JPH04180689A - Mounting board of power device - Google Patents

Mounting board of power device

Info

Publication number
JPH04180689A
JPH04180689A JP2310547A JP31054790A JPH04180689A JP H04180689 A JPH04180689 A JP H04180689A JP 2310547 A JP2310547 A JP 2310547A JP 31054790 A JP31054790 A JP 31054790A JP H04180689 A JPH04180689 A JP H04180689A
Authority
JP
Japan
Prior art keywords
power device
laminated
sheet
resin layer
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2310547A
Other languages
Japanese (ja)
Inventor
Hisao Murakami
村上　久男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2310547A priority Critical patent/JPH04180689A/en
Publication of JPH04180689A publication Critical patent/JPH04180689A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To execute a mounting operation with high reliability by a method wherein a ceramic sheet is laminated on one part on the surface of a metal base board, an insulating resin layer is laminated on other parts and a power device which generates heat highly is mounted on the surface of the ceramic sheet. CONSTITUTION:A ceramic sheet 2 is laminated, by a bonding operation or the like, on a part where a power device 4 is mounted on the surface of a metal base board 1 which is formed of a metal sheet whose thermal conductivity is excellent such as a copper sheet, an aluminum sheet or the like and an insulating resin layer 3 is laminated on other parts. The device (power circuit component) 4 which generates heat highly and which is used at a high voltage is loaded and mounted on the surface of the sheet 2 at a mounting board A formed in this manner and other power devices which are used at a low voltage or general circuit components 5 are loaded and mounted on the surface of the layer 3. Thereby, the high-voltage device 4 can be mounted with high reliability, and the ceramic sheet whose costs are high may be used only in the part where the device 4 is mounted. As a result, it is possible to restrain material costs from becoming high.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、放熱のために金属基板を具備したパワーデバ
イス実装板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a power device mounting board provided with a metal substrate for heat radiation.

〔従来の技術〕[Conventional technology]

インバーターなど高発熱のパワーデバイス（パワー回路
部品）を実装する場合、その発熱を放熱する必要がある
ために、銅板やアルニミニウ板など熱伝導性の優れた金
属基板を用いて実装板を作成することがおこなわれてい
る。パワーデバイスの発熱は金属基板に伝熱され、金属
基板から放散されるのである。When mounting a power device (power circuit component) that generates a lot of heat, such as an inverter, it is necessary to dissipate the heat, so the mounting board is created using a metal substrate with excellent thermal conductivity, such as a copper plate or an aluminum plate. is being carried out. Heat generated by the power device is transferred to the metal substrate and radiated from the metal substrate.

第２図はこのような実装板Ａの一例を示すものであり、
パワーデバイス４は金属基板１に積層した絶縁樹脂層３
を介して電気絶縁性を確保した状態で実装するようにし
である。FIG. 2 shows an example of such a mounting board A.
The power device 4 includes an insulating resin layer 3 laminated on a metal substrate 1
It should be mounted while ensuring electrical insulation through the .

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしこのものにあって、パワーデバイス４が高電圧タ
イプのものの場合、樹脂絶縁層３ではパワーデバイス４
と金属基板１との間の耐圧を得ることは難しく、高電圧
のパワーデバイス４を信頼性高く実装することが難しい
という問題があった本発明は上記の点に鑑みて為された
ものであり、高電圧のパワーデバイスを信頼性高く実装
することができるパワーデバイス実装板を提供すること
を目的とするものである。However, in this case, if the power device 4 is a high voltage type, the resin insulation layer 3
It is difficult to obtain a withstand voltage between the metal substrate 1 and the metal substrate 1, and it is difficult to mount the high voltage power device 4 with high reliability.The present invention was made in view of the above points. The object of the present invention is to provide a power device mounting board on which high voltage power devices can be mounted with high reliability.

〔課題を解決するための手段〕[Means to solve the problem]

本発明に係るパワーデバイス実装板は、金属基板１の表
面の一部にセラミック板２を積層すると共に他の一部に
絶縁樹脂層３を積層し、セラミック板２の表面に高発熱
のパワーデバイス４を実装して成ることを特徴とするも
のである。The power device mounting board according to the present invention has a ceramic plate 2 laminated on a part of the surface of a metal substrate 1 and an insulating resin layer 3 laminated on the other part, and a high heat generating power device is mounted on the surface of the ceramic plate 2. 4 is implemented.

〔作用〕[Effect]

本発明にあっては、金属基板ｌの表面の一部にセラミッ
ク板２を積層すると共に他の一部に絶縁樹脂層３を積層
し、セラミック板２の表面に高発熱のパワーデバイス４
を実装するようにしているために、パワーデバイス４と
金属基板１との間の高耐電圧をセラミック板２で確保す
ることかできる。In the present invention, a ceramic plate 2 is laminated on a part of the surface of the metal substrate l, and an insulating resin layer 3 is laminated on the other part, and a high heat generating power device 4 is laminated on the surface of the ceramic plate 2.
Since the power device 4 and the metal substrate 1 are mounted, a high withstand voltage between the power device 4 and the metal substrate 1 can be ensured by the ceramic plate 2.

