KR101996616B1 - Electronic device having a heat radiating apparatus - Google Patents

Abstract

The present invention provides electronic equipment having a heat radiating device capable of increasing heat radiation efficiency. The electronic equipment comprises: at least two heat radiation sources; a heat radiation unit provided between the at least two heat radiation sources; a housing provided to cover the heat radiation sources; and a coupling unit provided at a side surface of the heat radiation unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic device having a heat-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a heat dissipating device, and more particularly to an electronic device having a heat dissipating function by forced air cooling in a structure having high rigidity.

2. Description of the Related Art Generally, an electronic apparatus is provided with a circuit board inside a housing (or case) that forms an external shape. On the circuit board, various components for implementing the functions of the electronic apparatuses are mounted. Some components generate a lot of heat during operation. For example, components such as a central processing unit (CPU), a thermoelectric element, and a power transistor generate high temperature heat during operation. If the temperature of such a part exceeds the proper temperature, an operation error of the electronic device may occur. In severe cases, the component or the electronic device may be damaged. Therefore, the heat source of the electronic device, that is, the component that generates a lot of heat, must be sufficiently cooled.

A heat dissipating device is provided to dissipate the heat generated inside the electronic device. The construction of an electronic device having a conventional heat dissipating device will be described with reference to Figs. 1 to 4. Fig. Here, FIG. 1 is a perspective view, FIG. 2 is a top view, FIG. 3 is a front view, and FIG. 4 is a side view. 1 to 4, the electronic device includes at least two heat sources 11 and 12, heat radiation fins 21 and 22 provided outside the heat sources 11 and 12, heat radiation fins 21 and 22, And a cooling fan 30 connected thereto. The housing 40 covers upper and lower portions of the heat sources 11 and 12 and the heat radiating fins 21 and 22 and a side surface opposed to the cooling fan 30. At this time, the housing 40 exposes the radiating fins 21 and 22 in the direction opposite to the cooling fan 30, so that a part of the radiating fins 21 and 22 is exposed to the outside.

The electronic device according to the related art has a structure in which the radiating fins 21 and 22 are vertically erected with the heat generating sources 11 and 12 to contact the radiating fins 11 and 12 and the cooling fan 30 connected to one side of the radiating fins 21 and 22. [ And the outside air is sucked through the air ducts of the radiating fins 21 and 22, that is, the cooling air passages, to exchange heat with the radiating fins 21 and 22. That is, conventionally, the heat radiation fins 21 and 22 are placed outside the heat sources 11 and 12, respectively, and the cooling fan 30 is driven, And the heat is exchanged to the radiating fins 21 and 22 by the forced air cooling method. Therefore, the air flow A from the heat radiating fins 21 and 22 exposed to the outside through the inside of the heat radiating fins 21 and 22 to the cooling fan 30 is generated.

In order to support the heat dissipation fins 21 and 22, the conventional cooling system has to be provided with the external fastening portions 50 below the heat dissipation fins 21 and 22 as shown in FIGS. 1 and 2, It is necessary to reinforce its own rigidity, so that the weight is increased. Further, since the cooling fan 30 is provided at a position partially deviated from the radiating fins 21 and 22, and the air duct is formed in a long and curved shape, a pressure drop of the air may be generated. That is, the flow of air passing through the radiating fins 21 and 22 may be weakened and the heat dissipation efficiency may be deteriorated. In order to reduce the pressure drop of the air, additional air ducts must be installed. The side fins 21 and 22 may be formed on the outer surface of the housing by machining a side housing for coupling the side faces of the heat sources 11 and 12 with the heat radiating fins 21 and 22 Can be used. In this case, an additional cover (41 in Fig. 3) in the form of a plate for controlling the flow of the cooling air A and mechanically protecting the radiating fins 21, 22 themselves is required. In addition, the total area may be increased in order to efficiently utilize the area (60 of FIGS. 2 and 3) for heat exchange between the heat sources 11 and 12 and the heat radiating fins 21 and 22.

