KR20000021081A - Heat-sink structure having high efficiency - Google Patents

Heat-sink structure having high efficiency Download PDF

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Publication number
KR20000021081A
KR20000021081A KR1019980040019A KR19980040019A KR20000021081A KR 20000021081 A KR20000021081 A KR 20000021081A KR 1019980040019 A KR1019980040019 A KR 1019980040019A KR 19980040019 A KR19980040019 A KR 19980040019A KR 20000021081 A KR20000021081 A KR 20000021081A
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South Korea
Prior art keywords
heat
sink
heat dissipating
high efficiency
lower heat
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KR1019980040019A
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Korean (ko)
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KR100498300B1 (en
Inventor
오동엽
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구자홍
엘지전자 주식회사
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Priority to KR10-1998-0040019A priority Critical patent/KR100498300B1/en
Publication of KR20000021081A publication Critical patent/KR20000021081A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

PURPOSE: A heat-sink structure having high efficiency is provided to decrease the equipment area of a component of a base board and to improve the radiation of heat efficiency. CONSTITUTION: A heat-sink of high efficiency has a lower heat dissipating plate(11) and an upper heat dissipating plate(12). The lower heat dissipating plate(11) is equipment on the upside of a power device equipment on a base board. An installing part having a certain depth is formed on the upper surface of the lower heat dissipating plate(11). Many lower heat dissipating pins(11b) are formed to protrude from circumference to out direction. The upper heat dissipating plate(12) is inserted and combined with the installing part. Many upper heat dissipating pins(12a) is formed on upper surface of the upper heat dissipating plate(12).

Description

고효율 히트-싱크 구조High Efficiency Heat-Sink Structure

본 발명은 고효율 히트-싱크 구조에 관한 것으로, 특히 베이스 보드 상에서 설치면적을 감소시키도록 하는데 적합한 고효율 히트-싱크 구조에 관한 것이다.The present invention relates to a high efficiency heat-sink structure, and more particularly to a high efficiency heat-sink structure suitable for reducing the installation area on the base board.

최근 전자제품들은 고성능화되어지는 반면에 크기는 컴팩트화되는 경향이 있으며, 그에따라 전자제품의 내부에 장착되는 부품들도 이전보다 크기가 작고, 고기능화가 요구되어지는데, 이와 같은 고기능화된 파워 소자들은 방열기구인 히트-싱크를 설치하여 충분한 방열이 이루어지도록 함으로써 오동작이 발생되는 것을 방지하게 되어 있으며, 이러한 방열기구가 설치된 예가 도 1에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.In recent years, electronic products have become high-performance, while the size tends to be compact. Accordingly, components mounted inside the electronic products are also smaller in size and require higher functionalization. By installing a heat-sink to ensure sufficient heat dissipation is prevented from malfunctioning, an example in which the heat dissipation mechanism is installed is shown in Figure 1, briefly described as follows.

도 1은 종래 히트-싱크가 설치된 상태를 보인 사시도로서, 도시된 바와 같이, 종래에는 전자제품에 장착되는 베이스 보드(1)에 파워 소자(2) 및 여러 가지 부품(3)들이 설치되어 있고, 상기 파워 소자(2)의 상면에는 히트-싱크(4)가 설치되어 있다.1 is a perspective view showing a state where a conventional heat-sink is installed. As shown in the related art, a power element 2 and various components 3 are conventionally installed on a base board 1 mounted on an electronic product. The heat sink 4 is provided on the upper surface of the power element 2.

상기 히트-싱크(4)는 열전달이 잘되는 판상의 바디부(4a) 상면에 일체로 다수개의 방열핀(4b)을 형성한 구조로 되어 있다.The heat sink 4 has a structure in which a plurality of heat dissipation fins 4b are integrally formed on the upper surface of the plate-shaped body portion 4a that is well-heated.

