JP2013131649A - Heat radiation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cool a heating component using a small number of cooling resources.SOLUTION: A chassis 31 divides an internal space of a housing into a space 201 and a space 202, and a vent hole 33, discharging heat generated from a heating component 92 from the space 202, is formed at a position near a rear surface panel 41. A fan 50 is installed on the rear surface panel 41. A heat radiator 70 is disposed in the space 201, contacts with a heating component 91, and discharges heat absorbed from the heating component 91. A vent hole 43 is formed in a position of the rear surface panel 41 which corresponds to the fan 50. The heat radiator 70 forms at least a part of a duct forming a heat discharge passage connecting the vent hole 33 with the vent hole 43 and radiates the heat absorbed from the heating component 91 to the heat discharge passage.

Description

  The present invention relates to a heat dissipation structure.

  Currently, electronic parts and devices such as CPUs, chip parts, hard disk devices, and DVD devices are arranged inside electronic devices such as personal computers. These electronic components and devices generate heat when the power is supplied, and gradually become high temperature. If these electronic components and devices become too hot, there is a high possibility that these electronic components and devices will malfunction. For this reason, various countermeasures for heat dissipation as exemplified in Patent Document 1 are currently being taken.

  Patent Document 1 discloses a cooling device for an electronic device that forcibly cools a heat generating member fixed to a heat sink with a cooling fan and naturally cools another heat generating member with a negative pressure generated by the cooling fan. In addition, in the electronic apparatus cooling device disclosed in Patent Document 1, a space in which a certain heat generating member fixed to a heat sink is disposed and a space in which another heat generating member is disposed are partitioned by a guide member. .

JP 2000-174474 A

  However, in the electronic apparatus cooling device disclosed in Patent Document 1, cooling of other heat generating members may not be sufficient. This is because some heat generating members are cooled by the heat sink and the cooling fan, while other heat generating members are only naturally cooled by the negative pressure generated by the cooling fan.

  In addition, there is a method in which a heat sink and a cooling fan are separately prepared for cooling other heat generating members. However, this method is contrary to weight reduction, space saving, cost reduction, and the like. For this reason, there is a demand for a heat dissipation structure that can efficiently cool the heat-generating component using a small amount of cooling resources.

  This invention is made | formed in view of such a condition, and it aims at providing the thermal radiation structure which can cool a heat-emitting component efficiently using few cooling resources.

In order to achieve the above object, a heat dissipation structure according to the present invention is:
A top plate, a bottom plate arranged parallel to the top plate, a front plate arranged perpendicular to the top plate, a back plate arranged parallel to the front plate, the top plate and the front plate Two side plates arranged perpendicular to each other, and a housing comprising:
Between the upper surface plate and the bottom surface plate, it is arranged in parallel with the upper surface plate and accommodates a space inside the housing, a first accommodating space for accommodating the first heating element, and a second heating element. And a first heat exhaust port for discharging heat generated from the second heating element from the second housing space at a position near the back plate. A partition plate;
A fan installed at a position corresponding to the first accommodation space of the back plate;
A radiator that is disposed inside the first housing space, contacts the first heating element, and releases heat absorbed from the first heating element;
A second heat exhaust port is formed at a position corresponding to the fan of the back plate,
The radiator constitutes at least a part of a duct that forms a heat exhaust path connecting the first heat exhaust port to the second heat exhaust port, and absorbs heat absorbed from the first heating element. To the heat exhaust path,
The fan discharges heat released from the radiator to the exhaust heat path and heat discharged from the second accommodation space to the exhaust heat path to the outside of the housing.
It is characterized by that.

The radiator is columnar, the length of the column is substantially equal to the length from the partition plate to the upper surface plate, and the cross section of the column is parallel to the partition plate. Placed inside,
A part of the upper surface plate may constitute at least a part of the duct.

The first heat exhaust port is formed at a position away from the two side plates of the partition plate,
The fan is installed such that a position in a direction orthogonal to the two side plates among the positions corresponding to the first accommodation space of the back plate is the same position as the first heat exhaust port. ,
The radiator is
The first cross-sectional shape of the column is a U-shape, and the first central portion is a surface orthogonal to the cross-section and an inner central surface is opposed to the back plate and is in contact with or close to the back plate. It may be arranged inside the storage space.

The first heat exhaust port is formed at a position close to any one of the two side plates of the partition plate,
The fan is installed such that a position in a direction orthogonal to the two side plates among the positions corresponding to the first accommodation space of the back plate is the same position as the first heat exhaust port. ,
The radiator is
The shape of the cross section of the column is L-shaped, one of the surfaces that is orthogonal to the cross section and faces the back plate, and the other inner surface is one of the two side plates. You may arrange | position inside the said 1st accommodation space so that it may oppose to this one side plate, and it contacts or adjoins to the said back plate, and it contacts or adjoins said one side plate.

  The radiator is plate-shaped, and any one surface of the four side surfaces of the pillar is opposed to the back plate, and two of the four side surfaces of the pillar are adjacent to the one surface. You may arrange | position inside the said 1st accommodation space so that a surface may contact or adjoin each of the said 2 side plate.

  The housing may be configured by stacking a first housing surrounding the first housing space and a second housing surrounding the second housing space.

