JP7376117B2 - Electronic equipment equipped with cooling means and its cooling method - Google Patents

Electronic equipment equipped with cooling means and its cooling method Download PDF

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JP7376117B2
JP7376117B2 JP2021016268A JP2021016268A JP7376117B2 JP 7376117 B2 JP7376117 B2 JP 7376117B2 JP 2021016268 A JP2021016268 A JP 2021016268A JP 2021016268 A JP2021016268 A JP 2021016268A JP 7376117 B2 JP7376117 B2 JP 7376117B2
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generating component
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達夫 秋葉
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NEC Platforms Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Description

本発明は、冷却手段を備えた電子機器およびその冷却方法に関する。 The present invention relates to an electronic device equipped with a cooling means and a cooling method thereof.

金属製の筐体内に発熱部品が配置された電子機器（例えば、ルータなどの通信機器）において、発熱部品の発熱により、温度上昇した筐体表面に使用者が接触することで、低温やけど等の事故が発生する場合があった。 In electronic devices (e.g., communication devices such as routers) that have heat-generating components placed inside a metal casing, users may suffer from low-temperature burns if they come into contact with the surface of the casing, which has risen in temperature due to the heat generated by the heat-generating components. Accidents could occur.

特許文献１では、筐体内に排気ファンを取付け、この排気ファンによって筐体内の空気を外部に排気することで、電子機器の冷却を行う方法が開示されている。 Patent Document 1 discloses a method of cooling an electronic device by installing an exhaust fan inside the housing and exhausting air inside the housing to the outside using the exhaust fan.

実開平５－２１４９１号公報Utility Model Publication No. 5-21491

しかしながら、特許文献１に記載の方法では、筐体表面の冷却が不十分な場合があり、上記事故を予防する観点から、より優れた冷却方法および冷却手段を備えた電子機器の開発が求められていた。 However, with the method described in Patent Document 1, cooling of the surface of the casing may be insufficient, and from the viewpoint of preventing the above-mentioned accidents, there is a need to develop electronic devices equipped with better cooling methods and cooling means. was.

本発明は、上述した課題を鑑みてなされたものであり、簡単な構成で筐体表面の温度上昇を防ぐことができる冷却手段を備えた電子機器、およびその冷却方法を提供することを目的とする。 The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an electronic device equipped with a cooling means that can prevent a rise in temperature on the surface of the casing with a simple configuration, and a method for cooling the same. do.

本発明の冷却手段を備えた電子機器は、金属製の筐体と、前記筐体内に配置される、発熱部品および冷却手段と、前記発熱部品の温度を計測する温度計測手段と、を含み、前記冷却手段は、前記発熱部品の温度が所定値以上である場合には、前記発熱部品を冷却し、前記発熱部品の温度が所定値未満である場合には、前記筐体の内壁面を冷却する構成を有する。 An electronic device equipped with a cooling means of the present invention includes a metal housing, a heat generating component and a cooling means disposed within the housing, and a temperature measuring means for measuring the temperature of the heat generating component, The cooling means cools the heat generating component when the temperature of the heat generating component is equal to or higher than a predetermined value, and cools the inner wall surface of the casing when the temperature of the heat generating component is less than a predetermined value. It has a configuration that

また、本発明の電子機器の冷却方法は、金属製の筐体内に、発熱部品と、冷却手段とが配置された電子機器の冷却方法であり、前記冷却手段によって、前記発熱部品の温度が所定値以上である場合には、前記発熱部品を冷却し、前記発熱部品の温度が所定値未満である場合には、前記筐体の内壁面を冷却する。 Further, the method for cooling an electronic device of the present invention is a method for cooling an electronic device in which a heat generating component and a cooling means are arranged in a metal housing, and the temperature of the heat generating component is controlled by the cooling means to a predetermined temperature. If the temperature is above the predetermined value, the heat generating component is cooled, and if the temperature of the heat generating component is less than a predetermined value, the inner wall surface of the casing is cooled.

本発明によれば、簡単な構成で筐体表面の温度上昇を防ぐことができる冷却手段を備えた電子機器、およびその冷却方法を提供することができる。 According to the present invention, it is possible to provide an electronic device equipped with a cooling means that can prevent a rise in temperature on the surface of a housing with a simple configuration, and a method for cooling the electronic device.

