JP2017199770A - Heat sink and housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat radiation efficiency of a heat sink.SOLUTION: A heat sink is provided with: fins 5 provided on a surface 4 of a flat part 3; a cavity part 1 provided adjacent to the flat part 3; and fins 8 provided in the cavity part 1 to cause airflow in the cavity part 1 by chimney effect. The airflow improves heat radiation efficiency.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat sink that dissipates heat generated from a device and a housing including the heat sink.

  Electronic devices such as computers, industrial equipment, and electronic components generate heat in their operating state. Since electronic devices may malfunction due to heat, it is necessary to release heat. Therefore, conventionally, a heat sink has been provided in the electronic component or its housing. A plurality of fins are provided on the surface of the heat sink, and heat transmitted from the heat source is released through the fins. The conventional heat sink has a plurality of fins so that the surface area of the heat sink on the heat dissipation side is increased, and the heat dissipation effect is increased.

JP 2007-273529 A

  However, the conventional heat sink has a problem that the heat dissipation efficiency is limited by the material of the heat sink, the number, size, and surface area of the fins. In particular, when the fin of the heat sink is adjacent to a building wall or other equipment, there is a problem that the heat radiation efficiency is lowered.

  An object of the present invention is to solve the above problems and improve the heat dissipation efficiency of a heat sink.

  In order to achieve the above object, a heat sink according to an embodiment of the present invention includes one or more plate-like body portions, one or more cavity portions adjacent to the body portion, and the cavity portions. Openings provided at both ends, a plurality of first fins provided on the surface of each main body, and a plurality of second fins provided on the inner surface of each cavity. It is characterized by.

  A housing according to an embodiment of the present invention is a housing of an electronic device having a heat source therein, and at least a part of an outer surface of the housing is the heat sink, and the opening of each heat sink. And a pair of top plates forming the other outer surface of the casing facing each other and facing each other, and a vent hole formed at a position in contact with the opening of each top plate.

  The heat sink according to one embodiment of the present invention as described above has fins provided on the surface of the main body, a cavity provided adjacent to the main body, and a fin provided inside the cavity. Thus, an air flow is generated in the cavity due to the chimney effect, and the heat dissipation efficiency is improved by the air flow.

The perspective view which shows the structural example of the heat sink of this invention The perspective view which shows the structural example of the housing | casing of this invention The figure which illustrates the cross-sectional structure of the housing | casing of this invention The figure which illustrates the heat dissipation aspect of this invention The figure which shows the example of arrangement | positioning of the industrial equipment which consists of a housing | casing of this invention The figure which shows the example of the arrangement position of a cavity part The figure which shows the structural example of a cavity part The figure which enumerates the example of the positional relationship of the ventilation hole of a housing | casing and the fin of a cavity part Diagram showing heat sink configuration example

  A heat sink may be attached to an electronic component serving as a heat generation source, an industrial device including the heat generation source, an electronic device such as a computer, or other various devices in order to release the generated heat.

The heat sink and housing of the present invention will be described with reference to FIGS.
FIG. 1 is a perspective view showing a configuration example of a heat sink according to the present invention, showing the configuration of both front and back surfaces. FIG. 2 is a perspective view showing a configuration example of the housing of the present invention.

  As shown in FIG. 1, the heat sink 2 includes a plate-like main body 3 and a cavity 1 adjacent to the main body 3. The main body 3 includes a plurality of fins 5 on the surface 4. The number, thickness, height, length, arrangement direction, and shape of the fins 5 are arbitrary. The cavity part 1 is a cylindrical shape that is continuously in contact with the main body part 3, and has a cavity that extends in the length direction A of the end part of the main body part 3 that contacts the cavity part 1, and both end parts in the direction A are The opening 6 is opened. The cavity 1 has one or more fins 8 on its inner surface 7. The number, the thickness, the height from the inner surface, the length in the direction A, and the shape of the fins 8 can be arbitrarily set according to the heat radiation efficiency. Also, the position of the end portion in the direction A of the fin 8 may be flush with the opening 6, or may protrude from the opening 6 inside the cavity 1 from the opening 6. Further, the fin 8 may be divided in the cavity 1 in the direction A. Further, each fin 8 may be formed in a direction parallel to the direction A, or may be inclined. In FIG. 1, the cavity 1 is provided at both ends of the main body 3 with the main body 3 interposed therebetween, but may be provided at only one side. A plurality of main body portions 3 may be provided, and the cavity portion 1 may be provided between the two main body portions 3.

