JP7121099B2 - Heat dissipation mechanism and device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation mechanism including a heat generating component and a heat dissipation member.

The power consumption of wireless routers tends to increase as the communication speed increases. On the other hand, small routers are gaining acceptance in the market due to their space-saving design and installation location. A wireless router may have a structure in which a heat sink made of an aluminum plate or the like is brought into contact with a chip mounted on a substrate via a thermally conductive component to cool the chip.

This structure allows the heat generated by the chips on the substrate to be released through the heat radiation holes provided at the top and bottom of the housing, thereby cooling the inside of the housing. If there is no further component to cover the substrate in the housing, the heat radiation hole cannot be made larger than the size determined by the necessity of safety measures such as measures against insect damage to prevent entry of insects. Therefore, in general, by adding the above-mentioned parts that cover the board, the heat dissipation holes in the housing are increased to increase the flow rate of the air flowing to the heat sink for cooling, and to achieve efficient cooling. there is The components covering the substrate described above are provided with holes for heat radiation determined from safety measures such as pest control, so that the chip and substrate can be cooled.

FIG. 1 is a conceptual diagram showing the configuration of an electronic device 80, which is an example of an electronic device having the structure described above. The electronic device 80 includes a housing 70 , a substrate 20 , a heat-generating component 30 , and an internal housing cover 60 . A heat-generating component 30 installed on the substrate 20 is in contact with the heat sink 10 . The housing inner cover 60 covers the combination of the substrate 20 and the heat generating component 30 together with the left side surface of the housing 70 . A hole 51a and a hole 51b are formed in the lower portion 69 and the upper portion 68 of the housing inner cover 60, respectively. Holes 51 a and 51 b are significantly smaller holes when compared to hole 52 a formed in lower portion 79 and hole 52 b formed in upper portion 78 of housing 70 .

A space 91 surrounded by the side surfaces of the housing inner cover 60 and the housing 70 is formed around the substrate 20 and the heat-generating components 30 installed thereon. Inside the housing 70 , a space 92 is also formed outside the housing inner cover 60 .

The air warmed by the heat emitted from the heat-generating component 30 and the left side surface of the radiator plate 10 to the space 91 is emitted to the outside from the holes 51b and 52b by the air flowing into the space 91 from the holes 52a and 51a. On the other hand, the air warmed by the heat emitted from the right side of the radiator plate 10 into the space 92 is emitted outside through the holes 52b by the air flowing into the space 92 through the holes 52a.

In the electronic device 80, the heat-generating component 30 is cooled as described above, and heat generation is suppressed.

2 to 4 are conceptual diagrams showing specific examples of the electronic device 80 in FIG. FIG. 2 is an exploded view of the electronic device 80. As shown in FIG. FIG. 3 is an assembly drawing of the electronic device 80. As shown in FIG. 2, the illustration of the stand 99 in FIG. 3 is omitted. FIG. 4 shows a configuration in which the second housing section 72 and the stand 99 are removed from the configuration of FIG.

Heat-generating component 30 is a set of three heat-generating components. 3 and 4, the heat transfer component 40 of FIG. 2 is in contact with both the heat generating component 30 and the radiator plate 10 and sandwiched between them. In this state, the heat generated by the heat-generating component 30 is transferred to the radiator plate 10 through the heat-transfer component 40 . The convex portion 15 of the heat sink 10 is a portion that protrudes toward the heat transfer component 40 and presses the heat transfer component 40 against the heat generating component 30 in the state shown in FIGS. 3 and 4 . In the housing 70 of FIG. 3, the portion surrounded by the housing inner cover 60 and the first housing section 71 of FIGS. 2 and 4 corresponds to the space 91 of FIG. 3 corresponds to the space 92 in FIG. 1, except for the part corresponding to the space 91 in FIG.

Here, Patent Literature 1 discloses an electric device in which a heat sink having radiation fins and a heat-generating first electric component is attached, and a heat-generating second electric component are housed in a housing.

