into the notch.
【００１１】本発明では前記空間に筐体内冷却用ファン
を設置しない情報処理装置として提供できる。この場
合、前記回路基板は筐体内冷却用ファンを設置する場合
と同一構造とした方が設計し易さからも好ましい。According to the present invention, it is possible to provide an information processing apparatus in which a cooling fan in a housing is not installed in the space. In this case, it is preferable that the circuit board has the same structure as that of the case where the cooling fan in the housing is installed, from the viewpoint of easy design.
【００１２】また本発明は前記空間に筐体内冷却用ファ
ンが設置されている情報処理装置であってもよい。ある
いは、前記筐体の前記放熱体が対向する部分と前記放熱
体の前記切り欠き内に延びた部分との間に筐体内冷却用
ファンが配置されているものであってもよい。これらの
場合も、前記回路基板は筐体内冷却用ファンを設置しな
い場合と同一構造としていることが設計上好ましい。Further, the present invention may be an information processing apparatus in which a cooling fan in a housing is installed in the space. Alternatively, a cooling fan in the housing may be arranged between a portion of the housing facing the heat radiator and a portion of the heat radiator extending into the notch. Also in these cases, it is preferable in terms of design that the circuit board has the same structure as the case where the cooling fan in the housing is not provided.
【００１３】（作用）上記のとおりの構成では、放熱体
とこれに対向する筐体との距離は発熱部品が接する部分
における距離より、その発熱部品の周辺部における距離
の方が大きいので、発熱部品の熱を放熱する放熱体の熱
が筐体の側面付近へ伝導する途中で、放熱体が対向する
筐体部分に熱が伝わることなく、筐体の側面へと良好に
伝わる。その結果、机と接触する筐体底部や利用者が触
れる筐体上部の操作盤が高熱になる事を防止できる。さ
らに、放熱体と、放熱体が対向する筐体部分との間隔が
広くなったので、筐体内冷却用ファンと併用する場合、
流れる空気の量が増加するとともに、放熱体に対向する
筐体部分へ伝わる熱も一層抑えることができる。よっ
て、発熱部品および筐体をより冷却することが可能であ
る。(Operation) In the configuration described above, the distance between the heat radiator and the housing facing the heat radiator is greater at the peripheral portion of the heat radiating component than at the portion where the heat radiating component is in contact. While the heat of the heat radiator that dissipates the heat of the component is being conducted to the vicinity of the side surface of the housing, the heat is satisfactorily transmitted to the side surface of the housing without transmitting the heat to the facing housing portion. As a result, it is possible to prevent the operation panel at the bottom portion of the housing that comes into contact with the desk and the operation panel at the top of the housing that the user touches from becoming hot. Furthermore, since the space between the heat radiator and the housing portion facing the heat radiator is increased, when used together with the cooling fan in the housing,
As the amount of flowing air increases, the heat transmitted to the housing portion facing the radiator can be further suppressed. Therefore, it is possible to further cool the heat generating component and the housing.
【００１４】その上、前記回路基板端部の、前記筐体の
側面付近に筐体内冷却用ファンを設置できる空間を開け
るための切り欠き内へ、前記放熱体における発熱部品の
周辺部分を延ばして配置することにより、放熱体とこれ
に対向する筐体との距離は発熱部品が接する部分におけ
る距離より、その発熱部品の周辺部における距離の方が
大きくなるため、放熱性が向上し、机と接触する筐体底
部や利用者が触れる筐体上部の操作盤の高熱化が一層抑
えられる。In addition, the peripheral portion of the heat-generating component in the heat radiator is extended into a notch at the end of the circuit board near the side surface of the housing to open a space in which a cooling fan in the housing can be installed. By arranging, the distance between the heat radiator and the housing facing the heat radiator is larger at the peripheral portion of the heat radiating component than at the portion where the heat radiating component is in contact with the heat radiating component. Heating of the operating panel at the bottom of the housing that comes into contact or at the top of the housing that the user touches is further suppressed.
