TWI392997B - Cooling circulating system of server apparatus - Google Patents

Cooling circulating system of server apparatus Download PDF

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Publication number
TWI392997B
TWI392997B TW099138226A TW99138226A TWI392997B TW I392997 B TWI392997 B TW I392997B TW 099138226 A TW099138226 A TW 099138226A TW 99138226 A TW99138226 A TW 99138226A TW I392997 B TWI392997 B TW I392997B
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TW
Taiwan
Prior art keywords
side
airflow
server
air
fan module
Prior art date
Application number
TW099138226A
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Chinese (zh)
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TW201220029A (en
Inventor
Chien An Chen
Kai Yang Tung
Mao Ching Lin
Original Assignee
Inventec Corp
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Filing date
Publication date
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Priority to TW099138226A priority Critical patent/TWI392997B/en
Publication of TW201220029A publication Critical patent/TW201220029A/en
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Publication of TWI392997B publication Critical patent/TWI392997B/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades

Description

Server cooling cycle system

The present invention relates to a server cabinet, and more particularly to a server cooling cycle system.

In recent years, the rapid and vigorous development and expansion of the Internet, especially in some large enterprises, or the business premises of the Internet, etc., due to the expansion of business needs, the number of servers is increasing, resulting in the arrangement of servers. Management is more centralized to save space on the server. Because such a large number of densely packed servers and other devices are bound to cause excessive heat generation, resulting in unstable operation of the overall server system, this has always been an important problem that the data center must face.

Taking the data center as an example, in order to solve the problem of heat dissipation in a large number of server racks and in a closed machine room (for example, a container room), the current method is to configure a cooling air conditioning system in the equipment room to dissipate heat. When the number of servers is small, the cooling fan of the server itself is used for cooling and cooling. However, with the increasing number of servers in the cooling air-conditioning system, the cabinets are arranged more and more densely, and the cold air blown by the cooling air-conditioning system cannot flow to all parts of the equipment room at all, resulting in the hot air being easily concentrated in a specific area. Of course, it will cause instability of the server system.

The fan module inside the server rack is mounted on the top or the rear side of the rack. The fan module is installed on the top of the rack, and a plurality of cooling fans are installed on the top of the rack. The hot air inside the server rack is drawn to the outside. However, a typical server rack accommodates a plurality of servers and has a predetermined height. Therefore, during the process of drawing hot air by the cooling fan, the flow path of the hot air in the server is often blocked by a plurality of servers, so that the cooling fan can only discharge the hot air adjacent to the top of the server rack. However, there is no obvious pumping effect on the hot air at the bottom of the server rack, which causes hot air to accumulate at the bottom of the server cabinet, which seriously affects the performance of the server.

However, it is customary to install the fan module on the server frame on the rear side, and the airflow generated by the fan module passes through the passage between the respective server boards and is discharged from the front side of the frame. Although the accumulation of hot air at the bottom of the server rack can be avoided, the conventional fan module can prevent the hot air inside the server from being discharged to the outside world by guiding airflow or heat convection. The airflow generated by the fan module flows to the heat generating components on the motherboard or the motherboard of each server, which causes airflow to overflow around the inside of the server rack, and a stable flow field cannot be formed inside the server rack. Therefore, the heat dissipation of each server inside the server rack is uneven, which causes some servers to be easily damaged due to overheating of the temperature, thereby affecting the overall operating efficiency of the server rack.

The data center cooling system disclosed in U.S. Patent No. 7,511,960 is a closed loop cooling path for forming a plurality of server racks inside a container room to generate a stable flow field inside the container room. Cool and dissipate heat.

However, the cooling system disclosed in the Patent No. 7,511,960 must have a cold and hot passage in the interior of the container room to allow the flow field inside the container room to flow stably. As a result, the server racks that can be loaded in a single container room are relatively limited, and cannot be loaded to the maximum number, so that the overall operational efficiency of the data center cannot be improved, and more containers are forced. The machine room can smoothly install a predetermined number of server racks.

In view of the above problems, the present invention provides a cooling cycle system for a server, whereby the design of the conventional server cabinet cannot improve the average heat dissipation of each server, and the cold and hot channels inside the machine room occupy excessive use space, resulting in a single The maximum number of servers cannot be loaded in the equipment room, which causes problems such as heat dissipation performance and operational efficiency of the server cabinet or the equipment room.

The cooling cycle system of the server disclosed in the present invention comprises a cabinet assembly, a plurality of first fan modules, a plurality of second fan modules, and two air guiding hoods. The cabinet assembly has a plurality of racks connected in series, the first fan module is mounted on the rack, and a first airflow is blown toward the first direction, and the second fan module is installed on the machine. And a second air stream is blown toward the second direction. The air guiding hoods are respectively installed on the opposite ends of the cabinet assembly, and the two air guiding hoods respectively have at least one fluid passage.

