JP5417274B2 - Heat dissipation structure of electronic equipment - Google Patents

Description

  Embodiments described herein relate generally to a heat dissipation structure for an electronic device.

For example, in an electronic device such as a communication device, in order to reduce the size of the device and cope with high heat generation, the heat dissipation structure is difficult. In recent years, devices equipped with forced air cooling fans are increasing as a countermeasure.
In a device equipped with a forced air cooling fan, the cooling performance of electronic components depends on the arrangement on the electronic circuit board. For this reason, it is appropriate to dispose the highly heat-generating electronic component at a position where the cooling air speed is as fast as possible in the vicinity of the cooling fan. However, due to the configuration of the electric circuit board, there may be a case where the highly heat-generating electronic component has to be disposed at a position where the distance from the cooling fan is long and the cooling air velocity is low. In this case, there is a possibility that the cooling air velocity is not sufficiently secured around such a high heat generating electronic component, and the cooling effect of the high heat generating electronic component is lowered. Furthermore, when the cooling air sequentially cools the plurality of electronic components, heat accumulation tends to increase the temperature of the electronic components on the leeward side, which may reduce long-term reliability.

JP-A-11-186664 JP 2006-210516 A

  In order to efficiently cool the highly heat-generating electronic components arranged at a position away from the cooling fan, there is a method of increasing the wind speed by adding a mechanical member for forming a single cooling channel. However, in a high-density mounting device or the like, it is not efficient because there is a limit to a space for securing a flow path forming component. Therefore, if measures such as making the cooling fan larger and faster or increasing the number of cooling fans are taken, there are problems that the components become complicated, the equipment becomes larger, and the cost becomes higher.

  According to the embodiment, an air intake portion in which an intake hole for cooling air is formed in at least one wall surface of a box-shaped outer casing that houses an electronic device, and an exhaust hole is formed in a wall surface other than the wall surface on which the air intake portion is formed The outer casing is configured to shield each surface other than the wall surface on which the air intake portion is formed and the wall surface on which the exhaust portion is formed, and has a plurality of heat generating components mounted thereon. The electronic circuit main board is a heat dissipation structure for an electronic device installed in a state where the circuit main board is disposed in a horizontal direction inside the outer casing, and the electronic circuit main board is provided with a notch in a part of a plate surface, A rectangular parallelepiped module component whose height from the bottom plate of the outer casing is higher than the height of the electronic circuit main board is disposed in the notch, and suction is performed from the wall surface on which the suction section is formed into the outer casing. The cooling air A first flow path that flows along the surface of the circuit main board and flows to the exhaust part side, and cooling air sucked into the outer casing from the wall surface on which the air intake part is formed is the back surface of the electronic circuit main board And the second flow path that flows from the notch to the surface side of the electronic circuit main board and forms the second heat flow path that is disposed on the electronic circuit main board on the air intake side. Cooling means is provided for cooling the component with cooling air flowing through the first flow path, and cooling the heat generating component on the downstream side disposed on the exhaust section side with cooling air flowing through the second flow path. It is characterized by.

It is the top view which showed the whole structure of the thermal radiation structure in the state which removed the top plate of the electronic device of 1st Embodiment. It is a front view which shows the arrangement | positioning state of the air intake hole of the front panel of the electronic device of 1st Embodiment. It is the III-III sectional view taken on the line of FIG. It is the IV-IV sectional view taken on the line of FIG. It is the top view which showed the whole structure of the thermal radiation structure in the state which removed the top plate of the electronic device of 2nd Embodiment.

Hereinafter, embodiments will be described with reference to the drawings.
[First Embodiment]
(Constitution)
FIG. 1 is a diagram illustrating a state in which the top plate 4 is removed in the overall configuration of the heat dissipation structure of the electronic device 1 of the present embodiment. The electronic device 1 has a shielded box-shaped outer casing 2. Specifically, the outer casing 2 includes a chassis 3 and a top plate 4. The chassis 3 is formed by a bottom plate 5 and both side plates 6a and 6b. A front panel (front plate) 7 is disposed on the front surface of the outer casing 2, and a rear panel 8 is disposed on the rear surface.

  An electronic circuit main board 9 is arranged horizontally in the gravity direction inside the outer casing 2 of the electronic device 1. On the electronic circuit main board 9, a plurality of electronic components (heat generating components) 10a to 10d, which generate heat to a relatively high temperature during operation, are mounted in the present embodiment. The electronic components 10a to 10d are formed by a CPU, a power amplifier, or the like, for example. The electronic components 10a to 10d are arranged with a heat radiator for heat dissipation.