Korean Patent No. 10-1831196 Korean Patent No. 10-1325569

The present invention provides an electronic apparatus having a heat dissipation device capable of improving heat dissipation efficiency.

The present invention provides an electronic device having a heat dissipating device that can realize space efficiency, light weight, and high rigidity by integrating a supporting structure and a heat dissipating structure.

An electronic device according to an aspect of the present invention includes at least two heat sources; A heat dissipation unit provided between the at least two heat sources; A housing provided to cover the heat source; And a fastening portion provided on a side surface of the heat dissipating portion.

The heat dissipating unit is opened at one side and the other side opposite to each other in the first direction.

The fastening portion is provided in a second direction orthogonal to the first direction and the heat dissipating portion and the heat generating source are provided in a vertical direction.

The heat dissipation unit includes two heat dissipation plates spaced apart from each other, a side plate provided between the two heat dissipation plates in the second direction, and a plurality of heat dissipation fins provided between the two heat dissipation plates.

The fastening portion is provided in contact with the side plate, and the heat generating source is provided in contact with the heat dissipating plate.

The fastening portion includes a fastening hole provided in a vertical direction.

And a cooling fan provided at one side of the heat dissipation unit which is opened in a first direction.

According to another aspect of the present invention, there is provided an electronic apparatus including: a heat dissipation unit having a plurality of heat dissipation fins protruding in one direction; A heat generating unit arranged to be in contact with the heat dissipating unit in a protruding direction of the heat dissipating fin; A housing that exposes at least a part of the heat dissipation unit and seals the heat dissipation unit; And a fastening portion provided on at least one side of the heat dissipating portion.

And a cooling fan provided on at least a part of the heat-radiating portion exposed by the housing.

According to another aspect of the present invention, there is provided an electronic apparatus including: a heat dissipation unit generating an air flow in a first horizontal direction; At least two heat sources arranged to be respectively in contact with one surface and the other surface of the heat dissipating unit in a vertical direction; A housing covering the first and second heat sources in a vertical direction and opening the heat radiation portion in a first horizontal direction; A cooling fan provided on one side of the heat dissipating unit in a first horizontal direction; And a fastening portion provided on a side surface of the heat radiation portion in a second horizontal direction orthogonal to the first horizontal direction.

The present invention provides a heat dissipation unit including a heat dissipation fin inside a housing of an electronic apparatus. That is, the heat dissipating unit and the heat generating unit are provided inside the tubular housing. At this time, the heat radiating portion is provided in the horizontal direction and the heat generating source is provided in the horizontal direction so as to contact the heat radiating portion.

Therefore, the present invention can eliminate the disadvantages of the housing to which the conventional technology is applied and achieve high structural rigidity. In addition, the heat dissipating fins for heat exchange can be connected to each other to have high rigidity. If the number of heat dissipating fins is increased to increase the heat exchange efficiency by increasing the contact area of the heat dissipating fins and air, the rigidity of the housing and the inner assembly as a whole may increase . Also, the air flow introduced from the outside by the cooling fan is maintained in the form of a straight line without bending or narrowing the channel, so that the pressure loss can be reduced as compared with the conventional one, and the heat radiation efficiency can be improved. In addition, in the past, it is necessary to add a cover part to protect the shape of the heat dissipating fin and to form a channel of sucked air, but such an additional part is not required in the present invention. On the other hand, since the outer fastening portion is provided in a shape in which the distance from the center of gravity is shortened, the supporting path is shortened, and as a result, the overall stability and higher rigidity can be obtained.

1 to 4 are schematic views of an electronic device having a heat dissipating device according to a conventional example.
5 to 9 are schematic views of an electronic apparatus having a heat dissipating device according to an embodiment of the present invention.
10 and 11 are schematic views of a heat dissipating device according to an embodiment of the present invention;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely. In the drawings, the thickness is enlarged to clearly illustrate the various layers and regions, and the same reference numerals denote the same elements in the drawings.