  In the heat sink 2 having such a configuration, heat released from the heat source is absorbed by the back surface 9 with respect to the front surface 4 of the main body 3, and is released to the outside from the fin 5, and is also opened from the fin 8 through the cavity 1. 6 is released. Here, an air flow is generated in the cavity 1 due to the chimney effect. The heat released from the fins 8 is easily released from the openings 6 along this air flow. That is, the cavity portion 1 serves as a path (guidance portion) for guiding heat to the outside, and the opening portion serves as a heat discharge port (discharge portion) to the outside. According to the heat sink 2, heat dissipation efficiency is improved by radiating heat from the fins 8 using the air flow as compared with the case where the heat is naturally radiated from the fin 5 having the same size and shape to the outside. Conversely, even when the size of the heat sink 2 is reduced by making the fins 8 smaller or the number of fins smaller than that of the fins 5, the same heat radiation efficiency as in the conventional case can be ensured. In particular, when the heat source is disposed in the vicinity of the back surface 9 of the main body 3, the heat absorbed by the main body 3 is transferred to the cavity 1 and then radiated from the cavity 1. That is, not only heat is released from the fins 8 of the cavity 1 having higher heat dissipation efficiency than the fins 5, but also the heat absorption area that absorbs heat generated by the heat source and the cavity 1 are separated from each other. And the heat dissipation area are separated from each other, so that heat can be radiated more efficiently.

  In addition, the surface which becomes the heat source direction side in the cavity part 1 and the other side (back surface side) from the fin 5 may be an open surface. Conversely, a wall (not shown) may be formed on the back side. When walls are provided, fins 8 may be provided on the inner surface. By providing the wall, heat can be absorbed from the wall, and the cooling efficiency is improved. Furthermore, by providing the fin 8 on the wall, the heat absorbed by the wall 8 can also be efficiently released into the cavity 1 and can be efficiently radiated by the above-described chimney effect.

  As shown in FIG. 2, a housing 10 according to an embodiment of the present invention has a configuration in which at least a part of the outer surface thereof is the heat sink 2 shown in FIG. 1 and includes various devices, devices, and components inside. The heat sink 2 is provided so that the surface 4 of the main body 3 on which the fins 5 are formed is located on the outer side of the housing 10, and the fins 5 face the outer surface of the housing 10. The outer surface of the housing 10 facing each of the openings 6 of the heat sink 2 is configured by a top plate 11. The top plate 11 includes a vent hole 12 at least at a part of the position overlapping the opening 6. The vent hole 12 serves as an intake / exhaust port for air flowing through the cavity 1. By providing the vent hole 12, a path through which heat is released from the cavity 1 is secured in the housing 10. For this reason, the housing | casing 10 can acquire the effect of the thermal radiation efficiency improvement by the heat sink 2. FIG.

Next, a heat radiation path from the heat sink will be described with reference to FIGS.
FIG. 3 is a diagram illustrating a cross-sectional structure of a housing of the present invention, and FIG. 4 is a diagram illustrating a heat dissipation mode of the present invention.