상기와 같은 히트-싱크(4)는 베이스 보드(1)에 설치되는 파워 소자(2)의 상면에 부착된 상태로 사용되어 지고, 파워 소자(2)의 동작시 발생되는 열을 외부로 방출하게 되며, 이와 같이 설치되는 히트-싱크(4)의 주변에는 다른 부품(3)들이 설치되어 사용되어 진다.The heat sink 4 as described above is used to be attached to the upper surface of the power device 2 installed in the base board 1, and to dissipate heat generated during operation of the power device 2 to the outside. The other components 3 are installed and used around the heat sink 4 installed as described above.

그러나, 상기와 같이 구성되어 있는 종래 히트-싱크(4)는 설치면적을 넓게 차지하여 다른 부품(3)들이 히트-싱크(4)의 외측에 위치되도록 설치되어야 하고, 이는 베이스 보드(1)의 크기가 커지는 것이 불가피하게 되어, 부품의 소형화에 따른 전자제품의 컴팩트화에 역행하는 문제점이 있었다.However, the conventional heat sink 4 configured as described above occupies a large installation area so that the other parts 3 should be installed so as to be located outside the heat sink 4, which is a function of the base board 1. Increasing the size is inevitable, and there is a problem against the compactness of electronic products due to the miniaturization of parts.

상기와 같은 문제점을 감안하여 안출한 본 발명의 목적은 베이스 보드의 부품 설치면적을 감소시킴과 아울러 방열효과를 향상시키도록 하는데 적합한 고효율 히트-싱크 구조를 제공함에 있다.An object of the present invention devised in view of the above problems is to provide a high-efficiency heat-sink structure suitable for reducing the component installation area of the base board and improving the heat dissipation effect.

도 1은 종래 히트-싱크가 설치된 상태를 보인 사시도.1 is a perspective view showing a state where a conventional heat-sink is installed.

도 2는 본 발명 고효율 히트-싱크의 구조를 보인 분해사시도.Figure 2 is an exploded perspective view showing the structure of the present invention high efficiency heat-sink.

도 3은 본 발명 고효율 히트-싱크의 구조를 보인 사시도.Figure 3 is a perspective view showing the structure of the present invention high efficiency heat-sink.

도 4는 본 발명 고효율 히트-싱크가 설치된 상태를 보인 정면도.Figure 4 is a front view showing a state in which the present invention high efficiency heat-sink is installed.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

11 : 하부 방열판 11a : 안착부11: lower heat sink 11a: seating portion

11b : 하부 방열핀 12 : 상부 방열판11b: lower heat sink fin 12: upper heat sink

12a : 상부 방열핀 14 : 베이스 보드12a: upper heat sink fin 14: base board

15 : 파워 소자 16 : 부품15: power element 16: part

17 : 통기구멍17: vent hole

상기와 같은 본 발명의 목적을 달성하기 위하여 베이스 보드에 설치된 파워 소자의 상측에 설치되며 상면에 일정 깊이의 안착부가 형성되어 있고 외주연부에서 일정높이의 외측방향으로 돌출되도록 다수개의 하부 방열핀들이 형성되어 있는 하부 방열판과, 상기 안착부에 삽입결합되며 상면에 다수개의 상부 방열핀들이 형성되어 있는 상부 방열판으로 구성되는 것을 특징으로 하는 고효율 히트-싱크 구조가 제공된다.In order to achieve the object of the present invention as described above is installed on the upper side of the power device installed on the base board is formed a seating portion of a predetermined depth and a plurality of lower heat dissipation fins are formed so as to protrude outward of a certain height from the outer peripheral portion There is provided a high efficiency heat-sink structure comprising a lower heat sink and an upper heat sink inserted into the seating portion and having a plurality of upper heat radiation fins formed on an upper surface thereof.

이하, 상기와 같이 구성되는 본 발명 고효율 히트-싱크 구조를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the present invention high efficiency heat-sink structure constructed as described in more detail as follows.

도 2는 본 발명 고효율 히트-싱크의 구조를 보인 분해사시도이고, 도 3은 본 발명 고효율 히트-싱크의 구조를 보인 사시도이다.2 is an exploded perspective view showing the structure of the present invention high-efficiency heat-sink, Figure 3 is a perspective view showing the structure of the present invention high-efficiency heat-sink.

