TW201502459A - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TW201502459A
TW201502459A TW102124785A TW102124785A TW201502459A TW 201502459 A TW201502459 A TW 201502459A TW 102124785 A TW102124785 A TW 102124785A TW 102124785 A TW102124785 A TW 102124785A TW 201502459 A TW201502459 A TW 201502459A
Authority
TW
Taiwan
Prior art keywords
fins
heat sink
air flow
heat
base
Prior art date
Application number
TW102124785A
Other languages
Chinese (zh)
Inventor
Tai-Wei Lin
Chih-Ta Huang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW102124785A priority Critical patent/TW201502459A/en
Priority to US14/252,378 priority patent/US20150013955A1/en
Publication of TW201502459A publication Critical patent/TW201502459A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/08—Fins with openings, e.g. louvers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

A heat sink for cooling electronic components, includes a base and a number of parallel fins vertically fixed on the base. A number of vents are defined in each of the fins. A number of first air channels are formed through the corresponding vents and perpendicular to the fins. A number of second air channels are formed between each two adjacent fins.

Description

散熱器heat sink

本發明涉及一種散熱器。The invention relates to a heat sink.

電腦的電子元件（如晶片或處理器）在運行時會產生高熱，為解決其散熱問題，通常會設置散熱器對電子元件進行散熱。散熱器的散熱鰭片通常平行於風流流向佈置，以便使風流自散熱鰭片之間的間隙流過。但當系統風流方向改變時，風流流經散熱器時會受到散熱鰭片的阻礙，不能順利流經散熱鰭片，影響散熱效率。Computer electronic components (such as chips or processors) generate high heat during operation. To solve their heat dissipation problems, a heat sink is usually provided to dissipate heat from electronic components. The heat sink fins of the heat sink are generally arranged parallel to the flow direction of the wind flow so that the wind flows through the gap between the heat sink fins. However, when the wind flow direction of the system changes, the wind flow will be blocked by the heat dissipation fins when flowing through the heat sink, and cannot flow smoothly through the heat dissipation fins, thereby affecting the heat dissipation efficiency.

鑒於以上內容，有必要提供一種可適應不同風流流向的散熱器。In view of the above, it is necessary to provide a heat sink that can accommodate different wind flow directions.

一種散熱器，用於對電子元件進行散熱，該散熱器包括一底座和複數垂直固定於底座且相互平行的鰭片，該等鰭片對應地分別開設複數的通風孔，該等鰭片沿垂直鰭片的方向對應該等通孔形成複數第一風流通道，相鄰兩鰭片之間形成第二風流通道。A heat sink for dissipating heat to an electronic component, the heat sink comprising a base and a plurality of fins vertically fixed to the base and parallel to each other, wherein the fins respectively open a plurality of vent holes, and the fins are vertical The direction of the fins corresponds to the through holes forming a plurality of first air flow passages, and the second air flow passages are formed between the adjacent two fins.

相較先前技術，該散熱器的第一風流通道及第二風流通道可供平行及垂直鰭片的風流流過，從而保持散熱效率。Compared with the prior art, the first air flow channel and the second air flow channel of the heat sink can flow through the wind of the parallel and vertical fins, thereby maintaining heat dissipation efficiency.

200‧‧‧電子元件200‧‧‧Electronic components

100‧‧‧散熱器100‧‧‧heatsink

101‧‧‧底座101‧‧‧Base

10‧‧‧鰭片10‧‧‧Fins

11‧‧‧本體部11‧‧‧ Body Department

111‧‧‧通風孔111‧‧‧ventilation holes

12‧‧‧散熱片12‧‧‧ Heat sink

13‧‧‧風流口13‧‧‧The estuary

14‧‧‧第一風流通道14‧‧‧First wind flow channel

15‧‧‧第二風流通道15‧‧‧Second airflow passage

圖1係本發明散熱器的較佳實施方式與一電子元件的立體分解圖。1 is an exploded perspective view of a preferred embodiment of the heat sink of the present invention and an electronic component.

圖2係圖1的組裝圖。Figure 2 is an assembled view of Figure 1.

圖3係圖2沿III-III方向的剖視圖。Figure 3 is a cross-sectional view taken along line III-III of Figure 2.

請參照圖1，本發明散熱器100用於對一電子元件200進行散熱。散熱器100包括一底座101和複數垂直固定於底座101上的平行間隔的鰭片10。Referring to FIG. 1, the heat sink 100 of the present invention is used to dissipate heat from an electronic component 200. The heat sink 100 includes a base 101 and a plurality of parallel spaced fins 10 vertically fixed to the base 101.

請一倂參照圖2及圖3，每一鰭片10包括一片狀的本體部11，每一本體部11開設n行*m列的通風孔111。每一通風孔111係一矩形孔。本實施方式中，鰭片10於一角設有一矩形的缺口。每一通風孔111的兩長邊分別設有垂直鰭片10的兩散熱片12，該兩散熱片12之間形成一風流口13。該等鰭片10沿垂直鰭片10的方向對應每一風流口13形成一第一風流通道14。每行的通風孔111的散熱片12之間形成一第二風流通道15。本實施例中，散熱片12為矩形片狀，每一通風孔111內的兩散熱片12平行相對。Referring to FIG. 2 and FIG. 3, each of the fins 10 includes a sheet-like body portion 11, and each of the body portions 11 defines a vent hole 111 of n rows*m. Each of the ventilation holes 111 is a rectangular hole. In the present embodiment, the fin 10 is provided with a rectangular notch at one corner. Two fins 12 of the vertical fins 10 are respectively disposed on the two long sides of each of the vent holes 111, and a wind vent 13 is formed between the two fins 12. The fins 10 form a first air flow passage 14 corresponding to each of the air flow openings 13 in the direction of the vertical fins 10. A second air flow passage 15 is formed between the fins 12 of the vent holes 111 of each row. In this embodiment, the fins 12 are in the shape of a rectangular sheet, and the two fins 12 in each of the vent holes 111 are parallel to each other.