  According to the present invention, it is possible to efficiently cool the heat-generating component using a small amount of cooling resources.

1 is a perspective view of a heat dissipation structure according to a first embodiment of the present invention. It is a disassembled perspective view of the thermal radiation structure which concerns on the 1st Embodiment of this invention. It is a perspective view of a heat sink with which a heat dissipation structure concerning a 1st embodiment of the present invention is provided. It is a rear view of the thermal radiation structure concerning a 1st embodiment of the present invention. It is a fragmentary sectional view in the AA arrow of Drawing 4 of a heat dissipation structure concerning a 1st embodiment of the present invention. It is a fragmentary sectional view in the BB arrow of Drawing 4 of a heat dissipation structure concerning a 1st embodiment of the present invention. It is a perspective view of the heat radiator with which the thermal radiation structure concerning the 2nd Embodiment of this invention is provided. It is a rear view of the thermal radiation structure concerning the 2nd Embodiment of this invention. It is a fragmentary sectional view in the AA arrow of FIG. 8 of the thermal radiation structure which concerns on the 2nd Embodiment of this invention. It is a fragmentary sectional view in the AA arrow of Drawing 4 of a heat dissipation structure concerning a 3rd embodiment of the present invention. It is a rear view of the thermal radiation structure concerning the 4th Embodiment of this invention. It is a fragmentary sectional view in the BB arrow of Drawing 11 of a heat dissipation structure concerning a 4th embodiment of the present invention.

(First embodiment)
Hereinafter, with reference to drawings, the heat dissipation structure concerning a 1st embodiment of the present invention is explained. Note that the heat dissipation structure is a heat dissipation structure applied to electronic devices such as audio devices, measuring instruments, communication devices, and personal computers. The heat dissipation structure includes a housing, a partition plate that partitions the space inside the housing, a fan, and a radiator (heat sink).

  FIG. 1 is a perspective view of a heat dissipation structure 100 according to the present embodiment. FIG. 2 is an exploded perspective view of the heat dissipation structure 100.

  In the present embodiment, as shown in FIG. 1, the casing 150 of the heat dissipation structure 100 is a substantially rectangular parallelepiped, and the top plate 10, the front panel 20, the chassis 31, the chassis 32, the back panel 41, A back panel 42. The top plate 10, the front panel 20, the back panel (back metal fitting) 41, and the back panel 42 (back metal fitting) are plate-like whose surfaces orthogonal to the thickness direction are substantially rectangular. On the other hand, each of the chassis 31 and the chassis 32 has a U-shaped cross section formed by bending both ends of a plate having a rectangular surface perpendicular to the thickness direction in the same direction.

  The outer shape of the housing 150 is a front surface that is orthogonal to the Z axis and is a surface from the positive direction of the Z axis, a rear surface that is orthogonal to the Z axis and is a surface from the negative direction of the Z axis, and is orthogonal to the Y axis. An upper surface that is a surface from the + direction of the X axis, a bottom surface that is a surface that is orthogonal to the Y axis and that is from the − direction of the Y axis, a right side surface that is orthogonal to the X axis and is a surface from the + direction of the X axis, and the X axis And a left side surface which is a surface from the negative direction of the X axis. The positive direction of the Z axis is a direction from the back surface of the heat dissipation structure 100 toward the front surface of the heat dissipation structure 100, and is appropriately referred to as a front direction. The negative direction of the Z axis is a direction from the front surface of the heat dissipation structure 100 toward the back surface of the heat dissipation structure 100, and is referred to as a rear direction as appropriate. Further, the + direction of the Y axis is a direction from the bottom surface of the heat dissipation structure 100 toward the upper surface of the heat dissipation structure 100 and is appropriately referred to as an upward direction. The negative direction of the Y axis is a direction from the upper surface of the heat dissipation structure 100 toward the bottom surface of the heat dissipation structure 100, and is referred to as a downward direction as appropriate. In addition, the + direction of the X axis is a direction from the left side surface of the heat dissipation structure 100 toward the right side surface of the heat dissipation structure 100 and is appropriately referred to as a right direction. The − direction of the X axis is a direction from the right side surface of the heat dissipation structure 100 toward the left side surface of the heat dissipation structure 100, and is appropriately referred to as the left direction.

  The front surface of the housing 150 is configured by the outer surface of the front panel 20. The rear surface of the housing 150 is configured by arranging the outer surface of the rear panel 41 and the outer surface of the rear panel 42 in order from the + direction of the Y axis. The upper surface of the housing 150 is configured by the outer surface of the top plate 10. The bottom surface of the housing 150 is configured by a surface outside the central portion of the chassis 32. The right side surface of the housing 150 is configured by arranging an outer surface at one end of the chassis 31 and an outer surface at one end of the chassis 32 in order from the + direction of the Y axis. The left side surface of the housing is configured by arranging the outer surface of the other end portion of the chassis 31 and the outer surface of the other end portion of the chassis 32 in order from the + direction of the Y axis. The central portion of the chassis 31 serves as a partition plate that partitions the space inside the housing 150 into two spaces.