5 to 9 are schematic views of an electronic apparatus having a heat dissipating device according to an embodiment of the present invention. 5 is a perspective view, Fig. 6 is a perspective view, Fig. 7 is a top view, Fig. 8 is a front view, and Fig. 9 is a side view. 10 and 11 are views for explaining an example of a heat dissipating device according to an embodiment of the present invention, FIG. 10 is a perspective view for explaining the shape of the heat dissipating fin, and FIG. 11 is a cross- Fig.

5 to 9, an electronic apparatus having a heat dissipating device according to an embodiment of the present invention includes a heat generating source 110, 120, and 100, a heat dissipating unit 200 provided between the two heat generating sources 110 and 120, A cooling fan 300 connected to the heat dissipating unit 200, housings 410, 420 and 400 provided to cover the heat generating sources 110 and 120 and a fastening unit 500 ). Here, the heat dissipation unit 200 and the two heat sources 100 may be provided in a vertical direction. That is, the first and second heat sources 110 and 120 may be provided in the vertical direction with the heat dissipation unit 200 interposed therebetween. The height of the heat dissipation unit 200 and the height of the heat dissipation unit 200 to the housing 400 covering the heat source 100 may be the same. That is, the height of the heat dissipating unit 200 and the heights of the first and second housings 410 and 420, which are respectively provided to cover the first and second heat generating units 110 and 120 from the heat dissipating unit 200, can do. However, the heights of the heat dissipating unit 200 and the first and second housings 410 and 420 from the heat dissipating unit 200 may be different depending on the shape, size, and heat generation amount of the electronic device.

The heat sources 110, 120, and 100 perform respective functions of the electronic device and generate a predetermined heat. These heat sources 110 and 120 may include a circuit board on which a plurality of passive and active elements are mounted. That is, on the circuit board, various electric and electronic parts for implementing the functions of the respective electronic devices are mounted. Also, at least some of the electrical and electronic components can generate a lot of heat during operation. For example, components such as central processing units (CPUs), thermoelectric elements, power transistors, etc., generate high temperature heat during operation. Of course, the heat sources 110 and 120 may include various components that generate heat in addition to the electrical and / or electronic components mounted on the circuit board, for example, a power supply unit. The power source device may be an external AC power source to generate at least one DC power source, and a lot of heat may be generated during operation of the power source device. On the other hand, the heat sources 110 and 120 may be provided on both sides of the heat dissipation unit 200. That is, the first and second heat sources 110 and 120 may be provided on one side and the other side of the heat dissipation unit 200, respectively. For example, the first heat generating source 110 may be provided on the upper side of the heat dissipating unit 200, and the second heat generating unit 120 may be provided on the lower side of the heat dissipating unit 200. At this time, the heat sources 110 and 120 may be provided such that a large surface thereof contacts the heat dissipation unit 200. That is, the heat sources 110 and 120 may be provided in a substantially hexahedron shape having a predetermined length and a predetermined thickness in the lateral and longitudinal directions, and the two faces of the heat sources 110 and 120, A plane larger than the three sides may have a rectangular shape, and one of two sides of the rectangle opposite to each other may be in contact with the heat dissipation unit 200. The first and second heat sources 110 and 120 may be disposed on the upper side of the heat dissipating unit 200. The heat dissipating unit 200 may be disposed horizontally so that the two sides of the heat dissipating unit 200 face upward and downward, And the lower side, respectively. Of course, the heat sources 110 and 120 may be in contact with the heat dissipation unit 200 at least one side regardless of the area. Here, the first and second heat sources 110 and 120 may have the same function and configuration, and may have different functions and configurations. For example, each of the first and second heat sources 110 and 120 may be a power supply unit or a circuit board having a plurality of components mounted thereon, and any one of the first and second heat sources 110 and 120 may be a power supply unit And the other may be a circuit board.

