JP6741257B2 - Electronic device heat dissipation structure and electronic device - Google Patents

Description

The present disclosure relates to a heat dissipation structure of an electronic device and the electronic device.

A general electronic device is configured to be able to radiate heat from a heat-generating component such as a semiconductor chip mounted on a substrate. For example, in the heat dissipation structure of the electronic device of Patent Document 1, the heat generating component mounted on the substrate is brought into contact with the heat transfer protrusion formed on the resin cover member, and the heat of the heat generating component is transferred to the heat transfer protrusion. The heat is transmitted to the cover member through the heat radiation.

JP, 2009-182182, A

Since the heat dissipation structure of the electronic device of Patent Document 1 is configured to transfer the heat of the heat generating component to the cover member to dissipate the heat, the cover member is heated. Therefore, the cover member has a high temperature while the electronic device is in operation.

One of the objects to be achieved by the embodiments disclosed in the present specification is to provide a heat dissipation structure of an electronic device and an electronic device that contribute to solving the problem. It should be noted that this goal is only one of the goals that the embodiments disclosed herein seek to achieve. Other objects or problems and novel features will become apparent from the description of the present specification or the accompanying drawings.

The heat dissipation structure of the electronic device of the first aspect is
A first resin heat dissipating member that is disposed on the side of the mounting surface of the heat generating component on the board and is in contact with the heat generating component;
A second resin heat dissipating member arranged on the opposite side to the mounting surface of the heat generating component on the substrate so as to sandwich the substrate with the first resin heat dissipating member;
A cover member having a side wall portion that surrounds the first resin heat dissipation member and the second resin heat dissipation member with a gap formed between the outer surfaces of the first resin heat dissipation member and the second resin heat dissipation member. When,
Equipped with.

According to the above aspect, it is possible to provide the heat dissipation structure of the electronic device and the electronic device capable of suppressing the heating of the cover member during the operation of the electronic device.

It is an exploded view which shows the electronic device of embodiment typically. It is sectional drawing which shows the electronic device of embodiment typically. It is sectional drawing which expands and shows the heat generating component periphery in the electronic device of embodiment. It is a perspective view which shows typically the 1st resin heat dissipation member in the electronic device of embodiment. FIG. 6 is a different perspective view schematically showing the first resin heat dissipation member in the electronic device of the embodiment. It is a perspective view which shows typically the 2nd resin heat dissipation member in the electronic device of embodiment. FIG. 7 is an exploded view showing an electronic device configured to transfer the heat transferred to the shield case covering the heat generating component to the first resin heat dissipation member via the thermal pad and the heat dissipation metal plate. FIG. 9 is a diagram schematically showing how the air outside the electronic device is guided between the first resin heat dissipation member and the second resin heat dissipation member in the electronic device of the embodiment.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. Further, in order to clarify the explanation, the following description and drawings are appropriately simplified.

FIG. 1 is an exploded view schematically showing the electronic device of this embodiment. FIG. 2 is a sectional view schematically showing the electronic device of the present embodiment. FIG. 3 is an enlarged cross-sectional view showing the periphery of the heat generating component in the electronic device of the present embodiment. In the following description, a three-dimensional (XYZ) coordinate system will be used for the sake of clarity. Here, the Z axis + side is the upper side of the electronic device, and the Z axis − side is the lower side of the electronic device.

The electronic device 1 is, for example, a wireless communication device. As shown in FIG. 1, the electronic device 1 includes a substrate 2 and a heat dissipation structure 3. In order to realize the function of the electronic device 1, the board 2 has the heat-generating component 4 mounted on at least one of the X-axis + side surface and the X-axis − side surface of the board 2. The heat generating component 4 is a semiconductor chip or the like.

