JP2007165423A - Electronic appliance device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic appliance device which enables a plurality of heat-generating components mounted on a circuit board to easily dissipate heat while reserving a vent path of high heat-generating components inside an electronic appliance device, and is reliable, compact and space-saving. <P>SOLUTION: The electronic appliance device includes a hollow duct 5 made of a highly heat conductive material having an opening 52 communicating with the open air coming in/out of vent holes 61 and 62 of a case body 6, in a space between a power board 3 and a control board 4 of a layered structure. The hollow duct 5 is formed to notch a region opposite to a mounting position of a heat-generating component 31 with a longer standing part than that of a high heat-generating component among the heat-generating components mounted on the power board 3, and in addition is placed in close contact with the high heat-generating component 32. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention accommodates a plurality of circuit boards having different functions mounted with various heat generating components in a case main body in a hierarchical structure with a space between each circuit board in the same case, for example, DC In particular, the present invention relates to a heat dissipation structure for improving the cooling capacity of an electronic device apparatus.

Conventionally, a plurality of circuit boards having different functions mounted with various heat generating components in a case body are housed in a hierarchical structure with a space between each circuit board in the same case, and direct current is changed to alternating current. 2. Description of the Related Art Electronic equipment devices such as power conversion devices that operate with a high-voltage power source such as an inverter for conversion are used. In recent years, there has been an increasing demand for downsizing of electronic devices against the background of energy saving, downsizing, and cost reduction in the field of industrial machinery and equipment. Hereinafter, an example of an inverter will be described.
In this electronic apparatus device, a power module including a semiconductor element such as an IGBT element that generates high heat is used, and a heat dissipation structure for directly cooling the power module by fixing the power module to a heat sink or a power module A heat dissipating structure that indirectly cools the power module by forming a ventilation path using a space between circuit boards having different functions adjacent to the circuit board, and cooling air from the fan on the circuit board After forcibly applying to the heat sink facing the first heat generating component mounted on the windward side, the direction of the cooling air is forcibly changed by the guide so that the cooling air can be mounted on the leeward side of the circuit board. In addition, a structure for cooling the second heat generating component has been proposed (see, for example, Patent Document 1 and Patent Document 2).
Japanese Patent Laid-Open No. 3-16299 (first page to second page, FIG. 2) Japanese Patent Laid-Open No. 11-098772 (page 4, FIG. 1)

FIG. 4 is an exploded perspective view of the electronic device apparatus showing the first prior art, and corresponds to the technique of Patent Document 1.
In the figure, 1 is an electronic device, 2 is a heat sink, 21 is a power module, 22 is a stud, 23 is a mounting screw, 3 is a power board, 32 is a first heat-generating component with high heat generation, and 31 is compared with the first heat-generating component 32. The second heat generating component having a long standing portion, 4 is a control board, 6 is a case body, and 61 and 62 are vent holes.
The case body 6 contains a power circuit portion and a control circuit portion having different functions. As the power circuit portion and the control circuit portion, a circuit board including a power board 3 and a control board 4 on which various second heat generating components 31 and first heat generating components 32 are mounted is used. Are arranged in the same case in a hierarchical structure with a space between each substrate.
Further, a high heat generation power module 21 for power conversion is connected to the back surface of the power substrate 3 through electrodes. A heat sink 2 for heat dissipation is fixed to the back surface of the power module 21 so as to be in close contact therewith. Further, fixing members such as studs 22 are attached to the four corners of the heat sink 2, and the attachment screws 23 are inserted into the holes provided in the four corners of the power board 3 and the control board 4, and the attachment screws 23 are attached to the studs 22. By screwing, the substrates 3 and 4 and the heat sink 2 are fixed. Then, the case body 6 is formed with slit-like vent holes 61 and 62 so as to open on the surfaces facing the longitudinal direction of the power board 3 and the control board 4.
In such an electronic apparatus device, heat generated in one power module 21 is radiated by the heat sink 2. On the other hand, when the outside air is taken in from the ventilation hole 61 provided on the lower surface of the case body 6 along the ventilation hole 62 provided on the upper surface, the outside air flows into the space between the power board 3 and the control board 4. Then, heat generated from the heat generating components mounted on each substrate is released to the outside of the case body 6 by natural convection of the inflowing outside air, and heat exchange is performed.

