CN109845425B

CN109845425B - Electronic device

Info

Publication number: CN109845425B
Application number: CN201880001578.5A
Authority: CN
Inventors: 太田武志; 中岛雄二
Original assignee: Toshiba Corp; Toshiba Infrastructure Systems and Solutions Corp
Current assignee: Toshiba Corp; Toshiba Infrastructure Systems and Solutions Corp
Priority date: 2017-09-29
Filing date: 2018-04-03
Publication date: 2020-06-05
Anticipated expiration: 2038-04-03
Also published as: TWI673603B; CN109845425A; SG11201907198XA; WO2019064655A1; KR20190041964A; JP6400815B1; KR102168824B1; TW201921224A; JP2019067888A

Abstract

In an electronic apparatus according to an embodiment of the present invention, a guide member includes: a first guide member having a first bottom wall covering a side of the heat sink opposite to the first surface of the central processing unit, and two first side walls protruding from the first bottom wall to the first surface side and covering both sides of the heat sink in the second direction and constituting a first passage of air from a position facing the fan to the side of the heat sink opposite to the fan; and a second guide member having two second side walls facing the first bottom wall at a distance from each other on a side opposite to the first side wall and extending in a direction intersecting the first bottom wall, the two second side walls constituting a second passage of air extending curvedly from a position facing the fan to a position facing the auxiliary storage device.

Description

Electronic device

Technical Field

Embodiments of the present invention relate to an electronic device.

Background

Conventionally, there is known an electronic device including a case in which heat generating components such as a central processing unit and an auxiliary storage unit are housed, a fan mounted on the case, and a louver (guide member) housed in the case and guiding cooling air of the fan toward the heat generating components.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 11-177265

Disclosure of Invention

Problems to be solved by the invention

Such an electronic device is advantageous in that a new configuration can be obtained after improvement to further reduce the number of defects.

Means for solving the problems

An electronic device according to an embodiment includes a case, a fan, a central processing unit, a heat sink, an auxiliary storage device, and a guide member. The box body is provided with a first outer wall provided with an air suction port. The fan is mounted on the first outer wall and conveys air into the box body from the air suction port. The central processing unit is accommodated in the case and arranged in a first direction intersecting the first outer wall with the fan. The heat sink is mounted on the first surface of the central processing unit. The auxiliary memory device is accommodated in the case and arranged in a second direction intersecting the first direction with the central processing unit. The guide member is housed in the case, is aligned in a first direction with the fan, and has: a first guide member having a first bottom wall covering a side of the heat sink opposite to the first surface, and two first side walls protruding from the first bottom wall to the first surface side and covering both sides of the heat sink in the second direction and constituting a first passage of air from a position facing the fan to the side of the heat sink opposite to the fan; and a second guide member having two second side walls facing the first bottom wall at a distance from each other on a side opposite to the first side wall and extending in a direction intersecting the first bottom wall, the two second side walls constituting a second passage for air extending from a position facing the fan to a position facing the auxiliary storage device while curving.

Drawings

Fig. 1 is an exemplary and schematic top view of an electronic device according to an embodiment.

Fig. 2 is an exemplary and schematic exploded perspective view of a guide member of an electronic device according to an embodiment.

Fig. 3 is a YZ cross-sectional view of a guide member of an electronic apparatus according to an embodiment.

Fig. 4 is an XZ cross-sectional view of a guide member of an electronic apparatus according to an embodiment.

Detailed Description

Hereinafter, exemplary embodiments of the present invention are disclosed. The configuration of the embodiment described below and the operation and effect of the configuration are examples. In the present specification, the ordinal numbers are used only for distinguishing the components and the members, and do not indicate the order or the priority.

Fig. 1 is an exemplary and schematic top view of an electronic device 1. In the following drawings, three directions orthogonal to each other are defined for convenience. The X direction is along the depth direction (longitudinal direction) of the casing 3 and the guide member 2, the Y direction is along the width direction (short-side direction) of the casing 3 and the guide member 2, and the Z direction is along the height direction (thickness direction) of the casing 3 and the guide member 2. The X direction is an example of the first direction, and the Y direction is an example of the second direction. In the following description, the positive side (the tip side of the arrow) in each of the X direction, the Y direction, and the Z direction is referred to as one side, and the negative side is referred to as the other side.