In this embodiment, as the heat generating component 4, as shown in FIGS. 1 and 2, two heat generating components 4a and 4b are mounted on the surface of the substrate 2 on the X axis + side, and the heat generating component 4 on the X axis − side of the substrate 2 is mounted. Although one heat-generating component 4c is mounted on the surface, the mounting surface and the number of heat-generating components 4 can be appropriately changed.

The heat dissipation structure 3 radiates the heat of the heat generating component 4. The heat dissipation structure 3 includes a first resin heat dissipation member 10, a second resin heat dissipation member 11, and a cover member 12. Here, in the present embodiment, the heat dissipation structure 3 further includes a shield case 13 and a thermal pad 14.

As shown in FIGS. 1 and 3, the shield case 13 covers the heat-generating component 4. Specifically, the shield case 13 has a box-shaped basic form so as to cover the surface of the heat-generating component 4. The shield case 13 is made of, for example, metal so as to suppress the intrusion of electromagnetic waves from the outside.

The surface of the shield case 13 opposite to the substrate 2 is formed as a flat surface substantially parallel to the YZ plane. However, the shape and material of the shield case 13 can be changed according to the type of the electronic device 1, and may be made of resin, for example.

As shown in FIGS. 2 and 3, the thermal pad 14 is arranged between the heat generating component 4 and the shield case 13. Specifically, the thermal pad 14 is a sheet body formed in a shape capable of covering the surface of the heat-generating component 4 on the opposite side to the substrate 2, for example, a substantially rectangular shape. The thermal pad 14 is made of a material capable of transmitting the heat of the heat-generating component 4, for example, urethane resin. However, the shape and material of the thermal pad 14 can be appropriately selected according to the shape of the heat generating component 4, the heat generation temperature, and the like.

The surface of the thermal pad 14 on the side of the substrate 2 is substantially in surface contact with the surface of the heat-generating component 4 on the side opposite to the substrate 2, and the surface of the thermal pad 14 on the side opposite to the substrate 2 is on the shield case 13. Substantially surface contact is made with the surface (inner surface) on the substrate 2 side. Therefore, the heat of the heat-generating component 4 is transferred to the shield case 13 via the thermal pad 14 as well as the substrate 2.

The first resin heat radiation member 10 is arranged on the X axis + side with respect to the substrate 2. Here, FIG. 4 is a perspective view schematically showing the first resin heat dissipation member in the electronic device of the present embodiment. FIG. 5 is a different perspective view schematically showing the first resin heat radiation member in the electronic device of the present embodiment.

Specifically, as shown in FIGS. 2 and 4, the first resin heat dissipation member 10 has a substantially C-shaped basic shape as viewed from the Y axis + side. As shown in FIGS. 4 and 5, the first resin heat dissipation member 10 includes a first horizontal portion 10a, a second horizontal portion 10b, a vertical portion 10c, a claw portion 10d, and an engaging protrusion 10e. I have it.

The first horizontal portion 10a projects toward the X axis + side from the Z axis + side end of the vertical portion 10c. The second horizontal portion 10b protrudes from the Z-axis-side end of the vertical portion 10c toward the X-axis + side. The vertical portion 10c connects the first horizontal portion 10a and the second horizontal portion 10b.

As shown in FIGS. 2 and 5, the claw portion 10d projects from the Z-axis + side end of the vertical portion 10c toward the X-axis − side, and the Z-axis + side end of the substrate 2 is hooked. There is. The engaging projection 10e projects from the end of the vertical portion 10c on the −Z axis side to the −X axis side, and has a plate-like shape that is substantially parallel to the XY plane.

In the first resin heat radiation member 10 as described above, a part of the vertical portion 10c is mounted on the surface of the substrate 2 on the X axis + side while being arranged on the X axis + side of the substrate 2. It is in contact with the X-axis + side surface of the shield case 13 that individually covers the heat-generating components 4a and 4b. Thereby, the heat of the heat generating components 4 a and 4 b is transmitted to the first resin heat radiation member 10 via the thermal pad 14 and the shield case 13.