  Further, the electronic device 1 is provided with a power supply unit 12 for supplying power to the main board 9 and a rectangular parallelepiped electronic component 13. The rectangular parallelepiped electronic component 13 is, for example, a synthesizer module. The power supply unit 12 and the rectangular parallelepiped electronic component 13 are disposed at a substantially central position in the front-rear direction inside the outer casing 2. Here, the power supply unit 12 is disposed in the vicinity of the right side plate 6b in FIG. The rectangular parallelepiped electronic component 13 is disposed in the vicinity of the left side plate 6a in FIG.

  In addition, the chassis 3 of the electronic device 1 includes a partition plate 3 a that partitions between the storage unit of the power supply unit 12 and the storage unit of the main board 9. The partition plate 3 a is installed so that the radiation noise of the power supply unit 12 does not affect the main board 9. Note that a large number of small-diameter ventilation holes 12a that can prevent leakage of radiation noise of the power supply unit 12 are formed on each wall surface of the storage unit of the power supply unit 12, and the heat dissipation effect of the power supply unit 12 is also taken into consideration. Yes.

  In the electronic device 1, as shown in FIG. 2, a plurality of air intake holes 7 a are formed in the front panel 7 to form an air intake portion 14. Further, one or a plurality of cooling fans 15 in the present embodiment are arranged on the rear panel 8. These two cooling fans 15 constitute an exhaust part 16 in which exhaust holes are formed in the rear panel 8.

  Accordingly, when the two cooling fans 15 are driven, cooling air is sucked into the outer casing 2 of the electronic device 1 from the plurality of intake holes 7a of the front panel 7, and the electronic devices are transmitted from the two cooling fans 15 of the rear panel 8. A heat radiating structure of a forced air cooling fan is formed by exhausting the cooling air to the outside of 1 to exhaust heat.

  Also, in the electronic circuit main board 9 of the present embodiment, two of the four electronic components 10a to 10d are placed between the front panel 7 and the partition plate 3a of the power supply unit 12 (cooling air). (Upstream of the flow path). The remaining two electronic components 10c and 10d are arranged on the downstream side of the cooling air flow path with respect to the upstream electronic components 10a and 10b.

  When the two cooling fans 15 are driven, the cooling air flowing into the outer casing 2 of the electronic device 1 from the plurality of intake holes 7a of the front panel 7 is indicated by a solid arrow B1 in FIG. Cooling air flowing along the surface of the main board 9 is directly blown to the electronic components 10a and 10b on the upstream side. Therefore, the electronic components 10a and 10b on the upstream side can be efficiently cooled by the low-temperature cooling air sucked from the intake holes 7a. As a result, the cooling air sucked into the outer casing 2 from the front panel 7 in which the plurality of intake holes 7a of the intake section 14 are formed flows along the surface of the electronic circuit main board 9, and the exhaust section 16 of the rear panel 8. A first flow path (first ventilation path) X1 that flows to the side is formed.

  Further, the electronic circuit main board 9 has a first notch 19 at a portion corresponding to the partition plate 3 a of the power supply unit 12 and a second notch 20 at a portion corresponding to the rectangular parallelepiped electronic component 13. Is formed. Here, the first notch portion 19 of the electronic circuit main board 9 is formed in a state where a space S1 through which cooling air can pass is provided between the first notch portion 19 and the partition plate 3a of the power supply unit 12. Similarly, the second cutout portion 20 of the electronic circuit main board 9 is formed in a state where a space S2 through which cooling air can pass is provided between the second cutout portion 20 and the rectangular parallelepiped electronic component 13.

  As a result, a part of the cooling air that enters the inside of the outer casing 2 from the intake hole 7a of the intake portion 14 is part of the back surface of the main board 9, that is, the gap S3 between the main board 9 and the bottom plate 5 of the chassis 3 ( Flows downstream) (see FIG. 3). At this time, the component of the cooling air flowing through the gap S3 between the main board 9 and the bottom plate 5 of the chassis 3 toward the partition plate 3a side of the power supply unit 12 as indicated by the dotted arrow B2-1 in FIG. It hits the partition plate 3a of the power supply unit 12 and bounces back. Therefore, as shown by the solid arrow B3-1 in FIG. 1 and the main board from the narrow space S1 between the first notch 19 of the electronic circuit main board 9 and the partition plate 3a of the power supply unit 12 as shown in FIG. 9 flows out to the surface side. At this time, the wind speed of the cooling air increases, and it becomes possible to directly cool the electronic component 10c on the downstream side directly with the cooling air in a low temperature state in which heat is not accumulated.