FIG. 5 is a side sectional view of an electronic apparatus device showing the second prior art, and corresponds to the technique of Patent Document 2.
In the figure, 101 is an electronic device, 102 is a heat sink, 103 is a heat sink base, 104 is a heat generating component contact surface, 105 is a cooling fin, 106 is an outer frame, 107 is a ventilation duct, 108 is a cooling fan, 109 is a suction port, 110 Is a discharge port, 111 is a circuit board, 112 is a first heat generating component, 113 is a second heat generating component, 114 is a vent hole, 115 is a guide, and 116 is a partition.
The first heat generating component 112 and the second heat generating component 113 are attached to the upper surface of the circuit board 111, and the back surface of the first heat generating component 112 is brought into close contact with the heat generating component contact surface 104 of the heat sink base 103.
In addition, a cooling fan 108 is attached in front of the heat sink 102, a ventilation hole 114 communicating with the cooling fin 105 side is provided in a portion facing the second heating component 113 of the heat sink base 103, and the second heating component 113 is provided in the ventilation hole 114. An inclined guide 115 extending toward is provided.
In such a configuration, cooling of the first heat generating component and the second heat generating component is performed as follows. That is, the cooling air generated by the cooling fan 108 takes in air from the suction port 109 of the ventilation duct, takes the heat of the first heat generating component 112 from the cooling fin 105 of the heat sink 102, and then hits the partition 116 of the outer frame 106. The direction is changed and the air flows through the ventilation hole 114 while changing the direction toward the anti-cooling fin side of the heat sink base 103. The cooling air that has flowed to the anti-cooling fin side of the heat sink main body 103 is guided toward the second heat generating component 113 by the guide 115, takes heat from the second heat generating component 113, and is discharged from the discharge port 110 to the outside of the control device. Flows out.

However, the conventional electronic device has the following problems.
(1) In the first prior art, the length of the standing portion of the second heat generating component 31 disposed at the lower end of the power board 3 (upwind of the ventilation path) is approximately the center of the power board 3 (downward of the ventilation path). Is larger than the length of the standing part of the first heat generating component 32 with high heat generation disposed in the cooling air, so that the cooling air hits only the second heat generating component 31 on the first wind and passes through the second heat generating component 31 on the wind. The cooling air thus diffused before reaching the first heat generating component 32 in the leeward direction, making it difficult for the cooling air to go to the first heat generating component 32 and preventing good heat dissipation. As a result, there is a problem of reliability such that the heat generation of the circuit board on which the heat generating component is mounted shortens the life of the heat generating component and causes malfunction.
In addition, when a relatively large number of the second heat generating components 31 having a large standing portion are mounted inside the device, it is difficult to secure the ventilation path, and the case body 5 is used to secure the ventilation path. If the space between the substrates to be stored in a hierarchical structure is increased, there is a problem that it is extremely strict to meet the demand for downsizing and space saving of the entire device.
(2) In the second prior art, since each heat generating component and the ventilation path on the substrate are arranged in separate spaces, the heat generating component needs to be arranged on the ventilation path from the viewpoint of space saving. A large restriction occurs in the arrangement.
The present invention has been made in view of such problems, and facilitates heat dissipation of a plurality of heat generating components mounted on a circuit board while ensuring a ventilation path for high heat generating components inside an electronic device. An object of the present invention is to provide a small, space-saving electronic device that is capable of achieving high reliability.