散熱器100的底座101吸收電子元件200的熱量後傳導到該等鰭片10。當風流方向平行於鰭片10時，風流從散熱器100的第二風流通道15流過，帶走散熱器100吸收的熱量。當風流方向垂直於該等鰭片10時，風流從散熱器100的第一風流通道14流過以帶走散熱器100吸收的熱量。The base 101 of the heat sink 100 absorbs heat from the electronic component 200 and is conducted to the fins 10. When the direction of the wind flow is parallel to the fins 10, the wind flows through the second air flow passage 15 of the heat sink 100, taking away the heat absorbed by the heat sink 100. When the direction of the wind flow is perpendicular to the fins 10, the wind flows through the first air flow passage 14 of the heat sink 100 to carry away the heat absorbed by the heat sink 100.

本發明散熱器100可供平行及垂直鰭片10的風流流過。散熱片12保證了鰭片10在設有通風孔111的情況下依然具有足夠的散熱面積，不會因風流方向的不同而改變散熱器100的散熱效率。The heat sink 100 of the present invention can flow through the wind of the parallel and vertical fins 10. The heat sink 12 ensures that the fin 10 still has a sufficient heat dissipation area in the case where the vent hole 111 is provided, and the heat dissipation efficiency of the heat sink 100 is not changed due to the difference in the direction of the wind flow.

綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

無no

100‧‧‧散熱器 100‧‧‧heatsink

101‧‧‧底座 101‧‧‧Base

10‧‧‧鰭片 10‧‧‧Fins

11‧‧‧本體部 11‧‧‧ Body Department

111‧‧‧通風孔 111‧‧‧ventilation holes

12‧‧‧散熱片 12‧‧‧ Heat sink

13‧‧‧風流口 13‧‧‧The estuary

Claims (4)

一種散熱器，用於對電子元件進行散熱，該散熱器包括一底座和複數垂直固定於底座且相互平行的鰭片，該等鰭片對應地分別開設複數的通風孔，該等鰭片沿垂直鰭片的方向對應該等通孔形成複數第一風流通道，相鄰兩鰭片之間形成第二風流通道。A heat sink for dissipating heat to an electronic component, the heat sink comprising a base and a plurality of fins vertically fixed to the base and parallel to each other, wherein the fins respectively open a plurality of vent holes, and the fins are vertical The direction of the fins corresponds to the through holes forming a plurality of first air flow passages, and the second air flow passages are formed between the adjacent two fins. 如申請專利範圍第1項所述的散熱器，其中該等通風孔排成複數行及複數列。The heat sink of claim 1, wherein the vent holes are arranged in a plurality of rows and a plurality of columns. 如申請專利範圍第2項所述的散熱器，其中每一通風孔呈矩形。The heat sink of claim 2, wherein each of the ventilation holes has a rectangular shape. 如申請專利範圍第3項所述的散熱器，其中鰭片於通風孔的兩側凸設兩平行的散熱片，第一風流通道形成於每一行的通風孔的兩散熱片之間。The heat sink according to claim 3, wherein the fins have two parallel fins protruding from two sides of the vent hole, and the first air flow passage is formed between the two fins of the vent hole of each row.
TW102124785A 2013-07-10 2013-07-10 Heat sink TW201502459A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW102124785A TW201502459A (en) 2013-07-10 2013-07-10 Heat sink
US14/252,378 US20150013955A1 (en) 2013-07-10 2014-04-14 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102124785A TW201502459A (en) 2013-07-10 2013-07-10 Heat sink

Publications (1)

Publication Number Publication Date
TW201502459A true TW201502459A (en) 2015-01-16

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ID=52276195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102124785A TW201502459A (en) 2013-07-10 2013-07-10 Heat sink

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TW (1) TW201502459A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10408613B2 (en) * 2013-07-12 2019-09-10 Magic Leap, Inc. Method and system for rendering virtual content
BR112017027837A2 (en) * 2015-07-06 2018-09-04 Gen Electric thermal management system
EP3859261B1 (en) * 2020-01-29 2022-11-09 Cooler Master Co., Ltd. Heat exchanger fin and manufacturing method of the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3521914A1 (en) * 1984-06-20 1986-01-02 Showa Aluminum Corp., Sakai, Osaka HEAT EXCHANGER IN WING PANEL DESIGN
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
US20030024687A1 (en) * 2001-07-31 2003-02-06 Cheng Chung Pin Radiation fin set for heat sink
US6615910B1 (en) * 2002-02-20 2003-09-09 Delphi Technologies, Inc. Advanced air cooled heat sink
US20060225866A1 (en) * 2005-04-07 2006-10-12 Chao-Chuan Chen Cooling fin assembly
TWI264271B (en) * 2005-05-13 2006-10-11 Delta Electronics Inc Heat sink
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
US20070119566A1 (en) * 2005-11-30 2007-05-31 Xue-Wen Peng Heat dissipation device
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device

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