JP2019054024A - Radiator - Google Patents

Abstract

To provide a radiator capable of efficiently dissipating heat generated from an electronic component with a simple configuration and also capable of reducing an occupied area on a circuit board.SOLUTION: A radiator 1 in contact with an electronic component 7 to dissipate heat generated from the electronic component 7 includes a heat dissipation plate 2 having a plurality of wind-receiving heat dissipation surfaces formed to be bent so as to be orthogonal in each air flow direction depending on air flows that change by on-off switching of an air-cooling fan. A wind-receiving heat dissipation surface 2A is orthogonal to a rising air flow generated around the heat dissipation plate 2, and a wind-receiving heat dissipation surface 2B is orthogonal to cooling air blown from the cooling fan. In these wind-receiving heat dissipation surfaces 2A, 2B, through holes 4 for passing the air flow to a downstream side are formed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a radiator that radiates heat generated from an electronic component.

  A heat sink (heat sink) is used to dissipate heat generated from electronic components that generate a large amount of heat, such as thyristors and power transistors. For example, there has been proposed a radiator having a plurality of heat radiating plates erected on a mounting substrate at a predetermined interval and having a tubular body inserted into a through hole formed in each of the heat radiating plates. In this radiator, cooling air is blown to the tubular body from an air cooling fan arranged opposite to the heat sink, and cooling air is blown between adjacent heat sinks from another air cooling fan arranged on the side surface (patent) Reference 1).

  Further, a heat radiator for cooling a microprocessor used in an electronic device or the like has been proposed. For example, a box-shaped radiator having a bottom surface that contacts the surface of a microprocessor, four side surfaces in which ventilation holes are formed, and an air cooling fan on the ceiling surface has been proposed (see Patent Document 2).

Japanese Patent Laid-Open No. 10-4165 JP-A-10-294582

  However, although the conventional heatsink can provide a sufficient heat dissipation effect (air cooling performance), it has a complicated structure, resulting in poor production efficiency and a large occupied area on the circuit board, which limits the degree of freedom in circuit design. There are various inconveniences such as this.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a radiator that can efficiently radiate heat generated from an electronic component with a simple configuration and can reduce an occupied area on a circuit board.

  The present invention provides the following radiator.

That is, the heat radiator according to the embodiment of the present invention has the following configuration.
A radiator that contacts an electronic component and dissipates heat from the electronic component,
There are a plurality of wind receiving and radiating surfaces that are bent so as to be substantially perpendicular to the direction of each air flow according to the air flow that changes depending on the on / off switching of the air cooling fan, and different directions among the plurality of wind receiving and radiating surfaces It is comprised by the heat sink with which the through-hole was formed for every said wind-receiving heat radiating surface extended in this.

  According to this configuration, at least one of the plurality of wind receiving and radiating surfaces when the air cooling fan is on is substantially orthogonal to the air flow direction of the cooling air of the air cooling fan, while the air flow direction of the cooling air of the air cooling fan is off when the air cooling fan is off. The other surface that is not substantially orthogonal to the airflow is substantially orthogonal to the direction of the naturally occurring airflow such as the upward airflow that exists when the air cooling fan is off. And since the through-hole through which the airflow can pass is formed in the wind receiving and radiating surface orthogonal to each air flow direction, the air flow is downstream from the through hole formed in the wind receiving and radiating surface without causing the air flow to stay. Passes and exhibits excellent heat dissipation efficiency. In addition, other surfaces that are not substantially orthogonal to the airflow direction (surfaces that are bent with respect to the wind receiving and radiating surface) also contribute to improving the radiating performance of the radiating plate as a secondary radiating surface. As a result, it is possible to effectively dissipate heat generated from the electronic components regardless of whether the air cooling fan is operated. Furthermore, since the radiator itself is a simple and compact configuration composed of a plurality of bent wind-receiving and radiating surfaces, it is excellent in production efficiency and can occupy a relatively small area on the circuit board.

  The said structure WHEREIN: It is preferable that the said heat sink contains the said wind-receiving heat radiation surface substantially orthogonal to the ascending airflow which has arisen in the circumference | surroundings.

  According to this configuration, when the air-cooling fan is turned off, a rising air flow is generated around the heat sink due to the heated air around the heat sink including heat generated by the electronic component. In this case, since the wind receiving and radiating surface of the heat sink substantially orthogonal to the rising air flow allows air to pass downstream from the through-hole formed in the wind receiving and radiating surface without retaining the air flow, excellent heat dissipation It exhibits efficiency and contributes greatly to improving the heat dissipation capacity of the heat sink. Moreover, since the other surface bent continuously with the wind receiving heat radiating surface is not orthogonal to the air flow, it contributes to the heat radiating capability of the heat radiating plate as a secondary heat radiating surface.

