US20140076521A1

US20140076521A1 - Bidirectional heat dissipation structure

Info

Publication number: US20140076521A1
Application number: US13/623,119
Authority: US
Inventors: Kuo-Jen Lin; Chih-Hung Cheng; Wen-Jung Liu; Chun-Lung HUANG
Original assignee: CpuMate Inc; Golden Sun News Techniques Co Ltd
Current assignee: CpuMate Inc; Golden Sun News Techniques Co Ltd
Priority date: 2012-09-20
Filing date: 2012-09-20
Publication date: 2014-03-20

Abstract

A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to the field of heat dissipation equipments applied in electronic devices, in particular to a bidirectional heat dissipation structure capable of generating horizontal airflow and downward airflow simultaneously to dissipate heat from an electronic device and its surrounding.
2. Description of the Related Art
As science and technology advance, computers and information technology are developed rapidly, and the computing speed of the electronic devices installed in a computer comes with an increasingly higher speed. Among the heat-generating components of the computer, central processing units (CPU) produce more heat than any other components of the computer, and thus a heat dissipating device is generally installed for dissipating heat to assure stability and performance.
A general heat dissipating device comprises a heat dissipating body and a fan, wherein the heat dissipating body is a structure with a plurality of fins stacked onto one another, an aluminum extruded heat dissipating body, at least one heat pipe, at least one vapor chamber, or any combination of the above. The fan is mounted to the top or a side of the heat dissipating body, and the bottom of the heat dissipating body is attached onto a heat-generating electronic device, so that the heat generated by the electronic device can be transferred to the heat dissipating body by means of thermal conduction and then dissipated by airflow of the fan.
Due to the limitations of the shape of the heat dissipating body and the installation method of the fan, the airflow cannot be blown at the electronic device and its surrounding directly if the fan is blowing wind downwardly or sideway, and there is insufficient space between the heat dissipating body and the electronic device. Therefore, most heat dissipating devices can only dissipate the heat generated by the electronic device by a direct-contact conduction method only, and the design of such heat dissipating device cannot meet the heat dissipation requirements of the electronic devices that produce a large quantity of heat in a short time.

SUMMARY OF THE INVENTION

Therefore, it is a primary objective of the present invention to provide a bidirectional heat dissipation structure comprising a heat sink, and the heat sink is having a plurality of cooling fins with at least one guide slat installed on the cooling fin, wherein the guide slats are installed at appropriate positions and extended upwardly or downwardly from the heat sink to form a downward diversion channel, so that when a horizontal airflow of a wind source is blown sideway into the heat sink, horizontal and downward airflows are produced for dissipating the heat from an electronic device and its surrounding.
To achieve the foregoing objective, the present invention provides a bidirectional heat dissipation structure installed onto an electronic device and having a wind source disposed on a side of the bidirectional heat dissipation structure, and the bidirectional heat dissipation structure comprises: a base, disposed on the electronic device; a plurality of heat pipes, extended in a direction from the base; and a heat sink, having a plurality of cooling fins, each cooling fin sequentially passing through the heat pipes, and stacked with each other above the base, and the cooling fin having a plurality of through holes for passing the heat pipes, and the cooling fin having at least one guide slat; thereby a horizontal diversion channel is formed between the cooling fins when the bidirectional heat dissipation structure is assembled, and the guide slats form a downward diversion channel between the cooling fins; and the wind source supplies wind from a lateral side, and a portion of wind current dissipates heat through the horizontal diversion channel, and the other portion of the wind current blows downwardly to dissipate heat of the electronic device through the downward diversion channel.
Wherein, the base includes a plurality of grooves corresponsive to the heat pipes and the grooves parallelly and transversally penetrate a side of the base. The heat pipes are substantially U-shaped with the central position disposed in the grooves respectively, so that both ends of each heat pipe are vertically erected from the base.
Wherein, each of the through holes has a circular flange disposed around the through hole to facilitate the assembling process, not only providing a partitioning structure for the assembling, but also providing an effective support to enhance the stability of the assembly.
Similarly, the cooling fin has a baffle plate disposed on a side of the cooling fin to facilitate the assembling process, and the baffle plate is installed between the two cooling fins and forms a whole plane after the assembling. In addition, each guide slat has a predetermined included angle with respect to each baffle plate, wherein the predetermined included angle falls within a range from 30° to 89°, so that when the horizontal airflow enters, an air collecting structure is formed; or each guide slat has a predetermined gap from each baffle plate for passing a portion of the horizontal airflow to adjust the back pressure during use.
It is noteworthy that, the guide slat of each cooling fin is an arc sheet structure or a rectangular sheet structure, and the guide slat is extended in a direction (upwardly or downwardly) towards a side of the cooling fin and an included angle is defined between the guide slat and the cooling fin.
To improve the smooth air discharge of the downward diversion channel, each cooling fin has at least one penetrating hole formed at a lateral edge of the guide slat and communicated with the downward diversion channel, so that the other portion of the wind current is blown downwardly through the downward diversion channel and the penetrating holes for dissipating heat around the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a preferred embodiment of the present invention;

