JP2793356B2 - Power device mounting board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a power device mounting plate provided with a metal substrate for heat dissipation.

[Conventional technology]

When mounting high-heat-generating power devices (power circuit components) such as inverters, it is necessary to dissipate the heat generated. Is being performed. The heat generated by the power device is transferred to the metal substrate and dissipated from the metal substrate.

FIG. 2 shows an example of such a mounting plate A, in which the power device 4 is mounted on the surface of the electric insulating layer 10 laminated on the metal substrate 1. And in this one, in addition to the power device 4, other circuit components 5,
For example, when mounting an IC or the like that is susceptible to heat that malfunctions when subjected to the action of heat, heat from the power device A is applied to the metal substrate 1.
To act on the circuit component 5 along the path.
Therefore, in this case, the printed wiring board 11 formed using a resin laminate such as a glass epoxy laminate as a substrate is bonded to a portion other than the portion where the power device 4 is mounted with an adhesive
This printed wiring board is laminated on the surface of the electrical insulation layer 10 at 12.
By mounting the circuit component 5 on the circuit board 11, the heat generated from the power device 4 is prevented from being transmitted to the circuit component 5 by the printed wiring board 11.

[Problems to be solved by the invention]

However, in this case, as described above, the printed wiring board 11
Therefore, there is a problem that the cost of parts is high and the processing cost of the printed wiring board 11 is also necessary, so that the product cost is high.

The present invention has been made in view of the above points, and has as its object to provide a power device mounting board that can be manufactured at low cost.

[Means for solving the problem]

The power device mounting board according to the present invention has an electrical insulating layer 2 with high thermal conductivity laminated on a part of the surface of the metal substrate 1 and an electrical insulating layer 3 with low thermal conductivity on another part,
It is characterized in that a high heat generating power device 4 is mounted on the surface of the electrical insulating layer 2 having high thermal conductivity, and another circuit component 5 is mounted on the surface of the electrical insulating layer 3 having low thermal conductivity. is there.

[Action]

According to the present invention, an electrical insulating layer 2 having high thermal conductivity is laminated on a part of the surface of the metal substrate 1 and an electrical insulating layer 3 having low thermal conductivity is laminated on another part of the surface. Since the high-heat-generating power device 4 is mounted on the surface of the high-electric-insulation layer 2 and the other circuit components 5 are mounted on the surface of the low-heat-conductivity electric-insulation layer 3, the power device 4 Heat is generated from the electrically insulating layer 2 having high thermal conductivity to the metal substrate 1.
And the heat can be radiated and the heat of the metal substrate 1 can be prevented from being transmitted to the circuit component 5 by the electric insulating layer 3 having low thermal conductivity.

〔Example〕

 Hereinafter, the present invention will be described in detail with reference to examples.

FIG. 1 shows an embodiment of the present invention. The surface of a metal substrate 1 made of a metal plate having excellent thermal conductivity, such as a copper plate or an aluminum plate, has heat at a place where the power device 4 is mounted. An electrical insulating layer 2 having high conductivity and an electrical insulating layer 3 having low thermal conductivity are laminated at other locations. The electric insulating layers 2 and 3 are formed as a resin layer such as an epoxy resin. The electric insulating layer 2 having a high thermal conductivity is made of a resin having a good thermal conductivity and an electric insulating property such as alumina. It can be formed by mixing about 80 to 90% by weight, and the electrically insulating layer 3 having low thermal conductivity can be formed by not adding a filler to the resin or by reducing the amount of the filler to a small amount.

In the mounting board A prepared as described above, a power device (power circuit component) 4 such as an inverter, a thyristor, a power transistor, or a controller board is mounted on the surface of the electrically insulating layer 2 having high thermal conductivity. And other circuit components 5, for example, circuit components 5 that are weak to heat, such as ICs, are electrically insulating layers 3 having low thermal conductivity.
It is mounted on the surface of the device and mounted. At this time, it is possible to form a circuit 13 on the surface of each of the electrical insulating layers 2 and 3 by etching a metal foil or the like, and mount the power device 4 or the circuit component 5 to this circuit so that the circuit 13 is connected. it can.

In the mounting board A, the power device 4
The heat generated from the metal substrate 1 is satisfactorily transmitted to the metal substrate 1 via the electrically insulating layer 2 having high thermal conductivity, and is radiated well from the metal substrate 1. Further, since the circuit component 5 is mounted on the surface of the electric insulating layer 3 having low thermal conductivity, the heat transmitted from the power device 4 to the metal substrate 1 is transmitted to the circuit component 5 by the electric insulating layer 3. Thus, it is possible to prevent the heat of the power device 4 from acting on the circuit component 5.

〔The invention's effect〕

As described above, in the present invention, an electrically insulating layer having high thermal conductivity is laminated on a part of the surface of a metal substrate, and an electrically insulating layer having low thermal conductivity is laminated on another part. The heat from the power device is transferred to the heat because the power device that generates high heat is mounted on the surface of the electrically insulating layer with high thermal conductivity and other circuit components are mounted on the surface of the electrically insulating layer with low thermal conductivity. The heat transfer from the power device to the metal board can be prevented from being transferred to the circuit components by the low heat conductive electrical insulation layer, while the heat transfer from the power device to the metal board can be satisfactorily conducted to the metal board. The power device and other circuit components can be mounted on one metal substrate, and the power device and other circuit components can be compactly mounted, and the heat of the power device acts on the circuit components. Prevent It is those that can Rukoto.

[Brief description of the drawings]

FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1 is a metal substrate, 2 is an electrical insulating layer having high thermal conductivity, 3 is an electrical insulating layer having low thermal conductivity, 4 is a power device, and 5 is a circuit component.

Claims (1)

(57) [Claims] An electric insulating layer having a high thermal conductivity, wherein an electric insulating layer having a high thermal conductivity is laminated on a part of the surface of a metal substrate and an electric insulating layer having a low thermal conductivity is laminated on another part. A power device mounting plate comprising: a high heat generating power device mounted on a surface of the device; and another circuit component mounted on a surface of an electrically insulating layer having low thermal conductivity.