  Here, the structure of the heat dissipation structure 100 will be described in detail with reference to FIG. First, the upper end of both ends of the chassis 32 and the lower end of both ends of the chassis 31 are fixed by the screws 61, whereby the chassis 31 is fixed on the chassis 32. Then, the top plate 10 is fixed on the chassis 31 by fitting the upper ends of the both ends of the chassis 31 and the both ends of the top plate 10. A notch 34 disposed at one end of both ends of the chassis 31 and a notch 35 disposed at one end of both ends of the chassis 32 are disposed at both ends of the front panel 20. The front panel 20 is fixed to the chassis 31 and the chassis 32 by fitting with the protrusion 21.

  Further, the other end of both ends of the chassis 31 and the rear panel 41 are fixed by screws 61, whereby the chassis 31 and the rear panel 41 are fixed. Similarly, the other end of the both ends of the chassis 32 and the back panel 42 are fixed by screws 61, whereby the chassis 32 and the back panel 42 are fixed. As described above, the housing 150 includes the top plate 10, the front panel 20, the chassis 31, the chassis 32, the back panel 41, and the back panel 42.

  Here, a ventilation hole 43 is provided in the center of the back panel 41. Then, the back panel 41 and the fan 50 are fixed by screws 62 in a state where the fan 50 is stacked from the outside of the back panel 41 so as to cover the ventilation hole 43.

  Further, the circuit board 82 on which the heat generating component 92 is mounted is attached to the inner surface of the central portion of the chassis 32 with screws 63. Similarly, a circuit board 81 on which a heat generating component 91 is mounted is attached to the inner surface of the central portion of the chassis 31 with screws 63. Here, the heat radiator 70 is fixed to the heat generating component 91 with screws 64. Here, it is desirable that the heat generating component 91 and the radiator 70 are in contact with each other in as wide a range as possible, that is, the contact area is wide.

  FIG. 3 shows a perspective view of the radiator 70. As shown in FIG. 3, the radiator 70 is formed by bending both ends of a radiator plate whose surface orthogonal to the thickness direction is rectangular (LY1 × (LZ1 + LX1 + LZ1)) in the same direction, and has a U-shaped cross section. It is a columnar shape. The radiator 70 includes a central portion 71, an end portion 72, and an end portion 73. As for the size of the central portion 71, the plane orthogonal to the thickness direction is LX1 × LY1. As for the size of the end portion 72 and the end portion 73, the plane orthogonal to the thickness direction has a size of LZ1 × LY1. In addition, a screw receiver 74 to which a screw 64 is fixed is formed in the central portion 71 of the radiator 70. In the present embodiment, in order to facilitate understanding, the thickness of the radiator 70, that is, the thickness of the central portion 71, the thickness of the end portion 72, and the thickness of the end portion 73 is not considered.

  Here, LY1 which is the length of the column of the radiator 70 (the length in the direction perpendicular to the U-shaped cross section (Y-axis direction)) is the height of the chassis 31 (the top plate 10, the chassis 31, and the chassis). It is desirable that the length of the chassis 31 in the stacking direction (Y-axis direction) with 32 is substantially equal. Further, it is desirable that LX1 is substantially the same as or slightly longer than the length of the ventilation hole 43 in the X-axis direction. Further, it is desirable that LZ1 is substantially the same as or slightly shorter than the distance from the heat generating component 91 to the back panel 41.

  In the radiator 70, the outer surface of the central portion 71 of the radiator 70 is in contact with the heat generating component 91, and the outer surface of the central portion 71 of the radiator 70 is parallel to the back panel 41. It is fixed to the heat generating component 91 in a state where the character-shaped cross section is parallel to the central surface of the chassis 31 and the substrate surface of the circuit board 81. Here, the position of the ventilation hole 43 (or the position of the fan 50) in the longitudinal direction (X-axis direction) of the back panel 41 and the position of the radiator 70 in the same direction (X-axis direction) are substantially the same position. That is, the radiator 70 is fixed to the heat generating component 91 so as to cover the ventilation hole 43 (or the fan 50).

  Further, of the surfaces constituting the surface of the radiator 70, the radiator 70 is configured so that the surface farthest from the outer surface of the central portion 71 of the radiator 70 is in contact with or close to the back panel 41. It is desirable to be fixed to. That is, LZ1 which is the length of the radiator 70 in the direction orthogonal to the surface of the central portion 71 of the radiator 70 (Z-axis direction) is the distance from the heat generating component 91 mounted on the circuit board 81 to the back panel 41. It is desirable that the radiator 70 be formed so as to be substantially the same as or slightly shorter.

  Further, when an area surrounded by the radiator 70 and the back panel 41 is projected onto the chassis 31 along the Y-axis direction, the ventilation holes 33 are provided in at least a part of the area projected onto the chassis 31. . It is desirable that the size of the ventilation hole 33 is substantially the same as or slightly smaller than the area.

  As described above, the space in the housing 150 is divided into a space surrounded by the chassis 31 and a space surrounded by the chassis 32 and the like. The heat generated in the space surrounded by the chassis 31 and the like is released to the outside of the housing 150 by the radiator 70 installed in the chassis 31, and the heat generated in the space surrounded by the chassis 32 and the like is The fan 50 installed in the chassis 31 is discharged outside the casing 150. Hereinafter, a state in which heat generated in each space is released to the outside of the housing 150 will be described with reference to a cross-sectional view of the heat dissipation structure 100.

