JPH0917921A - Cooling structure of electronic device unit - Google Patents
Cooling structure of electronic device unitInfo
- Publication number
- JPH0917921A JPH0917921A JP19112795A JP19112795A JPH0917921A JP H0917921 A JPH0917921 A JP H0917921A JP 19112795 A JP19112795 A JP 19112795A JP 19112795 A JP19112795 A JP 19112795A JP H0917921 A JPH0917921 A JP H0917921A
- Authority
- JP
- Japan
- Prior art keywords
- high heat
- heat generation
- electronic device
- device unit
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インテル社「ｉ４８
６」等の大型の高発熱ＩＣを１つ有する電子機器ユニッ
トであって、特に工場の製造現場等で長時間連続運転さ
れる産業用電子機器ユニットの冷却構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a cooling structure for an electronic device unit having one large high heat generation IC such as 6 ”, and particularly for an industrial electronic device unit that is continuously operated for a long time at a factory manufacturing site or the like.
【０００２】[0002]
【従来の技術】インテル社「ｉ４８６」等の大型の高発
熱ＩＣを冷却するため、そのＩＣ上に直接、そのＩＣの
垂直上方から見てほぼ同じ大きさの超小型の電動ファン
を取り付けて、強制冷却する方式が知られている。一
方、実開平１−１３９４９４号公報には、複数のＩＣの
上面部に金属ブロックを接着し、その複数の金属ブロッ
ク上に共通して１枚の放熱板を密接固着し、その放熱板
が筐体に固着されたものが開示されている。2. Description of the Related Art In order to cool a large heat generating IC such as Intel's "i486", an ultra-small electric fan of about the same size as that seen vertically from above the IC is directly mounted on the IC. A method of forced cooling is known. On the other hand, in Japanese Utility Model Laid-Open No. 1-139494, a metal block is adhered to the upper surface of a plurality of ICs, and one heat sink is commonly adhered to the plurality of metal blocks in close contact with each other. Those fixed to the body are disclosed.
【０００３】[0003]
【発明が解決しようとする課題】ところが、電動ファン
を使用する従来のものは、電動ファンの耐久性や、電動
ファンからの電磁ノイズの発生等に難点があり、工場の
製造現場等で長時間連続運転されるものには適用できな
かった。また、実開平１−１３９４９４号公報に示され
るものは、複数のＩＣに対して共通の１枚の放熱板とな
るので、放熱効果が低く、さらに、その放熱板が金属の
場合は、筐体接地（フレームグランド）となり、電磁ノ
イズを拾ってしまい、ＩＣに悪影響を与えるという問題
がある。そこで、本発明は、電磁ノイズを拾うことな
く、また強制冷却手段を用いることなく大型の高発熱Ｉ
Ｃを冷却できる電子機器ユニットを提供することを目的
とする。However, the conventional one using an electric fan has drawbacks such as durability of the electric fan and generation of electromagnetic noise from the electric fan, and therefore, it is difficult to operate the electric fan for a long time in a factory. It could not be applied to those that are operated continuously. Further, the one disclosed in Japanese Utility Model Laid-Open No. 1-139494 has a single heat dissipation plate common to a plurality of ICs, and therefore has a low heat dissipation effect. Further, when the heat dissipation plate is a metal, the housing is There is a problem in that it becomes ground (frame ground), electromagnetic noise is picked up, and the IC is adversely affected. Therefore, in the present invention, a large, high heat generation I is achieved without picking up electromagnetic noise and without using a forced cooling means.
An object is to provide an electronic device unit capable of cooling C.
【０００４】[0004]
【課題を解決するための手段】本発明は、高発熱ＩＣを
実装したプリント基板を有する電子機器ユニットにおい
て、前記高発熱ＩＣの上面部に接着した金属ブロック
と、前記金属ブロック上にネジ止めしたプリント基板と
略同一の大きさの放熱用金属板とを備え、前記放熱用金
属板の周辺部の少なく１箇所は前記プリント基板にスタ
ッドを介して固定するとともに、前記高発熱ＩＣの信号
電位にグランドしたことを特徴とするものである。According to the present invention, in an electronic equipment unit having a printed circuit board on which a high heat generation IC is mounted, a metal block adhered to the upper surface of the high heat generation IC, and screwed onto the metal block. A heat-dissipating metal plate having substantially the same size as the printed circuit board is provided, and at least one peripheral portion of the heat-dissipating metal plate is fixed to the printed circuit board via studs, and at the same time the signal potential of the high heat generating IC is maintained. It is characterized by having been grounded.