本発明に係る冷却手段を備えた電子機器の一実施形態において、発熱部品の温度が所定値未満の場合の構成を示す概略図である。FIG. 2 is a schematic diagram showing a configuration when the temperature of a heat generating component is less than a predetermined value in an embodiment of an electronic device equipped with a cooling means according to the present invention. 本発明に係る冷却手段を備えた電子機器の一実施形態において、発熱部品の温度が所定値以上の場合の構成を示す概略図である。FIG. 2 is a schematic diagram showing a configuration when the temperature of a heat-generating component is equal to or higher than a predetermined value in an embodiment of an electronic device equipped with a cooling means according to the present invention.

上述したように、金属筐体を有する通信機器などの電子機器において、機器の使用時等に、筐体表面の温度上昇により低温やけど等の問題が生じる場合があり、これまで、製品に注意喚起等の記載を行う必要があった。特許文献１に記載の方法では、筐体表面の冷却が不十分な場合があり、更なる技術の開発が求められていた。 As mentioned above, when using electronic devices such as communication devices that have metal casings, problems such as low-temperature burns may occur due to the rise in temperature on the surface of the casing. It was necessary to write the following information. In the method described in Patent Document 1, cooling of the surface of the casing may be insufficient, and further technological development has been required.

本発明に係る冷却手段を備えた電子機器（以降、本電子機器と称することがある）は、発熱部品（例えば、ルータなどにおける主要装置）の温度に応じて、冷却箇所を変更することで、より効率的に筐体表面の冷却を行うことができる。したがって、本電子機器を用いることで、これまで問題とされてきた使用者による低温やけど等の事故の発生を容易に防止できる。 An electronic device equipped with a cooling means according to the present invention (hereinafter sometimes referred to as the present electronic device) can change the cooling location depending on the temperature of a heat-generating component (for example, a main device in a router, etc.). The surface of the housing can be cooled more efficiently. Therefore, by using this electronic device, it is possible to easily prevent accidents such as low-temperature burns caused by users, which have been considered a problem so far.

以下、本発明を適用した具体的な実施形態について、図面を参照しながら詳細に説明する。ただし、本発明が以下の実施形態に限定される訳ではない。また、説明を明確にするため、以下の記載及び図面は、適宜、簡略化されている。 Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. Further, in order to clarify the explanation, the following description and drawings are simplified as appropriate.

＜電子機器＞
本電子機器は、金属製の筐体と、前記筐体内に配置される、発熱部品、冷却手段および温度計測手段とを備える。また、本電子機器は、前記冷却手段の設置角度を変更可能な変更手段を有していてもよく、当該変更手段は、発熱部品の温度に応じて、冷却手段の設置角度を変更することで、冷却対象を変更できる。 <Electronic equipment>
This electronic device includes a metal casing, and a heat generating component, a cooling means, and a temperature measuring means arranged within the casing. Further, the electronic device may include a changing means that can change the installation angle of the cooling means, and the changing means changes the installation angle of the cooling means according to the temperature of the heat generating component. , the cooling target can be changed.

ここで、図１および図２に、本電子機器の一実施形態を示す概略図を示す。図１は、発熱部品の温度が所定値未満の場合の本電子機器の構成を示すものであり、図２は、発熱部品の温度が所定値以上の場合の本電子機器の構成を示すものである。これらの図を用いて本電子機器の構成をより詳しく説明する。 Here, FIGS. 1 and 2 are schematic diagrams showing one embodiment of the present electronic device. Figure 1 shows the configuration of this electronic device when the temperature of the heat generating parts is below a predetermined value, and Figure 2 shows the configuration of this electronic device when the temperature of the heat generating parts is above the predetermined value. be. The configuration of this electronic device will be explained in more detail using these figures.

図１および図２において、金属製の筐体は符号１０で表される。筐体１０の材質は、金属であれば特に限定されず、通常の電子機器の筐体に用いられる材質を適宜使用できる。筐体１０の内部は、（筐体の）上壁面１、（筐体の）側壁面２および不図示の下壁面で囲まれた構造を有している。これらの図では、本電子機器の一部のみが記載されており、他の部分に関しては記載を省略している。 In FIGS. 1 and 2, the metal housing is designated by the reference numeral 10. The material of the casing 10 is not particularly limited as long as it is metal, and any material used for the casing of ordinary electronic devices can be used as appropriate. The inside of the casing 10 has a structure surrounded by an upper wall surface 1 (of the casing), a side wall surface 2 (of the casing), and a lower wall surface (not shown). In these figures, only a part of the electronic device is shown, and other parts are omitted.