FIG. 2 is a perspective exploded view of a preferred embodiment of the present invention;

FIG. 3 is a schematic view of an application status of a preferred embodiment of the present invention;

FIG. 4 is a perspective view of another implementation of a preferred embodiment of the present invention;

FIG. 5 is a perspective exploded view of another implementation of a preferred embodiment of the present invention;

FIG. 6 is a schematic view showing the structure of a cooling fin in a reverse side in accordance with another implementation of a preferred embodiment of the present invention;

FIG. 7 is a schematic view of an application in accordance with another implementation of a preferred embodiment of the present invention;

FIG. 8 is a first schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention; and

FIG. 9 is a second schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The technical contents of the present invention will become apparent with the detailed description of preferred embodiments and the illustration of related drawings as follows.
With reference to FIGS. 1 and 2 for a perspective view and a perspective exploded view of a preferred embodiment of the present invention respectively, a bidirectional heat dissipation structure 1 of the invention is provided and installed to an electronic device 2, and a wind source 3 is disposed on a side of the bidirectional heat dissipation structure 1. The bidirectional heat dissipation structure 1 comprises a base 11, a plurality of heat pipes 12 and a heat sink 14 having a plurality of the cooling fins 13.
The base 11 is made of a thermally conductive metal such as aluminum or copper, and cast or punched to form a rectangular block structure and a side of the base 11 can be mounted on the electronic device 2. In addition, the base 11 has a plurality of grooves 111 corresponsive to the heat pipes 12 respectively and the grooves 111 penetrate through a side of the base 11 parallelly and transversely. It is noteworthy that the width of the groove 111 is flexible and can be changed according to the requirement of containing one heat pipe 12 or a plurality of parallelly installed heat pipes 12.
Each of the heat pipes 12 is U-shaped, with the central position disposed in the grooves 111 respectively, so that both ends of each heat pipe 12 are vertically erected from the base 11. In other words, the heat pipes are extended upwardly from the base 11.
The cooling fins 13 are made of a thermally conductive metal such as aluminum or copper and punched to produce a plurality of plate structures, and each cooling fin 13 has a plurality of through holes 131 for passing the heat pipes 12 respectively, and both windward sides of each cooling fin 13 are bent into guide slats 132 respectively, wherein both guide slats 132 are extended upwardly or both guide slats 132 are extended downwardly, and the cooling fins 13 are sequentially passed and installed onto the heat pipes 12 to form a structure of the cooling fins stacked with each other above the base 11. It is noteworthy that when each guide slat 132 is extended in a direction from the cooling fin 13, an included angle is defined, wherein the included angle is smaller than 90 degrees.
During assembling, a horizontal diversion channel 136 is formed between the cooling fins 13, and after the guide slats 132 are stacked and installed, a downward diversion channel137 is formed between both windward sides of the cooling fins 13. During the use of this invention, the wind source 3 is disposed on a side of the bidirectional heat dissipation structure 1 and capable of blowing wind from a lateral side, wherein a portion of the wind current can dissipate heat from surfaces of the cooling fins 13 through the horizontal diversion channel136, and the other portion of the wind current is induced by the guide slats and then blown directly downward through the downward diversion channel137, so as to achieve the effect of dissipating the heat of the electronic device 2.
With reference to FIGS. 4 to 7 for perspective views of another implementation, a schematic view of a heat sink 14 in a reverse side, and a schematic view of an application in accordance with another implementation of a preferred embodiment of the present invention respectively, each of the through holes 131 has a circular flange 133 disposed around the through hole 131 and provided for the partitioning and fixing functions during the assembling process of stacking the cooling fins 13, so that the cooling fins 13 have an appropriate partition space from one another to form the horizontal diversion channel136. In FIGS. 7 and 8, each cooling fin 13 has a baffle plate 134 for blocking airflow to prevent the airflow from escaping in a particular direction, or the baffle plate 134 can be used to assist forming the horizontal diversion channel136. The baffle plate 134 is installed between two adjacent cooling fins 13. In this preferred embodiment, the baffle plate 134 is extended in a direction from both edges, but the invention is not limited to such arrangement only. Each guide slat 132 has a predetermined included angle with respect to each baffle plate 134, wherein the predetermined included angle falls within a range from 30° to 89°, and each guide slat 132 has a predetermined gap from each baffle plate 134 to form a part of the horizontal diversion channel136. To improve the circulation efficiency of the downward diversion channel137, each cooling fin 13 has a pair of penetrating holes 135 formed at positions corresponding to an edge of the guide slat 132 and communicated with the downward diversion channel137, so that the other portion of the wind current can be blown downwardly through the downward diversion channel137 and the penetrating holes 135 to dissipate the heat around the electronic device 2. It is noteworthy that each guide slat 132 is made into an arc sheet structure or a rectangular sheet structure. As shown in FIG. 7, each guide slat 132 is substantially an arc sheet structure.
With reference to FIG. 8 for the first schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention, the wind current flows along each baffle plate 134 and enters the horizontal diversion channel136, and a portion of the wind current passes through the predetermined gap, while colliding with the guide slats 132 to produce rotations and flow downwardly through the penetrating holes 135, so as to form a downwardly blown vortex-like wind current. In this preferred embodiment, the baffle plate 134 can be bent into an L-shape, and the baffle plate 134 can be in a plate form (as shown in FIG. 9). However, the invention is not limited to such arrangements only.
With reference to FIG. 9 for the second schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention, if there is no predetermined gap or a smaller predetermine gap between each guide slat 132 and each baffle plate 134, a substantially sealed partition is formed, and an acute angle is formed on a side of the partition (which is the junction between the guide slat 132 and the baffle plate 134), so that after the wind current is blocked by each guide slat 132 and each baffle plate 134, the wind current is blown downwardly from the penetrating holes 135 to produce a straight wind current blowing downwardly. Both of the aforementioned downwardly blown wind currents can achieve the effect of dissipating the heat generated by the electronic device 2.