  Further, in the above-described configuration, it is preferable to have a leg portion that extends from the heat radiating plate, allows the heat radiating plate to be installed on the circuit board, and separates the heat radiating plate from the circuit board.

  According to this configuration, since the heat sink is installed on the circuit board by the legs and the gap is formed between the circuit board and the heat sink, air can be efficiently passed downstream through the gap. . As a result, the cooling efficiency of the electronic component is increased. In addition, an electronic component having a height lower than the height of the gap can be mounted in the gap between the heat sink and the circuit board. That is, the area occupied by the radiator on the circuit board can be reduced, and the mounting efficiency of the electronic components can be increased.

  Moreover, in the said structure, it is preferable not to have a through-hole in the predetermined area | region of the said heat sink with which the said electronic component is mounted | worn.

  According to this configuration, since the heat sink and the electronic component are brought into surface contact, the heat generated in the electronic component can be efficiently transmitted to the heat sink and radiated.

  According to the radiator of the present invention, it is possible to efficiently dissipate heat generated from the electronic component with a simple configuration, and it is possible to reduce the occupied area on the circuit board.

It is a perspective view which shows the whole structure of the heat radiator of this invention. It is a front view of the heat radiator of the present invention. It is a left view of the heat radiator of this invention. It is a right view of the heat radiator of this invention. It is a rear view of the heat radiator of this invention. It is a top view of the heat radiator of this invention. It is a schematic diagram which shows cooling of the electronic component by the heat radiator of this invention. It is a perspective view from the front side of the heat radiator of a modification. It is a perspective view from the front side of the heat radiator of another modification. It is a perspective view from the back side of the heat radiator of another modification. It is a perspective view from the front side of the heat radiator of another modification. It is a perspective view from the back side of the heat radiator of another modification. It is a schematic diagram which shows cooling of the electronic component by the heat radiator of another modification.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIG. 1, the radiator 1 according to the present embodiment includes a radiator plate 2 and leg portions 3 extending from the radiator plate 2.

  As shown in FIGS. 2 to 4, the heat radiating plate 2 has two surfaces of a rectangular first large surface 2 </ b> A and a small second surface 2 </ b> B formed by bending from one side edge of the first surface 2 </ b> A. Have. The first surface 2A and the second surface 2B function as a wind receiving and radiating surface of the present invention. Moreover, the heat sink 2 has a third surface 2C that is smaller than the second surface 2B that is bent from the other side edge of the first surface 2A.

  In the present embodiment, the first surface 2A to the second surface 2B and the third surface 2C, which serve as a base, are formed by bending a thin sheet of a galvanized steel sheet. For example, a galvanized steel sheet having a thickness of 1 mm and excellent solder wettability is used. In addition, the material of the heat sink 2 is not limited to a galvanized steel plate, It is also possible to use various metals, such as aluminum and copper excellent in thermal conductivity.

  As shown in FIG. 2, the first surface 2 </ b> A of the heat sink 2 has a first region in which a plurality of through holes 4 are formed in approximately one third on the upper side and three in the lower third. And a second region in which the through hole 5 is formed. The through holes 4 in the first region are formed in a two-dimensional two-stage shape by punching. As will be described later, the through-hole 4 allows the ascending air current generated therethrough to pass therethrough. In the present embodiment, the through hole 4 is set as follows. A triangle formed by connecting the centers of two adjacent through holes 4 on the upper side and one through hole 4 on the lower side between the two through holes 4 is set to be an equilateral triangle. For example, in this embodiment, the through hole 4 having a diameter of 4 mm is formed in the first surface 2A having a width of about 51 mm. The distance (pitch) between the centers of these through holes 4 is set to 6 mm. The diameter, the number, the pitch, and the like of the through holes 4 are appropriately changed depending on the material, shape, dimensions, material thickness, etc. of the heat sink 2 to be used.

  Three through holes 5 are formed in the second region by burring from the front side, and a flange 6 is formed on the back side as shown in FIGS. 5 and 6. That is, the through hole 5 is for fixing the electronic component 7 to the heat radiating plate 2 with the screw 8. Note that the number, position, and dimensions of the through holes 5 are appropriately changed according to the electronic component 7 to be mounted. In the present embodiment, one electronic component 7 is mounted on the first surface 2A. For example, two or more electronic components 7 having the same shape or electronic components 7 having different shapes as described later are used. Two or more can be mounted (see FIG. 8).