In addition, Patent Document 2 discloses a power conversion electronic device in which a plurality of electronic devices including an inverter and a radiator are provided in a housing, and one or more electronic devices are attached to the radiator and the electronic devices are air-cooled. do.

JP 2017-204928 A JP 2014-166116 A

However, since the electronic device 80 shown in FIGS. 1 to 3 requires the inner housing cover 60, it is difficult to assemble the electronic device 80, and the manufacturing cost of the electronic device 80 increases. Although not shown in FIGS. 1 to 4, the electronic device 80 requires parts for fastening the heat sink 10 to the upper portion 68 and the lower portion 69 of FIG. This first makes the assembly work of the electronic device 80 difficult. In addition, it becomes necessary to remove the housing inner cover 60 from the housing 70 each time the state or operation of the heat-generating component 30 mounted on the substrate 20 or other components (not shown) is checked. , poor workability.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat dissipation mechanism and the like capable of achieving both safety measures and effective cooling within a housing without using parts that cover heat-generating components within the housing.

The heat dissipating mechanism of the present invention includes a heat dissipating member that dissipates the heat transmitted from the heat generating component by contacting the heat generating component directly or via a heat transfer component, and a housing that covers the heat generating component and the heat dissipating member. wherein the heat dissipation member divides at least a part of the space inside the housing into a first space in which the heat-generating component is installed and a second space in which the heat-generating component is not installed. A first hole of a predetermined size connected to the outside of the housing is formed on the first space side of the housing. A second hole, which is connected to the outside and is significantly larger than the first hole, is formed on the side of the second space.

The heat dissipation mechanism and the like of the present invention can achieve both safety measures and effective cooling inside the housing without using parts that cover the heat-generating parts within the housing.

1 is a conceptual diagram showing the configuration of a general electronic device that achieves both safety measures and cooling; FIG. 1 is a conceptual diagram (exploded view) showing a specific example of a general electronic device; FIG. 1 is a conceptual diagram (external view) showing a specific example of a general electronic device; FIG. 1 is a conceptual diagram (partial view) showing a specific example of a general electronic device; FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional conceptual diagram showing the structure (1) of the electronic device of this embodiment. It is a cross-sectional conceptual diagram showing the structure (2) of the electronic device of this embodiment. It is a cross-sectional conceptual diagram showing the structure (3) of the electronic device of this embodiment. It is a cross-sectional conceptual diagram showing the structure (4) of the electronic device of this embodiment. 1 is a conceptual diagram (exploded view) showing the configuration of a first specific example of an electronic device of the present embodiment; FIG. 1 is a conceptual diagram (partial view 1) showing the configuration of a first specific example of an electronic device of the present embodiment; FIG. FIG. 2 is a conceptual diagram (partial view 2) showing the configuration of the first specific example of the electronic device of the present embodiment; FIG. 5 is a conceptual diagram (exploded view) showing the configuration of a second specific example of the electronic device of the present embodiment; FIG. 11 is a conceptual diagram (partial view 1) showing the configuration of a second specific example of the electronic device of the present embodiment; FIG. 10 is a conceptual diagram (partial view 2) showing the configuration of a second specific example of the electronic device of the present embodiment; It is an image figure showing the minimum composition of the electronic equipment of this embodiment.

In the electronic device of this embodiment, the space inside the housing is partitioned into two spaces by the radiator plate. Then, the hole for heat dissipation on the board-existing side of the case partitioned by the heat sink is made smaller than the hole for heat dissipation on the opposite side of the case. As a result, the electronic device can effectively cool the heat-generating components by effectively dissipating heat from the opposite side to the outside of the housing while taking safety measures including measures against insect damage to the wiring and components on the substrate. to

FIG. 5 is a conceptual cross-sectional view showing the configuration of an electronic device 80 that is an example of the electronic device of this embodiment. Electronic device 80 is, for example, a wireless router. An electronic device 80 includes a housing 70, a substrate 20, a heat-generating component 30 placed on the substrate 20, and a radiator plate 10 through which heat is transferred from the heat-generating component 30, which is a component that generates heat when energized. The inside of the housing 70 is partitioned by the radiator plate 10 into a space 93 on the side where the heat generating component 30 exists and a space 94 on the opposite side.