At this time, the X-axis-side surface of the vertical portion 10c and the X-axis + side surface of the shield case 13 that individually cover the heat-generating components 4a and 4b mounted on the X-axis + side surface of the substrate 2 are respectively provided. It is preferable that the first flat surface 10f and the second flat surface 10g that are substantially in surface contact be formed. Thereby, the heat of the heat generating components 4a and 4b can be efficiently transmitted to the first resin heat dissipation member 10.

The first flat surface 10f and the second flat surface 10g preferably have a shape capable of making substantially surface contact with the entire area of the X-axis + side of the shield case 13. By the way, in FIG. 5, the first flat surface 10f, which is substantially in surface contact with the shield case 13 that covers the heat-generating component 4a, is shown by hatching toward the Y axis − side as it goes toward the Z axis − side, and goes toward the Z axis − side. Therefore, the second flat surface 10g that is substantially in surface contact with the shield case 13 that covers the heat-generating component 4b is shown by hatching toward the Y axis + side.

The second resin heat dissipation member 11 is arranged on the X axis − side with respect to the substrate 2 such that the substrate 2 is sandwiched between the first resin heat dissipation member 10 and the second resin heat dissipation member 11. .. Here, FIG. 6 is a perspective view schematically showing the second resin heat dissipation member in the electronic device of the present embodiment.

Specifically, as shown in FIG. 2, the second resin heat dissipation member 11 has a substantially C-shaped basic shape when viewed from the Y-axis + side. And the 2nd resin heat dissipation member 11 is provided with the 1st horizontal part 11a, the 2nd horizontal part 11b, the vertical part 11c, the nail|claw part 11d, the support part 11e, and the engagement groove part 11f.

The first horizontal portion 11a projects from the end of the vertical portion 11c on the Z axis + side toward the X axis − side. The second horizontal portion 11b projects in the X-axis-side from the Z-axis-side end of the vertical portion 11c. The vertical portion 11c connects the first horizontal portion 11a and the second horizontal portion 11b.

The claw portion 11d projects from the end portion on the Z axis + side of the vertical portion 11c to the X axis + side, and the end portion on the Z axis + side of the substrate 2 is hooked. Here, the claw portions 11d are alternately arranged when viewed from the Z-axis direction so as not to interfere with the claw portions 10d of the first resin heat dissipation member 10.

The support portion 11e projects from the Z-axis-side end of the vertical portion 11c to the X-axis + side, and the substrate 2 is sandwiched between the first resin heat dissipation member 10 and the second resin heat dissipation member 11. In this state, the Z-axis-side end of the substrate 2 is placed.

That is, the substrate 2 is sandwiched between the first resin heat dissipation member 10 and the second resin heat dissipation member 11, and the claw portion 10d of the first resin heat dissipation member 10 and the second resin heat dissipation member 10 are provided. It is supported by the claw portion 11d of the member 11 and the support portion 11e.

The engagement groove portion 11f is formed on the surface of the support portion 11e on the +Z-axis side, and the first resin heat dissipation member 10 and the second resin heat dissipation member 11 sandwich the substrate 2 and The engaging protrusion 10e of the first resin heat radiation member 10 is engaged. As a result, the second resin heat dissipation member 11 is positioned with respect to the first resin heat dissipation member 10.

In the second resin heat dissipation member 11 as described above, a part of the vertical portion 11c is mounted on the surface of the substrate 2 on the X axis side in a state of being arranged on the X axis − side of the substrate 2. The X-axis-side surface of the shield case 13 that covers the heat-generating component 4c and the region where the heat-generating component 4a is arranged are in contact with the substrate 2 so as to cover the X-axis-side via the substrate 2.

As a result, the heat of the heat generating component 4a is transferred to the second resin heat dissipation member 11 via the substrate 2. Further, the heat of the heat generating component 4c is transferred to the second resin heat dissipation member 11 via the thermal pad 14 and the shield case 13.