【００１５】[0015]
【発明の実施の形態】次に本発明の実施の形態について
図面を参照して説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１６】図１は本発明の情報処理装置の一例を示す
概略斜視図である。この図で示す形態の情報処理装置
は、薄く平らな筐体の上面に操作盤であるキーボード４
を配置してなる本体部１に対して表示部２を、ヒンジ部
３を回転軸にして開閉自在に取り付けた構成である。本
体部１を形成する筐体は筐体の設置面に平行な上面およ
び底面に垂直な側面１１を有する。このような構成の情
報処理装置にはいわゆるノート型パソコンを適用するこ
とが出来る。また、装置の薄型化および軽量化のため
に、表示部２にはバックライトを使用しない反射型液晶
パネルを用いたものもある。このように薄型の装置にお
いて、本発明は特に有効である。なぜなら薄型のため、
熱が机に伝導しやすいからである。FIG. 1 is a schematic perspective view showing an example of the information processing apparatus of the present invention. The information processing apparatus of the form shown in this figure has a keyboard 4 as an operation panel on the upper surface of a thin and flat housing.
The display unit 2 is attached to the main body 1 having the above-described arrangement so that the display unit 2 can be opened and closed with the hinge 3 as a rotation axis. The housing forming the main body 1 has a top surface parallel to the installation surface of the housing and a side surface 11 perpendicular to the bottom surface. A so-called notebook computer can be applied to the information processing apparatus having such a configuration. Further, in order to make the device thinner and lighter, some display units 2 use a reflective liquid crystal panel that does not use a backlight. The present invention is particularly effective in such a thin device. Because it is thin,
This is because heat is easily conducted to the desk.
【００１７】このような情報処理装置本体部１の筐体の
内部構造の概略を図２に、発熱体であるＣＰＵを通る縦
断面で表した。図２に示すように、キートップ４ａを配
列してなるキーボード４の下側に配置された筐体７内の
回路基板５上のＣＰＵ６は熱を発するため、パソコン利
用者が触れるキーボード４側とは反対側の基板面に搭載
されている。ＣＰＵ６は回路基板５に直接接する場合で
あっても、回路基板５に導電材を介して間接的に搭載さ
れる場合であってもよい。ＣＰＵ６と筐体７の間には放
熱プレート８がＣＰＵ６の反搭載面６ａ（ＣＰＵの回路
基板への搭載面とは反対側の面）と接するように配置さ
れ、かつ一端が本体部１の側面１１（図１参照）へ向か
って延びている。この構成により、発熱部品であるＣＰ
Ｕ６からの熱を放熱プレート８を通じて本体部１の側面
１１へと伝導している。FIG. 2 schematically shows the internal structure of the casing of the information processing apparatus main body 1 in a longitudinal section passing through a CPU which is a heating element. As shown in FIG. 2, the CPU 6 on the circuit board 5 in the housing 7 arranged below the keyboard 4 in which the key tops 4a are arranged generates heat, so that the keyboard 4 is touched by the personal computer user. Are mounted on the opposite substrate surface. The CPU 6 may be either in direct contact with the circuit board 5 or indirectly mounted on the circuit board 5 via a conductive material. A heat radiating plate 8 is arranged between the CPU 6 and the housing 7 so as to be in contact with the non-mounting surface 6a of the CPU 6 (the surface opposite to the mounting surface of the CPU on the circuit board). 11 (see FIG. 1). With this configuration, the heating component CP
The heat from U <b> 6 is conducted to the side surface 11 of the main body 1 through the heat dissipation plate 8.