The heat dissipation unit 200 may be provided between the first and second heat sources 110 and 120 in contact therewith. The heat dissipation unit 200 may have a substantially hexahedral shape. That is, the heat dissipating unit 200 may have four planes between two planes having two planes that contact one face of each of the first and second heat sources 110 and 120. At this time, two sides of the four sides of the heat dissipation unit 200 facing each other may be opened. That is, the two sides may be opened in the air flow direction corresponding to the position of the cooling fan 300 such that an air passage through which air flows through the inside of the heat dissipation unit 200 is opened. The heat dissipating unit 200 includes two heat dissipating plates 210 and a plurality of heat dissipating fins 220 provided between the two heat dissipating plates 210 and a side plate 230 provided on two sides between the two heat dissipating plates 210 . That is, the heat dissipating unit 200 includes two heat dissipating plates 210 spaced from each other by a predetermined distance, a side plate 230 provided on two sides between the two heat dissipating plates 210, two heat dissipating plates 210, And a plurality of heat dissipation fins 220 may be provided in the space formed by the two side plates 230. At this time, the two heat sinks 210 form a flat plate contacting the first and second heat sources 110 and 120, and the two side plates 230 seal the two sides between the two heat sinks 210 . Therefore, a passage through which the air flows can be maintained through two mutually opposed sides where the two side plates 230 are not formed. Meanwhile, the heat dissipation unit 200 may be applied to a body by applying a metal printing processing technique. That is, the heat radiating plate 210, the heat radiating fin 220, and the side plate 230 may be separately manufactured and joined together, or may be fabricated into a single body.

The heat sink 210 may be provided in a substantially rectangular plate shape having a predetermined thickness. In addition, two heat sinks 211, 212 and 210 may be spaced apart from each other by a predetermined distance, and first and second heat sources 110 and 120 may be in contact with one surface of each of the two heat sinks 211 and 212 . For example, the heat dissipation unit 200 may be provided in a horizontal direction so that the first and second heat dissipation plates 211 and 212 are vertically spaced apart from each other. At this time, the heat sink 210 may be formed to have a size larger than that of the heat sources 110 and 120 depending on the shape of the heat sources 110 and 120. That is, the heat sink 210 may have an area larger than the area of one plane of the heat sources 110 and 120. When the size of the heat sink 210 is smaller than that of the heat sources 110 and 120, the heat sink 210 may not be in contact with the heat sink 200, The heat sources 110 and 120 are preferably provided. The heat sink 210 may be formed of a material having a high thermal conductivity, for example, a metal material such as copper or aluminum. Of course, the heat sink 210 may be formed of a material having a high thermal conductivity in addition to the metal. Each of the heat sinks 210 may have a predetermined structure. 11, the mesh structure 213 may be formed inside the heat dissipating plate 210 to improve the thermal conductivity, or may be filled with, for example, a mixture of graphite particles and nickel particles. That is, each of the heat sinks 210 has a predetermined plate shape, and a space is provided therein to fill the mesh structure 213, or a material having a high thermal conductivity, such as a mixture of graphite particles and nickel particles, have. Since the heat sink 210 has a predetermined structure inside the heat sink 210, the heat sink 210 can function as a heat spreader to dissipate the heat of the heat sinks 110 and 120 more efficiently.

The radiating fins 220 may be vertically provided between the two heat sinks 210. The plurality of radiating fins 220 may be spaced apart from each other to form an air flow passage. At this time, the plurality of radiating fins 220 may be formed in various shapes. Examples of the shapes of the radiating fins 220 are shown in Figs. 9 (a) and 9 (b). For example, the plurality of radiating fins 220 may be provided in a flat plate shape having a predetermined thickness as shown in FIG. 10 (a), or may be formed in a predetermined interval in the horizontal direction orthogonal to each other as shown in FIG. 10 (b) And may have a substantially hexahedral shape having the same size. Of course, it may be provided in a cylindrical shape having a predetermined distance in one direction and another direction orthogonal to the one direction. The radiating fins 220 may be made of the same material as the radiating plate 210. The radiating fin 220 may be integrally formed with the radiating plate 210, or may be coupled to the radiating plate 210. 11, a capillary groove 221 may be formed in a vertical direction inside the radiating fin 220 so as to prevent a temperature difference from the radiating plate 210. In addition, The mesh structure may be mounted in the same manner as the mesh structure, or the porous material may be filled in the capillary grooves formed in the longitudinal direction at regular intervals to have the heat spreader and the heat pipe function.