As shown in fig. 1, the electronic apparatus 1 includes a casing 3, a guide member 2, a fan unit 4, a substrate 5, an auxiliary storage device 6, a power supply device 7, a RAID (redundant arrays of independent disks) module 11, an expansion module 15, an external storage device 16, and the like. The electronic apparatus 1 is a rack-mount type industrial computer. The electronic device 1 is not limited to this example, and may be configured as various electronic devices 1 such as a desktop personal computer, a video display device, a television receiver, a game machine, a video display control device, and an information storage device.

The case 3 is formed into a box shape of a rectangular parallelepiped flat in the Z direction. The box 3 includes a plurality of wall portions such as a bottom wall 3a, a top wall 3b (see fig. 3), a front wall 3c, a left wall 3d, a rear wall 3e, and a right wall 3 f.

The bottom wall 3a and the top wall 3b each extend in a direction (XY plane) orthogonal to the Z direction, and are arranged in parallel with each other with a space therebetween in the Z direction. The bottom wall 3a is provided with a support portion for supporting the casing 3 in a state separated from a placement portion such as a shelf, a table, or a placement table, not shown. The top wall 3b covers a housing portion of the box 3 enclosed by the bottom wall 3a, the front wall 3c, the left wall 3d, the rear wall 3e, and the right wall 3 f.

The front wall 3c and the rear wall 3e each extend in a direction (YZ plane) orthogonal to the X direction, and are provided in parallel to each other with a space therebetween in the X direction. The front wall 3c is located between the other end of the bottom wall 3a in the X direction and the other end of the top wall 3b in the X direction, and the rear wall 3e is located between one end of the bottom wall 3a in the X direction and one end of the top wall 3b in the X direction. The front wall 3c is provided with an inlet port 3 r. The air inlet 3r is positioned on the other side of the front wall 3c in the Y direction, i.e., in the vicinity of the left wall 3d, and penetrates the front wall 3c in the X direction. The front wall 3c is an example of a first outer wall.

Further, the auxiliary storage device 6 and a plurality of openings through which the other end portion of the external storage device 16 in the X direction is exposed are provided on one side of the front wall 3c in the Y direction, that is, on the side opposite to the air inlet 3 r. The plurality of openings are arranged in the Z direction with a space therebetween. The auxiliary storage device 6 and the external storage device 16 are fixed to the front wall 3c in a state of being inserted into the respective openings.

Further, the rear wall 3e is provided with a plurality of exhaust ports 3 k. The exhaust port 3k is aligned with the RAID module 11, the

heat sinks

9 and 14 provided on the substrate 5, and heat generating components such as the power circuit component 10, the expansion module 15, and the power supply device 7 in one direction in the X direction. The air outlet 3k can discharge the air flow heat-exchanged with these heat generating components by a fan unit 4 described later.

Each of the left wall 3d and the right wall 3f extends in a direction (XZ plane) orthogonal to the Y direction, and is provided in parallel with each other with a space therebetween in the Y direction. The left wall 3d is located between the other end of the bottom wall 3a in the Y direction and the other end of the top wall 3b in the Y direction, and the right wall 3f is located between one end of the bottom wall 3a in the Y direction and one end of the top wall 3b in the Y direction. The left wall 3d is located between the other end of the front wall 3c in the Y direction and the other end of the rear wall 3e in the Y direction, and the right wall 3f is located between one end of the front wall 3c in the Y direction and one end of the rear wall 3e in the Y direction. The left wall 3d is an example of the second outer wall.

The fan unit 4 is mounted on the inner side of the front wall 3 c. The fan unit 4 is fixed to the front wall 3c in a state of being inserted into the air inlet 3 r. The fan unit 4 has a fan 41 rotatable about a rotation axis extending in the X direction. The fan 41 is an intake fan that takes in air (outside air) outside the casing 3 into the casing 3. The fan unit 4 is not limited to this example, and may be attached to the outside of the front wall 3 c.