  Similarly, as indicated by a dotted arrow B2-2 in FIG. 1, the component of the cooling air flowing in the gap S3 between the main board 9 and the bottom plate 5 of the chassis 3 toward the rectangular parallelepiped electronic component 13 is a rectangular parallelepiped. The electronic component 13 is bounced back. Therefore, as shown in the solid line arrow B3-2 in FIG. 1 and FIG. 4, the state where the second notch portion 20 and the rectangular parallelepiped electronic component 13 are pulled out to the surface of the main board 9 from the narrow space S2. It flows in. At this time, the wind speed of the cooling air increases, and it becomes possible to directly cool the electronic component 10d on the downstream side directly with the cooling air in a low temperature state in which heat is not accumulated.

  As a result, the cooling air sucked into the outer casing 2 from the front panel 7 in which the plurality of intake holes 7a of the intake section 14 is formed flows along the back surface of the electronic circuit main board 9, and the first notch 19 And the 2nd flow path (2nd ventilation path) X2 which flows into the surface side of the electronic circuit main board | substrate 9 from the 2nd notch part 20 is formed. Therefore, in the electronic device 1 of the present embodiment, the upstream electronic components 10a and 10b disposed on the intake circuit 14 side on the electronic circuit main board 9 are cooled by the cooling air flowing through the first flow path X1. Cooling means 21 for cooling the downstream electronic components 10c and 10d disposed on the exhaust part 16 side with cooling air flowing through the second flow path X2 is provided.

(effect)
Therefore, the above configuration has the following effects. That is, in this embodiment, the rectangular parallelepiped electronic component 10 and the power supply unit 12 shielded by the partition plate 3a are arranged on both the left and right sides of the electronic circuit main board 9, and the electronic circuit main board 9, a first notch 19 is provided at a portion corresponding to the partition plate 3a of the power supply unit 12, and a second notch 20 is provided at a portion corresponding to the rectangular parallelepiped electronic component 13. Furthermore, a space S1 through which cooling air can pass is provided between the partition plate 3a of the power supply unit 12 and the first cutout portion 19, and similarly between the rectangular parallelepiped electronic component 13 and the second cutout portion 20. A space S2 through which cooling air can pass is provided. As a result, the cooling air sucked into the outer casing 2 from the front panel 7 in which the plurality of intake holes 7a of the intake section 14 is formed flows along the back surface of the electronic circuit main board 9, and the first notch 19 And the 2nd flow path X2 which flows into the surface side of the electronic circuit main board | substrate 9 from the 2nd notch part 20 can be formed.

  Therefore, in the electronic device 1 of the present embodiment, the upstream electronic components 10a and 10b disposed on the intake circuit 14 side on the electronic circuit main board 9 are cooled by the cooling air flowing through the first flow path X1. Further, it is possible to provide a cooling means 21 for cooling the downstream electronic components 10c and 10d arranged on the exhaust part 16 side with cooling air flowing through the second flow path X2. For this reason, the cooling air blown to the two upstream electronic components 10a and 10b and whose temperature has risen passes around the two downstream electronic components 10c and 10d, and at the same time, the two upstream electronic components 10a and 10b. Cooling air in a low temperature state that does not pass can be blown to the two electronic components 10c and 10d on the downstream side for cooling. As a result, the cooling fan 15 externally cools the two downstream electronic components 10c and 10d only by the flow of the cooling air that has been blown to the two upstream electronic components 10a and 10b and the temperature has increased. It is possible to prevent heat from being accumulated inside the electronic device 1 before being exhausted. As a result, the ambient temperature of the two downstream electronic components 10c and 10d between the two upstream electronic components 10a and 10b and the cooling fan 15 increases, and the two downstream electronic components 10c and 10c, 10d can be prevented from being affected. As a result, the heat dissipating structure of the electronic device with a simple structure and low cost can be obtained with the minimum necessary components constituting the electronic circuit main board 9 by appropriately arranging the components of the electronic circuit main board 9 and the appropriate openings. Can be provided.

[Second Embodiment]
(Constitution)
FIG. 5 shows the overall configuration of the heat dissipation structure of the electronic device 1 of the second embodiment. In FIG. 5, the same parts as those in FIG. In the electronic apparatus 1 according to the present embodiment, two cooling fans 21 that suck cooling air from the outside and blow the air into the outer casing 2 are arranged on the front panel 7 on the front surface of the outer casing 2. As a result, an intake portion 22 having two cooling fans 21 is formed on the front panel 7. Further, the rear panel 8 is formed with an exhaust portion 24 in which a plurality of exhaust holes 23 are formed.