【００１８】本発明の特徴の一つとしては、放熱プレー
ト８はＣＰＵ６が搭載された回路基板方向に向かって少
なくとも一つの屈曲部を有している。よって、放熱プレ
ート８とこれに対向する筐体７との距離は、ＣＰＵ６
（発熱部品）の直下における距離Ｌ1よりＣＰＵ６周辺
（発熱部品周辺）の部分Ｌ2の方が大きい（例えばＬ1＝
１．２ｍｍ、Ｌ2＝１．６ｍｍ）。この構造では、ＣＰ
Ｕ６（発熱部品）の熱を放熱する放熱プレート８の熱が
本体部１の側面１１へと伝導する途中で、放熱プレート
８が対向する筐体部分に伝わることなく、本体部１の側
面１１へと良好に伝わる。その結果、机と接しているパ
ソコンの筐体部分が高温になる事を防止でき、パソコン
の接している机が熱くならない。As one of the features of the present invention, the heat radiation plate 8 has at least one bent portion toward the circuit board on which the CPU 6 is mounted. Therefore, the distance between the heat radiating plate 8 and the housing 7 opposed thereto is determined by the CPU 6.
It is larger portion L 2 of a distance L 1 from the CPU6 around just under the (heat-generating component) (heat-generating component) near (eg L 1 =
1.2 mm, L 2 = 1.6 mm). In this structure, the CP
While the heat of the heat radiating plate 8 that dissipates the heat of U6 (heat generating component) is being conducted to the side surface 11 of the main body 1, the heat radiating plate 8 is not transmitted to the opposing housing portion but to the side surface 11 of the main body 1. And transmitted well. As a result, it is possible to prevent the temperature of the case portion of the personal computer in contact with the desk from becoming high, and the desk in contact with the personal computer does not become hot.
【００１９】以下の表１は、図２のように放熱プレート
８に屈曲部を設けた場合の効果を示す実験結果である。
この表から判るように、図２のような屈曲部を設けた場
合、当該屈曲部が無い場合に対して、ＣＰＵ自体の温度
とともにＣＰＵ直下の筐体表面の温度が低下した。な
お、表中の数値は図７の内部構造を持つ携帯性のあるパ
ソコンを用いて実験した値である。Table 1 below is an experimental result showing the effect when a bent portion is provided on the heat radiation plate 8 as shown in FIG.
As can be seen from this table, when the bent portion as shown in FIG. 2 was provided, the temperature of the housing surface immediately below the CPU as well as the temperature of the CPU itself decreased compared to the case without the bent portion. The numerical values in the table are values obtained by experiments using a portable personal computer having the internal structure shown in FIG.
【００２０】[0020]
【表１】 [Table 1]
【００２１】図３は図１における本体部１を形成する筐
体内の回路基板のレイアウトの一例を上面から見た透視
図を示している（但し、回路基板以外は省略した）。こ
の図に示すように本体部１の左側面１ｄに相対する回路
基板５の端部には、本体部１の左側面１ｄ付近に筐体内
冷却用ファン９を設置できる空間を開けるための切り欠
き５ａが設けられている。なお、ファン９を本体部１の
後側面に設置する場合はそれに応じて切り欠きの位置も
変える必要がある。FIG. 3 is a perspective view of an example of a layout of a circuit board in a housing forming the main body 1 in FIG. 1 as viewed from above (however, components other than the circuit board are omitted). As shown in this figure, a notch is provided at an end of the circuit board 5 opposite to the left side 1d of the main body 1 to open a space in the vicinity of the left side 1d of the main body 1 where the cooling fan 9 in the housing can be installed. 5a is provided. When the fan 9 is installed on the rear side surface of the main body 1, the position of the notch needs to be changed accordingly.
【００２２】冷却用ファン９は、搭載するＣＰＵの性能
に応じた発生熱量によっては必ずしも備えなくても良い
が、回路基板５は、搭載するＣＰＵの発熱量に係わらず
ファン９を設置できる切り欠き５ａを備えていて、異な
る発熱量のＣＰＵでも汎用となるように同形とした。言
い換えれば、冷却ファンを備える必要がある装置でも必
要でない装置でも回路基板５は同一形状とした。The cooling fan 9 may not necessarily be provided depending on the amount of heat generated according to the performance of the mounted CPU. However, the circuit board 5 has a cutout on which the fan 9 can be installed regardless of the amount of heat generated by the mounted CPU. 5a, and have the same shape so that CPUs with different heat values can be used for general purposes. In other words, the circuit board 5 has the same shape regardless of whether it is necessary to provide the cooling fan or not.