The substrate 5 is positioned in the other side of the Y direction in the case 3. The substrate 5, the air inlet 3r, and the fan 41 are arranged in one direction in the X direction. The substrate 5 extends parallel to the bottom wall 3a and is formed in a rectangular plate shape elongated in the X direction. The substrate 5 has an upper surface 5a parallel to the bottom wall 3a on the side opposite to the bottom wall 3 a. The substrate 5 may also be referred to as a main substrate, a first substrate, a circuit substrate, a control substrate, or the like.

A plurality of electronic components such as the cpu 8, the power circuit component 10, and a PCH13(platform controller hub) are mounted on the upper surface 5a of the board 5. The wiring in the substrate 5 and these electronic components constitute a control circuit of the electronic apparatus 1.

The cpu 8 has an upper surface 8a parallel to the upper surface 5a of the substrate 5 on the side opposite to the substrate 5. A heat sink 9 is attached to an upper surface 8a of the cpu 8. The cpu 8, the radiator 9, and the fan 41 are arranged in the X direction. The cpu 8 and the radiator 9 are separated from the fan 41 in one direction in the X direction. The heat sink 9 has a plurality of fins arranged in the X direction and the Y direction with a gap therebetween. The upper surface 8a is an example of a first surface.

In addition, PCH13 is also aligned with fan 41 in the X direction. PCH13 is further separated from fan 41 in the X direction than central processing unit 8 and radiator 9. The power supply circuit unit 10 is provided close to the cpu 8 and the heat sink 9 in one of the Y directions.

The guide member 2 is fixed to the substrate 5 or the case 3 so as to cover the heat sink 9 from the side opposite to the upper surface 8a of the cpu 8, i.e., from one side in the Z direction. The guide member 2 and the auxiliary storage device 6 are arranged in the other Y direction. The guide member 2 is configured to be able to divide the cooling air from the fan 41 into at least a first airflow W1 for the radiator 9, a second airflow W2 for the auxiliary storage device 6, and a third airflow W3 for the power circuit component 10 (see fig. 3).

The auxiliary storage device 6 is positioned in one of the Y directions and the other of the X directions in the casing 3. The auxiliary memory device 6, the cpu 8, and the heat sink 9 are arranged in one of the Y directions. The auxiliary storage device 6 is an HDD (hard disk drive), SSD (solid state drive), or the like. In the present embodiment, two auxiliary storage devices 6 are stacked in the Z direction with a space therebetween. At least a part of the second air flow W2 passes through the gap between the two auxiliary storage devices 6, and is discharged to the outside of the case 3 from an exhaust port or the like provided on the flange-like exposed surface of the auxiliary storage device 6 exposed to the front wall 3 c. In the present embodiment, the auxiliary storage device 6 is located on one side in the Y direction on the front wall 3c side of the substrate 5, but may be located on the other side in the Y direction on the front wall 3c side of the substrate 5, or may be located on one side in the Y direction on the rear wall 3e side of the substrate 5 or on the other side in the Y direction on the rear wall 3e side of the substrate 5.

The external storage devices 16 are stacked with a space in one Z direction of the auxiliary storage device 6. The external storage device 16 is an ODD (optical disk drive) or the like. At least a part of the second air flow W2 also passes through a gap or the like between the external storage device 16 and the auxiliary storage device 6, and is discharged from the front wall 3c side.

The RAID module 11 is located in the other Y direction and one X direction in the enclosure 3. The RAID module 11 and at least a part of the fan 41 (the other end in the Y direction) are arranged in one of the X directions. The RAID module 11 has a substrate 11a disposed in parallel with the left wall 3d with a slit. As can also be seen from fig. 1, the base plate 11a partitions the space in the case 3 between the bottom wall 3a and the top wall 3b in the Y direction.

The controller 11b of the RAID module 11 is provided on a surface 11a1 of the board 11a facing the left wall 3d of the disk 3. Further, a heat sink 11c is provided on the side of the controller 11b opposite to the substrate 11 a. The substrate 11a may also be referred to as a submount, a second substrate, or the like.