The side plates 231, 232, 230 may be provided to seal the two sides between the heat sinks 210. That is, the side plate 230 may be provided on two sides between the heat sinks 210 so as to form airflow passages. Accordingly, a plurality of radiating fins 220 may be provided in the space formed by the heat sink 210 and the side plate 230, and an air flow passage in one direction may be provided. The side plate 230 may be provided in a plate shape having a predetermined thickness. At this time, the side plate 230 may be formed of a metal material similar to the heat sink 210. That is, the side plate 230 may be made of the same material as the heat sink 210.

The cooling fan 300 is provided on one side of the electronic device. That is, the cooling fan 300 may be connected to the heat dissipation unit 200 and provided at one side. The cooling fan 300 may be provided on one side of the heat dissipation unit 200 to provide an air flow passage through the heat dissipation unit 200. That is, the cooling fan 300 is provided in the heat dissipating unit 200 at one side of the air flow passage and rotates to allow air to flow from the other side of the cooling fan 300 to force air to flow through the heat dissipating unit 200, . Accordingly, the airflow A from the heat radiating fin 220 exposed to the outside through the inside of the heat dissipating unit 200 to the cooling fan 300 can be generated. On the other hand, a plurality of cooling fans 300 may be provided to improve the cooling efficiency. That is, a plurality of cooling fans 300 may be provided according to the size of the heat dissipation unit 200, the size of the cooling fan 300, and the like. In the electronic device according to the present invention, the heat generated in the heat source 100 is transferred to the duct-type housing 200, that is, the heat dissipation unit 200, and the heat is exchanged with the cool air sucked into the duct by the cooling fan 300, .

The housings 410, 420, and 400 may be provided to cover electronic devices. That is, the heat source 100 and the heat dissipation unit 200 may be provided in the housing 400. At this time, the housing 400 may be provided so that one side of the heat dissipating unit 200 and the cooling fan 300 are exposed. In addition, the housing 400 may be provided to cover the first and second heat sources 100, respectively. To this end, the housing 400 may include a first housing 410 to cover the first heat source 110 and a second housing 420 to cover the second heat source 120. At this time, the first and second housings 410 and 420 may be provided so that the heat sources 110 and 120 are not in contact with each other but are spaced from each other at a predetermined interval. To this end, the housing 400 may have a shape having a substantially rectangular flat plate spaced apart from one surface of the heat source 100, and four extending plates extending from one side of the flat plate to one side. Accordingly, the four extending plates of the housing 400 are contacted with and coupled to the heat dissipating unit 200, so that the heat generating source 100 may be provided in the housing 400 so as to be separated from the housing 400. Of course, the housing 400 may be provided to cover the side surface of the heat dissipating unit 200. That is, the housing 400 may contact the side plate 230 of the heat dissipating unit 200 to cover the side plate 230.