【００２３】放熱プレート８とファン９を併用した場合
は、図２に示したように放熱プレート８とこれに対向す
る筐体７との間の空間が従来（図７および図８参照）よ
りも大きいため、流れる空気の量が増加するとともに、
放熱プレート８が対向する筐体７へと伝導する熱の損失
を防げるので、ＣＰＵ６および筐体７をより冷却するこ
とができる。When the heat radiating plate 8 and the fan 9 are used together, as shown in FIG. 2, the space between the heat radiating plate 8 and the housing 7 facing the heat radiating plate 8 is larger than that of the conventional case (see FIGS. 7 and 8). Because it is large, the amount of flowing air increases,
Since the heat dissipation plate 8 can prevent loss of heat conducted to the opposing housing 7, the CPU 6 and the housing 7 can be further cooled.
【００２４】また、本体部１の内部をＣＰＵ６と切り欠
き５ａを通る縦断面で表した概略図である図４のよう
に、ファン９を設置しない場合は、回路基板５の切り欠
き５ａの空間内に放熱プレート８におけるＣＰＵ６周辺
の部分を延ばして配置することにより、使われないスペ
ースを放熱性向上のために有効利用することが好まし
い。特に図４に示す構成によると、回路基板５の切り欠
き５ａの空間を利用して、放熱プレート８におけるＣＰ
Ｕ６周辺の部分をパソコン底側の筐体７から遠ざけるこ
とができるため、パソコン底側の筐体７表面の高熱化が
図２の形態に比べて一層抑えられる。When the fan 9 is not installed as shown in FIG. 4, which is a schematic view showing the inside of the main body 1 in a longitudinal section passing through the CPU 6 and the notch 5a, the space of the notch 5a of the circuit board 5 is provided. It is preferable that a portion around the CPU 6 in the heat radiation plate 8 is extended in the inside so that unused space is effectively used for improving heat radiation. In particular, according to the configuration shown in FIG. 4, the CP of the heat radiation plate 8 is utilized by utilizing the space of the notch 5a of the circuit board 5.
Since the portion around U6 can be kept away from the housing 7 on the bottom side of the personal computer, the surface of the housing 7 on the bottom side of the personal computer can be further prevented from being heated as compared with the embodiment shown in FIG.
【００２５】また図４に示した構成に対して、ファン９
を併用してもよい。この構成例を図５に示す。すなわ
ち、回路基板５の切り欠き５ａの空間に放熱プレート８
におけるＣＰＵ６周辺の部分を延ばすとともに、この空
間内の放熱プレートと、放熱プレート８に対向する筐体
７との間にファン取付部１０を用いて冷却用ファン９を
配置する構成が考えられる。なお、図５のようにファン
９の羽根部を水平方向にして配置することで、薄型の筐
体に好ましく対応させることができる。In addition to the configuration shown in FIG.
May be used in combination. FIG. 5 shows an example of this configuration. That is, the radiation plate 8 is provided in the space of the notch 5a of the circuit board 5.
A configuration in which a portion around the CPU 6 is extended and a cooling fan 9 is disposed between the heat radiating plate in this space and the housing 7 facing the heat radiating plate 8 by using a fan mounting portion 10 is considered. By arranging the blades of the fan 9 in the horizontal direction as shown in FIG. 5, it is possible to preferably cope with a thin housing.
【００２６】次に、その他の実施の形態を説明する。Next, another embodiment will be described.