The power supply device 7 is positioned in one of the Y direction and the X direction in the case 3. The power supply device 7 and the auxiliary storage device 6 are arranged in one of the X direction and the Y direction with respect to the substrate 5. In addition, the power supply device 7 has a fan unit 71. In the present embodiment, the fan 72 of the fan unit 71 generates an air flow that draws in at least a part of the second air flow W2 into the power supply device 7 and discharges the air flow from one side of the power supply device 7 in the X direction.

Fig. 2 is an exploded perspective view of the guide member 2. As shown in fig. 2, the guide member 2 includes a lower guide 21 and an upper guide 22. The upper guide 22 is positioned on one side of the lower guide 21 in the Z direction. The lower guide 21 is provided with a hook portion 21f protruding in one direction in the Z direction, and the upper guide 22 is provided with an opening 22r through which the hook portion 21f passes. The lower guide 21 and the upper guide 22 are detachably coupled to each other by so-called snap-fit engagement formed by hooking the hook 21f2 of the hook portion 21f and the edge portion 22r1 of the opening 22 r. The lower guide 21 is an example of a first guide, and the upper guide 22 is an example of a second guide.

The lower guide 21 has a bottom wall 21a,

side walls

21b, 21c, a wiring holding portion 21d, a hook portion 21f, and a mounting piece 21 g. The bottom wall 21a covers one side of the heat sink 9 (see fig. 3) in the Z direction, that is, the side opposite to the upper surface 8a of the cpu 8. The bottom wall 21a is substantially parallel to one end surface (XY plane) of the heat sink 9 in the Z direction. The bottom wall 21a is an example of a first bottom wall, and is also referred to as an upper wall, a first covering portion, and the like.

The

side walls

21b and 21c protrude from the bottom wall 21a toward the upper surface 8a of the cpu 8, which is the other side in the Z direction, and cover both sides of the heat sink 9 (see fig. 3) in the Y direction. The

side walls

21b and 21c are arranged substantially in parallel with each other at a distance from each other in the Y direction. The

side walls

21b and 21c are substantially parallel to end surfaces (XZ plane) on both sides of the heat sink 9 in the Y direction. The

side walls

21b, 21c and the bottom wall 21a constitute a first passage P1 of the guide member 2. The

side walls

21b and 21c are an example of the first side wall, and are also referred to as a second covering portion. The first path P1 is also referred to as a lower path or the like. The

side walls

21b and 21c are inclined so as to gradually widen on both sides in the Y direction as they go to the other side in the Z direction. In the present embodiment, with such a configuration (shape), the insertion of the heat sink 9 into the first passage P1 is improved.

As shown in fig. 2, the bottom wall 21a is provided with a plurality of

recesses

21r and 21 s. The

recesses

21r, 21s are open in one Z direction and recessed in the other Z direction. The recess 21r is provided at the center of the bottom wall 21a in the Y direction. The recess 21r extends from the other end of the bottom wall 21a in the X direction toward one end in the X direction. The recess 21s is located on one side of the recess 21r in the X direction, and is provided across the side wall 21b and one end of the recess 21r in the X direction. The depth of the recess 21s is deeper than the depth of the recess 21 r.

The wiring holding portions 21d are provided at the corners of the bottom wall 21a at two positions in the X direction. The wiring holding portions 21d are rotatably supported via rotary shafts 21e extending from the bottom wall 21a toward one side in the Z direction. That is, the wire holding portion 21d can adjust the mounting angle around the rotation axis 21 e. The wiring holding unit 21d can hold the wiring and the like that electrically connects the auxiliary storage device 6 and the RAID module 11 in a posture intersecting the rotation axis 21 e.

The hook portions 21f are provided on both sides in the Y direction via the recess 21r of the bottom wall 21 a. The hook portions 21f have projections 21f1 and hooks 21f2, respectively. The projecting portion 21f1 projects from the bottom wall 21a in one direction in the Z direction. The hooks 21f2 protrude in a direction to approach each other from the end of the protruding portion 21f1 on the side opposite to the bottom wall 21a, i.e., from a position away from the bottom wall 21 a. The hook portion 21f is also referred to as a first hook portion or the like, and the hook 21f2 is also referred to as a claw or the like.