At this time, the surface of the vertical portion 11c on the +X-axis side may be provided with a first flat surface 11g and a second flat surface 11h, as shown in FIG. The first flat surface 11g is substantially in surface contact with the X-axis-side surface of the shield case 13 that covers the heat-generating component 4c mounted on the X-axis-side surface of the substrate 2.

The second flat surface 11h is arranged so as to face the first flat surface 10f that is substantially in surface contact with the shield case 13 that covers the heat-generating component 4a in the first resin heat dissipation member 10, and at least the heat-generating component 4a is disposed. Substantially surface contact is made with the substrate 2 so as to cover the formed region from the X-axis-side via the substrate 2.

Thereby, the heat of the heat generating components 4a and 4c can be efficiently transmitted to the second resin heat dissipation member 11. The first flat surface 11g preferably has a shape capable of covering the entire area of the X-axis-side surface of the shield case 13. Further, the second flat surface 11h may have a shape capable of covering at least the entire region where the heat-generating component 4a is arranged from the X-axis-side through the substrate 2.

By the way, in FIG. 6, the first flat surface 11g is shown by hatching toward the Y axis − side as it goes toward the Z axis − side, and the second flat surface is shown by hatching toward the Y axis + side as it goes toward the Z axis − side. 11h is shown.

As shown in FIG. 1, the cover member 12 includes a cover main body portion 12a and a bottom portion 12b, and is made of resin, for example. The cover body portion 12a includes a side wall portion 12c and a ceiling portion 12d. The side wall portion 12c has a cylindrical shape as a basic form, and as shown in FIG. It is arranged so as to surround the heat dissipation member 10 and the second resin heat dissipation member 11.

Specifically, the first resin heat dissipation member 10 and the second resin heat dissipation member 10 are provided between the inner peripheral surface of the side wall portion 12c and the outer peripheral surfaces of the first resin heat dissipation member 10 and the second resin heat dissipation member 11. A gap is formed so that heat can be prevented from being transferred from the resin heat dissipation member 11 to the side wall portion 12c. That is, the gap between the inner peripheral surface of the side wall portion 12c and the outer peripheral surfaces of the first resin heat dissipation member 10 and the second resin heat dissipation member 11 functions as a heat insulating layer.

The ceiling portion 12d closes the opening of the side wall portion 12c on the +Z axis side. The bottom portion 12b is fixed to the lower portion of the side wall portion 12c so as to cover the opening on the Z axis − side of the side wall portion 12c. Inside the cover member 12, the first resin heat dissipation member 10 and the second resin heat dissipation member 11 are housed in such a state that the substrate 2 is sandwiched between the first resin heat dissipation member 10 and the second resin heat dissipation member 11. The second resin heat dissipation member 11 is fixed to the ceiling portion 12d by the bolts 15, so that the substrate 2, the first resin heat dissipation member 10 and the second resin heat dissipation member 11 are fixed to the cover member 12. ing.

Further, an engaging protrusion 10h projecting from the Z-axis-side surface of the second horizontal portion 10b of the first resin heat dissipation member 10 to the Z-axis-side is formed on the Z-axis + side surface of the bottom portion 12b. The engagement protrusion (not shown) that is engaged with the first engagement recess 12e and projects from the Z-axis-side surface of the second horizontal portion 11b of the second resin heat dissipation member 11 to the Z-axis-side. (Omitted) is engaged with the second engaging recess 12f formed on the surface of the bottom portion 12b on the −Z axis side, so that the substrate 2, the first resin heat dissipation member 10 and the second resin heat dissipation member are formed. 11 is fixed to the cover member 12.

As described above, the heat dissipation structure 3 and the electronic device 1 are spaced apart from the outer surfaces of the first resin heat dissipation member 10 and the second resin heat dissipation member 11 to form the first resin heat dissipation member 10 as described above. Further, the side wall portion 12c of the cover member 12 is arranged so as to surround the second resin heat dissipation member 11. Therefore, heating of the cover member 12 can be suppressed while the electronic device 1 is in operation.