【００２７】図６は、図１における本体部１の内部構造
の変形例の概略をＣＰＵを通る縦断面で表した図であ
る。この図を参照すると、回路基板５のキーボード４側
の基板面に発熱部品であるＣＰＵ６が直接または間接的
に搭載されている。キーボード４とＣＰＵ６の間には放
熱プレート８がＣＰＵ６の反搭載面６ａと接するように
配置され、かつ一端が本体部１の側面１１（図１参照）
へ向かって延びている。その上、放熱プレート８とこれ
に対向するキーボード４との距離は、ＣＰＵ６（発熱部
品）が接する部分における距離よりＣＰＵ６周辺（発熱
部品周辺）の部分の方が大きい。そのため、ＣＰＵ６
（発熱体）の熱を放熱する放熱プレート８の熱がキーボ
ード４に伝わることなく、本体部１の側面１１へと良好
に伝わる。その結果、利用者が触れるキーボード４が高
熱になる事を防止できる。FIG. 6 is a view schematically showing a modification of the internal structure of the main body 1 in FIG. 1 in a vertical section passing through the CPU. Referring to this figure, a CPU 6 which is a heat-generating component is directly or indirectly mounted on the board surface of the circuit board 5 on the keyboard 4 side. A heat radiation plate 8 is arranged between the keyboard 4 and the CPU 6 so as to be in contact with the non-mounting surface 6a of the CPU 6, and one end is a side surface 11 of the main body 1 (see FIG. 1).
Extending towards. In addition, the distance between the heat radiating plate 8 and the keyboard 4 facing the heat radiating plate 8 is larger at the portion around the CPU 6 (around the heat generating component) than at the portion where the CPU 6 (heat generating component) contacts. Therefore, CPU6
The heat of the heat radiating plate 8 that dissipates the heat of the (heating element) is transmitted to the side surface 11 of the main body 1 satisfactorily without being transmitted to the keyboard 4. As a result, it is possible to prevent the keyboard 4 touched by the user from becoming overheated.
【００２８】なお、図６に示した形態に対し、図３〜図
５を参照して説明した技術思想を適宜組み合わせたもの
も本発明に含む。The present invention also includes a combination of the embodiment shown in FIG. 6 and the technical ideas described with reference to FIGS. 3 to 5 as appropriate.
【００２９】[0029]
【発明の効果】以上説明したように、本発明よれば、放
熱体とこれに対向する筐体との距離が発熱部品が接する
部分における距離より、その発熱部品の周辺部における
距離の方が大きい構成をとることにより、発熱部品の熱
を放熱する放熱体の熱が筐体の側面へ伝導する途中で、
放熱体が対向する筐体部分に伝わることなく、筐体の側
面へと良好に伝わる。その結果、利用者が触れる操作盤
や机との接触部分が高熱になる事を防止できる。As described above, according to the present invention, the distance between the heat radiator and the housing facing the heat radiator is greater at the peripheral portion of the heat generating component than at the portion where the heat generating component contacts. By taking the configuration, while the heat of the radiator that radiates the heat of the heat-generating component is being conducted to the side of the housing,
The radiator does not propagate to the opposing housing portion, but transmits well to the side surface of the housing. As a result, it is possible to prevent the contact portion between the operation panel and the desk touched by the user from becoming overheated.
【００３０】さらに、放熱体と、これに対向する筐体部
分との間隔が広くなったので、筐体内冷却用ファンと併
用する場合、流れる空気の量が増加するとともに、放熱
体が対向する筐体部分へと伝わる熱の損失も一層妨げ
る。よって、発熱部品および筐体をより冷却することが
できる。Further, since the distance between the heat radiator and the housing portion facing the heat radiator is widened, when used together with the cooling fan in the housing, the amount of flowing air increases and the heat radiator faces the housing. Loss of heat transmitted to the body parts is further prevented. Therefore, the heat-generating component and the housing can be further cooled.
【００３１】その上、前記回路基板端部の、前記筐体の
側面付近に筐体内冷却用ファンを設置できる空間を開け
るための切り欠き内へ、前記放熱体における発熱部品の
周辺部分を延ばして配置することにより、放熱体とこれ
に対向する筐体との距離は発熱部品が接する部分におけ
る距離より、その発熱部品の周辺部における距離の方が
大きくなるため、放熱性が向上し、利用者が触れる操作
盤や机との接触部分の高熱化が一層抑えられる。In addition, a peripheral portion of the heat radiator is extended into a notch at an end of the circuit board near a side surface of the housing to open a space in which a cooling fan in the housing can be installed. By arranging, the distance between the heat radiator and the housing facing the heat radiator is larger at the peripheral portion of the heat generating component than at the portion where the heat generating component is in contact. The contact portion with the operation panel or desk touched by the heat can be further suppressed from being heated up.