The mounting pieces 21g are provided at three positions other than one of the Y direction and the other of the X direction in the four corners of the

side walls

21b, 21c of the lower guide 21. The mounting piece 21g protrudes from the

side walls

21b, 21 c. The mounting pieces 21g are provided with protrusions 21h into which a fastening member such as a screw is inserted. The lower guide 21 is attached to the case 3 by being coupled to the base plate 5 by a coupling member penetrating through the three protrusions 21 h. The mounting pieces 21g are not limited to this example, and may be provided at four corners of the lower guide 21, or may be provided at two positions on a diagonal line among the four corners of the lower guide 21.

The upper guide 22 has a bottom wall 22a,

side walls

22b, 22c, a deflector 22g, and a protruding wall 22 h. The bottom wall 22a overlaps one side of the bottom wall 21a of the lower guide 21 in the Z direction, i.e., the side opposite to the

side walls

21b and 21 c. The bottom wall 22a extends substantially parallel to the bottom wall 21a (XY plane). The bottom wall 22a is curved in one of the Y directions so as to approach the auxiliary storage device 6 from the other end in the X direction toward the one end in the X direction. The bottom wall 22a is an example of a second bottom wall, and is also referred to as a lower wall or the like. The upper guide 22 is not limited to this example, and the bottom wall 22a may be provided on the side opposite to the bottom wall 21a of the

side walls

22b and 22c, that is, on one side in the Z direction, or may be provided on both sides in the Z direction.

The bottom wall 22a has a contact region 22a1 and a separation region 22a 2. The contact region 22a1 is a region (portion) of the bottom wall 22a that is in contact with the bottom wall 21a, and the separation region 22a2 is a region (portion) of the bottom wall 22a that provides the gap 30 between the bottom wall 21a and the

recesses

21r, 21 s. The slit 30 constitutes a first section P31 that is a part of the third passage P3 of the guide member 2. The first section P31 is surrounded by the

bottom walls

21a and 22a, and extends substantially in an L shape between the inlet end 30a facing the fan 41 and the outlet end 30b facing the protruding wall 22 h. The third path P3 is also referred to as a middle path or the like.

In addition, two openings 22r through which the protruding portions 21f1 of the hook portions 21f penetrate are provided in the contact region 22a1 of the bottom wall 22 a. Further, a step slightly protruding in one direction in the Z direction from the bottom wall 22a is provided at the edge portion 22r1 of the opening 22 r. In the present embodiment, the step is hooked to the hooking 21f2 in an elastically deformed state, thereby suppressing relative movement (rattling or the like) of the upper guide 22 with respect to the lower guide 21 due to vibration or the like.

The

side walls

22b and 22c protrude from an end (side) of the bottom wall 22a in one direction in the Z direction, and face each other with a space therebetween. In addition, the

side walls

22b, 22c are curved along the bottom wall 22a from an inlet end 22x facing the fan 41 to an outlet end 22Y facing the auxiliary storage 6 and extend in one of the Y directions. The

side walls

22b, 22c and the bottom wall 22a constitute a second passage P2 of the guide member 2. The

side walls

22b and 22c exemplify second side walls. The second path P2 is also referred to as an upper path or the like.

The deflector 22g is provided in the vicinity of the outlet end 22y in the second passage P2. The offset portion 22g protrudes from the bottom wall 22a in one direction in the Z direction, and includes a plurality of fins arranged in the X direction with a slit therebetween. The fins of the offset portion 22g are inclined so as to approach the other side in the X direction from the side opposite to the exit end 22y of the second passage P2 toward the exit end 22 y. In the present embodiment, with such a configuration, the second air flow W2 discharged from the outlet end 22y is directed toward the heat generating portion of the auxiliary storage device 6.