【０００５】[0005]
【作用】上記手段により、工場の製造現場等で長時間連
続運転されるものには適用できない小型の電動ファンに
よる強制空冷を施すことなく、インテル社「ｉ４８６」
等の大型の高発熱ＩＣを容易にかつ長時間の運転に供す
ることのできる高信頼性を持った冷却方式を提供するこ
とができる。By the above means, the Intel "i486" can be used without forced air cooling by a small electric fan, which is not applicable to those that are continuously operated for a long time at a factory manufacturing site.
It is possible to provide a highly reliable cooling system capable of easily operating a large-sized high heat generation IC such as the above for long-term operation.
【０００６】[0006]
【実施例】以下、本発明の実施例を図に基づいて説明す
る。図１は構成図、図２は基板上のプリント配線例であ
る。図１（Ａ）は斜視図、図１（Ｂ）は、図１のＢ方向
から見た図である。さて、プリント基板１に実装された
高発熱ＩＣ２の上部に金属ブロック３を熱伝導性接着剤
４により接着する。この金属ブロック３と密着するよう
に、熱伝導性グリース９を介してプリント基板と概ね同
寸法の金属板５を実装する。熱伝導性グリース９は伝熱
性をよくするためのものであり、必須のものではない。
金属板５は放熱用であり、アルミ板が望ましい。金属板
５の４隅には、導電性のスタッド６によりプリント基板
１のシグナルグランドと接続するべく、スタッド固定用
の穴７を設けている。プリント基板にも、スタッド６を
介して金属板５と電気的に接続するためにスタッド固定
用の穴７とその周囲に配設されたランド１０を設けてい
る。すなわち、プリント基板１、プリント基板と概ね同
寸法の金属板５、スタッド６、金属ブロック３はネジ８
で固定し、高発熱ＩＣ２とその上部の金属ブロック３は
熱伝導性の接着剤で接着する。スタッド６の高さは、高
発熱ＩＣ２に金属ブロック３を積み重ねた高さと等しい
高さを有するものである。逆にいうと、金属ブロック３
の高さは、スタッド６の高さから高発熱ＩＣ２の高さを
差し引いたものとも言える。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram, and FIG. 2 is an example of printed wiring on a substrate. 1A is a perspective view, and FIG. 1B is a view seen from the direction B in FIG. Now, the metal block 3 is bonded to the upper portion of the high heat generating IC 2 mounted on the printed board 1 by the heat conductive adhesive 4. A metal plate 5 having substantially the same size as the printed circuit board is mounted via a heat conductive grease 9 so as to be in close contact with the metal block 3. The heat conductive grease 9 is for improving heat conductivity and is not essential.
The metal plate 5 is for heat dissipation and is preferably an aluminum plate. Holes 7 for fixing studs are provided at the four corners of the metal plate 5 so as to be connected to the signal ground of the printed board 1 by the conductive studs 6. The printed board is also provided with holes 7 for fixing studs and lands 10 arranged around the holes 7 for electrically connecting to the metal plate 5 via the studs 6. That is, the printed circuit board 1, the metal plate 5 having substantially the same dimensions as the printed circuit board, the studs 6, and the metal block 3 are provided with screws 8.
Then, the high heat generating IC 2 and the metal block 3 above it are bonded by a heat conductive adhesive. The height of the stud 6 is the same as the height of the metal block 3 stacked on the high heat generation IC 2. Conversely, the metal block 3
The height of can be said to be the height of the stud 6 minus the height of the high heat generation IC 2.