Here, FIG. 7 is an exploded view showing an electronic device configured to transfer the heat transferred to the shield case covering the heat-generating component to the first resin heat dissipation member via the thermal pad and the heat dissipation metal plate. .. The first resin heat dissipation member 10 of the electronic device 100 shown in FIG. 7 has a structure in which a heat dissipation fin 10i described later is omitted.

The electronic device 100 shown in FIG. 7 is configured to transfer the heat of the heat generating components 4a and 4b to the first resin heat dissipation member 10 via the thermal pad 101 and the heat dissipation metal plate 102. Therefore, in the electronic device 100 shown in FIG. 7, the number of required thermal pads is increased and the cost is increased as compared with the electronic device 1 of the present embodiment, and the assembly of the electronic device 100 is complicated. Further, since the electronic device 100 shown in FIG. 7 uses the heat dissipation metal plate 102, when the electronic device 100 is configured as a wireless communication device, the antenna characteristics are adversely affected.

On the other hand, the electronic device 1 of the present embodiment can reduce the number of required thermal pads as compared with the electronic device 100 shown in FIG. 7, can reduce the cost, and can easily assemble the electronic device 1. Is. Further, since the heat-dissipating metal plate 102 is not used, when the electronic device 1 is configured as a wireless communication device, it is possible to reduce adverse effects on antenna characteristics.

As shown in FIG. 2, the heat dissipation structure 3 of the present embodiment may further include a first ventilation path 16 and a second ventilation path 17. Specifically, the first ventilation passage 16 includes an intake port (first intake port) 16a formed in a lower portion (for example, the bottom portion 12b) of the cover member 12, and a second ventilation port of the first resin heat dissipation member 10. A first penetrating portion 16b formed on the horizontal portion 10b, a second penetrating portion 16c formed on the first horizontal portion 10a of the first resin heat dissipation member 10, and an upper portion of the cover member 12 (for example, a ceiling). An exhaust port (first exhaust port) 16d formed in the portion 12d) is provided.

At this time, air is heated in the gap between the first resin heat dissipation member 10 and the cover member 12 by the heat transferred from the heat generating component 4 to the first resin heat dissipation member 10. As a result, an updraft is generated in the gap between the first resin heat radiation member 10 and the cover member 12.

As a result, the air outside the electronic device 1 is sucked through the intake port 16a and passes through the first penetrating portion 16b, the gap between the first resin heat radiation member 10 and the cover member 12, and the second penetrating portion 16c. Then, the gas is exhausted from the exhaust port 16d. As described above, the first ventilation passage 16 is configured to allow air to pass through the gap between the first resin heat dissipation member 10 and the cover member 12.

The second ventilation passage 17 is configured to be substantially the same as the first ventilation passage 16, and thus the overlapping description will be omitted, but an intake port (for example, a bottom portion 12b) formed in the lower portion of the cover member 12 ( Second intake port) 17a, a first penetrating portion 17b formed in the second horizontal portion 11b of the second resin heat dissipation member 11, and a first horizontal portion 11a of the second resin heat dissipation member 11. It has the 2nd penetration part 17c formed and the exhaust port (2nd exhaust port) 17d formed in the upper part (for example, ceiling part 12d) of cover member 12.

Therefore, the air outside the electronic device 1 is taken in through the intake port 17a and passes through the first penetrating portion 17b, the gap between the second resin heat radiation member 11 and the cover member 12, and the second penetrating portion 17c. Is exhausted from the exhaust port 17d. In this way, the second ventilation path 17 is configured to allow air to pass through the gap between the second resin heat dissipation member 11 and the cover member 12.