In order to solve the above problems, the present invention is configured as follows.
The invention described in claim 1 includes a plurality of circuit boards having different functions on which various heat-generating components are mounted, a case main body for storing the boards in a hierarchical structure with a space between each circuit board, A vent hole formed so as to open on a surface of the case body that faces the longitudinal direction of the circuit board. The outside air is taken from one vent hole provided in the case body toward the other vent hole. In the electronic device as described above, the circuit board having the hierarchical structure is made of a highly heat conductive material having an opening communicating with outside air entering and exiting the vent hole in a space between at least two boards. A hollow duct is provided, and the hollow duct is opposed to a mounting position of a second heat generating component having a length of a standing portion larger than that of the first heat generating component having high heat generation among the heat generating components mounted on the circuit board. Do Together is shaped to cut out position, it is characterized in that it is arranged so as to be in close contact with the artificial first heating component.
According to a second aspect of the present invention, in the electronic device apparatus according to the first aspect, a plurality of fins are provided inside the hollow duct so as to face a portion in contact with the heat radiation surface of the first heat generating component. It is characterized by that.
According to a third aspect of the present invention, in the electronic device apparatus according to the first or second aspect, when the first heat-generating component having high heat generation is disposed at a position away from the hollow duct, An extension plate extended so as to be in contact with the heat radiating surface of the first heat-generating component is provided on one side surface.
According to a fourth aspect of the present invention, in the electronic device device according to the first or second aspect, the hollow duct is made of a high-rigidity material, and each of the circuit boards is provided at four corners of the hollow duct. Protrusions that maintain a constant spacing between the circuit boards are provided so that the heat-generating components mounted facing each other do not interfere with each other.

According to the first aspect of the present invention, since the heat generating component having high heat generation is brought into close contact with the highly heat conductive hollow duct, a ventilation path necessary for heat dissipation in the hollow duct is secured, and heat is dissipated by this ventilation. can do. As a result, it is possible to perform heat diffusion and heat dissipation of heat-generating components with high heat generation in electronic devices well, solve problems such as long life of heat-generating components and malfunctions, and highly reliable electronic device devices Can be obtained.
Then, the hollow duct is formed between the plurality of boards so that the parts facing the heat-generating component having a long standing part are cut out between the boards, and arranged between the boards. A space can be narrowed, and a small and space-saving electronic device can be obtained.
In addition, according to the invention described in claim 2, since the fins are provided inside the hollow duct, the heat radiation area of the hollow duct can be increased, and as a result, the heat radiation capacity of the high heat generating component in the electronic device. Can be performed satisfactorily.
In addition, according to the invention described in claim 3, since the heat-generating component that cannot generate direct contact with the hollow duct is in close contact with the outside of the hollow duct via the extension plate, heat can be efficiently transferred to the hollow duct. As a result, it is possible to satisfactorily dissipate the heat-generating component in the electronic device.
According to the invention described in claim 4, since the duct is made of a highly rigid material and is also used as a projection of the hollow duct as a holding member for the circuit board, a holding member is separately provided on the circuit board itself. Thus, there is no need to form a hollow duct so as to avoid this holding member, and the size of the hollow duct can be maintained while firmly holding between each circuit board. Heat dissipation of the heat-generating component can be performed satisfactorily.

  Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is an exploded perspective view of an electronic device apparatus according to a first embodiment of the present invention. Note that the description of the same constituent elements of the present invention as those of the prior art will be omitted, and only different points will be described.
1 and 2, 5 is a hollow duct, 51 is a protrusion, and 52 is an opening.

The present invention is different from the prior art as follows.
In other words, the electronic device apparatus is composed of a highly heat-conductive material having an opening 52 that communicates with the outside air that enters and exits the vent holes 61 and 62 of the case body 6 in the space between the power board 3 and the control board 4 having a hierarchical structure. The hollow duct 5 has a length of the standing part of the component on the substrate, compared with the first heat-generating component 32 having a high heat generation, among the heat-generating components mounted on the power substrate 3. The second heat generating component 31 is shaped so as to cut out a portion facing the mounting position of the large second heat generating component 31 and is disposed so as to be in close contact with the first heat generating component 32 that generates high heat.
Specifically, it is preferable that the thickness of the hollow duct 5 is slightly larger than that having the longest standing part among the heat generating parts arranged on the substrate.
Further, the hollow duct 5 is made of a highly rigid material, and the heat generating components 31 and 32 mounted facing the power board 3 and the control board 4 at the four corners of the hollow duct 5 do not interfere with each other. Protrusions 51 are provided to keep the distance between the substrates 3 and 4 constant.