  In the housing 10, several heat sources 13, 14 such as an electronic circuit and a power source are provided. The heat generated by the heat sources 13 and 14 convects in the housing 10 as indicated by arrows B and C, and is absorbed by the main body 3 from the back surface 9 of the heat sink 2. A part of the heat absorbed by the main body 3 is transmitted to the fins 5 as indicated by an arrow D, and is released from the fins 5 to the outside of the housing 10. As shown by an arrow E, the remaining heat is transferred from the main body 3 to the cavity 1 and released from the fins 8 into the cavity 1. Here, in the cavity 1, due to the chimney effect, an air flow as indicated by an arrow F in FIG. 4 from one opening 6 toward the other opening 6, or both openings 6 from the inside of the cavity 1. An air flow as indicated by an arrow G toward the head is generated. This is because the inside of the cavity 1 becomes hotter than the air outside the housing 10 due to the heat from the heat sources 13 and 14, and the air inside the cavity 1 has a lower density than the outside air. Moreover, when the cavity part 1 is arrange | positioned so that the opening part 6 may face the top-and-bottom direction, the air which absorbed heat will rise, and the flow of the air in the cavity part 1 is promoted by it. And by such an air flow, the heat released from the fins 8 is released from the opening 6 of the cavity 1 to the outside of the housing 10. Since heat is released while the air flow is promoted in this manner, heat transfer is promoted compared to natural heat dissipation such as emission from the conventional heat sink or fin 5. Increases efficiency. In addition, since an air flow toward the outside of the housing 10 is generated inside the hollow portion 1, the air inside the housing 10 is easily drawn into the hollow portion 1. Thereby, the convection of the air which goes to the heat sink 2 in the housing | casing 10 is accelerated | stimulated, and the cooling efficiency inside a housing | casing improves with the improvement of a thermal radiation efficiency. Here, when the surface of the cavity 1 in the direction of the heat source is an open surface, the air is likely to be drawn in, and air convection in the housing 10 is further promoted.

  Depending on the arrangement of the heat sources 13 and 14 inside the housing 10, a heat radiating plate may be further provided inside the housing 10. In the example of FIG. 3, a heat radiating plate 15 is provided. The heat generated from the heat source 14 is absorbed by the heat radiating plate 15, released from the fins 16 of the heat radiating plate 15, and transmitted to the heat sink 2. By providing such a heat radiating plate 15, heat generated from the heat source 14 disposed at a position away from the heat sink 2 is also efficiently transmitted to the heat sink 2, and the cooling efficiency inside the housing 10 is improved.

FIG. 5 is a diagram showing an arrangement example of the industrial equipment provided with the casing of the present invention.
As shown in FIG. 5, a plurality of industrial devices 17 may be installed side by side on the wall surface of a building. For example, a plurality of industrial devices 17 may be arranged so as to contact each other on a DIN rail 18 installed on a wall surface. Thus, when the industrial equipment 17 is arrange | positioned so that it may mutually contact, the heat sink 2 may be arrange | positioned between industrial equipment 17 by the relationship etc. which need to expose the terminal 19 outside. In this case, the periphery of the fin 5 is surrounded by the industrial device 17, and the heat dissipation efficiency from the fin 5 is lowered together with the industrial device 17 generating heat. Even in such a case, in the case of the present invention, since the air that has absorbed heat is discharged from the opening of the cavity 1 that does not contact the other industrial equipment 17 and dissipates, the heat dissipation efficiency is reduced. Can be suppressed.

Hereinafter, a configuration example of each unit will be described with reference to FIGS. The following configurations can be implemented in combination.
FIG. 6 is a diagram illustrating an example of an arrangement position of the cavity.

  As shown in FIG. 6, it is assumed that the heat source 13 is located near the end of the heat sink 20. In this case, if the cavity 1 is disposed in the vicinity of the heat source 13, the efficiency of heat absorption in the main body 3 and the efficiency of heat dissipation from the cavity 1 are reduced. Therefore, the cavity 1 is not provided in the vicinity of the heat source 13, and the cavity 1 may be disposed at the opposite end, the center of the heat sink 20, or both. That is, the main body 3 can be divided into two, the cavity 1 can be sandwiched between them, and the cavity 1 can be provided at one end. The position of the cavity 1 is not limited to this, and may be arranged at any position other than the end of the heat sink 20. Further, the number of the hollow portions 1 may be other than two, or may be one or three or more. In this way, the position and number of the hollow portions 1 can be arbitrarily set according to the position of the heat source 13, and the heat dissipation efficiency and the cooling efficiency can be improved.