  FIG. 4 is a rear view of the heat dissipation structure 100 according to the present embodiment. FIG. 5 is a partial cross-sectional view of the heat dissipation structure 100 taken along the line AA in FIG. In other words, FIG. 5 is a diagram showing a part of a cross section when the heat dissipation structure 100 is cut off on a plane orthogonal to the Y-axis and including a one-dot chain line indicated by AA in FIG. 4. In FIG. 5, the ventilation holes 33 and the circuit board 81 are appropriately indicated by broken lines for easy understanding.

  The circuit board 81 covers a plane inside the central portion of the chassis 31 and is formed so as to avoid a position where a space surrounded by the radiator 70 is projected as viewed from the Y-axis direction. Further, the heat generating component 91 is mounted on the central portion of the end portion of the circuit board 81 on the back panel 41 side. The radiator 70 is fixed to the heat generating component 91 such that the outer surface of the U-shaped central portion 71 contacts the heat generating component 91. Here, in the chassis 31, a ventilation hole 33 is formed at a position where a space surrounded by the radiator 70 is projected as viewed from the Y-axis direction. Further, the rear panel 41 has a ventilation hole 43 formed at the center of the position where the radiator 70 is projected as viewed from the Z-axis direction. And the fan 50 is installed in the outer surface of the back panel 41 so that this ventilation hole 43 may be covered.

  FIG. 6 is a cross-sectional view of the heat dissipation structure 100 taken along the line BB in FIG. In other words, FIG. 6 is a diagram showing a part of a cross section when the heat dissipation structure 100 is cut off on a plane that is orthogonal to the X axis and includes a one-dot chain line indicated by BB in FIG. 4. In FIG. 6, for easy understanding, the screw 63, the screw receiver 65, the end 72 of the radiator 70, and the end 73 of the radiator 70 are indicated by broken lines as appropriate.

  The space 201 is a space surrounded by the top plate 10, the front panel 20, the chassis 31, the back panel 41, and the radiator 70. On the other hand, the space 202 is a space surrounded by the front panel 20, the chassis 31, the chassis 32, the back panel 42, and the ventilation holes 33.

  The circuit board 81 is fixed to the chassis 31 by fixing the screw 63 to a screw receiver 65 provided in the chassis 31 through a screw hole (not shown) formed in the circuit board 81. The radiator 70 is in contact with or close to the inner surface of the top plate 10, is in contact with or close to the inner surface of the central portion of the chassis 31, and is in contact with or close to the inner surface of the back panel 41.

  According to such a configuration, the radiator 70 constitutes a part of a duct that guides the heat generated from the heat generating component 92 to the outside of the housing 150 from the space 202. For this reason, the heat radiator 70 efficiently releases the heat absorbed from the outer surface from the inner surface using the airflow generated in the vicinity of the inner surface.

  The circuit board 82 is formed so as to cover a plane inside the central portion of the chassis 32. The circuit board 82 is fixed to the chassis 32 by fixing the screw 63 to a screw receiver 65 provided in the chassis 32 through a screw hole (not shown) formed in the circuit board 82. The heat generating component 92 is mounted on the circuit board 82.

  According to such a configuration, the air in the space 202 is converted into the ventilation hole 33, the top plate 10, and the rear panel by the forward rotation of the fan 50 (rotation that causes the air inside the housing 150 to flow outside the housing 150). It flows in the order of the duct constituted by 41 and the radiator 70 and the ventilation hole 43, and is discharged to the outside of the housing 150. That is, the air in the space 202 flows in the direction indicated by the arrows 301 and 302. On the other hand, the heat transmitted from the heat generating component 91 to the radiator 70 is released in the direction indicated by the arrow 303.

  As described above, according to the heat dissipation structure 100 according to the present embodiment, the heat generated from the heat generating component 92 rides on the airflow generated by the rotation of the fan 50 and is released to the outside of the housing 150. The heat generated from the heat generating component 91 is released to the outside of the housing 150 by the radiator 70 that forms part of the duct surrounding the path through which the airflow passes. Thus, the heat radiator 70 has a duct function. Accordingly, a single fan 50 can simultaneously cool a plurality of heat generating components present in different spaces. That is, according to the present embodiment, the heat radiator 70 is used as a part of a duct that guides the heat in the space 202 where the heat generating component 92 exists to the outside of the housing 150, so that the heat generating component 92 is blown by the fan. The structure in which the heat-generating component 91 is cooled by forcibly cooling the heat-dissipating device 70 in contact with the heat-generating component 91 existing in the space 201 can be realized in a simple and small space.

  In the present embodiment, the duct that guides the air in the space 202 to the outside of the housing 150 is constituted by a part of the top plate 10, a part of the back panel 41, and the radiator 70. According to such a configuration, the radiator 70 can be formed simply by bending the heat radiating plate at two locations in the same direction. For this reason, the process of the heat sink for forming the heat radiator 70 is easy. Further, since the outer surface of the central portion 71 of the radiator 70 is flat, it can be expected that heat exchange between the radiator 70 and the heat generating component 91 is efficiently performed.