A plurality of holes 53b and 53a are formed in the space 93 side of the upper portion 78 and the lower portion 79 of the housing 70, respectively. A plurality of holes 54b and 54a are formed in the space 94 side of the upper portion 78 and the lower portion 79 of the housing 70, respectively. Holes 53a and 53b are sufficiently small holes that allow for safety measures including pest control. In contrast, holes 54a and 54b are significantly larger holes than holes 53a and 53b.

The air heated by the heat emitted into the space 93 by the heat-generating component 30 and the left side surface of the radiator plate 10 is emitted to the outside of the housing 70 through the holes 53b by the air flowing into the space 93 through the holes 53a. As a result, the heat-generating component 30 and the left side surface of the heat sink 10 are cooled.

On the other hand, the air warmed by the heat emitted to the space 94 from the right side surface of the radiator plate 10 is emitted to the outside of the housing 70 from the holes 54b by the air flowing into the space 94 from the holes 54a. Thereby, the right side surface of the heat sink 10 is cooled.

Cooling in space 94 is more efficient because holes 54a and 54b are significantly larger than holes 53a and 53b. No safety measures are taken for the space 94 side in the housing 70, but there is no current-carrying portion to be subjected to safety measures on the space 94 side, so there is no problem.

As described above, the electronic device 80 realizes safety measures including measures against insect damage and cooling of the heat-generating component 30 without requiring a component that covers the heat-generating component 30, which corresponds to the housing inner cover 60 in FIG. It should be noted that the radiator plate 10 does not necessarily have to have only a flat surface as shown in FIG. 5, and may have a bent surface or a curved surface.

Furthermore, the inside of the housing of this embodiment need not be partitioned only by the heat sink. As shown in FIG. 6, the inside of the housing 70 may be partitioned by a combination of the radiator plate 10 and partition walls 75a and 75b. The partition walls 75a and 75b in FIG. 6 may be ribs fixed to the upper portion 78 and the lower portion 79 of the housing 70, or the like. Alternatively, the partition walls 75a and 75b may be plates or the like that are not fixed to the upper portion 78 or the lower portion 79 of the housing 70 but are fixed to the heat sink 10. FIG.

As shown in FIG. 6, by using not only the heat sink but also the partition to partition the inside of the housing, the degree of freedom in the shape and size of the heat sink is improved. Also, the heat sink can be not fixed to the partition wall, in which case the assembly of the electronic device becomes easier.

Such partition walls do not necessarily have to have only flat surfaces, and may have curved surfaces like the partition walls 75a and 75b in FIG. 7, or curved surfaces (not shown).

By providing the partition wall with a bent or curved surface, the degree of freedom in the shape, size, installation position, or installation direction of the heat sink is improved.

Such partitions, like partitions 75a and 75b in FIG. It may be something that prevents it.

The bulkhead blocks unnecessary larger holes corresponding to the holes 54a and 54b, so that the larger hole would exist in the space around the heat-generating component corresponding to the space 93 if not blocked. You can eliminate the inconvenience. This improves the flexibility of the shape and position of the partition.

5 to 8 show the case where the holes 54a and 54b, which are the larger holes, are the holes for heat dissipation on the space 94 side of the housing 70. FIG. However, the holes on the space 94 side of the housing 70 may include holes smaller than the holes 54a and 54b. Also, the smaller one may be the same size as the smaller holes 53a and 53b.

Specific examples of the electronic device 80 according to the present embodiment shown in FIGS. 5 to 8 will be described below. 9 to 11 are conceptual diagrams showing a first specific example of the electronic device 80 of this embodiment. FIG. 9 is an exploded view of the electronic device 80. As shown in FIG. 10 is a view of the second housing portion 72 and the radiator plate 10 of FIG. 9 viewed from a direction different from that of FIG. FIG. 11 is a diagram showing a state in which the heat sink 10 of FIG. 10 is attached to the second housing portion 72. As shown in FIG.