도시된 바와 같이, 본 발명 고효율 히트-싱크는 소자의 상측에 장착되며 상면에 일정깊이의 안착부(11a)가 형성됨과 아울러 외주연부에 일정 높이의 "ㄱ"자형상으로 다수개의 하부 방열핀(11b)들이 형성되어 있는 하부 방열판(11)과, 그 하부 방열판(11)의 안착부(11a)에 삽입결합되며 상면에 다수개의 상부 방열핀(12a)들이 일체로 돌출형성되어 있는 상부 방열판(12)으로 구성되어 있다.As shown, the high efficiency heat sink of the present invention is mounted on the upper side of the device, and a seating portion 11a having a predetermined depth is formed on the upper surface thereof, and a plurality of lower heat dissipation fins 11b are formed in the outer periphery of the "a" shape of a certain height. ) Is formed into the lower heat sink 11 and the upper heat sink 12 inserted and coupled to the seating portion 11a of the lower heat sink 11 and the plurality of upper heat radiation fins 12a protruding integrally on the upper surface. Consists of.

그리고, 상기 하부 방열판(11)의 안착부(11a) 벽체에는 다수개의 통기구멍(17)이 설치되어 있어서, 외부공기가 그 통기구멍(17)으로 유입되어 열교환이 이루어지도록 되어 있다.In addition, a plurality of vent holes 17 are provided in the wall of the seating portion 11a of the lower heat sink 11 so that external air flows into the vent holes 17 to perform heat exchange.

상기와 같이 구성되어 있는 본 발명의 고효율 히트-싱크(13)는 도 4와 같이, 베이스 보드(14)에 설치된 파워 소자(15)의 상측에 설치되며, 이와 같이 설치되는 히트-싱크(13)는 하부 방열판(11)의 외주연부가 일정 높이에서 외측으로 다수개의 방열핀(11b)들이 형성되어 있으므로, 그 하부 방열핀(11b)들의 하측에 다른 부품(16)을 설치하도록 설계하는 것이 가능해지고, 상기와 같이 구성되는 히트-싱크(13)는 자연대류와의 접촉면적인 방열면적은 종래와 동일하거나 종래 보다 넓게 설계하는 것이 가능해진다.The high-efficiency heat-sink 13 of the present invention configured as described above is installed above the power element 15 installed in the base board 14 as shown in FIG. 4, and the heat-sink 13 installed as described above. Since the outer circumferential edge of the lower heat sink 11 is formed with a plurality of heat dissipation fins 11b outward from a predetermined height, it is possible to design to install other components 16 under the lower heat dissipation fins 11b. The heat sink 13 configured as described above can be designed to have the same heat dissipation area as the contact area with natural convection or wider than the conventional one.

즉, 본 발명의 방열면적은 종래와 동일하거나 넓어지는 반면에 베이스 보드(14)에서의 설치면적은 종래 보다 좁아지므로 전자제품에 장착되는 부품의 소형화가 가능해진다.That is, the heat dissipation area of the present invention is the same as or wider than the conventional one, whereas the installation area of the base board 14 is narrower than the conventional one, so that the components mounted on the electronic products can be miniaturized.

이상에서 상세히 설명한 바와 같이, 본 발명 고효율 히트-싱크 구조는 하부 방열판에 상부 방열판을 조립할 수 있도록 하고, 그 하부 방열판의 외주연부에 형성되는 방열핀들의 하측에 베이스 보드에 설치되는 다른 부품들이 위치될 수 있도록 하여, 설치면적을 감소에 따른 부품의 크기를 감소시킬뿐만 아니라, 하부 방열판의 안착부 벽체 형성되어 있는 통기구멍으로 공기가 자유로이 유입되며 열교환이 이루어져서 방열효과를 향상시키는 효과가 있다.As described in detail above, the present invention high-efficiency heat-sink structure allows the upper heat sink to be assembled to the lower heat sink, and other components installed on the base board may be located under the heat dissipation fins formed at the outer periphery of the lower heat sink. In order to reduce the size of the component according to the reduction in the installation area, air is freely introduced into the vent hole formed in the wall of the seat of the lower heat sink, and heat exchange is performed to improve the heat dissipation effect.