Next, the heat dissipation process inside the electronic apparatus will be described with reference to FIG.
FIG. 2 is an assembled perspective view of the hollow duct, the power board, and the heat sink after the case body, the control board, and one side surfaces of the hollow duct are removed from the electronic device according to the first embodiment.
It is mounted on the power board 3 in a hollow duct 5 formed by cutting and forming so as to avoid a portion facing the second heat generating component 31 having a length of the standing portion larger than that of the first heat generating component 32 having high heat generation. When the first heat generating component 32 generates heat under the condition where the first heat generating component 32 having high heat generation is in close contact, the heat is transferred to the hollow duct 5 and diffused to the surface of the hollow duct 5. As a result, the heat transferred to the surface of the hollow duct over a wide area is dissipated by the air flowing from the vent hole 61 of the case body 6 into the opening 52 at the lower part of the hollow duct, and the air deprived of the heat is the opening 52 at the upper part of the hollow duct. Through the vent hole 62 of the case body 6. For this reason, the first heat generating component 32 mounted on the lee of the power board 3 has a position where ventilation is blocked by the second heat generating component 31 having a standing portion larger than the length of the standing portion of the first heat generating component 32. Even in this case, when the air is passed through the hollow duct avoiding the second heat generating component 31 mounted on the windward side, heat is diffused over the entire inner surface of the hollow duct 5, so that good heat dissipation is performed.

Therefore, in the first embodiment of the present invention, the first heat-generating component having high heat generation is configured to be in close contact with the highly heat-conductive hollow duct. Therefore, a ventilation path necessary for heat radiation in the hollow duct is secured, and this ventilation As a result, heat diffusion and heat dissipation of high heat-generating parts in electronic equipment can be performed well, the life of heat-generating parts is extended, and problems such as malfunctions are eliminated and reliability is improved. A highly electronic device can be obtained.
Then, the hollow duct is formed between the plurality of boards so that the parts facing the heat-generating component having a long standing part are cut out between the boards, and arranged between the boards. A space can be narrowed, and a small and space-saving electronic device can be obtained.

FIG. 3 is an assembly perspective view of an electronic device apparatus according to a second embodiment of the present invention, in which the heat sink, the power module, the power board, and the hollow duct and the power board after one side surfaces of the hollow duct are removed from the electronic apparatus device. Further, it corresponds to an assembled perspective view of the heat sink.
Reference numerals 33 and 34 denote high heat-generating first heat generating components, 53 a fin, and 54 an extension plate.
The second embodiment is different from the first embodiment in that a plurality of fins 53 are provided on the inner side of the hollow duct 5 so as to face the portion that contacts the heat radiation surface of the first heat generating component 33 having high heat generation. A thin plate-like extension plate 54 is provided on one side surface outside the hollow duct 5 so as to be in contact with the heat radiating surface of the first heat generating component 34 that is disposed at a position away from the hollow duct 5. It is.

Next, a heat dissipation process inside the electronic device will be described with reference to FIG.
When the first heat generating component 33 generates heat, the heat is transferred to the plurality of fins 53 provided inside the hollow duct 5 that is in close contact with the first heat generating component 33, and the internal ventilation of the hollow duct 5 is also transmitted to the fins 53. Since it passes, it is possible to release a lot of heat by ventilation as compared to the case without fins. As a result, even heat-generating components that generate a large amount of heat, such as the first heat-generating component 33, are easily radiated.
When the first heat generating component 34 that cannot directly adhere to the hollow duct 5 generates heat, the heat is transferred to the extension plate 54 that is extended to one side surface outside the hollow duct 5, and the main body of the hollow duct 5 is transmitted from the extension plate 54. Heat is transferred to. Thereby, heat is dissipated by the internal ventilation of the hollow duct 5.