【０００７】図２において、プリント基板上のプリント
配線は、プリント基板と概ね同寸法の金属板５を固定す
るスタッドをプリント基板のシグナルグランドに短絡さ
せるために、スタッド固定用穴７のランド１０をシグナ
ルグランドに配線している。多層基板であれば、そのラ
ンド１０からスルホールを介してシグナルグランド層に
接続し、両面基板であればシグナルグランドのパターン
配線に接続する。工場現場では、保安用のフレームグラ
ンドに接地すると、かえってノイズを拾う恐れがあるた
め、フレームグランドとは絶縁されているＣＰＵのシグ
ナルグランド（ＯＶ）に接地させるのである。これによ
り、放射雑音等の外部からの雑音に対しての耐久性が増
す効果がある。したがって、金属板５は放熱と耐雑音の
２面効果を有するのである。なお、図２では、四隅のス
タッド固定用穴７のランド１０から全てシグナルグラン
ドに接続している例を示しているが、ノイズ試験の結果
次第では必ずしも四隅ともシグナルグランドに接続する
必要はない。さらに、金属板５は平面であり、これを垂
直方向になるように電子機器を設置すれば、プリント基
板１と金属板５で熱気が上昇する空気の対流路が確保さ
れることになり、放射放熱より効果的である。In FIG. 2, the printed wiring on the printed circuit board has a land 10 of a stud fixing hole 7 for short-circuiting a stud for fixing a metal plate 5 having substantially the same size as the printed circuit board to a signal ground of the printed circuit board. Wiring to the signal ground. If it is a multi-layer substrate, it is connected to the signal ground layer from the land 10 through the through hole, and if it is a double-sided substrate, it is connected to the pattern wiring of the signal ground. At the factory site, noise may be picked up if grounded to the security frame ground. Therefore, the signal ground (OV) of the CPU, which is insulated from the frame ground, is grounded. This has the effect of increasing durability against external noise such as radiation noise. Therefore, the metal plate 5 has two effects of heat dissipation and noise resistance. Although FIG. 2 shows an example in which the lands 10 of the stud fixing holes 7 at the four corners are all connected to the signal ground, it is not always necessary to connect the four corners to the signal ground depending on the result of the noise test. Further, the metal plate 5 is a flat surface, and if the electronic device is installed so that the metal plate 5 is in a vertical direction, the printed circuit board 1 and the metal plate 5 will secure a convection path for the air in which hot air rises. It is more effective than heat dissipation.
【０００８】[0008]
【発明の効果】以上述べたように、本発明によれば、工
場の製造現場等で長時間連続運転されているものには適
用できない小型の電動ファンによる強制空冷を施すこと
なく、大型の高発熱ＩＣを容易にかつ長時間の運転に供
することのできる高信頼性を持った冷却構造を提供する
ことができるばかりでなく、放熱用金属板を高発熱ＩＣ
の信号電位にグランドさせることにより、放射雑音等の
外部からの雑音に対しての耐久性が増し、また、電動フ
ァンを使用することが無いためにコストの削減などを見
込むことができる。As described above, according to the present invention, it is possible to apply a large-sized high-performance machine without applying forced air cooling by a small electric fan, which cannot be applied to a machine that is continuously operated for a long time at a manufacturing site of a factory. In addition to providing a highly reliable cooling structure that allows the heat generating IC to be easily operated for a long time, the heat radiating metal plate is used as the high heat generating IC.
By grounding the signal potential of No. 2 to ground, the durability against external noise such as radiated noise is increased, and cost reduction can be expected because the electric fan is not used.
【図１】本発明の実施例を示す構造図FIG. 1 is a structural diagram showing an embodiment of the present invention.
【図２】本発明の実施例の基板上のプリント配線例FIG. 2 is an example of printed wiring on a board according to an embodiment of the present invention.