  As a result, when the two cooling fans 21 are driven, cooling air is sucked into the outer casing 2 of the electronic device 1 from the two cooling fans 21 of the front panel 7, and the exhaust portions of the plurality of exhaust holes 23 of the rear panel 8. A cooling air is exhausted from the electronic device 1 to the outside of the electronic device 1 to form a heat dissipation structure of a forced air cooling fan that is exhausted.

(Function)
Next, the operation of the present embodiment having the above configuration will be described. When the electronic device 1 according to the present embodiment is used, among the cooling air flowing into the outer casing 2 of the electronic device 1 by driving the two cooling fans 21 of the front panel 7, a solid line arrow B1 in FIG. As shown, the cooling air flowing along the surface of the main board 9 is directly blown to the electronic components 10a and 10b on the upstream side. Therefore, the electronic components 10a and 10b on the upstream side can be efficiently cooled by the low-temperature cooling air drawn from the cooling fan 21 of the front panel 7. Thereby, the cooling air sucked into the outer casing 2 from the two cooling fans 21 of the front panel 7 flows along the surface of the electronic circuit main board 9, and the exhaust part 23 side of the plurality of exhaust holes 23 of the rear panel 8. A first flow path (first ventilation path) X1 is formed.

  Further, by driving the two cooling fans 21 of the front panel 7, a part of the cooling air flowing into the outer casing 2 of the electronic device 1 is part of the back surface of the main board 9, that is, the main board 9 and the chassis 3. It flows downstream through a gap S3 (see FIG. 3) with the bottom plate 5. At this time, the component of the cooling air flowing through the gap S3 between the main board 9 and the bottom plate 5 of the chassis 3 toward the partition plate 3a side of the power supply unit 12 as indicated by the dotted arrow B2-1 in FIG. It hits the partition plate 3a of the power supply unit 12 and bounces back. Therefore, the surface of the main board 9 from the narrow space S1 between the first notch 19 of the electronic circuit main board 9 and the partition plate 3a of the power supply unit 12 as indicated by a solid arrow B3-1 in FIG. It flows in a state of coming out to the side. At this time, the wind speed of the cooling air increases, and it becomes possible to directly cool the electronic component 10c on the downstream side directly with the cooling air in a low temperature state in which heat is not accumulated.

  Similarly, the component of the cooling air flowing in the gap S3 between the main board 9 and the bottom plate 5 of the chassis 3 toward the rectangular parallelepiped electronic component 13 as shown by the dotted arrow B2-2 in FIG. The electronic component 13 is bounced back. Therefore, as shown by a solid line arrow B <b> 3-2 in FIG. 5, the air flows from the narrow space S <b> 2 between the second notch portion 20 and the rectangular parallelepiped electronic component 13 to the surface of the main board 9. At this time, the wind speed of the cooling air increases, and it becomes possible to directly cool the electronic component 10d on the downstream side directly with the cooling air in a low temperature state in which heat is not accumulated.

  Thereby, the cooling air sucked into the outer casing 2 from the two cooling fans 21 of the front panel 7 flows along the back surface of the electronic circuit main board 9, and the first cutout portion 19 and the second cutout portion. A second flow path (second ventilation path) X2 that flows from 20 to the surface side of the electronic circuit main board 9 is formed. Therefore, in the electronic apparatus 1 of the present embodiment, the electronic components 10a and 10b arranged on the front side (the intake portion 22 side of the two cooling fans 21) on the electronic circuit main board 9 are provided in the first flow path. Cooling means 21 is provided which mainly cools with the cooling air flowing through X1 and cools the downstream electronic components 10c and 10d arranged on the exhaust portion 16 side mainly with the cooling air flowing through the second flow path X2. ing.