With such a configuration, it is possible to suppress heat from being accumulated inside the cover member 12 and improve the cooling efficiency of the heat-generating component 4. By the way, in FIG. 2, the flow of air in the first ventilation passage 16 and the second ventilation passage 17 is shown by hatched arrows.

At this time, as shown in FIG. 4, a radiation fin (first radiation fin) 10i may be provided on the surface of the vertical portion 10c of the first resin heat radiation member 10 on the X axis + side. The radiating fin 10i protrudes from the surface of the vertical portion 10c on the X axis + side toward the X axis + side and extends in the Z axis direction. Such a radiation fin 10i is arranged in the first ventilation path 16.

Although not shown, it is preferable that the vertical portion 11c of the second resin heat dissipation member 11 has a heat dissipation fin (second heat dissipation fin) on the X-axis-side surface. The heat radiation fins of the second resin heat radiation member 11 project from the X-axis-side surface of the vertical portion 11c to the X-axis-side, and extend in the Z-axis direction. Such heat radiation fins are arranged in the second ventilation path 17.

With such a configuration, it is possible to increase the contact area between the air passing through the first ventilation passage 16 and the second ventilation passage 17 and the first resin heat radiation member 10 and the second resin heat radiation member 11. Therefore, the cooling efficiency of the heat generating component 4 can be further improved.

When the exhaust ports 16d and 17d are formed in the ceiling portion 12d of the cover member 12, the cover member 12 is spaced from the exhaust ports 16d and 17d in the Z-axis direction as shown in FIG. Therefore, it is preferable to provide a lid portion 12g that covers the exhaust ports 16d and 17d. This can prevent the user from touching the exhaust ports 16d and 17d.

Further, in the heat dissipation structure 3, the air sucked through the intake ports 16a or 17a is provided with a gap between the first resin heat dissipation member 10 and the cover member 12 or a gap between the second resin heat dissipation member 11 and the cover member 12. Not only that, it is preferable that the structure can be introduced between the first resin heat dissipation member 10 and the second resin heat dissipation member 11.

FIG. 8 is a diagram schematically showing how the air outside the electronic device is guided between the first resin heat dissipation member and the second resin heat dissipation member in the electronic device of the present embodiment. By the way, in FIG. 8, the flow of air guided between the first resin heat dissipation member 10 and the second resin heat dissipation member 11 is indicated by hatched arrows.

As shown in FIG. 8, the vertical portion 11c of the second resin heat dissipation member 11 extends to the Z axis − side with respect to the vertical portion 10c of the first resin heat dissipation member 10, and the second resin The support portion 11e of the heat dissipating member 11 extends to the Z-axis-side region of the second horizontal portion 10b of the first resin heat dissipating member 10.

The guide wall 12h projects from the surface of the bottom portion 12b of the cover member 12 on the +Z axis side. At least a part of the guide wall 12h is arranged substantially parallel to the YZ plane, and the end portion of the guide wall 12h on the Z axis + side is on the X axis + side of the support portion 11e of the second resin heat dissipation member 11. It has reached the end.

Further, in order to guide air between the first resin heat dissipation member 10 and the second resin heat dissipation member 11, the Z-axis-side end of the vertical portion 10c of the first resin heat dissipation member 10 is introduced. A through portion 10j and a hollow portion 10k are formed.

With such a configuration, the air taken in through the intake port 16a of the first ventilation path 16 is guided to the gap between the first resin heat dissipation member 10 and the cover member 12 from the first penetrating portion 16b, and The second horizontal portion 10b of the first resin heat radiation member 10, the guide wall 12h, and the support portion 11e of the second resin heat radiation member 11 lead to the penetrating portion 10j and enter the hollow portion 10k from the penetrating portion 10j. To do.