As shown in FIG. 9 , an electronic device 80 includes a first housing portion 71, a second housing portion 72, a substrate 20 on which a heat generating component 30 is mounted, a heat transfer component 40, and a heat sink 10. . The first housing portion 71 and the second housing portion 72 are combined to form a housing corresponding to the housing 70 in FIGS.

The substrate 20 and the heat-generating component 30 are parts corresponding to the substrate 20 and the heat-generating component 30 in FIGS. In FIG. 9, the number of heat-generating components constituting the heat-generating component 30 is three, but the number of components is arbitrary. The heat-transfer component 40 is sandwiched between the heat-generating component 30 and the heat sink 10 and transfers the heat of the heat-generating component 30 to the heat sink 10 . The convex portion 15 of the heat sink 10 has a convex structure for pressing the heat transfer component 40 against the heat generating component 30 .

Ribs 711 and 712 are formed on the first housing portion 71 . A plurality of holes 51b and 51a, which are smaller holes, are aligned in the upper and lower portions of the first housing portion 71, respectively.

On the other hand, as shown in FIGS. 9 to 11, in the upper portion 728 of the second housing portion 72, a plurality of holes 51b, which are smaller holes, and a plurality of holes 52b, which are larger holes, are aligned. and formed. In addition, a plurality of holes 51a, which are smaller holes, and holes 52a, which are larger holes, are formed in alignment in the lower portion 729 of the second housing portion 72. As shown in FIG.

11, of the holes 52a and 52b, the second row shown in FIG. Further, the first row shown in FIG. 11 among the holes 52a and 52b in FIG. It is blocked by ribs 711 and 712 .

In the state of FIG. 11 , the side portions 106 of the heat sink 10 are connected to the upper ends of the ribs 722 . In this state, the space surrounded by the upper portion 728, the lower portion 729, the side portions 723, the ribs 722, and the heat sink 10 of the second housing portion 72 corresponds to the space 94 in FIGS. . The space corresponding to this space 94 is connected to the space outside this space through the third row of holes 52a and 52b, which are the larger holes.

On the other hand, among the spaces inside the housing corresponding to the housing 70 in FIGS. 5 to 8 in which the first housing section 71 and the second housing section in FIG. A space other than the space is a space corresponding to the space 93 in FIGS. This space is connected to the space outside this space through the smaller holes 51a and 51b in a state where the first housing part 71 and the second housing part are combined.

12 to 14 are conceptual diagrams showing a second specific example of the electronic device 80 of this embodiment. FIG. 12 is an exploded view of the electronic device 80. As shown in FIG. 13 is a view of the first housing portion 73 and the heat sink 10 of FIG. 12 viewed from a direction different from that of FIG. FIG. 14 is a diagram showing a state in which the heat sink 10 of FIG. 13 is attached to the second housing portion 72. As shown in FIG.

When the configuration of FIG. 12 is assembled, the combination of the first housing portion 73 and the second housing portion 74 is a portion corresponding to the housing 70 of FIGS. Also, in this state, the side portions 103 and 105 of the heat sink 10 are connected to the ribs 731 as shown in FIG. Also, side portion 104 in FIG. 12 is connected to rib 741 . Additionally, rib 741 is connected to rib 731 in FIGS. 12, a space 93 corresponding to the space 93 in FIGS. 5 to 8 and a space 94 corresponding to the space 94 are formed. . Space 93 is connected to the outside by holes 51a and 51b, which are the smaller holes. Space 94 is also connected to the outside by the larger holes, holes 52a and 52b.
[effect]
In the electronic device of this embodiment, the inside of the housing is partitioned by a heat sink. Then, the hole for heat dissipation on the side of the housing where the heat generating components are present, which is partitioned by the heat dissipation plate, is made smaller than the hole on the opposite side of the housing so that safety measures including insect damage can be taken. On the other hand, the holes on the opposite side are made larger holes for better air inflow and outflow to the outside. As a result, the electronic device can effectively cool the heat-generating components by radiating heat from the opposite side to the outside of the housing while taking safety measures including pest control against wiring and components on the substrate.

