JP6354469B2 - Power supply cooling mechanism - Google Patents

Description

  The present invention relates to a cooling mechanism for a power supply device, and more particularly to a natural air cooling system.

  The power supply device has a cooling mechanism for radiating heat from the high heat-generating components of the constituent elements (for example, Patent Documents 1 to 5). For example, as shown in FIG. 3, a general cooling mechanism using a natural air cooling system that does not use a fan or the like has a heat sink 3 arranged in the upper and lower stages in the height direction in the casing 2 of the power supply device. Considering the heat balance of the heat sinks 3 arranged in this way, the temperature of the upper heat sink 3 receives heat from the lower heat sink 3 and becomes relatively high. Due to the temperature difference between the heat sinks 3 and 3, the lifespan of various components in the housing 2 is varied, so that the specifications of the components are restricted.

  In order to solve this problem, a method of mitigating the influence of heat dissipation by arranging the upper and lower heat sinks 3 and 3 so as to be shifted in the depth direction of the casing 2 has been adopted. There are many disadvantages, such as an increase and the complexity of the conductors forming the internal circuit.

JP 2004-140894 A Japanese Patent Laid-Open No. 9-307038 JP-A-10-270880 Japanese Unexamined Patent Publication No. 5-55589

  This invention is made | formed in view of said situation, and makes it a subject to achieve size reduction of the said apparatus, improving the cooling effect of a power supply device.

  Therefore, the cooling mechanism of the present invention includes a plurality of heat sinks disposed in the casing of the power supply device to dissipate the heat generating element of the device, and the heat flow from the one heat sink without transferring to the other heat sink. And a guide member for guiding the side surface of the housing.

  According to the present invention, since the heat flow from one heat sink in the casing of the power supply device does not transfer to the other heat sink, the temperature difference between these heat sinks is reduced.

  According to the present invention described above, it is possible to reduce the size of the apparatus while enhancing the cooling effect of the power supply apparatus.

(A) is the top view which showed the inside of the power supply device provided with the cooling mechanism in 1st embodiment of this invention, (b) is the side view which showed the inside, (c) is AA of the device Sectional drawing. (A) is the top view which showed the inside of the power supply device provided with the cooling mechanism in 2nd embodiment of this invention, (b) is the side view which showed the inside, (c) is AA of the device Sectional drawing. (A) is the top view which showed the inside of the conventional power supply device, (b) is the side view which showed the inside, (c) is AA sectional drawing of the device.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
The cooling mechanism 1 according to the present embodiment shown in FIG. 1 is configured such that a heat flow from a plurality of heat sinks 3 disposed in a housing 2 of the power supply device and a lower heat sink 3 in the housing 2 And a guide member 4 that guides the side face 23 of the housing 2 without shifting to 3.

  The housing 2 is formed of a rectangular housing, and stores a plurality of printed circuit boards (not shown) including a heating element exemplified by a high heat generation device that is a component of the power supply device, or includes a plurality of heating elements. A single printed circuit board (not shown) is stored. A vent hole 20 is formed in the bottom surface portion 21, the ceiling portion 22, and the side surface portion 23 of the housing 2.

  Heat sinks 3 are provided in the housing 2 according to the number of the heating elements. The heat sink 3 is in thermal contact with the heating element via a heat transfer unit (not shown). The heat sink 3 is arranged in two upper and lower stages in the height direction of the housing 2. The heat sinks 3 arranged in two upper and lower stages are installed without being shifted in the depth direction of the housing 2.

  The heat sink 3 has a known heat sink structure. That is, the heat sink 3 includes a back surface portion 31 that is in thermal contact with the heating element via the heat transfer portion, and a fin-shaped heat dissipation portion 32 that releases heat received from the back surface portion 31 to the air. The heat sink 3 is disposed in the housing 2 with the heat radiating portion 32 protruding toward a predetermined side surface portion 23 of the housing 2.