〔実施例〕〔Example〕

以下、本発明を実施例によって詳述する。 Hereinafter, the present invention will be explained in detail by way of examples.

第１図は本発明の一実施例を示すものであり、銅板やア
ルミニウム板など熱伝導性に優れた金属板で作成される
金属基板ｌの表面には、パワーデバイス４を実装する箇
所においてセラミック板２が接着等して積層してあり、
またその他の箇所には絶縁樹脂層３が積層しである。セ
ラミック板２としてはアルミナ等を焼結して作成される
ものを用いることができるものであり、熱伝導性を高め
るために、セラミック板２の表面に銅等の熱伝動率の高
い金属を溶射して作成されるメタライズされたセラミッ
ク板２を用いるのか好ましい。また絶縁樹脂層３はエポ
キシ樹脂などの樹脂の層として形成されるものであり、
アルミナ粉等の熱伝導性が良好で且つ電気絶縁性を有す
るフィラーを樹脂に配合することによって、熱伝導性を
高めるようにしである。FIG. 1 shows an embodiment of the present invention, in which the surface of a metal substrate l made of a metal plate with excellent thermal conductivity such as a copper plate or an aluminum plate is coated with ceramic at the location where the power device 4 is mounted. The plates 2 are laminated with adhesive etc.
Further, an insulating resin layer 3 is laminated at other locations. The ceramic plate 2 can be made by sintering alumina or the like, and in order to increase thermal conductivity, a metal with high thermal conductivity such as copper is sprayed on the surface of the ceramic plate 2. It is preferable to use a metallized ceramic plate 2 produced by. Further, the insulating resin layer 3 is formed as a layer of resin such as epoxy resin,
Thermal conductivity is increased by blending a filler with good thermal conductivity and electrical insulation, such as alumina powder, into the resin.

上記のようにして作成される実装板Ａにあって、インバ
ータやサイリスタ、パワートランジスタなど高放熱性で
あると共に高圧で使用されるパワーデバイス（パワー回
路部品）４はセラミック板２の表面に搭載して実装をお
こなうものであり、またその他の低圧で使用されるパワ
ーデバイスや一般の回路部品５は絶縁樹脂層３の表面に
搭載して実装をおこなうものである。このとき、セラミ
ック板２としてメタライズされたものを用いる場合には
、セラミック板２の箇所では電気絶縁性を確保できない
ので、絶縁樹脂層３の表面において回路６を作成し、こ
の回路６にパワーデバイス４や回路部品５を接続するよ
うにしである。回路６の作成は、銅箔等の金属箔をセラ
ミック板２や絶縁樹脂層３の表面の全面に積層し、これ
をエツチング加工して不要部分を除去することによって
おこなうことができる。In the mounting board A created as described above, power devices (power circuit components) 4 such as inverters, thyristors, and power transistors that have high heat dissipation and are used at high voltage are mounted on the surface of the ceramic board 2. Other power devices used at low voltage and general circuit components 5 are mounted on the surface of the insulating resin layer 3 for mounting. At this time, if a metallized ceramic plate 2 is used, electrical insulation cannot be ensured at the ceramic plate 2, so a circuit 6 is created on the surface of the insulating resin layer 3, and a power device is connected to the circuit 6. 4 and circuit components 5 are connected. The circuit 6 can be created by laminating a metal foil such as a copper foil over the entire surface of the ceramic plate 2 or the insulating resin layer 3, and etching it to remove unnecessary parts.