  The second surface 2B of the heat radiating plate 2 is bent so as to be orthogonal to the first surface 2A from one side edge of the first surface 2A. The second surface 2B is set to be approximately half the height of the first surface 2A, and the through holes 4 having the same shape as the first surface 2A are formed at equal intervals in a vertical row. Moreover, the leg part 3 is extended under the 2nd surface 2B.

  The third surface 2C of the heat radiating plate 2 is bent so as to be orthogonal to the first surface 2A from the other side edge of the first surface 2A. The third surface 2C is set to be approximately one-eighth of the first surface 2A. In the present embodiment, the through hole 5 is not formed in the third surface 2C. A leg 3 having the same shape as the second surface 2B extends below the third surface 2C.

  The leg 3 is configured to protrude a predetermined length from the lower end of the heat radiating plate 2 so that the heat radiating plate 2 can be installed on the circuit board 12. When the radiator 1 is installed on the circuit board 12, a gap is formed between the lower end of the first surface 2 </ b> A and the circuit board 12 by the pair of leg portions 3 facing each other at both ends of the first surface 2 </ b> A.

  The leg 3 has a through hole 9 and a protrusion 10. The through hole 9 is smaller than the through hole 4. The through hole 9 functions as follows. When the heat radiator 1 is mounted on the circuit board 12 and soldered, the through hole 9 prevents thermal diffusion to the heat radiating plate 2 and consequently suppresses the temperature drop of the soldered portion. That is, the through hole 9 suppresses a decrease in solder wettability of the leg portion 3.

  The protruding portion 10 is formed at the lower portion of the leg portion 3 and is inserted into an installation hole 13 formed through the circuit board 12 in the same manner as the lead terminal of the electronic component 7 as shown in FIG. The protrusion 10 is formed with a tapered notch 11 (see FIGS. 3 and 4) that engages with the installation hole 13 at a position facing in the width direction. In this embodiment, the surface having the through hole 4 is not provided in one leg, but the surface in which the through hole 4 functioning as a wind receiving and radiating surface is provided in the same manner as the other leg 3, The leg 3 may be extended from the surface.

  In the present embodiment, a notch 14 is formed at each of the two side edges of the first surface 2A of the heat radiating plate 2 and at one location of each of the second surface 2B and the third surface 2C. These notches 14 are for preventing distortion of the heat sink 2 that occurs when the second surface 2B and the third surface 2C are bent. Note that the notch 14 may not be provided if distortion is unlikely to occur depending on the material of the heat sink 2 and the bending angle.

  Next, heat dissipation of the electronic component 7 by the radiator 1 of the above embodiment will be described with reference to FIG.

<Example>
In this embodiment, one air cooling fan (not shown) is installed. The radiator 1 is attached to the circuit board 12 in a standing posture. Further, the radiator 1 is arranged such that the first surface 2A of the heat radiating plate 2 is substantially parallel to the airflow direction of the cooling air with respect to the airflow direction of the cooling air from the air cooling fan. For this reason, the 2nd surface 2B and 3rd surface 2C of the heat sink 2 are substantially orthogonal to the airflow direction of cooling air. Moreover, the 3rd surface 2C in which the through-hole 4 is not formed is arrange | positioned in the upstream of the airflow direction. As a result, the second surface 2B having a larger area than the third surface 2C is exposed to the cooling air after the first surface 2A, and secondary heat dissipation by the first surface 2A is inhibited by the second surface 2B. It is suppressed. At this time, the first surface 2A is a top surface. The air cooling fan is controlled to be turned on and off by a control unit such as a CPU (Central Processing Unit) in accordance with a temperature detected by a temperature sensor (not shown).

  When the air cooling fan is on (actuated), the radiator 1 receives the cooling air blown from the air cooling fan at the second surface 2B functioning as a wind receiving and heat radiating surface, and the through hole 4 formed in the second surface 2B. Cooling air is passed downstream from When the air cooling fan is off (stopped), the heated air around the radiator 1 including the heat generated from the electronic component 7 becomes an ascending current and passes through the through hole 4 of the first surface 2A. That is, the second surface 2B is substantially orthogonal to the airflow direction of the cooling air from the air cooling fan, and the first surface 2A is substantially orthogonal to the ascending airflow. As described above, in the present embodiment, the wind receiving and radiating surfaces extending in different directions, that is, the first surface 2A and the second surface 2B are formed with through holes through which airflow can pass, and the air cooling fan is switched on and off. Since each airflow associated with the airflow is received and the airflow is allowed to pass through without being retained, heat generated from the electronic component 7 can be effectively radiated.