The protruding wall 22h protrudes from the bottom wall 22a toward the other side in the Z direction, i.e., the power circuit component 10 (see fig. 3). The protruding wall 22h is provided on the opposite side of the bottom wall 22a from the deflecting portion 22 g. The projecting wall 22h is formed in a substantially U shape that is open toward the side wall 21b in an XY cross section orthogonal to the Z direction.

Fig. 3 is a YZ sectional view of the guide member 2. As shown in fig. 3, in the present embodiment, the side wall 21b is covered with the projecting wall 22h, and a gap 31 is provided between the side wall 21b and the projecting wall 22 h. The slit 31 faces the outlet end 30b of the first section P31. The slit 31 constitutes a second section P32 of the third passage P3. The second section P32 communicates with the first section P31, extending between the inlet end facing the outlet end 30b and the outlet end 22z facing the power circuit part 10. Therefore, according to the present embodiment, the cooling air (third air flow W3) from the fan 41 can be supplied to the power circuit component 10 through the first section P31 and the second section P32 by the third passage P3.

The guide member 2 is disposed in a state where the

side walls

21c and 22c on the opposite side of the auxiliary storage device 6, that is, the

side walls

21c and 22c near the left wall 3d are separated from the left wall 3d, among the

side walls

21b, 21c, 22b, and 22 c. In the present embodiment, with such a configuration, the fourth passage P4 is provided between the left wall 3d and the

side walls

21c and 22 c. The fourth path P4 extends in the X direction.

The inlet end of the fourth passage P4 (the

side walls

21c and 22c) faces the other side of the fan 41 in the Y direction. In other words, the guide member 2 is located at a position shifted in one direction in the Y direction with respect to the axial center of the fan 41. Therefore, the cooling air (fourth air flow) from the fan 41 flows into the fourth passage P4, and the heat sink 11c, the controller 11b, and the like of the RAID module 11, which is a heat generating component disposed in the fourth passage P4, can be cooled.

Fig. 4 is an XZ sectional view of the guide member 2. As shown in fig. 4, the radiator 9 and the cpu 8 are accommodated in the first passage P1. The first passage P1 extends in the X direction between an inlet end 21X facing the other side of the Z direction of the fan 41 and an outlet end 21y facing the opposite side of the heat sink 9 from the fan 41. Therefore, the first air flow W1 flowing into the first passage P1 from the inlet end 21x is discharged from the outlet end 21y via the radiator 9 and the cpu 8, and the radiator 9 and the cpu 8 are thereby cooled.

In addition, in a state where the guide member 2 is housed in the case 3, the other side in the Z direction of the first passage P1 is covered with the substrate 5, the bottom wall 3a, and the like. Specifically, the first passage P1 is surrounded by the bottom wall 21a and the

side walls

21b and 21c of the lower guide 21, and the base plate 5. In the present embodiment, with such a configuration, leakage of the first air flow W1 flowing through the first passage P1 is suppressed, and the cooling performance of the radiator 9 and the cpu 8 accommodated in the first passage P1 is improved.

Further, the first passage P1 is provided with a slope 21 k. The inclined surface 21k is provided on the bottom wall 21a on the side opposite to the recess 21 s. The inclined surface 21k is located closer to the fan 41 than the center position C in the X direction of the heat sink 9. The inclined surface 21k is inclined so as to approach the heat sink 9 as it is distant from the fan 41 in one direction in the X direction. In the present embodiment, with such a configuration, the flow velocity of the first air flow W1 near the center position C of the radiator 9 is increased. Therefore, according to the present embodiment, the cooling effect by the first air flow W1 can be improved near the center position C where the temperature is most likely to increase in the radiator 9 and the central processing unit 8.

The second path P2 extends curvedly from the inlet end 22x facing one side in the Z direction of the fan 41 toward the auxiliary storage device 6. In the second passage P2, one side in the Z direction is closed by the ceiling wall 3b in a state where the guide member 2 is housed in the case 3. That is, the second passage P2 is surrounded by the bottom wall 22a, the

side walls

22b, 22c, and the top wall 3b of the upper guide 22. In the present embodiment, with such a configuration, leakage of the second air flow W2 flowing through the second passage P2 is suppressed, and the cooling performance of the auxiliary storage device 6 cooled from the fan 41 via the second passage P2 is improved. The ceiling wall 3b is not limited to this example, and may cover the second passage P2 with a gap from the

side walls

22b and 22 c.