Claims

What is claimed is:

1. A bidirectional heat dissipation structure, installed onto an electronic device, and having a wind source disposed on a side of the bidirectional heat dissipation structure, comprising:

a base, disposed on the electronic device;

a plurality of heat pipes, extended in a direction from the base; and

a heat sink, having a plurality of cooling fins, each cooling fin sequentially passing through the heat pipes, and the cooling fins being stacked with each other above the base, and the cooling fin having a plurality of through holes for passing the heat pipes, and the cooling fin having at least one guide slat;

thereby a horizontal diversion channel is formed between the cooling fins when the bidirectional heat dissipation structure is assembled, and the guide slats form a downward diversion channel between the cooling fins; and the wind source supplies wind from a lateral side, and a portion of wind current dissipates heat through the horizontal diversion channel, and the other portion of the wind current blows downwardly to dissipate heat of the electronic device through the downward diversion channel.

2. The bidirectional heat dissipation structure of claim 1, wherein the base includes a plurality of grooves corresponsive to the heat pipes and the grooves parallelly and transversely penetrate a side of the base.

3. The bidirectional heat dissipation structure of claim 2, wherein the heat pipes are substantially U-shaped with the central position disposed in the grooves respectively, so that both ends of each heat pipe are vertically erected from the base.

4. The bidirectional heat dissipation structure of claim 1, wherein each of the through holes has a circular flange disposed around the through hole.

5. The bidirectional heat dissipation structure of claim 1, wherein the cooling fin has a baffle plate disposed on a side of the cooling fin.

6. The bidirectional heat dissipation structure of claim 5, wherein each guide slat has a predetermined included angle with respect to each baffle plate, and the predetermined included angle falls within a range from 30° to 89°.

7. The bidirectional heat dissipation structure of claim 5, wherein each guide slat has a predetermined gap from each baffle plate.

8. The bidirectional heat dissipation structure of claim 1, wherein the guide slat is an arc sheet structure or a rectangular sheet structure.

9. The bidirectional heat dissipation structure of claim 1, wherein the guide slat is extended in a direction towards a side of the cooling fin and an included angle is defined between the guide slat and the cooling fin.

10. The bidirectional heat dissipation structure of claim 1, wherein the cooling fin has at least one penetrating hole formed at a lateral edge of the guide slat and communicated with the downward diversion channel, so that the other portion of the wind current is blown downwardly through the downward diversion channel and the penetrating holes for dissipating heat around the electronic device.