しかして上記のように作成される実装板Ａにあって、パ
ワーデバイス４や回路部品５からの発熱はセラミック板
２や絶縁樹脂層３を介して金属基板ｌに伝わり、金属基
板ｌから良好に放熱される。セラミック板２としてメタ
ライズされたものを用いる場合には熱伝導性が良好であ
るために、放熱を一層良好におこなわせることができる
。また、セラミック板２は耐電圧性が高いために、パワ
ーデバイス４と金属基板１との間の高耐電圧をセラミッ
ク板２で確保することができるものである〔発明の効果
〕 上述のように本発明にあっては、金属基板の表面の一部
にセラミック板を積層すると共に他の一部に絶縁樹脂層
を積層し、セラミック板の表面に高発熱のパワーデバイ
スを実装するようにしているために、パワーデバイスと
金属基板との間の高耐電圧をセラミック板で確保するこ
とができ、高電圧のパワーデバイスを信頼性高く実装す
ることができるものである。しかも高価なセラミック板
はパワーデバイスを実装する箇所にだけ用いればよいも
のであり、材料コストが高くなることを抑えることがで
きるものである。However, in the mounting board A produced as described above, heat generated from the power device 4 and circuit components 5 is transmitted to the metal substrate l via the ceramic plate 2 and the insulating resin layer 3, and is effectively removed from the metal substrate l. Heat is dissipated. When a metallized ceramic plate 2 is used, it has good thermal conductivity, so that heat can be dissipated even better. Furthermore, since the ceramic plate 2 has high voltage resistance, the ceramic plate 2 can ensure a high voltage resistance between the power device 4 and the metal substrate 1. [Effects of the Invention] As described above. In the present invention, a ceramic plate is laminated on a part of the surface of the metal substrate, and an insulating resin layer is laminated on the other part, so that a high heat generation power device is mounted on the surface of the ceramic plate. Therefore, a high withstand voltage between the power device and the metal substrate can be ensured by the ceramic plate, and a high voltage power device can be mounted with high reliability. Moreover, the expensive ceramic plate only needs to be used at the location where the power device is mounted, and an increase in material cost can be suppressed.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の断面図、第２図は従来例の
断面図である。 ｌは金属基板、２はセラミック板、３は絶縁樹脂層、４
はパワーデバイスである。FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1 is a metal substrate, 2 is a ceramic plate, 3 is an insulating resin layer, 4
is a power device.

Claims (2)

【特許請求の範囲】[Claims] （１）金属基板の表面の一部にセラミック板を積層する
と共に他の一部に絶縁樹脂層を積層し、セラミック板の
表面に高発熱のパワーデバイスを実装して成ることを特
徴とするパワーデバイス実装板。(1) A power source characterized by laminating a ceramic plate on a part of the surface of a metal substrate and laminating an insulating resin layer on the other part, and mounting a high heat generation power device on the surface of the ceramic plate. Device mounting board. （２）セラミック板としてメタライズされたものを用い
ることを特徴とする請求項１に記載のパワーデバイス実
装板。(2) The power device mounting board according to claim 1, wherein a metallized ceramic board is used.
JP2310547A 1990-11-15 1990-11-15 Mounting board of power device Pending JPH04180689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2310547A JPH04180689A (en) 1990-11-15 1990-11-15 Mounting board of power device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2310547A JPH04180689A (en) 1990-11-15 1990-11-15 Mounting board of power device

Publications (1)

Publication Number Publication Date
JPH04180689A true JPH04180689A (en) 1992-06-26

Family

ID=18006552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2310547A Pending JPH04180689A (en) 1990-11-15 1990-11-15 Mounting board of power device

Country Status (1)

Country Link
JP (1) JPH04180689A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621248U (en) * 1992-08-19 1994-03-18 株式会社富士通ゼネラル Substrate for hybrid IC
JPH0623269U (en) * 1992-08-28 1994-03-25 太陽誘電株式会社 Circuit device having heat sink
EP2416630A1 (en) * 2010-08-05 2012-02-08 Unimicron Technology Corp. Circuit board and manufacturing method thereof
JP2013026416A (en) * 2011-07-20 2013-02-04 Toyoda Gosei Co Ltd Element mounting substrate and light emitting device including the same
US8598463B2 (en) 2010-08-05 2013-12-03 Unimicron Technology Corp. Circuit board and manufacturing method thereof
WO2013186364A1 (en) * 2012-06-14 2013-12-19 Osram Gmbh Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board
CN103917043A (en) * 2014-03-14 2014-07-09 苏州晶品光电科技有限公司 Patterned multi-insulating-material circuit substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6436256A (en) * 1987-07-31 1989-02-07 Nec Corp Facsimile equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6436256A (en) * 1987-07-31 1989-02-07 Nec Corp Facsimile equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621248U (en) * 1992-08-19 1994-03-18 株式会社富士通ゼネラル Substrate for hybrid IC
JPH0623269U (en) * 1992-08-28 1994-03-25 太陽誘電株式会社 Circuit device having heat sink
EP2416630A1 (en) * 2010-08-05 2012-02-08 Unimicron Technology Corp. Circuit board and manufacturing method thereof
US8598463B2 (en) 2010-08-05 2013-12-03 Unimicron Technology Corp. Circuit board and manufacturing method thereof
JP2013026416A (en) * 2011-07-20 2013-02-04 Toyoda Gosei Co Ltd Element mounting substrate and light emitting device including the same
WO2013186364A1 (en) * 2012-06-14 2013-12-19 Osram Gmbh Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board
US9516748B2 (en) 2012-06-14 2016-12-06 Osram Gmbh Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board
CN103917043A (en) * 2014-03-14 2014-07-09 苏州晶品光电科技有限公司 Patterned multi-insulating-material circuit substrate

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