As described above, in the present embodiment, the guide member 2 has the lower guide 21 (first guide) and the upper guide 22 (second guide), wherein the lower guide 21 (first guide) has the bottom wall 21a (first bottom wall) covering the side of the heat sink 9 opposite to the upper surface 8a (first surface) of the cpu 8, and the two

side walls

21b and 21c (first side walls) protruding from the bottom wall 21a to the upper surface 8a side and covering both sides of the heat sink 9 in the Y direction and constituting the first passage P1 of air from the position facing the fan 41 to the side of the heat sink 9 opposite to the fan 41, the upper guide 22 (second guide) has the two

side walls

22b and 22c (second side walls) facing each other with a space on the side of the bottom wall 21a opposite to the

side walls

21b and 21c and extending in the direction intersecting the bottom wall 21a, the two

side walls

22b and 22c (second side walls) form a second passage P2 of air that extends curvedly from a position facing the fan 41 to a position facing the auxiliary storage device 6. With this configuration, the guide member 2 can be obtained which can improve the cooling performance of each of the heat sink 9 and the auxiliary storage device 6 arranged in the Y direction in the casing 3. Further, the lower guide 21 or the upper guide 22 of the guide member 2 is commonly used in a plurality of electronic apparatuses 1 having different specifications such as the layout of each member, and thus the man-hours and cost required for manufacturing the electronic apparatus 1 may be reduced.

In the present embodiment, the lower guide 21 and the upper guide 22 form a third passage P3 which includes a first section P31 formed by the gap 30 between the bottom wall 21a and the separation region 22a2, a second section P32 communicated with the first section P31 and formed by the gap 31 between the protruding wall 22h and the side wall 21b, and air extending from a position facing the fan 41 to a position facing the power circuit component 10. With this configuration, the temperature rise of the power supply circuit component 10 can be more reliably suppressed than in a configuration in which the third path P3 is not provided. Further, according to the present embodiment, as compared with a configuration in which members forming passages are provided so as to correspond to the respective heating elements, the number of manufacturing steps and cost can be further reduced, and the number of members can be further reduced, or the configuration can be further made compact.

In the present embodiment, the upper guide 22 is provided with an opening 22r penetrating the bottom wall 22a, and the lower guide 21 includes a protrusion 21f1 protruding from the bottom wall 21a and penetrating the opening 22r, and a hook 21f2 provided at a position apart from the bottom wall 21a of the protrusion 21f1 and detachably hooked to the edge 22r1 of the opening 22 r. According to such a configuration, since the upper guide 22 can be detached from the lower guide 21, maintenance and the like of the respective components of the box body 3 can be performed more easily or smoothly. Specifically, there is an advantage that maintenance and the like of other components can be performed in a state where the radiator 9 in the first passage P1 holding the lower guide 21 is cooled by the cooling air of the fan 41. In addition, since the worker can operate the snap-fit from the side opposite to the lower guide 21, the worker can more easily remove the upper guide 22 from the lower guide 21.

In the present embodiment, the bottom wall 21a has the inclined surface 21k which is located closer to the fan 41 than the center position C of the heat sink 9 in the X direction and which is closer to the heat sink 9 as it is farther from the fan 41. With this configuration, the flow velocity of the first air flow W1 flowing through the first passage P1 can be increased near the center position C of the radiator 9. Therefore, according to the present embodiment, the cooling effect by the first air flow W1 can be improved near the center position C where the temperature is most likely to increase in the radiator 9 and the central processing unit 8. Further, since the cooling air flowing along the bottom wall 21a of the first passage P1 can be guided to the radiator 9, the cooling air can be suppressed from passing through the first passage P1 without exchanging heat with the radiator 9, and the radiator 9 and the cpu 8 can be cooled more efficiently.