Claims (3)

베이스 보드에 설치된 파워 소자의 상측에 설치되며, 상면에 일정 깊이의 안착부가 형성되어 있고, 외주연부에서 일정높이의 외측방향으로 돌출되도록 다수개의 하부 방열핀들이 형성되어 있는 하부 방열판과; 상기 안착부에 삽입결합되며, 상면에 다수개의 상부 방열핀들이 형성되어 있는 상부 방열판으로 구성되는 것을 특징으로 하는 고효율 히트-싱크 구조.A lower heat sink installed on an upper side of the power device installed on the base board, and having a seating portion having a predetermined depth formed thereon, and having a plurality of lower heat dissipation fins formed so as to protrude outward from the outer periphery at a predetermined height; The high efficiency heat-sink structure is inserted and coupled to the seating portion, the upper heat sink is formed with a plurality of upper heat radiation fins on the upper surface. 제 1항에 있어서, 상기 하부 방열핀들은 "ㄱ"자형상으로 형성되어 하측에 다른 부품들이 배치될 수 있도록 한 것을 특징으로 하는 고효율 히트-싱크 구조.The high-efficiency heat-sink structure of claim 1, wherein the lower heat dissipation fins are formed in a "-" shape to allow other components to be disposed on the lower side. 제 1항에 있어서, 상기 하부 방열핀의 안착부 벽체에는 다수개의 통기구멍이 형성되는 것을 특징으로 하는 고효율 히트-싱크 구조.The high-efficiency heat-sink structure of claim 1, wherein a plurality of vent holes are formed in the seat wall of the lower heat dissipation fin.
KR10-1998-0040019A 1998-09-25 1998-09-25 High efficiency heat sink structure KR100498300B1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030025788A (en) * 2001-09-21 2003-03-29 리드텍 리서치 인코포레이티드 Integrated apparatus for thermal dissipation
KR100708844B1 (en) * 2005-04-18 2007-04-17 삼성에스디아이 주식회사 A plasma display device
KR100728212B1 (en) * 2005-11-30 2007-06-13 삼성에스디아이 주식회사 Plasma display device
KR100749475B1 (en) * 2006-02-20 2007-08-14 삼성에스디아이 주식회사 Plasma display device
US7468887B2 (en) 2004-05-18 2008-12-23 Samsung Sdi Co., Ltd. Plasma display device

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Publication number Priority date Publication date Assignee Title
KR102588802B1 (en) * 2021-05-12 2023-10-16 박성철 Cooling device having improved cooling efficiency

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Publication number Priority date Publication date Assignee Title
KR910005648Y1 (en) * 1988-12-16 1991-07-27 대우전자 주식회사 A circuit element heat sink
KR940006785Y1 (en) * 1991-12-30 1994-10-01 산업과학기술연구소 Spot welding electrode
US5693981A (en) * 1993-12-14 1997-12-02 Lsi Logic Corporation Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system
JPH0864981A (en) * 1994-08-26 1996-03-08 Matsushita Electric Works Ltd Heat radiation plate for semiconductor device
KR19980019005U (en) * 1996-09-30 1998-07-06 배순훈 Combined Heat Sink Structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030025788A (en) * 2001-09-21 2003-03-29 리드텍 리서치 인코포레이티드 Integrated apparatus for thermal dissipation
US7468887B2 (en) 2004-05-18 2008-12-23 Samsung Sdi Co., Ltd. Plasma display device
KR100708844B1 (en) * 2005-04-18 2007-04-17 삼성에스디아이 주식회사 A plasma display device
KR100728212B1 (en) * 2005-11-30 2007-06-13 삼성에스디아이 주식회사 Plasma display device
KR100749475B1 (en) * 2006-02-20 2007-08-14 삼성에스디아이 주식회사 Plasma display device

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