  The guide member 4 includes a plate-like partition portion 41 that is erected facing the back surface portion 31 of the lower heat sink 3 in the housing 2, and upper and lower heat sinks 3 and 3 from the upper end portion of the partition portion 41. A plate-shaped heat insulating part 42 is provided between the plate 2 and the case 2.

  The partition part 41 is comprised from the well-known metal material. The heat insulating portion 42 is made of a heat-resistant plate-like material exemplified by polycarbonate, and is inclined in the height direction of the housing 2 from the upper end portion of the partition portion 41 to the side surface portion 23 side of the housing 2, for example, 10 horizontally. It is inclined from 20 degrees to 20 degrees.

  The effect of the cooling mechanism 1 of this embodiment is demonstrated referring FIG.

  When an upward air flow is generated in the housing 2 due to the temperature rise of the heating element due to the operation of the power supply device, the air flow in the housing 2 is as indicated by the white arrows shown in FIG. That is, when the heat of the heating element in the housing 2 is transmitted to the heat sink 3, the air around the heat sink 3 is warmed, the air density becomes relatively low, and an updraft is generated in the housing 2. The air that has generated this updraft, that is, hot air, moves along the heat insulating portion 42 of the guide member 4 and is guided to the side surface portion 23 side of the housing 2. To be released. The hot air around the upper heat sink 3 also moves to the ceiling portion 22 side of the housing 2 due to the rising airflow, and is released to the atmosphere from the vent 20 of the ceiling portion 22. As described above, the heat flow generated in the lower portion of the housing 2 is transferred to the side surface portion 23 of the housing 2 without coming into contact with the heat sink 3 on the upper stage side, and hot air is discharged from the housing 2.

  In the conventional cooling mechanism shown in FIG. 3, the heat generated in the lower part of the housing 2 and the hot air around the heat sink 3 are transferred to the upper heat sink 3 side in the housing 2 as a result. The temperature of the upper heat sink 3 is raised, and the temperature difference between the heat sinks 3 increases.

  On the other hand, in the cooling mechanism 1 of the present embodiment, the heat insulating portion 42 of the guide member 4 is disposed between the upper and lower heat sinks 3, 3. The surrounding hot air moves along the inclination of the heat insulating portion 42 without rising in the vertical direction. The hot air guided by the heat insulating part 42 is discharged from the vent 20 on the side part 23 of the casing 2 or released from the vent 20 on the ceiling 22 of the casing 2 without contacting the upper heat sink 3. Is done.

  Therefore, as compared with the conventional cooling mechanism, the temperature difference between the upper and lower heat sinks 3 and 3 is reduced, and the variation in the life of the components of the power supply device due to the temperature difference between the heat sinks 3 and 3 is also reduced. And since the absolute value of the temperature in the housing | casing 2 falls by the said temperature difference reducing, the breadth which selects the component of a power supply device spreads. Further, it is not necessary to dispose the upper and lower heat sinks 3 and 3 in the depth direction in the housing 2, and the power supply device can be downsized.

  In particular, the guide member 4 is provided with a partition portion 41 facing the lower heat sink 3 and a heat insulating portion 42 between the upper end of the partition portion 41 and the upper and lower heat sinks 3 and 3. The housing 2 is disposed obliquely in the height direction toward the side surface portion 2. Therefore, the heat flow transferred from the lower heat sink 3 can be guided in the vertical direction, and can be immediately guided to the side surface portion 23 side of the housing 2 without being brought into contact with the upper heat sink 3. Therefore, in addition to enhancing the heat dissipation effect of the lower heat sink 3 and the heat generating member thermally connected to the heat sink 3, the temperature rise of the upper heat sink 3 can be suppressed.

  Further, since the heat sinks 3 and 3 are arranged in two upper and lower stages in the casing 2 without being shifted in the depth direction of the casing 2, it is possible to avoid an increase in the size of the casing 2 of the power supply device. Therefore, the housing 2 can be downsized, and the structure of the power supply device such as a conductor and an auxiliary frame for attachment can be simplified.