In the present embodiment, the guide member 2 is disposed in a state where the side wall 21c near the left wall 3d (second outer wall) of the two

side walls

21b and 21c is separated from the left wall 3d, and a fourth passage P4 of air extending in the X direction from a position facing the fan 41 is provided between the left wall 3d and the side wall 21 c. With this configuration, compared to the configuration in which the fourth path P4 is not provided, the temperature rise of the RAID module 11, which is a heat generating component, disposed in the fourth path P4 can be more reliably suppressed. Further, according to the present embodiment, as compared with a configuration in which members forming passages are provided so as to correspond to the respective heating elements, the number of manufacturing steps and cost can be further reduced, and the number of members can be further reduced, or the configuration can be further made compact.

In the present embodiment, the case where the cooling target cooled by the fourth path P4 is the RAID module 11 is illustrated, but the present embodiment is not limited to this example, and may be an expansion module 15 or the like. The cooling target cooled by the second passage P2 may be the expansion module 15 or the like. In this way, the cooling targets of the first passage P1, the second passage P2, the third passage P3, and the fourth passage P4 of the guide member 2 can be variously changed according to the layout of the respective members.

The embodiments of the present invention have been described above, but the above embodiments are merely examples and are not intended to limit the scope of the present invention. The above embodiments may be implemented in other various forms, and various omissions, substitutions, combinations, and changes may be made without departing from the spirit of the invention. The above embodiments are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof. The present invention can be realized by a configuration other than the configurations disclosed in the above embodiments, and various effects (including derivative effects) obtained by the basic configuration (technical features) can be obtained. The specification (structure, type, direction, shape, size, length, width, thickness, height, number, arrangement, position, material, and the like) of each component can be modified as appropriate.

Claims

1. An electronic device is provided with:

a case having a first outer wall provided with an air suction port;

a fan mounted on the first outer wall and configured to supply air from the air inlet into the case;

a central processing unit housed in the case and arranged in a first direction intersecting the first outer wall with the fan;

a radiator mounted on a first surface of the central processing unit;

an auxiliary storage device housed in the case and arranged in a second direction intersecting the first direction with the central processing unit; and

a guide member housed in the case and aligned with the fan in the first direction,

the guide member has:

a first guide member having a first bottom wall covering a side of the heat sink opposite to the first surface, and two first side walls protruding from the first bottom wall to the first surface side and covering both sides of the heat sink in the second direction, and constituting a first passage of air from a position facing the fan to the side of the heat sink opposite to the fan; and

and a second guide member having two second side walls facing the first bottom wall at a distance from each other on a side opposite to the first side wall and extending in a direction intersecting the first bottom wall, the two second side walls constituting a second passage of air extending from a position facing the fan to a position facing the auxiliary storage device while curving.

2. The electronic device according to claim 1, comprising:

a power circuit unit housed in the case and arranged in the second direction with the central processing unit,

the second guide member has a second bottom wall having a contact region overlapping with the first bottom wall on a side opposite to the first side wall and being in contact with the first bottom wall, and a separation region provided with a gap between the second bottom wall and the first bottom wall, and a protruding wall protruding from the second bottom wall toward the power supply circuit part,

the first guide and the second guide constitute a third passage including a first section including a gap between the first bottom wall and the separation region, a second section communicating with the first section and including a gap between the protruding wall and the first side wall, and air extending from a position facing the fan to a position facing the power circuit member.

3. The electronic device of claim 2,

the second guide member is provided with an opening portion penetrating the second bottom wall,

the first guide includes a protruding portion protruding from the first bottom wall and penetrating the opening, and a hook provided at a position of the protruding portion away from the first bottom wall and detachably hooked to an edge portion of the opening.

4. The electronic device of any of claims 1-3,

the first bottom wall has an inclined surface that is located in the vicinity of the fan as compared to a central position of the heat sink in the first direction and that approaches the heat sink as it is farther from the fan.

5. The electronic device of any of claims 1-3,

the case has a second outer wall located at an opposite side of the guide member from the auxiliary storage,

the guide member is disposed in a state where one of the two first side walls near the second outer wall is separated from the second outer wall,

a fourth passage for air extending in the first direction from a position facing the fan is provided between the second outer wall and one of the first side walls.