  In the present embodiment, when the air-cooling fan is on, the heat generated from the electronic component 7 is secondarily dissipated from the first surface 2A, which is the mounting surface of the electronic component 7, and the second surface to the second surface 2A. The heat is transmitted to the surface 2B and the third surface 2C, and is efficiently radiated from the second surface 2B which is mainly the wind receiving and radiating surface. When the air cooling fan is off, heat generated from the electronic component 7 is mainly radiated from the first surface 2A. Since a plurality of through holes are formed in the first surface 2A, the rising airflow generated around the heat radiating plate 2 does not stay and smoothly passes downstream in the airflow direction (upward direction), and the heat dissipation efficiency Can be increased.

  Further, as described above, the radiator 1 of the present embodiment can increase the heat dissipation efficiency of the electronic component 7 with a simple configuration. Since the heat radiator 1 has a simple configuration in which a single heat radiating plate 2 is bent to provide a plurality of wind receiving and heat radiating surfaces, it is excellent in production efficiency and can occupy a small area on the circuit board.

  Furthermore, the radiator 1 is mounted on the circuit board 12 by the leg 3 and a gap is provided between the first surface 2A and the circuit board 12, so that the rise between the circuit board 12 and the radiator 1 is increased. In addition to allowing airflow to pass, the electronic component 7 having a height lower than the height of the gap can be mounted on the circuit board 12.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various design changes can be made as long as they are described in the claims. For example, the following embodiments are also included.

  (1) In the above embodiment, the gap is formed between the circuit board 12 and the first surface 2A of the heat sink 2 by the legs 3, but a configuration in which no gap is formed may be used. For example, as shown in FIG. 8, the lower portion of the first surface 2 </ b> A is expanded so as to be in contact with or close to the circuit board 12. A plurality of through holes 4 are formed in a lower region (third region) from the mounting surface of the electronic component 7. Thereby, the surface area (heat radiation area) of the first surface 2A can be increased while allowing the airflow near the surface of the circuit board 12 to pass therethrough. In the present embodiment, the size of the through hole 4 formed in the third region is set to be the same as that of the first region, but may be a different size, and the number of the through holes 4 is also different. It may be.

  (2) In the above embodiment, only two surfaces functioning as the wind receiving heat radiation surface and the secondary heat radiation surface are provided, but three or more surfaces may be provided. For example, as shown in FIGS. 9 and 10, the second surface 2B is expanded to the same height as the first surface 2A, and the upper and lower portions of the first surface 2A are extended to bend to the back side, The surface 2D and the fifth surface 2E are formed. The fourth surface 2D and the fifth surface 2E are set to have the same depth length on the back side as the second surface 2B. In the present embodiment, the through hole 4 is not formed in the fourth surface 2D and the fifth surface 2E.

  According to this configuration, when the radiator 1 of the modified example is installed on the circuit board 12 in the same posture as the radiator 1 shown in FIG. 7 and the air cooling fan is turned off (stopped), the fourth surface 2D and the fourth surface 2D Since the 5th surface 2E is not orthogonal to the ascending airflow, the heat dissipation efficiency is inferior to that of the first surface 2A, but contributes to the improvement of the heat dissipation capability of the heat sink as a secondary heat dissipation surface. In addition, when the air cooling fan is turned on (actuated), the fourth surface 2D and the fifth surface 2E are arranged orthogonal to the air flow direction of the cooling air of the air cooling fan and are exposed to the cooling air, thereby increasing the heat dissipation efficiency. Contribute to.

  (3) In each of the above embodiments, the through hole 4 formed in the heat radiating plate 2 is formed by punching. However, as shown in FIGS. 11 and 12, a cut is made in a substantially arc shape. May be bent to the back side to form the cooling fin 15.

  According to this configuration, since the area of the heat sink is expanded by the cooling fins 15, the heat dissipation efficiency of the radiator 1 is improved. Therefore, the heat dissipation efficiency is further improved by a synergistic effect with the cooling effect obtained by passing the cooling air through the through hole 4.

  (4) In each of the above-described embodiments, the configuration when one air-cooling fan is installed has been described, but it is possible to cope with the case where a plurality of air-cooling fans are installed. For example, the radiator 1 is configured as follows. Hereinafter, a description will be given based on FIG.