  Furthermore, since the heat sinks 3 and 3 in the housing 2 are arranged in a state in which the heat radiating portion 32 protrudes toward the side surface portion 23 of the housing 2, the heat radiation effect in the housing 2 is further enhanced. In particular, since the rear surface portion 31 of the lower heat sink 3 faces the partition portion 41 of the guide member 4, a wind tunnel effect that guides the rising heat flow generated around the heat sink 3 in the vertical direction occurs. The heat dissipation effect inside is promoted.

(Embodiment 2)
The cooling mechanism 10 of the present embodiment shown in FIG. 2 is a cooling mechanism that is applied to, for example, a power supply apparatus that has a relatively larger electric capacity than the power supply apparatus of the first embodiment. 2 are arranged so as to be arranged in the height direction and the depth direction. Similarly to the first embodiment, the heat sink 3 is also provided in the housing 2 with the heat radiating portion 32 protruding toward the side surface portion 23 of the housing 2.

  Moreover, the guide member 4 of this embodiment is provided with a pair between the heat sinks 3 and 3 arrange | positioned in the said depth direction. Further, the partitioning portions 41 of the pair of guide members 4 are disposed to face each other between the heat sinks 3 and 3.

  According to the cooling mechanism 10 described above, similarly to the cooling mechanism 1 of the first embodiment, the heat flow transferred from the lower heat sink 3 can be guided in the vertical direction, and the casing can be immediately formed without contacting the upper heat sink 3. 2 can be guided to the side surface portion 23 side. Further, it is not necessary to displace the heat sinks 3 and 3 arranged in the upper and lower stages in the depth direction in the housing 2, and the power supply device can be reduced in size.

  Furthermore, in this embodiment, the partition 41 of the guide member 4 provided in a pair between the lower heat sinks 3 and 3 is in a state of facing. As a result, a wind tunnel effect that directly guides the rising heat flow generated between the lower heat sinks 3 and 3 to the vent 20 of the ceiling portion 22 of the casing 2 is generated, and the heat dissipation effect in the casing 2 is promoted. . In particular, heat generated in the housing 2 of the power supply device having a relatively large electric capacity can be efficiently discharged.

DESCRIPTION OF SYMBOLS 1,10 ... Cooling mechanism 2 ... Housing | casing, 20 ... Vent, 21 ... Bottom part, 22 ... Ceiling part, 23 ... Side part 3 ... Heat sink, 31 ... Back part, 32 ... Radiating part 4 ... Guidance Member, 41 ... Partition, 42 ... Thermal insulation

Claims (4)

A plurality of heat sinks disposed within the casing of the power supply device to dissipate the heat generating element of the device;
A guide member that guides the heat flow from one heat sink to the side surface of the housing without transferring the heat flow to the other heat sink ;
The guide member is
A plate-like partitioning portion that is erected facing the one heat sink;
A plate-like heat insulating portion disposed obliquely in the height direction of the housing from the upper end portion of the partition portion toward the side surface portion of the housing between the heat sink and the other heat sink;
Cooling mechanism of the power supply device according to claim <br/> further comprising a. The plurality of heat sinks are arranged in a height direction of the housing and a depth direction of the housing,
The guide member is provided in a pair between heat sinks arranged in the depth direction,
The cooling mechanism for a power supply device according to claim 1 , wherein the partition portions of the pair of guide members are arranged to face each other between the heat sinks. The cooling mechanism for a power supply apparatus according to claim 2 , wherein the plurality of heat sinks arranged in the height direction are provided without being shifted from each other in the depth direction of the casing. The heat sink has a heat dissipation portion that dissipates in the air the heat of the heating element, one of the heat radiation member from claim 1, characterized in that projecting toward the side surface portion of the housing 3 The cooling mechanism of the power supply device according to Item 1.

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