【図１】本発明の情報処理装置の一例を示す概略斜視図
である。FIG. 1 is a schematic perspective view showing an example of an information processing apparatus according to the present invention.
【図２】図１に示した情報処理装置本体部を形成する筐
体の内部構造の概略を、発熱体であるＣＰＵを通る縦断
面で表した図である。FIG. 2 is a diagram schematically illustrating an internal structure of a housing forming a main body of the information processing apparatus illustrated in FIG. 1 in a vertical section passing through a CPU that is a heating element.
【図３】図１における本体部を形成する筐体内の回路基
板のレイアウトの一例を上面から見た透視図である。FIG. 3 is a perspective view of an example of a layout of a circuit board in a housing forming a main body in FIG. 1 as viewed from above.
【図４】図１における本体部のファン無しの場合の内部
構造の概略をＣＰＵと回路基板の切り欠き（図３）を通
る縦断面で表した図である。4 is a view schematically showing an internal structure of the main body in FIG. 1 in the case where there is no fan, in a vertical section passing through a notch (FIG. 3) of a CPU and a circuit board.
【図５】図１における本体部のファン有りの場合の内部
構造の変形例の概略をＣＰＵと回路基板の切り欠き（図
３）を通る縦断面で表した図である。5 is a view schematically showing a modification of the internal structure of the main body in FIG. 1 in the case where a fan is provided, in a vertical section passing through a notch (FIG. 3) of a CPU and a circuit board.
【図６】図１における本体部の内部構造の変形例の概略
をＣＰＵを通る縦断面で表した図である。FIG. 6 is a view schematically showing a modification of the internal structure of the main body in FIG. 1 in a vertical section passing through a CPU.
【図７】キーボードを備えた情報処理装置本体部の従来
の内部構造を示す断面概略図である。FIG. 7 is a schematic cross-sectional view showing a conventional internal structure of an information processing apparatus main body including a keyboard.
【図８】キーボードを備えた情報処理装置本体部の従来
の内部構造の別の例を示す断面概略図である。FIG. 8 is a schematic cross-sectional view showing another example of the conventional internal structure of the information processing apparatus main body including a keyboard.
１ 情報処理装置の本体部（キーボード側） ２ 情報処理装置の表示部 ３ ヒンジ部 ４ キーボード ４ａ キートップ ５ 回路基板 ５ａ 切り欠き ６ ＣＰＵ（発熱部品） ７ 筐体 ８ 放熱プレート ９ ファン １０ ファン取付部 １１ 側面 DESCRIPTION OF SYMBOLS 1 Main body part of information processing apparatus (keyboard side) 2 Display part of information processing apparatus 3 Hinge part 4 Keyboard 4a Key top 5 Circuit board 5a Notch 6 CPU (heat generating component) 7 Housing 8 Heat dissipation plate 9 Fan 10 Fan mounting part 11 Side
Claims (14)
路基板が筐体内に収容された情報処理装置において、 前記発熱部品には放熱体が取り付けられており、該放熱
体は、前記発熱部品が搭載された回路基板方向に向かっ
て少なくとも一つの屈曲部を有することを特徴とする情
報処理装置。1. An information processing apparatus having a heat generating component mounted on a circuit board and the circuit board housed in a housing, wherein a heat radiator is attached to the heat generating component, and the heat radiator includes An information processing apparatus having at least one bent portion toward a circuit board on which components are mounted.
路基板が筐体内に収容された情報処理装置において、 前記発熱部品には放熱体が取り付けられ、該放熱体とこ
れに対向する筐体部分との距離は前記発熱部品が接する
部分における距離より、前記発熱部品の周辺部における
距離の方が大きいことを特徴とする情報処理装置。2. An information processing apparatus in which a heat-generating component is mounted on a circuit board and the circuit board is housed in a housing, wherein the heat-generating component is provided with a heat radiator, and the heat radiator is opposed to the heat radiator. An information processing apparatus according to claim 1, wherein a distance to a body part is greater at a peripheral portion of said heat generating component than at a portion where said heat generating component contacts.