The fastening part 500 may be provided on a side surface of the electronic device. That is, it may be provided on one side of the heat dissipation unit 200 and on the side of the electronic device in a direction orthogonal to the direction in which the cooling fan 300 is installed. At this time, the coupling part 500 may be installed on the side plate 230 when one side of the heat dissipation part 200, that is, the side plate 230 of the heat dissipation part 200 is exposed to the outside. At this time, the fastening part 500 may be provided integrally with the heat dissipating part 200. That is, the fastening part 500 may be integrally formed with the side plate 230 of the heat dissipating part 200. Of course, the coupling part 500 may be coupled to the side plate 230 of the heat dissipating part 200 using fastening means (not shown) or the like. This fastening part 500 may be provided for fastening the electronic device to another electronic device or another object. For example, if the electronic top is a power supply, a fastening part 500 may be provided to fasten the power supply to a radar device or the like. The fastening part 500 may include a fixing part fixed to the side surface of the electronic device and a fastening hole for fastening the electronic device to another electronic device or object. The fastening part is fixed to the side plate of the heat dissipating part 200 and the fastening hole can be formed in the direction of contact between the heat dissipating part 200 and the heat generating source 100, that is, the vertical direction, on the extension plate extending from the fixing part. That is, since the fastening part 500 for mounting the electronic device is fastened to the outside, it has a shape capable of forming a short support path between the center of gravity of the weight of the electronic device and the supporting part of the other electronic device or the object supporting the electronic device .

As described above, the electronic device according to an embodiment of the present invention includes the heat generating sources 110 and 120 with the heat dissipating unit 200 therebetween, and the housing 400 is provided to cover the heat generating sources 110 and 120 The fastening part 500 is provided on both sides of the heat dissipating part 200. That is, a tubular housing 400 is provided, and a heat dissipating unit 200 and a heat generating source 100 are provided in the housing 400. Here, the housing 400 is manufactured in a tubular shape and has a high rigidity to structurally support the main internal components, that is, the heat source 100. In addition, when the number of the heat dissipation fins 220 is increased to increase the heat exchange efficiency by increasing the contact area of the heat dissipation fins 220 and the air, the heat dissipation fins 220 for heat exchange can be connected to each other, 400) and the stiffness of the entire inner assembly may also increase. Also, the air flow introduced from the outside by the cooling fan 300 is maintained in the form of a straight line without bending or narrowing the channel, so that the pressure loss can be reduced as compared with the conventional one, and the heat radiation efficiency can be improved. In addition, in the past, it is necessary to add a cover part to protect the shape of the heat dissipating fin and to form a channel of sucked air, but such an additional part is not required in the present invention. On the other hand, since the fastening part 500 has a shape in which the distance between the fastening part 500 and the center of gravity is shortened, the supporting path is shortened, so that the overall stable and higher overall stiffness effect can be expected.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the embodiments are for the purpose of illustration only and are not to be construed as limitations. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

100: a heat source 200:
300: cooling fan 400: housing
500: fastening portion

Claims (10)

A heat dissipating unit having one side and the other side opposite to each other opened to generate an air flow in a first horizontal direction;
At least two heat sources which are respectively installed at upper and lower portions of the heat dissipating unit so as to be perpendicular to the first horizontal direction and which are in direct contact with upper and lower surfaces of the heat dissipating unit;
A housing installed to cover the heat dissipation unit and the two heat dissipation sources, the heat dissipation unit and the two heat dissipation units being received therein, and one side and the other side of the heat dissipation unit being opened;
A cooling fan installed at one side or the other side of the heat dissipation unit to induce an air flow; And
A fastening part provided on a side surface of the heat dissipating part; , ≪ / RTI &
The heat-
Two heat sinks in contact with the two heat sources;
A plurality of heat dissipating fins spaced apart from each other between the two heat dissipating plates, each of the plurality of heat dissipating fins having an upper end connected to one of the two heat dissipating plates and a lower end connected to the other heat dissipating plate; And
A side plate provided on a side surface of the two heat sinks in a second horizontal direction orthogonal to the first horizontal direction to seal between the two heat sinks in the second horizontal direction;
.
delete delete ◈ Claim 4 is abandoned due to the registration fee. The method according to claim 1,
Each of the two heat sinks has a plate-like outer shape, and a space is provided therein to fill a mesh structure, or a mixture of graphite particles and nickel particles having a high thermal conductivity is filled, or a capillary groove filled with a porous material is formed Electronic devices.
The method according to claim 1,
And the fastening portion is provided in contact with the side plate.
The method of claim 5,
Wherein the fastening portion includes a fastening hole provided in a vertical direction.
delete delete delete delete

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