The first airflow generated by the first fan module enters the fluid passage of one of the air ducts, and is connected to the second airflow generated by the second fan module, and the second airflow generated by the second fan module enters The fluid passage of the other air hood is coupled to the first airflow generated by the first fan module to form a cooling circuit.

The utility model has the advantages that the cabinet assembly of the server can form a cooling circulation loop through the design of the air guiding hood, and each cabinet assembly can be cooled and cooled by itself, and does not need to additionally design cold and hot passages in the equipment room. The effect of auto-circulation cooling can be achieved. Therefore, the maximum number of cabinet assemblies can be loaded in the equipment room for maximum operational efficiency.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

1 to 3 are a perspective view and a side view of a first embodiment of the present invention. As shown, the cooling cycle system of the server of the present invention includes a cabinet assembly 100 and a plurality of first The fan module 120, the plurality of second fan modules 130, the second air hood 140, a radiator 150, a circuit board 160, and a carrier tray 170.

The rack assembly 100 has a plurality of racks 110, and each rack 110 is a hollow frame body composed of a plurality of steel bars, steel plates and angle steels. The frame 110 has opposite and spaced first side faces 111 and The two sides 112 are configured to form an accommodation space inside the frame 110. Each of the racks 110 is sequentially connected in series to the cabinet assembly 100 with the first side 111 facing the second side 112 of the adjacent rack 110, and the plurality of sets of cabinet assemblies 100 are placed in the container room (not shown) Within the show, to form a data center.

In addition, an opening 113 is defined in the side of the frame 110, and the opening 113 communicates with the accommodating space, so that the inside of the gantry 110 can communicate with the outside through the opening 113.

The first side 111 of the rack 110 is further provided with a plurality of assembly frames 114. The assembly frame 114 is located in the accommodating space of the rack 110, and the entire first side 111 of each rack 110 is assembled. The side of the frame 114 and the entire second side 112 (ie, the other side of the assembly frame 114) are hollowed out, so that the first side 111 and the second side 112 form a large area of air/air inlet. It is used for the air/intake of the airflow of the fan modules 120 and 130. Each of the racks 110 is connected to the first side 111 of the adjacent rack 110 by the second side 112 thereof, so that the internal housing spaces of the adjacent racks 110 are connected to each other (as shown in FIG. 3). ).

The first fan module 120 and the second fan module 130 are placed in the assembly frame 114 of the rack 110 in a laterally mounted manner. The first fan module is further referred to as the first fan module. The first fan module 120 and the second fan module 130 can be stably oriented in the first direction D1 and the second direction, respectively, so that the first fan module 120 and the second fan module 130 are stably maintained on the frame 110. Airflow is blown in direction D2. The two air guiding hoods 140 are respectively disposed at the opposite ends of the cabinet assembly 100, that is, one of the air guiding hoods 140 is disposed on the first side 111 of the outer frame 110 of the cabinet assembly 100, and Another air hood 140 is disposed on the second side 112 of the other frame 110 on the outermost side of the cabinet assembly 100. The interior of the second air hood 140 is respectively provided with a fluid passage 141 for introducing an external airflow into the air hood 140 and guiding its flow direction.

In detail, the first fan module 120 of the embodiment is disposed in the assembly frame 114 of the upper half of the rack 110, and the first fan module 120 is configured to blow airflow toward a first direction D1. The two fan modules 130 are disposed in the assembly frame 114 of the lower half of the frame 110, and the second fan module 130 is configured to blow airflow toward a second direction D2. Therefore, the internal space of the cabinet assembly 100 can be roughly divided into upper and lower halves and independent airflow flow regions due to the positions of the first fan module 120 and the second fan module 130.

As shown in FIG. 1 to FIG. 3, the radiator 150 of the present invention is mounted on the first side 111 of the frame 110 (ie, the frame 110 is provided with the first fan module). 120 and the side of the second fan module 130), and located outside the rack 110, that is, the first fan module 120 and the second fan module 130 are interposed between the heat sink 150 and the second of the rack 110. Between the side faces 112, a plurality of heat dissipation holes 151 are formed on the heat sink 150.

The heat sink 150 of the present invention is disposed adjacent to the first fan module 120 and the second fan module 130, and the airflow blown by the first fan module 120 and the second fan module 130 is cooled by the heat sink 150, and The radiator 150 is connected to a cooling water for heat dissipation. Therefore, the heat sink 150 can effectively reduce the temperature of the airflow blown by the first fan module 120 and the second fan module 130, so that the temperature of the airflow blown into the rack 110 is not too high. In turn, the interior of the cabinet assembly 100 produces a good convection heat dissipation effect.