り、前記筐体の内部において前記放熱体は前記発熱部品
の回路基板への搭載面とは反対側と接し、かつ前記回路
基板と前記放熱体が前記操作盤に沿って配置されている
ことを特徴とする請求項１または２に記載の情報処理装
置。3. An operation panel is provided on an upper portion of the housing, wherein the radiator contacts an opposite side of a mounting surface of the heat-generating component to the circuit board inside the housing, and The information processing apparatus according to claim 1, wherein the radiator and the radiator are arranged along the operation panel.
に前記発熱部品が搭載されている請求項３に記載の情報
処理装置。4. The information processing apparatus according to claim 3, wherein the heat generating component is mounted on a side of the circuit board opposite to the operation panel.
発熱部品が搭載されている請求項３に記載の情報処理装
置。5. The information processing apparatus according to claim 3, wherein the heat generating component is mounted on a surface of the circuit board on the operation panel side.
ンを設置可能な空間が設けられた請求項４または５に記
載の情報処理装置。6. The information processing apparatus according to claim 4, wherein a space in which a cooling fan in the housing can be installed is provided near a side surface of the housing.
欠きを設けることで開けられている請求項６に記載の情
報処理装置。7. The information processing apparatus according to claim 6, wherein the space is opened by providing a notch at an end of the circuit board.
部分が前記切り欠き内へ延びて配置されている請求項７
に記載の情報処理装置。8. The heat dissipating element according to claim 7, wherein a peripheral portion of said heat generating component extends into said notch.
An information processing apparatus according to claim 1.
ていない請求項６から８のいずれか１項に記載の情報処
理装置。9. The information processing apparatus according to claim 6, wherein an in-housing cooling fan is not installed in the space.
設置する場合と同一形状としている請求項９に記載の情
報処理装置。10. The information processing apparatus according to claim 9, wherein the circuit board has the same shape as a case where a cooling fan in a housing is installed.
されている請求項６または７に記載の情報処理装置。11. The information processing apparatus according to claim 6, wherein an in-housing cooling fan is provided in the space.
と前記放熱体の前記切り欠き内に延びた部分との間に筐
体内冷却用ファンが配置されている請求項８に記載の情
報処理装置。12. The information according to claim 8, wherein a cooling fan in the housing is arranged between a portion of the housing facing the heat radiator and a portion of the heat radiator extending into the notch. Processing equipment.
設置しない場合と同一形状としている請求項１１または
１２に記載の情報処理装置。13. The information processing apparatus according to claim 11, wherein the circuit board has the same shape as that when no cooling fan in the housing is provided.
ら１３のいずれか１項に記載の情報処理装置。14. The information processing apparatus according to claim 1, further comprising a reflective liquid crystal display unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000312720A JP2002123336A (en) | 2000-10-12 | 2000-10-12 | Information processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000312720A JP2002123336A (en) | 2000-10-12 | 2000-10-12 | Information processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002123336A true JP2002123336A (en) | 2002-04-26 |
Family
ID=18792253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000312720A Pending JP2002123336A (en) | 2000-10-12 | 2000-10-12 | Information processor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002123336A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008084216A (en) * | 2006-09-28 | 2008-04-10 | Fujitsu Ltd | Electronic appliance |
| JP2010055642A (en) * | 2009-12-07 | 2010-03-11 | Fujitsu Ltd | Electronic appliance |
| JP2022119279A (en) * | 2021-02-04 | 2022-08-17 | Ｎｅｃプラットフォームズ株式会社 | Electronic device with cooling means and cooling method thereof |
| WO2024058469A1 (en) * | 2022-09-14 | 2024-03-21 | 삼성전자 주식회사 | Electronic device comprising heat dissipation member |
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