JPS60262494A - Control circuit unit - Google Patents
Control circuit unitInfo
- Publication number
- JPS60262494A JPS60262494A JP11844084A JP11844084A JPS60262494A JP S60262494 A JPS60262494 A JP S60262494A JP 11844084 A JP11844084 A JP 11844084A JP 11844084 A JP11844084 A JP 11844084A JP S60262494 A JPS60262494 A JP S60262494A
- Authority
- JP
- Japan
- Prior art keywords
- circuit unit
- wiring board
- printed wiring
- control circuit
- noise
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ＩＣを含んだ印刷配線板と、金属放熱板に放
熱フィンを固定した半導体部品とを有する制御回路ユニ
ットに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a control circuit unit having a printed wiring board containing an IC and a semiconductor component having heat dissipation fins fixed to a metal heat dissipation plate.
従来例の構成とその問題点
従来のこの種の制御回路ユニットは第１図に示す様に構
成されている。すなわち、印刷配線板１には、ＩＣ２・
電界コンデンサ３・小信号トランジスタ４・抵抗５・金
属放熱板６に放熱フィンで固定された半導体７等が取付
けられている。Conventional configuration and problems thereof A conventional control circuit unit of this type is configured as shown in FIG. That is, the printed wiring board 1 includes IC2.
A semiconductor 7 and the like fixed with heat radiation fins are attached to an electrolytic capacitor 3, a small signal transistor 4, a resistor 5, and a metal heat radiation plate 6.
この場合、印刷配線板１の外部から侵入するノ２・、−
７
等を追加しなければならないため、コンデンサ・ダイオ
ード、チョークコイル等の電子部品の点数が増加するの
みならず、印刷配線板１の形状が大きくなるという問題
点があった。また、ＩＣ２がＭＯＳタイプ（特にマイク
ロコンビーータ）等の場合、ノイズの影響は大かつ重で
あり、これをいかに軽減するかが大きなテーマとなって
いる。In this case, the particles entering the printed wiring board 1 from outside 2., -
7 etc., the number of electronic components such as capacitors, diodes and choke coils increases, and the size of the printed wiring board 1 also increases. Further, when the IC2 is a MOS type (especially a microconbeater), the influence of noise is large and serious, and how to reduce this is a major theme.
発明の目的
本発明は、上述の問題点を除去し、ノイズ特に静電気の
影響を最少限にすると共に、ノイズ対策用の電子部品点
数を少なくし、印刷配線板の形状を小さく保持すること
を目的とするものである。Purpose of the Invention The purpose of the present invention is to eliminate the above-mentioned problems, minimize the effects of noise, especially static electricity, reduce the number of electronic components for noise countermeasures, and keep the shape of a printed wiring board small. That is.
発明の構成
この目的を達成するために本発明は、半導体部品の放熱
フィンを固定した金属放熱板で、少なくとも印刷配線板
に取付けられたＩＣの一面側とその対向面側を覆ったこ
とにより、静電気等のノイズを金属放熱板に落とし、ノ
イズがＩＣ等へ直接印加されにくい構成にしたものであ
る。Structure of the Invention To achieve this object, the present invention covers at least one side of an IC mounted on a printed wiring board and the opposite side thereof with a metal heat sink to which the heat sink of a semiconductor component is fixed. The structure is such that static electricity and other noise is absorbed by a metal heat sink, making it difficult for noise to be directly applied to ICs and the like.
この構成により、ノイズがＩＣ等へ直接印加されにくい
ため、静電気等のノイズの影響を軽減することができる
。With this configuration, it is difficult for noise to be directly applied to the IC, etc., so that the influence of noise such as static electricity can be reduced.
実施例の説明
以下、本発明の一実施例を第２図〜第３図を用いて説明
する。なお、第２図〜第３図中、第１図と同一部品につ
いては同一番号を付している。８は半導体部品７の放熱
フィンであり、９は金属放熱板６と放熱フィン８との固
定用ネジである。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 and 3. Note that in FIGS. 2 and 3, the same parts as in FIG. 1 are given the same numbers. 8 is a heat radiation fin of the semiconductor component 7, and 9 is a screw for fixing the metal heat radiation plate 6 and the radiation fin 8.