  According to this embodiment, each partitioned space in the housing can be cooled with few resources (one radiator 70 and one fan 50). Note that when the number of radiators 70 and fans 50 to be installed increases, the structure of the housing 150 becomes complicated, which hinders space saving, thinning, and the like, and hinders reduction in product cost. Further, when the number of fans 50 increases, noise due to rotating sound and vibration increases. On the other hand, when the number of the radiators 70 is increased, by opening the heat radiation holes, foreign matters are mixed into the housing 150, the electrical characteristics such as radiation are deteriorated, or the weight increases due to the installation of the radiator 70 and the housing 150 Problems such as narrowing of the space become larger. Therefore, as in this embodiment, a structure that reduces the number of fans 50 and radiators 70 as much as possible and efficiently cools the inside of the housing 150 is desirable. Note that this embodiment is particularly effective when the heat generating component 91 that is not preferably cooled by the fan 50 and the heat generating component 92 that is not preferable to be cooled by the radiator 70 are mixed in the housing.

(Second Embodiment)
In the first embodiment, an example in which the radiator 70 whose cross section is a U-shaped column shape is employed has been described. In the present invention, the radiator may not have a columnar shape with a U-shaped cross section. In the present invention, for example, a radiator 170 having an L-shaped column shape in cross section may be employed. Hereinafter, the second embodiment will be described, but the description of the same configuration as the first embodiment will be omitted or simplified.

  FIG. 7 is a perspective view of the radiator 170 provided in the heat dissipation structure according to the present embodiment. As shown in FIG. 7, the radiator 170 has, for example, a shape formed by bending a plate-shaped heat dissipation plate at a right angle, and has a L-shaped columnar cross section. For example, the heat radiator 170 has a length of LZ2 from one end in the X-axis direction with a heat dissipation plate whose length in the vertical direction (Y-axis direction) is LY2 and whose length in the horizontal direction (X-axis direction) is (LX2 + LZ2). It is formed by bending at a right angle.

  In the present embodiment, a portion where the outer surface is defined by LX2 × LY2 is a bent portion 171, and a portion where the outer surface is defined by LZ2 × LY2 is a bent portion 172. Of the surfaces constituting the bent portion 171, the surface perpendicular to the Z axis and in the + direction of the Z axis is referred to as the outer surface of the bent portion 171, and among the surfaces constituting the bent portion 171, Z A surface perpendicular to the axis and in the negative direction of the Z axis is referred to as an inner surface of the bent portion 171. Of the surfaces constituting the bent portion 172, the surface orthogonal to the X axis and in the + direction of the X axis is referred to as the outer surface of the bent portion 172, and among the surfaces constituting the bent portion 172, the X axis A surface that is perpendicular to the X axis and is in the negative direction of the X axis is referred to as an inner surface of the bent portion 172. In this embodiment, in order to facilitate understanding, the thickness of the radiator 170, that is, the thickness of the bent portion 171 and the thickness of the bent portion 172 are not considered.

  FIG. 8 is a rear view of the heat dissipation structure 110 according to the present embodiment. FIG. 9 is a partial cross-sectional view of the heat dissipation structure 110 as viewed in the direction of arrows AA in FIG. 8. In other words, FIG. 9 is a diagram showing a part of a cross section when the heat dissipation structure 110 is cut out on a plane that is orthogonal to the Y axis and includes a one-dot chain line indicated by AA in FIG. 8. In FIG. 9, for easy understanding, the ventilation hole 33 and the circuit board 81 are appropriately indicated by broken lines.

  The circuit board 81 covers a plane inside the central portion of the chassis 31 so as to avoid a position where a space surrounded by the radiator 170, the back panel 41, and the right end portion of the chassis 31 is projected as viewed from the Y-axis direction. It is formed. The heat generating component 91 is mounted on the right end portion of the end portion of the circuit board 81 on the back panel 41 side. The radiator 170 has the outer surface of the bent portion 171 in contact with or close to the heat generating component 191, and the end of the bent portion 171 not in contact with the bent portion 172 is in contact with the right end portion of the chassis 31 or The end of the bent portion 172 that is not in contact with the bent portion 171 is fixed to the heat generating component 191 so as to be in contact with or close to the inner surface of the back panel 41. Here, in the chassis 31, the ventilation hole 33 is formed at a position where a space surrounded by the radiator 170, the back panel 41, and the right end of the chassis 31 is projected as viewed from the Y-axis direction. Further, the rear panel 41 has a ventilation hole 43 in the center of the position where the radiator 170 is projected as viewed from the Z-axis direction. And the fan 50 is installed in the outer surface of the back panel 41 so that this ventilation hole 43 may be covered.

  As described above, according to the heat dissipation structure 110 according to the present embodiment, the heat generated from the heat generating component 92 rides on the airflow generated by the rotation of the fan 50 and is released to the outside of the housing 150. The heat generated from the heat generating component 91 is released to the outside of the housing 150 by the radiator 170 that forms a part of the duct surrounding the path through which the airflow passes.

  In this embodiment, the duct that guides the air in the space 202 to the outside of the housing 150 includes a part of the top plate 10, a part of the back panel 41, a part of the right end of the chassis 31, and the radiator 170. Consists of. According to such a configuration, the heat radiator 170 can be formed only by bending the heat radiating plate at one place. For this reason, the process of the heat sink for forming the heat radiator 170 is prepared. Further, since the outer surface of the bent portion 171 of the radiator 170 is flat, it can be expected that heat exchange between the radiator 170 and the heat generating component 91 is efficiently performed.