FIG. 15 is a conceptual diagram showing the configuration of a heat dissipation mechanism 80x, which is the minimum configuration of the heat dissipation mechanism of the embodiment. The heat dissipation mechanism 80x includes a heat dissipation member 10x that dissipates heat transferred from the heat-generating component by contacting the heat-generating component directly or via a heat-transfer component, and a housing 70x that covers the heat-generating component and the heat-dissipating member 10x. and The heat member 10x divides at least part of the space inside the housing 70x into a first space 93x in which the heat-generating component is installed and a second space 94x in which the heat-generating component is not installed. Divide into. A first hole (not shown) of a predetermined size connected to the outside of the housing 70x is formed on the first space 93x side of the housing 70x. A second hole connected to the outside and significantly larger than the first hole is formed on the second space 94x side of the housing 70x.

With the above configuration, the heat dissipation mechanism 80x has a size large enough to allow the second hole to effectively dissipate heat even when the first hole is small enough to allow safety measures including measures against insect damage. can do. Therefore, the heat dissipation mechanism 80x makes it possible to achieve both safety measures and effective cooling inside the housing without using components that cover the heat generating components within the housing.

Therefore, the heat dissipation mechanism 80x has the effects described in the section [Effects of the Invention] due to the above configuration. Note that the shape of the heat dissipation mechanism 80x and its configuration is not limited to that shown in FIG. 15, and is arbitrary.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and further modifications, replacements, and adjustments can be made without departing from the basic technical idea of the present invention. can be added. For example, the configuration of elements shown in each drawing is an example for helping understanding of the present invention, and the configuration is not limited to the configuration shown in these drawings.

Also, part or all of the above embodiments may be described as the following additional remarks, but are not limited to the following.
(Appendix 1)
a heat dissipating member that releases heat transferred from the heat generating component to the surroundings by contacting the heat generating component directly or via a heat transfer component;
A housing that covers the heat-generating component and the heat-dissipating member,
The heat dissipation member divides at least part of the space inside the housing into a first space in which the heat-generating component is installed and a second space in which the heat-generating component is not installed. partition,
A first hole of a predetermined size connected to the outside of the housing is formed on the first space side of the housing, and a first hole is formed on the second space side of the housing. A heat dissipation mechanism, wherein a second hole connected to the outside and significantly larger than the first hole is formed.
(Appendix 2)
The heat dissipation mechanism according to Appendix 1, wherein the heat dissipation member forms the first space and the second space by contacting a partition member formed in the housing.
(Appendix 3)
2. The heat dissipation mechanism according to appendix 2, wherein the contact is made by assembling.
(Appendix 4)
3. The heat dissipation mechanism according to any one of Appendixes 1 to 3, wherein the heat dissipation member is bent.
(Appendix 5)
3. The heat dissipation mechanism according to any one of appendices 1 to 3, wherein a plurality of the first holes are formed.
(Appendix 6)
6. The heat dissipation mechanism according to Appendix 5, wherein at least some of the plurality of first holes are aligned.
(Appendix 7)
7. The heat dissipation mechanism according to appendix 5 or appendix 6, wherein the first holes are formed in both of two opposing sides of the housing.
(Appendix 8)
8. The heat dissipation mechanism of paragraph 7, wherein the two sides are upper and lower sides in use.
(Appendix 9)
9. The heat dissipation mechanism according to any one of appendices 1 to 8, wherein a plurality of second holes are formed.
(Appendix 10)
10. The heat dissipation mechanism of Clause 9, wherein at least some of the plurality of second holes are aligned.
(Appendix 11)
11. The heat dissipation mechanism according to appendix 9 or appendix 10, wherein the first holes are formed in at least both of two opposing sides of the housing.
(Appendix 12)
12. The heat dissipation mechanism of paragraph 11, wherein the two sides are upper and lower sides in use.
(Appendix 13)
13. The heat dissipation mechanism according to any one of appendices 1 to 12, wherein the first hole has a size that effectively prevents insects from entering the housing.
(Appendix 14)
14. The heat dissipation mechanism according to any one of Appendixes 1 to 13, wherein the heat dissipation member is a plate-shaped heat dissipation plate.
(Appendix 15)
An apparatus comprising: the heat dissipation mechanism according to any one of appendices 1 to 14; and the heat generating component.