FIG. 7 is a diagram illustrating a configuration example of the cavity.
In the cavity 23 shown in FIG. 7, the opening area of the other opening 22 is larger than the opening area of the one opening 21. In addition, as the inside of the cavity portion 23 also moves from the opening portion 21 toward the opening portion 22, the opening area of the cross section increases continuously or intermittently. Thus, when the opening areas of the opening portions 21 and 22 at both ends of the cavity portion 23 are different, air circulation is further promoted and heat dissipation efficiency is improved. In addition, in the housing | casing using this heat sink, it is good for the magnitude | size of the ventilation hole of a housing | casing to adjust the total area according to the magnitude | size of the opening parts 22 and 23. FIG. For example, the area of the vent 12 on the top plate 11 on the upper side in FIG. 2 may be smaller than the area of the vent on the lower top plate (not shown in FIG. 2).

FIG. 8 is a table listing examples of the positional relationship between the ventilation holes of the housing and the fins of the cavity.
As for the positional relationship between the ventilation hole 12 of the housing and the fin 8 in the hollow portion, a part or all of the fin 8 may be exposed from the ventilation hole 12 (Example 1), or the fin 8 is exposed from the ventilation hole 12. Instead, the positional relationship may be such that the side surface of the fin 8 is in contact with the end side of the vent hole 12 (Example 2), or the position of the fin 8 and the position of the vent hole 12 may be shifted (Example 3).

FIG. 9 is a diagram illustrating a configuration example of the heat sink.
As shown in FIG. 9, the heat sink 24 may further include a heat transfer unit 25 on the back surface 9 of the main body 3 for directly transferring heat generated by the heat source in contact with the heat source to the main body 3. Further, the back surface 9 of the main body 3 may be provided with fins 26. The heat transfer section 25 and the fins 26 are effective for absorbing heat generated by the heat source and transmitting the heat to the main body section 3. The cavity 1 may be provided with fins 27 on the surface. By providing the fins 27, the cavity 1 can release heat from both the front and back surfaces, and can further improve the heat dissipation efficiency.

DESCRIPTION OF SYMBOLS 1 Cavity part 2 Heat sink 3 Main body part 4 Front surface 5 Fin 6 Opening part 7 Inner surface 8 Fin 9 Back surface 10 Case 11 Top plate 12 Ventilation hole 13 Heat source 14 Heat source 15 Heat sink 16 Fin 17 Industrial equipment 18 DIN rail 19 Terminal 20 Heat sink DESCRIPTION OF SYMBOLS 21 Opening part 22 Opening part 23 Cavity part 24 Heat sink 25 Heat-transfer part 26 Fin 27 Fin

Claims (7)

One or more plate-like body parts;
One or more cavities adjacent to the body portion;
Openings provided at both ends of the cavity,
A plurality of first fins provided on the surface of each of the main body portions;
A heat sink comprising a plurality of second fins provided on an inner surface of each of the hollow portions.   The heat sink according to claim 1, wherein the number of the main body portions is one, and two hollow portions are provided facing each other with the main body portion interposed therebetween.   3. The heat sink according to claim 1, wherein at least one of the hollow portions has an open surface opened to a back surface side with respect to a surface of the main body portion on which the first fin is provided. .   The heat sink according to any one of claims 1 to 3, wherein an inner diameter of at least one of the hollow portions decreases from one end portion toward the other end portion.   The at least one of the said main-body parts is further provided with the 1 or several 3rd fin provided in the back surface with respect to the surface in which the said 1st fin is provided. The heat sink according to any one of the above. A housing for an electronic device having a heat source therein,
At least a part of the outer surface of the housing is the heat sink according to any one of claims 1 to 5,
A pair of top plates forming the other outer surface of the casing facing each other in contact with the opening of each of the heat sinks;
A housing having a vent hole formed at a position in contact with the opening of each of the top plates.   The housing according to claim 6, wherein an area of the vent hole of one top plate is smaller than an area of the vent hole of the other top plate.

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