(Third embodiment)
In the second embodiment, an example in which the radiator 170 having a L-shaped columnar cross section is employed has been described. In the present invention, the radiator may not be a column having an L-shaped cross section. In the present invention, for example, a radiator 270 having an I-shaped cross section, that is, a plate shape may be employed. Hereinafter, the third embodiment will be described, but the description of the same configuration as that of the first embodiment or the second embodiment will be omitted or simplified.

  The rear view of the heat dissipation structure 120 according to the present embodiment is the same as the rear view shown in FIG. 10 is a partial cross-sectional view of the heat dissipating structure 120 as viewed in the direction of arrows AA in FIG. In other words, FIG. 10 is a diagram illustrating a part of a cross section when the heat dissipation structure 120 is cut out on a plane that is orthogonal to the Y axis and includes a one-dot chain line indicated by AA in FIG. 4. In FIG. 10, the ventilation holes 33 and the circuit board 81 are appropriately indicated by broken lines for easy understanding.

  The circuit board 81 covers a plane inside the central portion of the chassis 31 so as to avoid a position where a space surrounded by the radiator 270, the back panel 41, and both ends of the chassis 31 is projected as viewed from the Y-axis direction. It is formed. The heat generating component 91 is mounted at the center of the end of the circuit board 81 on the back panel 41 side. The radiator 270 has both surfaces orthogonal to the Z axis, the surface on the front panel 20 side is in contact with the heat generating component 91, the right end is in contact with or close to the right end of the chassis 31, and the left end is the left end of the chassis 31. It is fixed to the heat generating component 91 so as to be in contact with or close to the part and to have a predetermined gap between the surface on the back panel 41 side and the inner surface of the back panel 41. Here, in the chassis 31, as viewed from the Y-axis direction, the ventilation hole 33 is formed at a position where a space surrounded by the radiator 270, the back panel 41, and both ends of the chassis 31 is projected. Further, the rear panel 41 has a ventilation hole 43 in the center of the position where the radiator 270 is projected when viewed from the Z-axis direction. And the fan 50 is installed in the outer surface of the back panel 41 so that this ventilation hole 43 may be covered.

  As described above, according to the heat dissipation structure 120 according to the present embodiment, the heat generated from the heat generating component 92 rides on the airflow generated by the rotation of the fan 50 and is released to the outside of the housing 150. The heat generated from the heat generating component 91 is released to the outside of the housing 150 by the radiator 270 that forms a part of the duct surrounding the path through which the airflow passes.

  In the present embodiment, the duct that guides the air in the space 202 to the outside of the housing 150 includes a part of the top plate 10, a part of the back panel 41, a part of both ends of the chassis 31, and the radiator 270. Consists of. According to such a configuration, the heat radiator 170 can be formed by the heat radiating plate. For this reason, the process for forming the heat radiator 270 is easy. Further, since one surface of the radiator 270 is flat, it can be expected that heat exchange between the radiator 270 and the heat generating component 91 is efficiently performed. Furthermore, in this embodiment, since both sides of the circuit board 81 may be rectangular, the circuit board 81 can be easily formed.

(Fourth embodiment)
In the first embodiment, an example in which the space in the housing 150 is separated into two spaces, that is, the space 201 and the space 202 has been described. In the present invention, the space in the housing 150 may be separated into three or more spaces. Hereinafter, the space in the casing 150 is divided into one space in which the heat generating component 91 is cooled by the radiator 70 and two spaces in which the heat generating component 92 and the heat generating component 93 are cooled by the air flow generated by the fan 50. An example of separation will be described. Hereinafter, the fourth embodiment will be described, but the description of the same configuration as the first to third embodiments will be omitted or simplified.

  FIG. 11 is a rear view of the heat dissipation structure 130 according to the present embodiment. 12 is a cross-sectional view of the heat dissipation structure 130 as viewed from the direction of arrows BB in FIG. 11. In other words, FIG. 12 is a view showing a cross section when the heat dissipation structure 130 is cut off on a plane that is orthogonal to the X-axis and includes a one-dot chain line indicated by BB in FIG. 11. In FIG. 12, for easy understanding, the screw 63, the screw receiver 65, the end 72 of the radiator 70, and the end 73 of the radiator 70 are indicated by broken lines as appropriate.

  The space 201 is a space surrounded by the chassis 36, the front panel 20, the chassis 31, the back panel 41, and the radiator 70. On the other hand, the space 202 is a space surrounded by the front panel 20, the chassis 31, the chassis 32, the back panel 42, and the ventilation holes 33. Furthermore, the space 203 is a space surrounded by the top plate 10, the front panel 20, the back panel 43, and the ventilation holes 37.

  The circuit board 81 is fixed to the chassis 31 by fixing the screw 63 to a screw receiver 65 provided in the chassis 31 through a screw hole (not shown) formed in the circuit board 81. The radiator 70 is in contact with or close to the outer surface of the chassis 36, is in contact with or close to the inner surface of the central portion of the chassis 31, and is in contact with or close to the inner surface of the back panel 41. Here, a ventilation hole 33 is formed in the central portion of the end portion of the central portion of the chassis 31 on the back panel 41 side.