１…プリント基板、２…高発熱ＩＣ、３…金属ブロッ
ク、４…熱伝導性接着剤、５…金属板、６…スタッド、
７…スタッド固定用の穴、８…ネジ、９…熱伝導性グリ
ース、１０…ランド1 ... Printed circuit board, 2 ... High heat generation IC, 3 ... Metal block, 4 ... Thermal conductive adhesive, 5 ... Metal plate, 6 ... Stud,
7 ... Hole for fixing stud, 8 ... Screw, 9 ... Thermal conductive grease, 10 ... Land
Claims (3)
する電子機器ユニットにおいて、 前記高発熱ＩＣの上面部に接着した金属ブロックと、 前記金属ブロック上にネジ止めしたプリント基板と略同
一の大きさの放熱用金属板とを備え、 前記放熱用金属板の周辺部の少なく１箇所は前記プリン
ト基板にスタッドを介して固定するとともに、前記高発
熱ＩＣの信号電位にグランドしたことを特徴とする電子
機器ユニットの冷却構造。1. An electronic device unit having a printed circuit board on which a high heat generation IC is mounted, wherein the metal block bonded to the upper surface of the high heat generation IC and the printed circuit board screwed onto the metal block have substantially the same size. And a heat-dissipating metal plate, wherein at least one peripheral portion of the heat-dissipating metal plate is fixed to the printed circuit board via studs and is grounded to the signal potential of the high heat generation IC. Equipment unit cooling structure.
ドの高さから、前記高発熱ＩＣの高さを引いた値である
請求項１記載の電子機器ユニットの冷却構造。2. The cooling structure for an electronic device unit according to claim 1, wherein the height of the metal block is a value obtained by subtracting the height of the high heat generation IC from the height of the stud.
に設置するものである請求項１または２記載の電子機器
ユニットの冷却構造。3. The cooling structure for an electronic device unit according to claim 1, wherein the heat-dissipating metal plate is installed in a vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07191127A JP3077884B2 (en) | 1995-07-03 | 1995-07-03 | Cooling structure of electronic equipment unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07191127A JP3077884B2 (en) | 1995-07-03 | 1995-07-03 | Cooling structure of electronic equipment unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0917921A true JPH0917921A (en) | 1997-01-17 |
| JP3077884B2 JP3077884B2 (en) | 2000-08-21 |
Family
ID=16269326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07191127A Expired - Fee Related JP3077884B2 (en) | 1995-07-03 | 1995-07-03 | Cooling structure of electronic equipment unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3077884B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294312A (en) * | 2004-03-31 | 2005-10-20 | Matsushita Electric Ind Co Ltd | Substrate device |
| JP2007258385A (en) * | 2006-03-23 | 2007-10-04 | Yokogawa Electric Corp | Heat-sink device |
| JP2013138445A (en) * | 2013-01-23 | 2013-07-11 | Canon Inc | Imaging apparatus and electronic apparatus |
| JP2018113400A (en) * | 2017-01-13 | 2018-07-19 | ブラザー工業株式会社 | Electronic device |
| JP2019083262A (en) * | 2017-10-30 | 2019-05-30 | セイコーエプソン株式会社 | Printed circuit board |
| US10631397B1 (en) | 2018-10-25 | 2020-04-21 | Seiko Epson Corporation | Printed circuit board, electronic device and heat conduction sheet |
-
1995
- 1995-07-03 JP JP07191127A patent/JP3077884B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005294312A (en) * | 2004-03-31 | 2005-10-20 | Matsushita Electric Ind Co Ltd | Substrate device |
| JP2007258385A (en) * | 2006-03-23 | 2007-10-04 | Yokogawa Electric Corp | Heat-sink device |
| JP2013138445A (en) * | 2013-01-23 | 2013-07-11 | Canon Inc | Imaging apparatus and electronic apparatus |
| JP2018113400A (en) * | 2017-01-13 | 2018-07-19 | ブラザー工業株式会社 | Electronic device |
| JP2019083262A (en) * | 2017-10-30 | 2019-05-30 | セイコーエプソン株式会社 | Printed circuit board |
| US10779390B2 (en) | 2017-10-30 | 2020-09-15 | Seiko Epson Corporation | Printed circuit board and electronic device |
| US11013102B2 (en) | 2017-10-30 | 2021-05-18 | Seiko Epson Corporation | Printed circuit board and electronic device |
| US10631397B1 (en) | 2018-10-25 | 2020-04-21 | Seiko Epson Corporation | Printed circuit board, electronic device and heat conduction sheet |
| EP3644699A1 (en) | 2018-10-25 | 2020-04-29 | Seiko Epson Corporation | Printed circuit board, electronic device and heat conduction sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3077884B2 (en) | 2000-08-21 |
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