Here, the "heat-generating component" in the above appendix is, for example, the heat-generating component 30 shown in FIGS. 5 to 14 or the heat dissipation member 10x in FIG. 15, for example. 5 to 8, a combination of the first housing portion 71 and the second housing portion 72 in FIG. 9, or the first housing in FIG. It is a combination of the body portion 73 and the second housing portion 74, or the housing 70x in FIG.

Also, the "first space" is, for example, the space 93 in FIGS. 5 to 8 and 14 or the first space 93x in FIG. Also, the "second space" is, for example, the space 94 in FIGS. 5 to 8 and 14 or the second space 94x in FIG. Also, the "first hole" is, for example, the hole 51a or 51b in FIGS. Also, the "second hole" is, for example, hole 52a or 52b in FIGS.

Also, the "heat dissipation mechanism" is, for example, a combination of the housing 70 and the heat dissipation plate 10 in FIG. Alternatively, the "heat dissipation mechanism" is, for example, a combination of the housing 70, the heat dissipation plate 10, and the partition walls 75a and 75b shown in FIGS. 6 to 8, the rib 722 in FIG. 10 or 11, the rib 741 in FIG. 12, or the rib 731 in FIG. 13 or 14.

Also, the "two opposing sides" are, for example, the upper portion 78 and the lower portion 79 of FIGS. 5-8. The "two opposite sides" may alternatively be, for example, the combination of the top portion of the first housing portion 71 and the top portion 728 of the second housing portion 72 and the bottom portion of the first housing portion 71 and the second It is a combination with the lower part of the housing part 72 . "Two opposite sides" are alternatively, for example, the upper portion of the first housing portion 73 and the lower portion of the second housing portion 74 in FIG.

REFERENCE SIGNS LIST 10 radiator plate 10x radiator member 15 projection 20 substrate 30 heat-generating component 40 heat-transfer component 51a, 51b, 52a, 52b hole 60 housing inner cover 68, 78, 728 upper portion 69, 79, 729 lower portion 103, 104, 105, 106, 723 side portion 70, 70x housing 71, 73 first housing portion 711, 712, 721, 722, 731, 741 rib 72, 74 second housing portion 75a, 75b partition wall 80 electronic device 80x heat dissipation mechanism 91, 92, 93, 94 space 93x first space 94x second space

Claims (9)

a heat dissipating member that releases heat transferred from the heat generating component to the surroundings by contacting the heat generating component directly or via a heat transfer component;
A housing that covers the heat-generating component and the heat-dissipating member,
The heat dissipation member divides at least part of the space inside the housing into a first space in which the heat-generating component is installed and a second space in which the heat-generating component is not installed. partition,
A first hole of a predetermined size connected to the outside of the housing is formed on the first space side of the housing, and a first hole is formed on the second space side of the housing. a second hole connected to the outside and significantly larger than the first hole is formed ;
The first hole is of a size that effectively prevents insects from entering the interior of the housing.
Heat dissipation mechanism. 2. The heat dissipation mechanism according to claim 1, wherein said heat dissipation member forms said first space and said second space by contacting a partition member formed in said housing. 3. The heat dissipation mechanism according to claim 2, wherein said contact is made by assembling. 4. The heat dissipation mechanism according to claim 1, wherein said heat dissipation member is bent. 4. The heat dissipation mechanism according to claim 1, wherein a plurality of said first holes are formed. 6. The heat dissipation mechanism according to claim 5, wherein the first holes are formed in both two opposing sides of the housing. The heat dissipation mechanism according to claim 6, wherein the two sides are upper and lower sides in use. 8. The heat dissipation mechanism according to claim 1, wherein a plurality of said second holes are formed. An apparatus comprising the heat dissipation mechanism according to any one of claims 1 to 8 and the heat generating component.

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