The carrier tray 170 of the present invention can be made of a metal material, and the circuit board 160 is placed on the carrier tray 170. The circuit board 160 slides in through the opening 113 as the carrier tray 170 is laterally directed from the respective chassis 110. And loaded in the accommodating space of the rack 110.

The circuit board 160 of the present invention can also be directly mounted in the rack 110 without the installation work by the carrier tray 170. However, in order to prevent the circuit board 160 from directly contacting the frame of the rack 110, the carrier tray 170 is not provided. The invention provides a good protection effect, and effectively prevents the circuit board 160 from being damaged by collision with the frame 110 due to external forces such as vibration.

Please refer to FIG. 1 to FIG. 3 , the first fan module 120 and the second fan module 130 are respectively electrically connected to the external power supply device, and the first fan modules 120 are oriented. The first direction D1 generates a first airflow, and passes through the first side 111 and the second side 112 of each rack 110 to traverse the upper half of the airflow flow area of the cabinet assembly 100, and the second fan module 130 faces the first The second direction D2 generates a second airflow that traverses the lower half of the airflow region of the cabinet assembly 100 through the first side 111 and the second side 112 of each of the racks 110.

At this time, the first airflow of the first fan module 120 is blown into one of the air guiding covers 140 (ie, the air guiding cover 140 installed on the first side 111 of the frame 110), and passes through the air guiding cover. The fluid passage 141 of the 140 is engaged with the second airflow of the second fan module 130, and the second airflow of the second fan module 130 is blown into the other air hood 140 (ie, the first of the racks 110) The air guiding cover 140) of the two side faces 112 and the fluid passage 141 of the air guiding cover 140 are engaged with the first air flow of the first fan module 120 to form a cooling circuit inside the cabinet assembly 100. .

The circulating airflow formed by the first airflow and the second airflow passes through the heat dissipation holes 151 of the heat sinks 150 and the first side surface 111 and the second side surface 112 of each of the racks 110, and is then blown into the respective racks 110. Circuit board 160. The circulating airflow is convectively dissipated with the circuit board 160 in the single rack 110, and then traverses through the circuit board 160 into the adjacent another rack 110 for heat dissipation.

It is to be noted that the number of the first fan module 120, the second fan module 130, and the assembly frame 114 of the rack 110 is plural, and the number of the heat sinks 150 is also plural. The optimal heat dissipation effect is provided to the cabinet assembly 100, and the number of the circuit boards 160 is also provided in plurality to enable the single cabinet assembly 100 to have maximum operational efficiency. The number of the components of the above-mentioned cabinet assembly 100 are mutually corresponding, and those skilled in the art can increase or decrease the number of components according to actual use requirements, and are not limited to the embodiments disclosed in the present invention.

FIG. 4 is a side view showing a second embodiment of the present invention. The specific structure of the second embodiment of the present invention is similar to that of the first embodiment. The first fan of the cabinet assembly 100 of the second embodiment of the present invention The arrangement positions of the module 120 and the second fan module 130 are slightly different from those of the first embodiment, and the differences between the two embodiments will be described below.

The first fan module 120 and the second fan module 130 of the second embodiment of the present invention are installed in the assembly frame 114 of the rack 110, as shown in FIG. The first fan module 120 and the second fan module 130 are disposed on the rack 110 in a staggered manner. In this embodiment, the two first fan modules 120 and the two second fan modules are used. The combination of 130 is described and is not limited by this amount. Each of the air guiding hoods 140 has two fluid passages 141 respectively corresponding to the combination of the first fan module 120 and the second fan module 130. The first airflow of the first fan module 120 is respectively blown into the two fluid passages 141 of the air guiding cover 140, and is connected to the second airflow of the second fan module 130, and the second fan module 130 is second. The airflow is blown into the two fluid passages 141 of the air hood 140 and is coupled to the first airflow of the first fan module 120 to form a two cooling circuit inside the cabinet assembly 100.

Therefore, by combining the first fan module 120 and the second fan module 130, the upper and lower half spaces inside the cabinet assembly 100 each constitute a complete and independent at least two cooling loops. It should be noted that, in this embodiment, the second fan module 130 is mounted on the top of the rack 110, and the first fan module 120 and the second fan module 130 are staggered, so that the cabinet assembly of the embodiment is The internal cooling circuit of 100 operates in a clockwise direction. However, those skilled in the art can also mount the first fan module 120 on the top of the rack 110, and the first fan module 120 and the second fan module 130 are staggered to cool the interior of the cabinet assembly 100. The circulation loops operate in a counterclockwise direction.

The design of the second embodiment of the present invention can greatly shorten the travel path of the circulating airflow formed by the two fan modules 120 and 130, so that the overall cooling performance of the cabinet assembly 100 is further improved.