That is, the second horizontal portion 10b of the first resin heat dissipation member 10, the guide wall 12h, and the support portion 11e of the second resin heat dissipation member 11 allow the inhaled air to flow between the first resin heat dissipation member 10 and the first resin heat dissipation member 10. It functions as a guiding part to be guided between the resin heat dissipation member 11 and the second resin heat dissipation member 11. The air that has entered the hollow portion 10k rides on the rising air current and passes between the first resin heat dissipation member 10 and the second resin heat dissipation member 11.

Thereby, the heat of the shield case 13 can be dissipated, and the cooling efficiency of the heat-generating component 4 can be further improved. The configuration of the guide portion is not limited to the above, and the air sucked from the intake port 16a or 17a can be guided between the first resin heat dissipation member 10 and the second resin heat dissipation member 11. Any configuration will do.

The above-described embodiments are merely examples of application of the technical idea obtained by the inventor of the present invention. That is, the technical idea is not limited to the above-described embodiment, and it goes without saying that various modifications can be made.

The electronic device 1 according to the above-described embodiment is not limited to the wireless communication device, but may be any electronic device in which the heat-generating component 4 is mounted on the substrate 2. In that case, the shield case 13 and the thermal pad 14 may be omitted. Good.

DESCRIPTION OF SYMBOLS 1 electronic device 2 substrate 3 heat dissipation structure 4 (4a, 4b, 4c) heat generating component 5 cover member 10 first resin heat dissipation member 11 second resin heat dissipation member,
12 cover member, 12c side wall

Claims (9)

A first resin heat dissipating member that is disposed on the side of the mounting surface of the heat generating component on the board and is in contact with the heat generating component;
A second resin heat dissipating member arranged on the opposite side to the mounting surface of the heat generating component on the substrate so as to sandwich the substrate with the first resin heat dissipating member;
A cover member having a side wall portion that surrounds the first resin heat dissipation member and the second resin heat dissipation member with a gap formed between the outer surfaces of the first resin heat dissipation member and the second resin heat dissipation member. When,
A first intake port formed in the lower portion of the cover member for sucking air from the outside of the cover member; and a first exhaust port formed in the upper portion of the cover member for discharging the sucked air. A first ventilation path through which air passes through a gap between the first resin heat dissipation member and the cover member;
A second intake port formed in the lower part of the cover member for intake of air from the outside of the cover member; and a second exhaust port formed in the upper part of the cover member for exhausting the intake air. A second air passage through which air passes through a gap between the second resin heat dissipation member and the cover member;
A heat dissipation structure for electronic equipment. At least a part of the second resin heat radiation member contacts the substrate so as to cover a region where the heat generating component is arranged from a side opposite to a mounting surface of the heat generating component on the substrate. The heat dissipation structure for electronic devices described in. Said cover member includes a cover portion for covering the first outlet and the second outlet and said with a gap first outlet and the second outlet, according to claim 1 or 2 Heat dissipation structure for electronic devices. The intake air of an inductively portion for guiding between said second resin heat radiation member and the first resin heat radiating member, the heat radiating structure for an electronic device according to any one of claims 1 to 3 .. The heat dissipation of the electronic device according to any one of claims 1 to 4 , wherein the first resin heat dissipation member includes a first heat dissipation fin formed on an outer surface of the first resin heat dissipation member. Construction. The heat dissipation of the electronic device according to any one of claims 1 to 5 , wherein the second resin heat dissipation member includes a second heat dissipation fin formed on an outer surface of the second resin heat dissipation member. Construction. It said first resin heat radiation member includes a first planar surface that contacts the heat generating component, the heat dissipation structure of the electronic device according to any one of claims 1 to 6. The second resin heat dissipation member includes a second flat surface facing the first flat surface,
The electronic device according to claim 7 , wherein the second flat surface is in contact with the substrate so as to cover at least a region where the heat-generating component is arranged from a side opposite to a mounting surface of the heat-generating component on the substrate. Heat dissipation structure. A heat dissipation structure for an electronic device according to any one of claims 1 to 8 ,
A board on which the heat generating component is mounted,
An electronic device comprising:

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