本構成の様に、印刷配線板１に取付けたＩＣ２の一面側
及びその対向面側を金属放熱板６で間隙をおいて覆うこ
とにより、ＩＣ２及び印刷配線板１へ、直接、静電気等
のノイズの侵入するのが防止でき、静電気等の影響を軽
減することができる。As in this configuration, by covering one side and the opposite side of the IC 2 mounted on the printed wiring board 1 with the metal heat sink 6 with a gap in between, noise such as static electricity is directly transmitted to the IC 2 and the printed wiring board 1. The intrusion of static electricity can be prevented, and the effects of static electricity etc. can be reduced.
また、半導体部品７の放熱フィン８が絶縁されていなけ
れば、より静電気等のノイズが逃げやすくなるため効果
は大となる。Furthermore, if the radiation fins 8 of the semiconductor component 7 are not insulated, the effect will be greater because noise such as static electricity will escape more easily.
また、第３図の様に、放熱フィン８が絶縁されていない
半導体部品７をマイカ等の絶縁物１０及び絶縁ブッシン
グ１１を介して金属放熱板６と固定した場合でも金属放
熱板６と放熱フィン８との沿面距離ｌは比較的短いので
、静電気的のノイズは逃げやすく、この構成においても
効果は大きい。Furthermore, as shown in FIG. 3, even when a semiconductor component 7 with no insulated heat radiating fins 8 is fixed to the metal heat radiating plate 6 via an insulator 10 such as mica and an insulating bushing 11, the metal heat radiating plate 6 and the radiating fins Since the creepage distance l with respect to 8 is relatively short, electrostatic noise can easily escape, and this configuration also has a large effect.
なお、１２はナツトである。Note that 12 is a nut.
発明の効果
以上の様に、本発明の制御回路ユニットによれば、金属
放熱板で少なくとも印刷配線板に取付けられたＩＣの一
面側と他面側を覆ったので、静電気等のノイズに対する
影響を少なくすることができる。特にＩＣがＭＯＳタイ
プの場合顕著である。Effects of the Invention As described above, according to the control circuit unit of the present invention, since at least one side and the other side of the IC mounted on the printed wiring board are covered with a metal heat sink, the influence of noise such as static electricity can be reduced. It can be reduced. This is particularly noticeable when the IC is a MOS type.
またこの結果として印刷配線板上でのコンデンサダイオ
ードチョークコイル等の電子部品によるノイズ対策を少
なくすることができるため、印刷配線板の形状は小形に
保持でき、金属放熱板の形状を考慮するだけで静電気等
のノイズに対する影響を軽減できるという大きな効果が
得られる。In addition, as a result of this, it is possible to reduce noise countermeasures using electronic components such as capacitor diodes and choke coils on the printed wiring board, so the shape of the printed wiring board can be kept small, and only the shape of the metal heat sink can be considered. A great effect can be obtained in that the influence of noise such as static electricity can be reduced.
第１図は従来の制御回路ユニットの斜視図、第２図は本
発明の制御回路ユニットの一実施例の一５ｔ、−。
部切欠斜視図、第３図は本発明の他の実施例の側面図で
ある。
１・・・・・印刷配線板、２ ・ ・ＩＣ（集積部品）
、６ 金属放熱板、７・・・・半導体部品、８・・・放
熱フィン。FIG. 1 is a perspective view of a conventional control circuit unit, and FIG. 2 is an embodiment of the control circuit unit of the present invention. FIG. 3 is a side view of another embodiment of the present invention. 1...Printed wiring board, 2...IC (integrated parts)
, 6 metal heat sink, 7...semiconductor component, 8... heat sink fin.
Claims (1)
印刷配線板に取付けるとともに、このＩＣの一面側とそ
の対向面側は、前記半導体部品の放熱フィンを固定した
金属放熱板で覆った制御回路ユニット。An integrated component (hereinafter referred to as IC), an electronic component, and a semiconductor component are mounted on a printed wiring board, and one side of this IC and the opposite side thereof are covered with a metal heat sink to which the heat sink of the semiconductor component is fixed. circuit unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11844084A JPS60262494A (en) | 1984-06-08 | 1984-06-08 | Control circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11844084A JPS60262494A (en) | 1984-06-08 | 1984-06-08 | Control circuit unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60262494A true JPS60262494A (en) | 1985-12-25 |
Family
ID=14736688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11844084A Pending JPS60262494A (en) | 1984-06-08 | 1984-06-08 | Control circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60262494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123336A (en) * | 2000-10-12 | 2002-04-26 | Nec Corp | Information processor |
-
1984
- 1984-06-08 JP JP11844084A patent/JPS60262494A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123336A (en) * | 2000-10-12 | 2002-04-26 | Nec Corp | Information processor |
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