  The circuit board 82 is formed so as to cover a plane inside the central portion of the chassis 32. The circuit board 82 is fixed to the chassis 32 by fixing the screw 63 to a screw receiver 65 provided in the chassis 32 through a screw hole (not shown) formed in the circuit board 82. The heat generating component 92 is mounted on the circuit board 82.

  The circuit board 83 is formed so as to cover a plane inside the central portion of the chassis 36. The circuit board 83 is fixed to the chassis 36 by fixing the screw 63 to a screw receiver 65 provided in the chassis 36 through a screw hole (not shown) provided in the circuit board 83. The heat generating component 93 is mounted on the circuit board 83. Here, a ventilation hole 37 is formed in a central portion of the end portion of the central portion of the chassis 36 on the back panel 43 side.

  According to such a configuration, the radiator 70 forms a part of the duct that guides the heat generated from the heat generating component 92 to the outside of the housing 150, and guides the heat generated from the heat generating component 93 to the outside of the housing 150. This constitutes a part of the duct. For this reason, the heat radiator 70 efficiently releases heat from the heat generating component 91 absorbed from the outer surface from the inner surface, using the air flow generated in the vicinity of the inner surface.

  According to such a configuration, the air in the space 202 is converted into the ventilation hole 33, the back panel 41, and the radiator by the forward rotation of the fan 50 (rotation that causes the air inside the housing 150 to flow outside the housing 150). 70 and the ventilation hole 43 in this order, and are discharged to the outside of the housing 150. That is, the air in the space 202 flows in the direction indicated by the arrows 301 and 302. Further, due to the forward rotation of the fan 50, the air in the space 203 also flows in the order of the ventilation hole 37, the duct constituted by the back panel 41 and the radiator 70, and the ventilation hole 43. Released. That is, the air in the space 203 flows in the direction indicated by the arrows 301 and 304. On the other hand, the heat transmitted from the heat generating component 91 to the radiator 70 is released in the direction indicated by the arrows 301 and 303.

  As described above, according to the heat dissipation structure of the heat dissipation structure 130 according to the present embodiment, the heat generated from the heat generating component 92 and the heat generating component 93 rides on the airflow generated by the rotation of the fan 50 and The heat generated from the heat generating component 91 is released to the outside of the housing 150 by the radiator 70 that forms a part of the duct surrounding the path through which the airflow passes.

  In this embodiment, the duct that guides the air in the space 202 to the outside of the housing 150 is constituted by a part of the back panel 41 and the radiator 70, and the air in the space 203 is extended to the outside of the housing 150. The guiding duct is constituted by a part of the back panel 41 and the radiator 70. According to such a configuration, the radiator 70 can be formed simply by bending the heat radiating plate at two locations in the same direction. For this reason, the process of the heat sink for forming the heat radiator 70 is easy. Further, since the outer surface of the central portion 71 of the radiator 70 is flat, it can be expected that heat exchange between the radiator 70 and the heat generating component 91 is efficiently performed.

(Modification)
The present invention is not limited to those disclosed in the first to fourth embodiments.

  For example, in the fourth embodiment, the heat generating component 92 is cooled by the air flow generated by the fan 50 and the heat generating component 93 is the fan so that the heat generating component 91 is sandwiched by the space 201 cooled by the radiator 70. The space 203 cooled by the airflow generated by the airflow 50 is shown as an example. In the present invention, the arrangement order of the spaces is arbitrary.

  For example, each space may be arranged from the top in the order of the space 201, the space 202, and the space 203, or may be arranged from the top in the order of the space 203, the space 202, and the space 201. In any arrangement, for example, a ventilation hole is opened in a chassis other than the chassis arranged at the bottom.

  Further, the space in the housing 150 may be divided into four or more spaces. Furthermore, the number of spaces in which the heat generating components are cooled by the radiator and the number of spaces in which the heat generating components are cooled by the airflow generated by the fan 50 can be adjusted as appropriate. For example, the space in the housing 150 is divided into three spaces, the heat generating component is cooled by a radiator, the heat generating component is cooled by an air flow generated by the fan 50, and the heat generating component is cooled by a radiator. It may be arranged from the top in the order of the space.

  In the first embodiment, an example in which the radiator 70 has a columnar shape having a U-shaped cross section is shown, and in the second embodiment, an example in which the radiator 170 has a column shape having an L-shaped cross section is shown. In the third embodiment, an example in which the radiator 270 is plate-shaped has been described. In the present invention, the shape of the radiator is not limited to these examples. For example, the radiator may have a columnar shape having a U-shaped cross section, that is, a semi-cylindrical shape. The shape of the radiator is desirably a shape suitable for forming a duct in combination with a top plate or a back panel.

  In the first to fourth embodiments, examples in which the surface of the radiator is flat have been shown. In the present invention, the surface of the radiator may have a shape for improving the heat radiation efficiency, for example, a bellows shape or a sword mountain shape.

  In 1st Embodiment, the area of the ventilation hole 33 provided in the chassis showed the example which substantially corresponds with the cross-sectional area of the duct comprised with a heat radiator, a top plate, and a back panel. In the present invention, the area of the vent hole 33 may be smaller than the cross-sectional area of the duct.