(effect)
Therefore, the above configuration has the following effects. In other words, in the present embodiment, the upstream electronic components 10 a and 10 b arranged on the intake circuit 22 side on the electronic circuit main board 9 inside the outer casing 2 of the electronic device 1 are the surfaces of the electronic circuit main board 9. The electronic components 10c and 10d on the downstream side disposed on the exhaust part 24 side flow along the back surface of the electronic circuit main board 9, and are cooled by the cooling air flowing through the first flow path X1 along the first flow path X1. Cooling means 21 for cooling with the cooling air of the second flow path X <b> 2 flowing from the cutout portion 19 and the second cutout portion 20 to the surface side of the electronic circuit main board 9 can be provided. For this reason, the cooling air blown to the two upstream electronic components 10a and 10b and whose temperature has risen passes around the two downstream electronic components 10c and 10d, and at the same time, the two upstream electronic components 10a and 10b. Cooling air in a low temperature state that does not pass can be blown to the two electronic components 10c and 10d on the downstream side for cooling. As a result, the two electronic components 10c and 10d on the downstream side are cooled only by the flow of the cooling air that is blown to the two electronic components 10a and 10b on the upstream side and the temperature rises. It is possible to prevent heat accumulation. As a result, the ambient temperature of the two electronic components 10c and 10d on the downstream side of the two electronic components 10a and 10b on the upstream side is increased, and the two electronic components 10c and 10d on the downstream side are prevented from being affected. can do. As a result, the heat dissipating structure of the electronic device with a simple structure and low cost can be obtained with the minimum necessary components constituting the electronic circuit main board 9 by appropriately arranging the components of the electronic circuit main board 9 and the appropriate openings. Can be provided.

  In the first embodiment, the case of exhaust by the front intake and the rear cooling fan and the case of intake by the front cooling fan and the rear exhaust in the second embodiment have been described. However, the present invention is not limited to this. It is not a thing. For example, it is possible to configure as intake by the rear cooling fan and front exhaust, or exhaust by the rear intake and front cooling fan.

  According to these embodiments, in order to efficiently cool the high heat generation components inside the electronic device, the structure is simply and low-cost with the minimum necessary configuration by the appropriate arrangement of the electric circuit components and the appropriate opening. A heat dissipation structure for an electronic device can be provided.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2 ... Outer casing, 5 ... Bottom plate, 7a ... Air intake hole, 9 ... Electronic circuit main board, 10a, 10b ... Two upstream electronic components (heat generating components), 10c, 10d ... Downstream 2 One electronic component (heat generating component), 13 ... rectangular parallelepiped electronic component, 14 ... intake portion, 16 ... exhaust portion, 19 ... first notch portion, 20 ... second notch portion, X1 ... first flow Road, X2 ... second flow path, 21 ... cooling means.

Claims (3)

An air intake portion in which an air intake hole for cooling air is formed on at least one wall surface of a box-shaped outer casing that houses an electronic device, and an air exhaust portion in which an air exhaust hole is formed on a wall surface other than the wall surface on which the air intake portion is formed, respectively Formed,
The outer casing is configured by shielding each surface other than the wall surface on which the intake portion is formed and the wall surface on which the exhaust portion is formed,
A heat dissipation structure for an electronic device in which an electronic circuit main board on which a plurality of heat generating components are mounted is disposed in a state of being horizontally disposed inside the outer casing,
The electronic circuit main board is provided with a notch in a part of the plate surface, and a rectangular parallelepiped module component in which the height from the bottom plate of the outer casing is higher than the height of the electronic circuit main board. Is placed,
A first flow path in which cooling air sucked into the outer casing from the wall surface on which the intake section is formed flows along the surface of the electronic circuit main board and flows toward the exhaust section;
Cooling air sucked into the outer casing from the wall surface on which the air intake portion is formed flows along the back surface of the electronic circuit main board, and flows from the notch to the front surface side of the electronic circuit main board. Forming a flow path,
The downstream heat generating component disposed on the exhaust portion side is cooled by cooling air flowing through the first flow path on the upstream side of the heat generating component disposed on the electronic circuit main board. A cooling means for cooling the electronic device with cooling air flowing through the second flow path is provided. The outer casing is further provided with a power supply unit for supplying power to the electronic circuit main board.
The electronic circuit main board is provided with a second notch in a portion corresponding to the storage portion of the power supply unit,
2. The heat dissipation structure for an electronic device according to claim 1, wherein a noise shielding partition plate for noise shielding between the electronic circuit main board and the power supply unit is disposed in the second cutout portion. . The electronic circuit main board is configured to guide a flow of cooling air flowing on a back surface side of the electronic circuit main board to the front surface side of the electronic circuit main board between the notch and the rectangular parallelepiped module component. The ventilation path is formed,
A second ventilation path is formed between the second notch and the noise shielding partition plate to guide the flow of cooling air flowing on the back side of the electronic circuit main board to the front side of the electronic circuit main board. The heat dissipation structure for an electronic device according to claim 2, wherein the heat dissipation structure is an electronic device.

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