  In this embodiment, the air cooling fan is installed in two places, the 1st surface 2A used as the base of the heat sink 2 is orthogonal to the airflow direction of the cooling air from one 1st air cooling fan, and the 2nd surface 2B is The radiator 1 is installed on the circuit board 12 so as to be orthogonal to the airflow direction of the cooling air from the other second air cooling fan. The circuit board 12 is installed in a standing posture. Accordingly, in FIG. 13, the fourth surface 2D is the top surface.

  The shapes of the first surface 2A, the second surface 2B, and the fourth surface 2D are substantially square. Through holes 4 are formed two-dimensionally on each surface 2A, 2B, 2D. The electronic component 7 is mounted on the second surface 2B. Note that the through hole 4 is not formed in the mounting portion of the electronic component 7 on the second surface 2B.

  In the present embodiment, the leg 3 is illustrated as being the same as the protrusion 10 of the above embodiment on the second surface 2B and the fourth surface 2D, but is embedded in the circuit board 12. Absent.

  Next, the operation | movement which cools the electronic component 7 with the heat radiator 1 of this embodiment is demonstrated. When only the first air cooling fan is turned on, the first surface 2A passes the cooling air from the through hole 4 to the downstream side while receiving the cooling air blown from the first air cooling fan. That is, the cooling air that has passed through the through-hole 4 flows into a space surrounded by four directions by the first surface 2A, the second surface 2B, the fourth surface 2D, and the circuit board 12. Thereafter, the cooling air diffuses outside through the through-holes 4 in the second surface 4B and the fourth surface 2D in the direction not having the heat radiating plate 2 (heat radiating surface).

  On the other hand, when only the second air cooling fan is turned on, the second surface 2B passes the cooling air from the through hole 4 to the downstream side while receiving the cooling air blown from the second air cooling fan. The cooling air that has passed through the through-hole 4 passes through the through-hole 4 and the like and diffuses to the outside in the same manner as when the first air cooling fan is operating.

  When both the first air cooling fan and the second air cooling fan are turned off, the air in the space enclosed in the four directions by the first surface 2A, the second surface 2B, the fourth surface 2D, and the circuit board 12 becomes an electronic component. The temperature rises due to heat generation such as 7 and becomes an ascending current, and passes through the through hole 4 of the fourth surface 2D. That is, the air does not stay in the space and diffuses outside through the through hole 4 of the fourth surface 2D.

  As described above, air does not stay in the space surrounded by the heat radiating plate 2 and the circuit board 12 even when one of the air cooling fans is operating or when both the air cooling fans are stopped. Therefore, the heat generated from the electronic component 7 can be efficiently radiated.

  In addition, when the product including the circuit board 12 can be installed vertically or horizontally, or is portable, even if the top surface of the product is changed, the air is generated as an updraft generated when the air cooling fan is stopped. Can be passed through the through-hole 4 while being received by any one of the three surfaces. That is, the heat generated from the electronic component 7 can be efficiently radiated regardless of the posture and installation state of the product.

  (5) In the above embodiments, the other second surface 2B and the fourth surface 2D are bent at a right angle with respect to the first surface 2A serving as the base of the heat radiating plate 2, but the bending angle is limited to a right angle. Instead, the setting is appropriately changed so that the cooling air and the air receiving / radiating surface are orthogonal to each other in accordance with the circuit design and the installation angle of the air cooling fan.

DESCRIPTION OF SYMBOLS 1 Heat radiator 2 Heat sink 2A 1st surface 2B 2nd surface 2C 3rd surface 3 Leg part 4 Through-hole 5 Through-hole 6 Flange 7 Electronic component 8 Screw 9 Through-hole 10 Protrusion part 11 Notch 12 Circuit board 13 Installation hole 14 Notch

Claims (4)

A radiator that contacts an electronic component and dissipates heat from the electronic component,
There are a plurality of wind receiving and radiating surfaces that are bent so as to be substantially perpendicular to the direction of each air flow according to the air flow that changes depending on the on / off switching of the air cooling fan, and different directions among the plurality of wind receiving and radiating surfaces A heat radiator characterized in that it is constituted by a heat radiating plate in which a through-hole through which the air flow can pass is formed for each wind receiving and heat radiating surface extending in the air. The heat radiating plate according to claim 1, wherein the heat radiating plate includes the wind receiving and radiating surface substantially orthogonal to an ascending air current generated around the heat radiating plate. The heat dissipation according to claim 1, further comprising a leg portion that extends from the heat dissipation plate, allows the heat dissipation plate to be installed on a circuit board, and separates the heat dissipation plate from the circuit board. vessel. The radiator according to any one of claims 1 to 3, wherein the through hole is not provided in a predetermined region of the heat radiating plate on which the electronic component is mounted.

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