  In the first to fourth embodiments, examples in which the radiator and the chassis, the top plate 10, or the back panel are in contact with or in proximity to each other (an example in which there is almost no gap) have been shown. In the present invention, there may be a certain gap between the radiator and the chassis, the top plate 10 or the back panel. However, it is expected that the cooling efficiency is improved as the gap is narrowed.

  In the first to fourth embodiments, the example in which the space in the housing 150 is divided by the chassis has been described. In the present invention, a plurality of independent housings may be stacked to form one housing.

  In the first to fourth embodiments, the example in which the ventilation holes are not provided in the front panel 20 or the like has been described. In the present invention, air in the housing 150 may flow efficiently by providing ventilation holes in the front panel 20 or the like.

  In the first to fourth embodiments, the example in which the fan 50 rotates so as to release the air inside the housing 150 to the outside of the housing 150 has been described. In the present invention, the fan 50 may rotate so that air outside the housing 150 is pushed into the housing 150.

  In 1st Embodiment, the center part 71 of the heat radiator 70 showed the example fixed to the heat-emitting component 91. As shown in FIG. In the present invention, the end 72 of the radiator 70 or the end 73 of the radiator 70 may be fixed to the heat generating component 91. Further, the radiator 70 need not be fixed to the heat generating component 91, and may be fixed to the chassis 31 or the circuit board 81, for example.

  In the first embodiment, an example in which the respective members are fixed to each other by screws is mainly shown. In the present invention, a method for fixing the members to each other is arbitrary. For example, each member may be fixed to each other by an adhesive or a notch.

DESCRIPTION OF SYMBOLS 10 Top plate 20 Front panel 21 Protrusion part 31,32,36 Chassis 33,37,43 Ventilation hole 34,35 Notch part 41,42 Rear panel 50 Fan 61,62,63,64 Screw 65 Screw receiver 70,170, 270 Radiator 71 Center part 72, 73 End part 74 Screw receiver 81, 82, 83 Circuit board 91, 92, 93 Heat generating component 100, 110, 120, 130 Heat dissipation structure 150 Case 171 Folded part 172 Bent part 201, 202, 203 Space 301, 302, 303, 304 Arrow

Claims (6)

A top plate, a bottom plate arranged parallel to the top plate, a front plate arranged perpendicular to the top plate, a back plate arranged parallel to the front plate, the top plate and the front plate Two side plates arranged perpendicular to each other, and a housing comprising:
Between the upper surface plate and the bottom surface plate, it is arranged in parallel with the upper surface plate and accommodates a space inside the housing, a first accommodating space for accommodating the first heating element, and a second heating element. And a first heat exhaust port for discharging heat generated from the second heating element from the second housing space at a position near the back plate. A partition plate;
A fan installed at a position corresponding to the first accommodation space of the back plate;
A radiator that is disposed inside the first housing space, contacts the first heating element, and releases heat absorbed from the first heating element;
A second heat exhaust port is formed at a position corresponding to the fan of the back plate,
The radiator constitutes at least a part of a duct that forms a heat exhaust path connecting the first heat exhaust port to the second heat exhaust port, and absorbs heat absorbed from the first heating element. To the heat exhaust path,
The fan discharges heat released from the radiator to the exhaust heat path and heat discharged from the second accommodation space to the exhaust heat path to the outside of the housing.
A heat dissipation structure characterized by that. The radiator is columnar, the length of the column is substantially equal to the length from the partition plate to the upper surface plate, and the cross section of the column is parallel to the partition plate. Placed inside,
A part of the top plate constitutes at least a part of the duct;
The heat dissipation structure according to claim 1. The first heat exhaust port is formed at a position away from the two side plates of the partition plate,
The fan is installed such that a position in a direction orthogonal to the two side plates among the positions corresponding to the first accommodation space of the back plate is the same position as the first heat exhaust port. ,
The radiator is
The first cross-sectional shape of the column is a U-shape, and the first central portion is a surface orthogonal to the cross-section and an inner central surface is opposed to the back plate and is in contact with or close to the back plate. Placed inside the containment space,
The heat dissipation structure according to claim 2. The first heat exhaust port is formed at a position close to any one of the two side plates of the partition plate,
The fan is installed such that a position in a direction orthogonal to the two side plates among the positions corresponding to the first accommodation space of the back plate is the same position as the first heat exhaust port. ,
The radiator is
The shape of the cross section of the column is L-shaped, one of the surfaces that is orthogonal to the cross section and faces the back plate, and the other inner surface is one of the two side plates. It is arranged inside the first accommodation space so as to face one of the side plates and contact or approach the back plate and contact or approach the one side plate.
The heat dissipation structure according to claim 2. The radiator is plate-shaped, and any one surface of the four side surfaces of the pillar is opposed to the back plate, and two of the four side surfaces of the pillar are adjacent to the one surface. Arranged inside the first accommodating space such that a surface is in contact with or close to the two side plates, respectively.
The heat dissipation structure according to claim 2. The case is configured by overlapping a first case surrounding the first accommodation space and a second case surrounding the second accommodation space.
The heat dissipation structure according to any one of claims 1 to 5, wherein

Images