発熱部品（不図示）は、使用時などに発熱する本電子機器の主要装置であり、筐体１０内に配置される。発熱部品は用いる電子機器に応じて、適宜設定できる。 A heat-generating component (not shown) is a main device of the electronic device that generates heat during use, and is disposed within the casing 10. The heat generating components can be appropriately set depending on the electronic device used.

温度計測手段（不図示）は、発熱部品の温度を計測するものであり、電子機器に用いられる通常のものを適宜使用でき、例えば、温度センサなどを用いることができる。 The temperature measuring means (not shown) is for measuring the temperature of the heat-generating component, and can be any ordinary one used in electronic equipment, for example, a temperature sensor.

冷却手段（ファン）３は、発熱部品および筐体表面の温度上昇を抑制し、冷却するために、筐体内部に配置されるものである。排気冷却ファンは、主にファンが向けられた部分の空気を、排気ダクト７などを介して、図１および図２に示すように、ファン内に取り込んで排出する。 The cooling means (fan) 3 is arranged inside the casing in order to suppress the rise in temperature of the heat generating components and the surface of the casing and cool them. The exhaust cooling fan mainly takes air from the area toward which the fan is directed into the fan and discharges it through the exhaust duct 7 and the like, as shown in FIGS. 1 and 2.

本電子機器では、冷却手段は、発熱部品の温度が所定値以上である場合には、発熱部品を冷却し、発熱部品の温度が所定値未満である場合には、筐体の内壁面を冷却する構成を有する。発熱部品における上記所定温度（所定値）は、適宜設定でき、特に限定されないが、例えば、３０℃以上とすることができる。 In this electronic device, the cooling means cools the heat generating component when the temperature of the heat generating component is above a predetermined value, and cools the inner wall surface of the casing when the temperature of the heat generating component is below a predetermined value. It has a configuration that The predetermined temperature (predetermined value) of the heat generating component can be set as appropriate, and is not particularly limited, but can be, for example, 30° C. or higher.

変更手段は、発熱部品の温度が所定値以上である場合には、ファンの向きを発熱部品方向に変更し、発熱部品の温度が所定値未満である場合には、ファンの向きを筐体の内壁面方向に変更することができる。 The changing means changes the direction of the fan toward the heat generating component when the temperature of the heat generating component is above a predetermined value, and changes the direction of the fan toward the heat generating component when the temperature of the heat generating component is less than the predetermined value. It can be changed towards the inner wall surface.

ここで、これらの図では、変更手段は、固定用ばね４、回転用軸５および電気スイッチ６を含む構成となっている。電気スイッチ６は、発熱部品の温度が所定値以上になると、図１に示すように、電源がＯＮにされ、ファン３の角度（設置角度）を変更させ、具体的には、ファン３の角度を筐体の内壁面（図１では上壁面１）方向に変更する。そして、発熱部品の温度が所定値未満になると、図２に示すように、電気スイッチ６の電源がＯＦＦにされ、固定用ばね４と回転用軸５との作用により、ファン３は、元の角度、すなわち、発熱部品方向に戻る。 Here, in these figures, the changing means includes a fixing spring 4, a rotating shaft 5, and an electric switch 6. When the temperature of the heat-generating component exceeds a predetermined value, the electric switch 6 turns on the power and changes the angle (installation angle) of the fan 3, as shown in FIG. is changed toward the inner wall surface (upper wall surface 1 in FIG. 1) of the casing. Then, when the temperature of the heat-generating component becomes less than a predetermined value, as shown in FIG. angle, ie, back towards the heat generating component.

なお、使用者が誤って触れる可能性があるのは、筐体の上部であることが多いため、発熱部品の温度が所定値未満である場合に、ファンは、筐体内部の上壁面方向に向けられ、冷却を行うことが好ましい。また、冷却手段は、冷却手段を駆動する観点から、筐体の側壁面に近接した位置に配置することが好ましい。具体的には、筐体内の筐体側壁面に近接した、側壁面の上側、中央部、下側などに配置することができる。 Note that the upper part of the housing is often the part that users may accidentally touch, so if the temperature of the heat-generating components is below a predetermined value, the fan will move toward the upper wall inside the housing. Preferably, cooling is performed. Further, from the viewpoint of driving the cooling means, it is preferable to arrange the cooling means at a position close to the side wall surface of the housing. Specifically, it can be placed within the housing, close to the housing side wall surface, above the side wall surface, in the center, under the side wall surface, or the like.