Accordingly, the second embodiment of the present invention can increase the heat radiation area inside the hollow duct by improving the heat radiation capacity by providing a plurality of fins inside the hollow duct in the heat radiation structure of the electronic device. Can do. As a result, it is possible to satisfactorily dissipate heat from highly heat-generating components in the electronic device.
In addition, in the heat dissipation structure of an electronic device, by providing an extension plate that is extended on one side of the hollow duct, a high heat-generating component that cannot directly adhere to the hollow duct can be brought into close contact with the hollow duct. Heat can be transferred to the duct. As a result, it is possible to satisfactorily dissipate heat from highly heat-generating components in the electronic device.

In the embodiment of the present invention, the hollow duct is replaced with a fin or an extension plate so that the high heat generating component and the hollow duct are in close contact with each other. A protrusion may be provided, or a heat conductive sheet or oil compound may be inserted.
Further, the shape of the fin provided inside the hollow duct is not particularly limited.
Further, the shape of the extension plate is not particularly limited as long as the extension plate can be in close contact with a high heat-generating component arranged outside the hollow duct.

  According to the electronic device apparatus of the present invention, in addition to the inverter that converts direct current to alternating current, a motor control that drives a motor represented by a power converter or servo amplifier that operates with a high-voltage power source such as a converter that converts alternating current to direct current. Applicable to all electronic devices such as devices.

1 is an exploded perspective view of an electronic device apparatus according to a first embodiment of the present invention. Assembly perspective view of hollow duct, power board, and heat sink after removing one side of case main body, control board, hollow duct from electronic apparatus of first embodiment FIG. 4 is an assembly perspective view of an electronic device apparatus according to a second embodiment of the present invention, in which the heat sink, the power module, the power board, and the hollow duct and the power board after removing one side surface of the hollow duct from the electronic apparatus device Equivalent to assembly perspective view The exploded perspective view of the electronic device apparatus which shows the 1st prior art Side sectional view of electronic device showing second prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic device 2 Heat sink 21 Power module 22 Stud 23 Mounting screw 3 Power board (circuit board)
4 Control board (circuit board)
31 Second heat generating component (length of standing part is large)
32, 33, 34 First heat generating component (high heat generation)
5 Hollow duct 51 Projection 52 Opening 53 Fin 54 Extension plate 6 Case body 61 Vent 101 Electronic device 102 Heat sink 103 Heat sink body 104 Heating part contact surface 105 Cooling fin 106 Outer frame 107 Ventilation duct 108 Cooling fan 109 Suction port 110 Exhaust port 111 Circuit Board 112 First Heating Component 113 Second Heating Component 114 Ventilation Hole 115 Guide 116 Partition

Claims (4)

A plurality of circuit boards with different functions mounted with various heat generating components,
A case body for storing the boards in a hierarchical structure via a space between the circuit boards;
A vent formed so as to open in a surface facing the longitudinal direction of the circuit board of the case body;
In an electronic device apparatus that takes in outside air from one vent hole provided in the case body toward the other vent hole,
The circuit board having the hierarchical structure is provided with a hollow duct made of a highly thermally conductive material having an opening communicating with outside air entering and exiting the vent hole in a space between at least two boards.
The hollow duct is formed so as to cut out a portion facing the mounting position of the second heat generating component having a length of the standing portion larger than that of the first heat generating component having high heat generation among the heat generating components mounted on the circuit board. An electronic apparatus device that is molded and disposed so as to be in close contact with the first heat generating component.   2. The electronic device device according to claim 1, wherein a plurality of fins are provided inside the hollow duct so as to face a portion in contact with a heat radiation surface of the first heat-generating component.   When the first heat generating component with high heat generation is disposed at a position away from the hollow duct, an extension plate is provided on one side surface outside the hollow duct so as to be in contact with the heat radiating surface of the first heat generating component. The electronic device apparatus according to claim 1 or 2, wherein   The hollow duct is made of a high-rigidity material, and the circuit boards are arranged so that the various heat generating components mounted on the four corners of the hollow duct facing each other between the circuit boards do not interfere with each other. 3. The electronic device apparatus according to claim 1, further comprising a protrusion that maintains a constant interval between the two.

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