Of course, the position of the first fan module 120 and the second fan module 130 of the present invention installed on the frame 110 can be changed, as shown in the side view of the third embodiment shown in FIG. 5. The first fan module 120 of the third embodiment is mounted on the top of the rack 110. Therefore, the cooling circuit of the upper half of the cabinet assembly 100 of the present embodiment operates in a counterclockwise direction, and the cabinet assembly 100 is in the lower half. The cooling circuit of the part operates in a clockwise direction. The design of the third embodiment of the present invention can also shorten the travel path of the circulating airflow formed by the two fan modules 120 and 130, so that the overall cooling performance of the cabinet assembly 100 is further improved.

In addition, the first fan module 120 and the second fan module 130 of the present invention may also change their installation positions, for example, on the carrier tray 170 or any suitable position of the rack 110. As long as the first fan module 120 and the second fan module 130 blow their airflow in different directions, it is not limited that the fan modules 120 and 130 must be loaded into the assembly frame 114 of the rack 110.

By combining the fan modules of the server and the air hood of the present invention, at least one cooling circulation loop is formed inside the cabinet assembly of the present invention, so that each cabinet assembly can be an independent module and can be respectively Perform a cooling operation of the autologous cycle.

Therefore, the present invention does not need to additionally design a cold and hot passage in the container room, and the use space of the container room can be most effectively utilized, and the maximum number of cabinet assemblies can be loaded inside the machine room to achieve maximum operational efficiency.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.

100. . . Cabinet assembly

110. . . frame

111. . . First side

112. . . Second side

113. . . Opening

114. . . Assembly box

120. . . First fan module

130. . . Second fan module

140. . . Wind shield

141. . . Fluid channel

150. . . heat sink

151. . . Vents

160. . . Circuit board

170. . . Carrier disk

D1. . . First direction

D2. . . Second direction

Figure 1 is an exploded perspective view of a first embodiment of the present invention.

Fig. 2 is a perspective view showing the first embodiment of the present invention.

Figure 3 is a side elevational view of the first embodiment of the present invention.

Figure 4 is a side elevational view of a second embodiment of the present invention.

Figure 5 is a side elevational view of a third embodiment of the present invention.

110. . . frame

111. . . First side

112. . . Second side

120. . . First fan module

130. . . Second fan module

140. . . Wind shield

141. . . Fluid channel

150. . . heat sink

D1. . . First direction

D2. . . Second direction

Claims (6)

  1. A cooling cycle system for a server includes: a cabinet assembly having a plurality of racks connected in series; a plurality of first fan modules respectively disposed on the racks and blowing toward a first direction a first airflow; a plurality of second fan modules respectively disposed on the racks and blowing a second airflow toward a second direction; and two air ducts respectively mounted on the cabinet assembly The two air guiding hoods respectively have at least one fluid passage, the first airflow enters the fluid passage of one of the air hoods, and is engaged with the second airflow, and the second airflow enters another The fluid passage of the air hood is engaged with the first air flow to form a cooling circuit.
  2. The cooling cycle system of the server of claim 1, wherein each of the frames has a first side and a second side, and the first side and the second side of each of the racks are hollowed out And the frame is connected in series to the cabinet assembly with the first side facing the adjacent second side of the frame.
  3. The cooling cycle system of the server of claim 2, wherein the first side of each of the racks further has a plurality of assembly frames, and the first fan modules and the second fan modules are respectively installed Located in the assembly boxes.
  4. The cooling cycle system of the server of claim 2, further comprising a plurality of heat sinks respectively mounted on the first side of each of the racks, and the first fan modules and the first fan modules The second fan module is interposed between the heat sink and the second side.
  5. The cooling cycle system of the server of claim 4, wherein the heat sinks respectively have a plurality of heat dissipation holes, and the first air flow and the second air flow pass through the heat dissipation holes, the first side, and the second The side enters the two fluid passages of the two air hoods.
  6. The cooling circulation system of the server of claim 1, wherein each of the air hoods has two fluid passages, the first airflow of the first fan modules and the second airflow of the second fan modules The air flow system enters the two fluid passages respectively to form two cooling circulation loops.
TW099138226A 2010-11-05 2010-11-05 Cooling circulating system of server apparatus TWI392997B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099138226A TWI392997B (en) 2010-11-05 2010-11-05 Cooling circulating system of server apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW099138226A TWI392997B (en) 2010-11-05 2010-11-05 Cooling circulating system of server apparatus
US13/158,644 US8526182B2 (en) 2010-11-05 2011-06-13 Cooling circulation system of server

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TW201220029A TW201220029A (en) 2012-05-16
TWI392997B true TWI392997B (en) 2013-04-11

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US20120111533A1 (en) 2012-05-10
US8526182B2 (en) 2013-09-03
TW201220029A (en) 2012-05-16

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