このように、本電子機器は、強制空冷する通信装置などの内部に設置するファンの実装向きを可変させることにより、筐体表面（特に上壁面）の温度上昇を優先的に低減させる、すなわち、筐体放熱させることにより、使用者の低温やけどなどの事故を容易に防止できる。 In this way, this electronic device preferentially reduces the temperature rise on the housing surface (particularly the upper wall surface) by changing the mounting direction of the fan installed inside the forced air cooling communication device, etc. By dissipating heat from the housing, accidents such as low-temperature burns to the user can be easily prevented.

＜電子機器の冷却方法＞
本発明に係る電子機器の冷却方法（以下、本冷却方法と称することがある）は、金属製の筐体内に、発熱部品（主装置）と、冷却手段とが配置された電子機器の冷却方法である。ここで、本冷却方法では、冷却手段によって、発熱部品の温度が所定値以上である場合には、発熱部品を冷却し、前記発熱部品の温度が所定値未満である場合には、前記筐体の内壁面を冷却する。 <How to cool electronic equipment>
A method for cooling an electronic device according to the present invention (hereinafter sometimes referred to as the present cooling method) is a method for cooling an electronic device in which a heat generating component (main device) and a cooling means are arranged in a metal housing. It is. Here, in this cooling method, the cooling means cools the heat generating component when the temperature of the heat generating component is equal to or higher than a predetermined value, and when the temperature of the heat generating component is less than the predetermined value, the cooling means cools the heat generating component. cooling the inner wall surface of the

上述したように、本冷却方法では、冷却手段が、ファンを含み、発熱部品の温度が所定値以上である場合には、ファンの向きを前記発熱部品方向に変更し、発熱部品の温度が所定値未満である場合には、ファンの向きを筐体の内壁面方向に変更する。特に、発熱部品の温度が所定値未満である場合に、ファンを、筐体内部の上壁面方向に向けることで、より使用者の低温やけどなどを容易に防止できる。 As described above, in this cooling method, the cooling means includes a fan, and when the temperature of the heat-generating component is equal to or higher than a predetermined value, the direction of the fan is changed to the direction of the heat-generating component, so that the temperature of the heat-generating component reaches the predetermined value. If it is less than the value, change the direction of the fan toward the inner wall of the casing. In particular, when the temperature of the heat-generating component is less than a predetermined value, by directing the fan toward the upper wall surface inside the casing, low-temperature burns to the user can be more easily prevented.

なお、本冷却方法では、ルータなどの通信機器の金属製の筐体内部の側壁面近傍に図１および図２に示すような、物理的に取付け角度が変更可能な機構を有する排気冷却用のファンを設置することが好ましい。通常（発熱部品に発熱が生じていない場合など）は、図１に示すように、回転用軸５に取付けられたファン３を、固定用ばね４および電気スイッチ６の作用により、筐体１０の上壁面１の少なくとも一部を優先的に冷却するようにする。このように、通常時は、筐体表面を直接冷却し、筐体の表面温度を低下させる。この際、ファン３は、発熱部品用の排気ダクト７に向けられずに、発熱部品用の排気ダクト方向からの排気は優先されない。 In addition, in this cooling method, an exhaust cooling system is installed near the side wall inside the metal casing of a communication device such as a router, as shown in Figures 1 and 2, and has a mechanism that allows the installation angle to be physically changed. Preferably, a fan is installed. Normally (when no heat is generated in the heat-generating components, for example), as shown in FIG. At least a part of the upper wall surface 1 is preferentially cooled. In this way, under normal conditions, the surface of the casing is directly cooled to lower the surface temperature of the casing. At this time, the fan 3 is not directed toward the exhaust duct 7 for the heat generating components, and priority is not given to exhausting from the direction of the exhaust duct for the heat generating components.

そして、発熱部品等に搭載している温度計測手段（温度検出回路）により、発熱部品の温度が設定値（所定値）以上に上昇した場合には、以下のような動作が行われる。すなわち、図２に示すように、電気スイッチ６の動作により回転用軸５に取り付けられたファン３の向きを、発熱部品用の排気ダクト７の方向に変えることにより、排気ダクト７を通じて排気を行い、発熱部品の温度を優先的に設定値未満に低下させる。そして、発熱部品の温度が温度計測手段の設定値未満となった場合に、再度、図１に示すように、固定用ばね４及び電気スイッチ６の作用によりファン３の取付け角度を斜め方向、すなわち、筐体の内壁面方向（具体的には、上壁面方向）に傾かせる。これによって、筐体表面の排気を優先的に行い放熱させ、筐体の表面温度を定常的に低下させることができる。このように、本冷却方法では、金属筐体の表面温度を優先的に低下させるため、温度センサなどの温度計測手段により設定した値以上または未満になった場合にファンの傾きを制御する。 When the temperature of the heat-generating component rises to a set value (predetermined value) or higher by the temperature measuring means (temperature detection circuit) mounted on the heat-generating component, the following operation is performed. That is, as shown in FIG. 2, by operating the electric switch 6, the direction of the fan 3 attached to the rotating shaft 5 is changed to the direction of the exhaust duct 7 for heat-generating components, thereby exhausting the air through the exhaust duct 7. , preferentially lowers the temperature of heat-generating components below a set value. When the temperature of the heat generating component becomes lower than the set value of the temperature measuring means, the fixing spring 4 and the electric switch 6 act again to change the mounting angle of the fan 3 in the diagonal direction, as shown in FIG. , tilt toward the inner wall surface of the casing (specifically, toward the upper wall surface). As a result, the surface of the casing can be preferentially exhausted and radiated, thereby steadily lowering the surface temperature of the casing. In this way, in this cooling method, in order to preferentially lower the surface temperature of the metal casing, the inclination of the fan is controlled when the temperature exceeds or is less than a value set by a temperature measuring means such as a temperature sensor.

このように、冷却手段を備えた本電子機器は、ルータなどの通信装置に適用することができる。しかしながら、本発明は上記実施形態に限られたものではなく、趣旨を逸脱しない範囲で適宜変更することが可能である。 In this way, the present electronic device including the cooling means can be applied to communication devices such as routers. However, the present invention is not limited to the above embodiments, and can be modified as appropriate without departing from the spirit.

１ （筐体の）上壁面
２ （筐体の）側壁面
３ 冷却手段（ファン）
４ 固定用ばね
５ 回転用軸
６ 電気スイッチ
７ 排気ダクト
１０ 筐体 1 Upper wall surface (of the housing) 2 Side wall surface (of the housing) 3 Cooling means (fan)
4 Fixing spring 5 Rotating shaft 6 Electric switch 7 Exhaust duct 10 Housing

Claims (8)

金属製の筐体と、
前記筐体内に配置される、発熱部品および冷却手段と、
前記発熱部品の温度を計測する温度計測手段と、
を含む電子機器であって、
前記冷却手段は、前記発熱部品の温度が所定値以上である場合には、前記発熱部品を冷却し、前記発熱部品の温度が所定値未満である場合には、前記筐体の内壁面を冷却する構成を有し、
前記電子機器は、さらに、前記冷却手段の設置角度を変更可能な変更手段を有し、
前記変更手段により、前記発熱部品の温度に応じて、前記冷却手段の設置角度を変更することで、冷却対象を変更する、ことを特徴とする電子機器。 metal casing and
A heat generating component and a cooling means disposed within the housing;
temperature measuring means for measuring the temperature of the heat generating component;
An electronic device that includes
The cooling means cools the heat generating component when the temperature of the heat generating component is equal to or higher than a predetermined value, and cools the inner wall surface of the casing when the temperature of the heat generating component is less than a predetermined value. It has a configuration that
The electronic device further includes a changing means that can change the installation angle of the cooling means,
An electronic device characterized in that the changing device changes the cooling target by changing the installation angle of the cooling device according to the temperature of the heat generating component. 前記冷却手段が、ファンを含み、
前記変更手段が、前記発熱部品の温度が所定値以上である場合には、前記ファンの向きを前記発熱部品方向に変更し、前記発熱部品の温度が所定値未満である場合には、前記ファンの向きを前記筐体の内壁面方向に変更する、請求項１に記載の電子機器。 the cooling means includes a fan;
The changing means changes the direction of the fan toward the heat generating component when the temperature of the heat generating component is equal to or higher than a predetermined value, and changes the direction of the fan toward the heat generating component when the temperature of the heat generating component is less than a predetermined value. The electronic device according to claim 1 , wherein the direction of the electronic device is changed toward an inner wall surface of the casing. 前記発熱部品の温度が所定値未満である場合に、前記ファンが、前記筐体内部の上壁面方向に向けられる、請求項２に記載の電子機器。 The electronic device according to claim 2 , wherein the fan is directed toward an upper wall inside the housing when the temperature of the heat generating component is less than a predetermined value. 前記冷却手段が、前記筐体の側壁面に近接した位置に配置される、請求項１～３のいずれか一項に記載の電子機器。 The electronic device according to any one of claims 1 to 3 , wherein the cooling means is located close to a side wall surface of the casing. 金属製の筐体内に、発熱部品と、冷却手段とが配置された電子機器の冷却方法であって、
前記冷却手段によって、前記発熱部品の温度が所定値以上である場合には、前記発熱部品を冷却し、前記発熱部品の温度が所定値未満である場合には、前記筐体の内壁面を冷却し、
前記電子機器は、さらに、前記冷却手段の設置角度を変更可能な変更手段を有し、
前記変更手段により、前記発熱部品の温度に応じて、前記冷却手段の設置角度を変更することで、冷却対象を変更する、ことを特徴とする電子機器の冷却方法。 A cooling method for an electronic device in which a heat generating component and a cooling means are arranged in a metal casing,
The cooling means cools the heat-generating component when the temperature of the heat-generating component is equal to or higher than a predetermined value, and cools the inner wall surface of the casing when the temperature of the heat-generating component is less than a predetermined value. death,
The electronic device further includes a changing means that can change the installation angle of the cooling means,
A method for cooling an electronic device, characterized in that the changing device changes an object to be cooled by changing the installation angle of the cooling device according to the temperature of the heat generating component. 前記冷却手段が、ファンを含み、
前記発熱部品の温度が所定値以上である場合には、前記ファンの向きを前記発熱部品方向に変更し、前記発熱部品の温度が所定値未満である場合には、前記ファンの向きを前記筐体の内壁面方向に変更する、請求項５に記載の電子機器の冷却方法。 the cooling means includes a fan;
When the temperature of the heat generating component is above a predetermined value, the direction of the fan is changed to the direction of the heat generating component, and when the temperature of the heat generating component is below the predetermined value, the direction of the fan is changed to the direction of the heat generating component. 6. The method for cooling an electronic device according to claim 5 , wherein the cooling method is changed toward the inner wall surface of the body. 前記発熱部品の温度が所定値未満である場合に、前記ファンが、前記筐体内部の上壁面方向に向けられる、請求項６に記載の電子機器の冷却方法。 7. The method for cooling an electronic device according to claim 6 , wherein when the temperature of the heat generating component is less than a predetermined value, the fan is directed toward an upper wall surface inside the casing. 前記冷却手段が、前記筐体の側壁面に近接した位置に配置される、請求項５～７のいずれか一項に記載の電子機器の冷却方法。 The method for cooling an electronic device according to any one of claims 5 to 7 , wherein the cooling means is disposed close to a side wall surface of the casing.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002123336A (en) 2000-10-12 2002-04-26 Nec Corp Information processor
JP2007048917A (en) 2005-08-10 2007-02-22 Toshiba Tec Corp Electronic apparatus
JP2009027071A (en) 2007-07-23 2009-02-05 Funai Electric Co Ltd Device of cooling electronic equipment
JP2017199786A (en) 2016-04-27 2017-11-02 日本電気株式会社 Electronic device and control method of the same
WO2018123119A1 (en) 2016-12-26 2018-07-05 パナソニックＩｐマネジメント株式会社 Electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002123336A (en) 2000-10-12 2002-04-26 Nec Corp Information processor
JP2007048917A (en) 2005-08-10 2007-02-22 Toshiba Tec Corp Electronic apparatus
JP2009027071A (en) 2007-07-23 2009-02-05 Funai Electric Co Ltd Device of cooling electronic equipment
JP2017199786A (en) 2016-04-27 2017-11-02 日本電気株式会社 Electronic device and control method of the same
WO2018123119A1 (en) 2016-12-26 2018-07-05 パナソニックＩｐマネジメント株式会社 Electronic device

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